KR100660154B1 - Method for fabricating film carrier tape and apparatus for fabricating the same - Google Patents

Abstract

Provided are a method for producing a film carrier tape and an apparatus for producing the same. The method of manufacturing a film carrier tape includes forming a plurality of sprocket holes on both sides of a width direction of an insulating film having a conductive layer on one surface thereof, forming a first photoresist pattern for wiring formation on the conductive layer, and a sprocket. Forming a second photoresist pattern for forming a sprocket hole reinforcement layer including an opening exposing the sprocket hole on the conductive layer around the hole by a stamping method, and using the first and second photoresist patterns as an etching mask. Etching to form a wiring and a sprocket hole reinforcing layer.

Film Carrier Tape, Sprocket Hole, Stamp, Photoresist Pattern

Description

Method for fabricating film carrier tape and manufacturing apparatus therefor {Method for fabricating film carrier tape and apparatus for fabricating the same}

1 is a process flowchart of a method of manufacturing a film carrier tape according to an embodiment of the present invention.

2 to 9B are cross-sectional views and plan views of each step process intermediate structure in the method of manufacturing a film carrier tape according to an embodiment of the present invention.

10 is a cross-sectional view showing a part of a state in which a film carrier tape manufactured by a manufacturing method according to an embodiment of the present invention is conveyed by a conveying roller.

11A to 12B are cross-sectional views and plan views of a process intermediate structure of a second photoresist pattern forming step and a sprocket hole protective layer forming step in the method of manufacturing a film carrier tape according to another embodiment of the present invention.

13 is a schematic configuration diagram of a film carrier tape manufacturing apparatus according to an embodiment of the present invention.

14A and 14B are bottom perspective views of a stamp included in the film carrier tape manufacturing apparatus according to an embodiment of the present invention.

15A to 15D are diagrams sequentially illustrating a method of forming a second photoresist pattern using a film carrier tape manufacturing apparatus according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

101: insulating film 102: conductive layer

102a: wiring 102b to 102e: sprocket hole reinforcing layer

103: reinforcing film 104, 105: sprocket hole

108: first photoresist pattern

109a, 109b, 110a, 110b: second photoresist pattern

210: stage portion 220: coating portion

221, 221 ': Stamp 222, 222': Transfer surface

230: supply unit 240: control unit

TECHNICAL FIELD This invention relates to the manufacturing method of a film carrier tape, and its manufacturing apparatus. Specifically, It is related with the manufacturing method of the film carrier tape containing a sprocket hole, and its manufacturing apparatus.

With the development of the electronics industry, the demand for printed circuit boards (PCBs) for mounting electronic components such as integrated circuits and large scale integrated circuits (LSICs) has increased dramatically. have.

However, due to the demand for miniaturization, weight reduction, and high functionality of electronic devices, tape automated bonding (TAB), ball grid array (T-BGA), application specific integrated circuit (ASIC), and chip on (COF) have recently been developed as a method of mounting electronic components. Film and the like, and a film carrier tape is used to mount electronic components in this way. In particular, the importance is increasing in the electronic industry using a liquid crystal display (LCD), which requires high definition, thinning, and narrowing the frame area of a liquid crystal screen such as a personal computer and a mobile phone.

Generally as a manufacturing method of the film carrier tape for electronic component mounting, a some wiring etc. are formed on an insulating film, conveying continuously the insulating film which has a sprocket hole in the width direction both sides using the sprocket roll provided with the sprocket.

However, when the sprocket roll rotates, the sprocket inserted into the sprocket hole exerts a force on the sprocket hole, which may damage the insulating film. In order to prevent such damage, a method of forming a reinforcing layer of a metal layer around a sprocket hole is used. However, this method may cause contact between the sprocket of the sprocket roll and the sprocket hole reinforcement layer of the insulating film during film transfer, and the reinforcement layer may be damaged, and the debris generated here may be a metallic foreign material and short the wiring. Cause.

There is a need for a method of forming a sprocket hole reinforcing layer that can reduce manufacturing costs while simplifying the process while solving such wiring defects.

The technical problem to be achieved by the present invention is to provide a method for producing a film carrier tape, the process is simple, can reduce the manufacturing cost.

Another technical problem to be achieved by the present invention is to provide a film carrier tape manufacturing apparatus used in the production of the film carrier tape as described above.

Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of manufacturing a film carrier tape, the method comprising: forming a plurality of sprocket holes on both sides of a width direction of an insulating film having a conductive layer on one surface thereof, and on the conductive layer Forming a first photoresist pattern for forming a wiring on the second photoresist pattern for forming a sprocket hole reinforcement layer including an opening exposing the sprocket hole on the conductive layer around the sprocket hole; And forming the interconnection and the sprocket hole reinforcement layer by etching the conductive layer using the first and second photoresist patterns as etch masks.

According to another aspect of the present invention, there is provided an apparatus for manufacturing a film carrier tape, comprising: a stage portion for aligning an insulating film having a conductive layer having a sprocket hole, an opening for exposing the sprocket hole, and the sprocket; A coating part including a stamp having a transfer surface for transferring the photoresist on the conductive layer around the hole, a supply part for supplying the photoresist to the coating part, the stage part, the coating part, and the supply part, respectively. It includes a control unit for controlling.

Specific details of other embodiments are included in the detailed description and the drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In the present specification, a method of manufacturing a film carrier tape and a manufacturing apparatus thereof used in a COF mounting method will be described. However, these are merely exemplary and the manufacturing method and the manufacturing apparatus according to an embodiment of the present invention may include TAB, T-BGA, The present invention is also applicable to the production of film carrier tapes used in mounting methods such as ASIC.

Hereinafter, a method of manufacturing a film carrier tape according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 9B.

1 is a process flow diagram for a method of manufacturing a film carrier tape according to an embodiment of the present invention, Figures 2 to 9b is a cross-sectional view and a plan view of each step process intermediate structure.

Referring to FIG. 1, first, a sprocket hole is formed in an insulating film having a conductive layer (S1).

Specifically, referring to FIG. 2, the conductive layer 102 is formed on the insulating film 101. The insulating film 101 is not particularly limited as long as it is made of a material having insulation and flexibility, but may be made of, for example, a polyimide material. The insulating film 101 may have a thickness of about 40 μm or less, for example, about 38 μm or about 25 μm.

The conductive layer 102 is formed on one surface of the insulating film 101. The conductive layer 102 is formed by performing electroplating in succession with sputtering. The metal forming the conductive layer 102 is not particularly limited as long as it has good conductivity and has a predetermined strength, and may be made of, for example, copper (Cu).

In addition, referring to FIG. 3, a reinforcement film 103 may be further formed on the other surface of the insulating film 101. The reinforcement film 103 is to reinforce the strength of the insulating film 101, and may be formed of, for example, polyethylene terephtalate. As a method of attaching the reinforcement film 103 to the insulating film 101, an adhesive or an adhesive tape can be used.

The thickness of the reinforcement film 103 is not particularly limited as long as it can provide a predetermined strength to the insulating film 101, but the thickness thereof may be 50 μm or more. For example, the thickness of the reinforcement film 103 may be about 100 μm or about 125 μm. As the thickness of the reinforcing film 103 is thicker, the damage of the insulating film 101 may be prevented during the conveyance of the insulating film 101 during the manufacturing process, but when the thickness of the reinforcing film 103 is too thick, the flexibility of the insulating film 101 may be reduced.

4A and 4B, sprocket holes are provided at positions corresponding to each other on both sides in the width direction of the insulating film 101 having the conductive layer 102 and the reinforcing film 103 on each side by normal punching, respectively. (sprocket holes, 104, 105). The sprocket holes 104 and 105 are for inserting a sprocket provided in the sprocket roll so as to smoothly convey the film in a roll to roll or reel to reel method in a manufacturing process. A plurality of sprocket holes 104 and 105 are formed, and are aligned in a line along the longitudinal direction of the insulating film 101. At this time, the shape, size, number and the like of the sprocket hole is not particularly limited. For example, the shape of the sprocket hole may be a square or a circle, the size and number of the sprocket can be variously modified according to the size and number of the sprocket.

Subsequently, a first photoresist pattern for wiring formation is formed in the conductive layer (S2).

Referring to FIG. 5, since the film carrier tape should include wiring for electrical connection with the electronic component, a first photoresist pattern for wiring formation should be formed on the conductive layer 102.

First, the photoresist 106 is coated on the wiring formation region M between the sprocket holes 104 and 105 on the conductive layer 102 by a roll quarter or the like to form the photoresist layer 106.

Next, as shown in FIG. 6, exposure is performed using a mask 107 defining a wiring pattern, followed by development, thereby providing a predetermined first photoresist pattern in the wiring formation region M as shown in FIG. 7. Form 108.

Subsequently, a second photoresist pattern for forming the sprocket hole reinforcement layer is formed (S3).

8A and 8B, a stamping method using a stamp having a pattern substantially the same as a sprocket hole reinforcement layer pattern to be formed on the conductive layer 102 around the sprocket holes 104 and 105 may be used. 2 Photoresist patterns 109a and 110a are formed. Here, the stamping method means a method of transferring the same pattern as the stamp pattern onto the transfer object using a stamp having a predetermined pattern.

In order to form the second photoresist pattern by the stamping method, the photoresist is applied to a stamp having a pattern substantially the same as the sprocket hole reinforcement layer pattern, and then, on the conductive layer 102 around the sprocket holes 104 and 105. An apparatus for producing a film carrier tape for transferring a photoresist pattern can be used, which will be described later.

Since the sprocket hole reinforcement layer may be formed on at least one of both sides of the sprocket hole 104 and 105 in the width direction, the second photoresist patterns 109a and 110a for forming the sprocket hole reinforcement layer may also be in the width direction of the sprocket holes 104 and 105. The second photoresist patterns 109a and 110a may be formed on at least one side of both sides of the sprocket holes 104 and 105.

The second photoresist patterns 109a and 110a are formed in the longitudinal direction of the insulating film 101 with a line width larger than the diameters of the sprocket holes 104 and 105, and the sprockets are formed at positions where the sprocket holes 104 and 105 are formed. It may have a band shape including openings 111 and 112 larger than the areas of the sprocket holes 104 and 105 for exposing the holes 104 and 105. The second photoresist patterns 109a and 110a are not limited to the above, and various modifications may be made depending on the pattern of the sprocket hole reinforcement layer to be formed.

Subsequently, the conductive layer is etched to form a wiring and a sprocket hole reinforcement layer (S4).

After wet etching the conductive layer 102 using the first photoresist pattern 108 and the second photoresist patterns 109a and 110a formed on the conductive layer 102 as an etching mask, the first photoresist pattern 108 is continuously formed. When the resist pattern 108 and the second photoresist patterns 109a and 110a are peeled off, the wiring 102a and the sprocket hole reinforcing layers 102b and 102c are formed as shown in FIGS. 9A and 9B. That is, a predetermined wiring 102a is formed in the wiring forming region M on the insulating film 101 and a sprocket hole for reinforcing the strength around the sprocket holes 104 and 105 around the sprocket holes 104 and 105. Reinforcement layers 102b and 102c are formed. At this time, the sprocket hole reinforcing layers 102b and 102c are formed in the longitudinal direction of the insulating film 101 with a line width larger than the diameters of the sprocket holes 104 and 105, and the sprocket holes 104 and 105 are formed at the positions where the sprocket holes 104 and 105 are formed. It may have a band shape including openings 111 and 112 larger than the areas of the sprocket holes 104 and 105 for exposing the 104 and 105. The pattern of the sprocket hole reinforcing layers 102b and 102c is not particularly limited as long as it can reinforce the strength of the periphery of the sprocket holes 104 and 105.

The openings 111 and 112 of the sprocket hole reinforcing layers 102b and 102c formed on the insulating film 101 around the sprocket holes 104 and 105 should have an area larger than the area of the sprocket holes 104 and 105. The reason will be described with reference to FIG. 10.

10 is a cross-sectional view showing a part of a state in which a film carrier tape manufactured by a manufacturing method according to an embodiment of the present invention is conveyed by a conveying roller.

As shown in FIG. 10, when the sprocket hole reinforcing layer 102b is spaced apart from the sprocket hole 104 by a predetermined distance, the sprocket 301 is transported when the film carrier tape is conveyed by fitting the sprocket hole 104 to the sprocket 301. ) Can be prevented from contacting either up, down, left, or right of the sprocket hole reinforcement layer 102b. As a result, when the sprocket 301 is in contact with the sprocket hole reinforcing layer 102b, not only the damage of the sprocket hole reinforcing layer 102b but also metallic foreign matters caused by the breakage can be prevented, and furthermore, the wiring 102a due to the metallic foreign matter. A defect such as a short can be prevented.

Subsequently, a film carrier tape manufacturing method according to another embodiment of the present invention will be described with reference to FIGS. 11A to 12B. 11A to 12B are cross-sectional views and plan views of a process intermediate structure of a second photoresist pattern forming step and a sprocket hole protective layer forming step in the method of manufacturing a film carrier tape according to another embodiment of the present invention.

In the method of manufacturing a film carrier tape according to another embodiment of the present invention, in the step of forming the second photoresist pattern, the second photoresist pattern is different from the shape of the second photoresist pattern in one embodiment of the present invention, and the wiring and In the step of forming the sprocket hole reinforcing layer is the same as the film carrier tape manufacturing method according to an embodiment of the present invention except that the pattern of the sprocket hole reinforcing layer is different from the shape of the pattern of the sprocket hole reinforcing layer in one embodiment of the present invention Do. For convenience, description of overlapping portions in the film carrier tape manufacturing method will be omitted and only portions having differences will be described.

First, a predetermined first photoresist pattern 108 is formed in the wiring formation region M on the conductive layer 102 through the processes of FIGS. 2 to 7.

11A and 11B, in the step of forming the second photoresist patterns 109b and 110b, the second photoresist patterns 109b and 110b are formed by the sprocket holes 104 and 105 by a stamping method. It may be formed to have a rectangular shape surrounding the sprocket hole surrounding the opening 111, 112 larger than the area of the sprocket holes (104, 105) for exposing the sprocket holes (104, 105) in the formed position. . The second photoresist patterns 109b and 110b are not limited to the above, and various modifications are possible according to the pattern of the sprocket hole reinforcement layer to be formed.

Next, as shown in FIGS. 12A and 12B, in the forming of the sprocket hole reinforcement layers 102d and 102e, the first photoresist pattern 108 and the second photoresist pattern formed on the conductive layer 102. After wet etching the conductive layer 102 using the etching masks 109b and 110b as the etching mask, the first photoresist pattern 108 and the second photoresist patterns 109b and 110b are subsequently peeled off. And sprocket hole reinforcement layers 102d and 102e. In this case, the sprocket hole reinforcing layers 102d and 102e have an opening 111 larger than the area of the sprocket holes 104 and 105 for exposing the sprocket holes 104 and 105 at the positions where the sprocket holes 104 and 105 are formed. , 112, and may have a rectangular shape surrounding the sprocket hole. The shape of the sprocket hole reinforcing layers 102d and 102e is not particularly limited as long as the pattern can reinforce the strength of the periphery of the sprocket holes 104 and 105.

In the above, the manufacturing method for one film carrier tape has been described for convenience of description, but it is applicable to a plurality of film carrier tapes arranged in parallel, but is not limited thereto.

Hereinafter, a method of manufacturing a film carrier tape according to embodiments of the present invention, in particular, a device used to form a second photoresist pattern for forming a sprocket hole reinforcement layer on a conductive layer around a sprocket hole by a stamping method will be described. Let's do it.

13 is a perspective view of a film carrier tape manufacturing apparatus according to an embodiment of the present invention, Figures 14a and 14b are bottom perspective views of a stamp included in the film carrier tape manufacturing apparatus according to an embodiment of the present invention.

Referring to FIG. 13, the film carrier tape manufacturing apparatus 200 includes a stage unit 210, a coating unit 220, a supply unit 230, and a control unit 240.

First, the stage 210 is a portion where the insulating film 101 including the conductive layer 102 having the sprocket holes 104 and 105 is positioned and fixed and aligned. A predetermined number of fixing parts 211, for example, pin-shaped fixing parts 211, may be formed on the stage part 210, and the fixing parts 211 may be an insulating film having a conductive layer. It serves to fix the stage portion (210).

The lower portion of the stage 210 is supported by a support (not shown). In addition, a lower portion of the stage 210 may be provided with a spring (not shown). When the second photoresist pattern is formed on the conductive layer of the insulating film by a stamping method, the impact caused by the stamping may be alleviated by the spring. have.

As described above, the stage unit 210 may be moved up and down and left and right by the controller 240, and the balance may be adjusted.

The coating part 220 includes a stamp as a part for transferring the second photoresist pattern on the conductive layer 102.

14A and 14B, the stamps 221 and 221 ′ include the same pattern as the sprocket hole reinforcement layer pattern to be formed.

8B, 9B and 14A, for example, the sprocket hole reinforcement layers 102b and 102c are formed in the longitudinal direction of the insulating film 101 with a line width larger than the diameters of the sprocket holes 104 and 105, and the sprockets If it is a strip | belt shape which has opening 111,112 larger than the area of the sprocket hole 104,105 for exposing the sprocket hole 104,105 in the position where the hole 104,105 is formed, the stamp 221 ) Has a band-shaped transfer surface 222 including a plurality of openings 223 larger than the sprocket holes 104 and 105 for exposing the sprocket holes 104 and 105.

11B, 12BB, and 14B, for example, the sprocket hole reinforcing layers 102d and 102e may expose the sprocket holes 104 and 105 at the positions where the sprocket holes 104 and 105 are formed. If the shape of the rectangle having openings 111 and 112 larger than the area of the 104 and 105 and surrounding the sprocket hole, the stamp 221 'is also used to expose the sprocket hole 104 and 105. It has an opening 223 ′ larger than the area of 105 and has a rectangular transfer surface 222 ′ surrounding the sprocket holes 104, 105.

The transfer surfaces 222 and 222 'of the stamp 221 or 221' are not limited to the above, and may be modified to have various shapes according to the pattern of the sprocket hole reinforcing layers 102b, 102c or 102d and 102e.

In addition, the stamp 221 or 221 ′ is detachable from the coating unit 220, so that the sprocket hole reinforcing layer (102b, 102c or 102d, 102e) and even if the pattern of the sprocket hole reinforcing layer (102b, 102c or 102d, 102e) is changed. The process can be continued by a simple operation of exchanging and attaching a stamp 221 or 221 'having substantially the same transfer surface 222 or 222', which is convenient and saves time.

The coating unit 220 as described above may be moved up, down, left, and right by the controller 240.

Referring again to FIG. 13, supply 230 supplies and receives photoresist such that the photoresist can be applied to a pattern 222 or 222 ′ of the stamp of coating 220 (221 ′ in FIG. 14A or 221 ′ in FIG. 14B). As an example, an injection part (not shown) into which the photoresist is injected and a jig part 231 into which the photoresist is accommodated are included. The feed rate of the photoresist may be adjusted to be fed at a constant rate.

Subsequently, the second photoresist pattern forming method for forming the sprocket hole reinforcement layer on the upper surface of the conductive layer of the insulating film using the film carrier tape manufacturing apparatus as described above will be described.

15A to 15D are diagrams sequentially illustrating a method of forming a second photoresist pattern using a film carrier tape manufacturing apparatus according to an embodiment of the present invention.

Referring to FIG. 15A, first, the insulating film 101 including the conductive layer 102 on which the sprocket holes 104 and 105 are formed is conveyed to the stage portion 210 and fixed to the fixing portion 211. At the same time, the photoresist is supplied to the supply unit 230.

Subsequently, referring to FIG. 15B, the control unit 240 is adjusted to move the coating unit 220 including the stamp 221 or 221 ′ to the upper portion of the supply unit 230, and the jig unit of the supply unit 230 may be The photoresist contained in 231 is applied to the pattern 222 or 222 'of the stamp 221 or 221'.

Next, referring to FIGS. 15C and 15D, the controller 240 adjusts the sprocket hole for the coating part 220 including the pattern 222 or 222 ′ of the stamp 221 or 221 ′ coated with the photoresist. After the reinforcement layer is positioned on the conductive layer 102 to be formed, the photoresist applied to the pattern 222 or 222 'of the stamp 221 or 221' is lowered so as to surround the sprocket holes 104 and 105. The second photoresist pattern is formed by a stamping method to be transferred onto the conductive layer 102.

In the method of manufacturing a film carrier tape by the film carrier tape manufacturing apparatus according to an embodiment of the present invention as described above, when forming a second photoresist pattern for forming a sprocket hole reinforcement layer, a photoresist is applied to a stamp having a desired pattern. By transferring to the conductive layer around the sprocket hole by a stamping method

Therefore, in order to form a photoresist pattern for forming a conventional sprocket hole reinforcement layer, a photoresist pattern was formed using a glass mask that is relatively expensive up to the sprocket hole reinforcement layer formation region. It is not necessary to form up to the reinforcement layer forming region. Therefore, the exposure area of the exposure apparatus thereby can be reduced than in the related art, thereby reducing the equipment related cost. In addition, as the exposure area is reduced, precise exposure is possible, thereby facilitating a manufacturing method.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

The method of manufacturing a film carrier tape according to the present invention as described above can form a second photoresist pattern of a desired shape by a simple stamping method. In addition, the film carrier tape manufacturing apparatus according to the present invention is simple in configuration and easy to manufacture, and excellent in its utility.

Claims (7)

Forming a plurality of sprocket holes on both sides of a width direction of the insulating film having a conductive layer on one surface; Forming a first photoresist pattern for wiring formation on the conductive layer; Stamping a second photoresist pattern for forming a sprocket hole reinforcement layer including an opening exposing the sprocket hole on the conductive layer around the sprocket hole; And And etching the conductive layer using the first and second photoresist patterns as etch masks to form the wiring and the sprocket hole reinforcement layer. The method of claim 1, The second photoresist pattern forming step Applying a photoresist to a stamp of a pattern substantially the same as the pattern of the sprocket hole reinforcement layer; And And transferring the photoresist applied to one surface of the stamp onto the conductive layer around the sprocket hole. The method of claim 1, The area of the opening of the sprocket hole reinforcement layer is larger than the area of the sprocket hole. A stage unit for aligning an insulating film having a conductive layer having a sprocket hole formed therein; A coating including a stamp having an opening exposing the sprocket hole and a transfer surface for transferring the photoresist on the conductive layer around the sprocket hole; A supply unit for supplying a photoresist to the coating unit; And And a control unit for controlling each of the stage unit, the coating unit, and the supply unit. The method of claim 4, wherein And the stamp includes the transfer surface having a pattern substantially the same as the pattern of the sprocket hole reinforcement layer. The method of claim 5, And an area of the opening of the stamp includes an opening larger than an area of the sprocket hole. The method of claim 4, wherein The stamp is a film carrier tape manufacturing apparatus detachable from the coating portion.

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