JP2002287353A - Photosensitive solder resist composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a photosensitive solder resist composition excellent in characteristics such as resistance against gold plating, resistance against thermal shock and electric insulating property. SOLUTION: The composition contains (A) a resin containing radical polymerizable groups and carboxyl groups obtained by adding cyclic ether groups of vinyl monomers containing cyclic ether groups to carboxyl groups of radical copolymers containing at least vinyl aromatic compounds and vinyl monomers containing carboxyl groups as the monomer units, (B) an inorganic filler and (C) a photosetting mixture consisting of polyfunctional acryl monomers (c1), compounds having cyclic ether groups (c2) and a photopolymerization initiator (c3).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alkali developable photo solder resist composition and a solder resist film obtained by using the same.

[0002]

2. Description of the Related Art A method of forming a solder resist pattern on a printed wiring board is generally employed as a method of attaching solder to a predetermined portion of the printed wiring board. Solder resist is used to apply solder only to places where the pattern is not formed, prevent solder from attaching to the place where the pattern is formed, and protect the circuit where the pattern is formed. belongs to.

[0003] Mounting of electronic components on a printed wiring board is performed by:
In recent years, the density has increased, and even for solder resist,
Pattern miniaturization has become necessary. For this reason,
A method of patterning a solder resist by a photolithography method is generally used, and a liquid photo solder resist is used for this purpose.

As such a photo solder resist composition, Japanese Patent No. 2868190 discloses a modified epoxy resin obtained by adding acrylic acid to a polyfunctional epoxy resin and adding an acid anhydride to a hydroxyl group generated by this reaction. Used.

[0005] However, such a modified epoxy resin has an ester bond in a molecule which is susceptible to hydrolysis, and thus has a problem of poor acid resistance and alkali resistance. For this reason, there has been a problem that defects are likely to occur in the subsequent gold plating process. In addition, there is also a problem that, due to its high brittleness, for example, the thermal shock resistance is poor. Further, there is also a problem that the cost is increased due to the epoxy-modified resin.

Japanese Patent Application Laid-Open No. 2000-191737 proposes an acrylic resin-based photo solder resist. However, since this acrylic resin-based resist has high hydrophilicity, there is a problem that it is inferior in water resistance and electrical characteristics.

It is an object of the present invention to provide a photo solder resist composition having excellent properties such as gold plating resistance, resistance to thermal shock and electrical insulation, and a solder resist coating obtained using the same.

[0008]

Means for Solving the Problems The photo solder resist composition of the present invention is characterized in that (A) a cyclic polymer is added to the carboxyl group of a radical polymer containing at least a vinyl aromatic compound and a carboxyl group-containing vinyl monomer as monomer units A resin having a radically polymerizable group and a carboxyl group, obtained by adding a cyclic ether group of an ether group-containing vinyl monomer, (B) an inorganic filler, and (C) a polyfunctional acrylic monomer (c1); It is characterized by containing a photocurable mixture comprising a compound (c2) having an ether group and a photopolymerization initiator (c3).

The photo solder resist composition of the present invention contains the resin (A), the inorganic filler (B), and the photocurable mixture (C), so that it has excellent acid resistance and alkali resistance, and thus has excellent gold plating resistance. As well as excellent thermal shock resistance and electrical insulation.

In the resin (A), the amount of double bond is 1.
It is preferably from 0 × 10 ^{−3 to} 3.0 × 10 ⁻³ mol / g. The carboxyl group content (acid value) is 30 to
Preferably it is 200 mgKOH / g.

The ratio of the carboxyl group in the resin (A) to the cyclic ether group in the photocurable mixture (C), that is, the compound (c2), is 1.3 / 0.7 to 0.7 / molar.
It is preferably 1.3.

Further, the solder resist composition of the present invention may further contain a coloring pigment. The content of the inorganic filler (B) is preferably 5 to 75 parts by weight based on 100 parts by weight of the solid content of the entire photo solder resist composition of the present invention.

In the present invention, the resin (A) may be neutralized with a base and made water-soluble. The solder resist film of the present invention is obtained by applying the photo solder resist composition of the present invention to a substrate and drying at 50 to 90 ° C.
It is obtained by exposing to an active energy ray, developing and removing an unexposed portion with an alkaline cleaning liquid, and heating and curing the photocured portion at 140 to 170 ° C.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a resin (A) as a first component, an inorganic filler (B) as a second component, and a photo-curing as a third component of the photo solder resist composition of the present invention. The sexual mixture (C) will be described in detail.

(A) Radical polymerizable group and carboxyl group
And the first resin contained in the photo solder resist composition of the present invention.
Is a resin containing a radically polymerizable group and a carboxyl group, and at least a cyclic ether group to a carboxyl group of a radical copolymer containing at least a vinyl aromatic compound and a carboxyl group-containing vinyl monomer as a monomer unit. It can be obtained by ring-opening addition of a cyclic ether group of a vinyl monomer contained. The content of the vinyl aromatic compound contained in the resin (A) is preferably from 10 to 50% by weight, more preferably from 15 to 35% by weight. If it is less than 10% by weight, tackiness and heat resistance may be poor. If it exceeds 50% by weight, brittleness may be too high.

As the vinyl aromatic compound, styrene,
Examples include p-methylstyrene, m-methylstyrene, vinylnaphthalene and the like. Among these, styrene,
p-Methylstyrene is particularly preferably used.

Examples of the carboxyl group-containing vinyl monomer include acrylic acid and methacrylic acid. Glycidyl methacrylate is a typical example of a cyclic ether group-containing vinyl monomer, and is disclosed in JP-A-2000-191737.
No. 3,4-epoxycyclohexyl methacrylate described in JP-A No. 2-2 can also be used. However, glycidyl methacrylate is particularly preferably used from the viewpoints of addition reactivity, material cost, and the like.

The resin (A) containing a radical polymerizable group and a carboxyl group has at least one radical polymerizable group and a carboxyl group in one molecule, and the amount of double bonds is 1.0 × 10 ^{−3 to} 3.0
It is preferably × 10 ⁻³ mol / g, and the content of the carboxyl group is preferably 30 to 200 mgKOH / g. When the amount of double bonds is lower than 1.0 × 10 ⁻³ mol / g, the photocurability of the obtained resist is insufficient, and the adhesion and heat resistance during development may be inferior.
If it exceeds 10 ^-3 mol / g, not only the film strength may be brittle, but also the resolution may be reduced. When the content of the carboxyl group is less than 30 mgKOH / g, the alkali developability is reduced. When the content exceeds 200 mgKOH / g, the exposed portion may be dissolved.
The amount of double bonds is 1.5 × 10 ^{−3 to} 2.7 × 10 ⁻³ mol /
g, more preferably 70 to 120 mgKOH / g.

The number average molecular weight of the resin (A) is from 2000 to 2000.
It is preferably 40,000. If it is less than 2000, the heat resistance of the obtained resist may not be sufficient, and if it is more than 40000, the viscosity may be too high, which may cause a problem in workability in producing the composition.

In the present invention, a base is added to the resin (A) to neutralize a carboxyl group, whereby the resin (A) is neutralized.
May be used as an aqueous solution. The base is not particularly limited, and a well-known neutralizing agent for a carboxyl group, for example, an inorganic compound such as sodium hydroxide, potassium hydroxide, or lithium hydroxide or an amine compound such as triethylamine or dimethylethanolamine is used. be able to. The amount of the base is appropriately determined according to the molecular weight and the carboxyl group content of the resin (A), and may be any amount that can be made water-soluble. For example, 30 to 200% (0.3 ２2 mol) can be set to an amount capable of neutralizing.

(B) Inorganic filler The second filler contained in the photo solder resist composition of the present invention
Is an inorganic filler. The inorganic filler is used to improve the heat resistance of the resist, and known inorganic fillers such as barium sulfate, finely divided silicon carbide, amorphous silica, talc, and mica can be used. Note that the inorganic filler also includes a known flame retardant. The inorganic filler can be dispersed by a known method in the presence of the resin (A).

The amount of the inorganic filler is determined as a proportion of the solid content in the photo solder resist composition of the present invention. This ratio will be described later for the photo solder resist composition.

(C) Photo-Curable Mixture Third photocurable mixture contained in the photo solder resist composition of the present invention.
Is a photocurable mixture comprising a polyfunctional acrylic monomer (c1), a compound having a cyclic ether group (c2), and a photopolymerization initiator (c3).

<Polyfunctional acrylic monomer (c1)> The above polyfunctional acrylic monomer (c1) contains 2
Any polymer having at least two polymerizable groups (for example, an acryloyl group or a methacryloyl group) may be used. By containing the polyfunctional acrylic monomer (c1), photocuring for patterning can be performed.

Specific examples of the polyfunctional acrylic monomer (c1) include pentaerythritol triacrylate, dipentaerythritol pentaacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, Examples thereof include dipentaerythritol hexaacrylate and methacrylates corresponding thereto. These can be used alone or in combination of two or more.

<Compound having cyclic ether group (c2)
The compound (c2) having a cyclic ether group undergoes a curing reaction with a carboxyl group (mainly in the resin (A)) in the resist composition by heating. Examples of the group in which the cyclic ether group is a glycidyl group include known groups such as bisphenol type, phenol novolak type and cresol novolak type. The thing having an alicyclic epoxy group, various things are commercially available, for example, a celloxide series, sold by Daicel Chemical Industries, Eporide series, cyclomer series and those obtained by polymerizing such Can be mentioned. Also, those having an oxetane group are sold by Toagosei Co., Ltd. as Aron oxetane series. Among them, those having two or more alicyclic epoxy groups or oxetane groups in one molecule are preferable, and those having three or more are particularly preferable.

<Photopolymerization Initiator (c3)> Known photopolymerization initiators (c3) can be used. Specific examples include benzoin and benzoin alkyl ethers such as benzoin, benzoin methyl ether, benzoin ethyl ether and benzoin propyl ether; acetophenone, 2,2-dimethoxy-2-
Acetophenones such as phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone and 1,1-dichloroacetophenone; 2-methyl-1- [4-
(Methylthio) phenyl] -2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1- (4-
Aminoacetophenones such as morpholinophenyl) -butanone-1, N, N-dimethylaminoacetophenone; 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-
Anthraquinones such as chloroanthraquinone; 2,
Thioxanthones such as 4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone and 2,4-diisopropylthioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenone, 4,4'-
Benzophenones such as bisdiethylaminobenzophenone or xanthones; 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like. These can be used alone or as a mixture of two or more kinds, and further, a tertiary amine such as triethanolamine and a photoinitiating auxiliary such as ethyl dimethylaminobenzoate can be added and used.

The polyfunctional acrylic monomer (c1), the compound (c2) having a cyclic ether group other than the glycidyl group in the photocurable mixture contained in the photo solder resist composition of the present invention, and the photopolymerization initiator (c3) ) Is determined as a proportion of the solid content in the photo solder resist composition of the present invention. This ratio will be described later for the photo solder resist composition.

The photocurable mixture may contain, in addition to the above components, a compound containing an amino group such as dicyandiamide which reacts with a cyclic ether group, melamine, blocked isocyanate and the like.

Photo Solder Resist Composition The photo solder resist composition of the present invention is characterized in that (A) a carboxyl group of a radical copolymer containing at least a vinyl aromatic compound and a carboxyl group-containing vinyl monomer as a monomer unit has a cyclic group. A resin containing a radically polymerizable group and a carboxyl group obtained by adding a cyclic ether group of an ether group-containing vinyl monomer, (B) an inorganic filler, and (C) a polyfunctional acrylic monomer (c)
1), a photocurable mixture comprising a compound having a cyclic ether group (c2) and a photopolymerization initiator (c3).

The photo solder resist composition of the present invention can be obtained by mixing the above components by a method well known to those skilled in the art. In that case, it is preferable that each component ratio satisfies the following conditions in order to improve the performance of the resist composition and the resist obtained therefrom.

First, a carboxyl group in the resin (A)
The ratio with the cyclic ether group in the photocurable mixture (C) is
The molar ratio is preferably 1.3 / 0.7 to 0.7 / 1.3. If the ratio is out of this range, the degree of crosslinking does not increase, and the heat resistance may not be sufficient. Further, the ratio is more preferably 1.15 / 0.85 to 0.85 / 1.15.

Next, 5% of the inorganic filler (B) in 100 parts by weight of the solid content of the photo solder resist composition of the present invention is used.
Preferably, it is で 75 parts by weight. If the amount is less than 5 parts by weight, the heat resistance and the effect of preventing curing shrinkage may be poor, and if it exceeds 75 parts by weight, the developability may be reduced. More preferably, it is 15 to 60 parts by weight.

Further, the polyfunctional acrylic monomer (c1) contained in the photocurable mixture (C) is contained in the photo solder resist composition of the present invention in an amount of 2.
It is preferably from 0 to 15.0 parts by weight. If the amount is less than 2.0 parts by weight, the photocurability may be poor, and if it exceeds 15.0 parts by weight, the resistance to cold and thermal shock may decrease.

On the other hand, the photopolymerization initiator (c3) contained in the photocurable mixture (C) is 0.5 to 7.5 parts by weight based on 100 parts by weight of the solid content of the photo solder resist composition of the present invention. Preferably, there is. If the amount is less than 0.5 part by weight, the photocurability may not be sufficient. If the amount exceeds 7.5 parts by weight, the double bond chain during photocuring becomes too short, and the hardness of the film may be reduced. . More preferably, it is 1.0 to 5.0 parts by weight.

The compound (c2) having a cyclic ether group contained in the photocurable mixture (C) is 5.0 to 15 parts by weight based on 100 parts by weight of the solid content of the photo solder resist composition of the present invention. Preferably, there is. If the amount is less than 5.0 parts by weight, heat resistance may be poor due to low curing density, and if it exceeds 15 parts by weight, the cured film may be brittle. More preferably, it is 7.5 to 12.0 parts by weight.

The photo solder resist composition of the present invention may contain an internal solvent, if necessary, in addition to the above components. This is used as an auxiliary agent for homogenizing the film, and can dissolve oily components in the above-mentioned components, and has a boiling point of 120 to 250 ° C, preferably 135 to 200 ° C. Specific examples include propylene glycol diacetate, dipropylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate. When this internal solvent is used, the amount is preferably 100 parts by weight or less, more preferably 25 parts by weight or less, based on 100 parts by weight of the solid content of the photo solder resist composition of the present invention.

The photo solder resist composition of the present invention may contain a coloring pigment. As the coloring pigment, for example, known pigments such as copper phthalocyanine, chlorinated phthalocyanine, and quinacridone red can be used. When a color pigment is contained, the content of the color pigment is preferably 0.02 to 4.0 parts by weight based on 100 parts by weight of the solid content of the photo solder resist composition of the present invention.
If the amount is less than 0.02 parts by weight, the coloring property is poor, and if the amount exceeds 4.0 parts by weight, the photocurability is reduced, and the film may be peeled off during development. More preferably, the amount is 0.05 to 1.0 part by weight.

The photo solder resist composition of the present invention can be obtained by mixing the above components.
First, a resin (A) is produced, and an inorganic filler (B) is added thereto.
It is common to add a coloring pigment as needed and to disperse the mixture, and to homogenize the dispersion by adding each component of the photocurable mixture (C) and, if necessary, an internal solvent. As a product form, a two-pack type composed of a mixture of a resin (A) and an inorganic filler (B) and a photocurable mixture (C), and a resin (A), an inorganic filler (B), and a photocurable mixture A one-pack type containing all of (C) is possible.

The photo solder resist composition of the present invention is obtained by neutralizing the resin (A) with a base to make it water-soluble, removing the solvent contained in the resin as required, and then removing the inorganic filler (B) and optionally the resin. The dispersion obtained by adding a coloring pigment may be used as an emulsion by adding each component of the photocurable mixture (C) and, if necessary, an internal solvent. Since the amount of the solvent can be reduced in this aqueous photosolder resist composition, it is extremely advantageous in terms of odor, working environment and the like. The thus obtained emulsion of the aqueous photo solder resist composition of the present invention has an area average particle diameter of 0.1 to 10.
It is preferably 0 μm, more preferably 0.3 to 2.0 μm. If it is less than 0.1 μm, production is difficult, and if it exceeds 10.0 μm, sedimentation or aggregation of particles may occur.

The solid content of the photo solder resist composition of the present invention is preferably 30 to 90% by weight,
~ 85% by weight is more preferred. If it is less than 30% by weight,
It is not economical, and if it exceeds 90% by weight, the viscosity may be too high and the production may be difficult.

The photo solder resist composition of the present invention is applied to a substrate such as a substrate and dried usually at 50 to 90 ° C. After drying, it is exposed to active energy rays such as ultraviolet rays, the unexposed portions are developed and removed with an alkaline cleaning solution, and the photo-cured portions are further heated at, for example, 140 to 170 ° C., so that the thermo-curing proceeds and the solder resist A film can be obtained.

[0043]

EXAMPLES Production Example 1 (A) Radical polymerizable group and carbo
Preparation of Resin Containing Xyl Group A 760 parts by weight of carbitol acetate was charged into a 2 L separable flask equipped with a reflux tube, a temperature controller, and a stirring blade, and the temperature was adjusted to 120 ° C. Here, styrene 20
A mixture of 0 parts by weight, 300 parts by weight of methacrylic acid, and 7.5 parts by weight of tert-butylperoxy-2-ethylhexanoate was added dropwise over 2 hours, and the reaction was continued for 1 hour. Then 50 parts by weight of carbitol acetate, t
A mixture of 0.75 parts by weight of tert-butyl peroxy-2-ethylhexanoate was added dropwise over 30 minutes, and the reaction was further continued for 1 hour. The temperature was raised to 130 ° C. and maintained for 2 hours. A mixture of 310 parts by weight of glycidyl methacrylate, 1.5 parts by weight of benzylmethylamine, and 1.5 parts by weight of hydroquinone was added thereto, and the reaction was continued for 8 hours under an air stream. Weight average molecular weight is 14200, acid value is 9
2.6 mg KOH / g. The amount of double bonds was 2.76 × 10 ⁻³ mol / g.

Production Example 2 (A) Radical polymerizable group and cal
Production of Resin Containing Boxyl Group 760 parts by weight of carbitol acetate was charged into a 2 L separable flask equipped with a reflux tube, a temperature controller and a stirring blade, and the temperature was adjusted to 120 ° C. A mixture of 160 parts by weight of p-methylstyrene, 40 parts by weight of methyl methacrylate, 300 parts by weight of methacrylic acid, and 7.5 parts by weight of tert-butylperoxy-2-ethylhexanoate was added dropwise over 2 hours. The reaction was continued for another hour. Then 50 parts by weight of carbitol acetate, ter
t-butyl peroxy-2-ethylhexanoate
75 parts by weight of the mixture was added dropwise over 30 minutes, and the reaction was continued for another 1 hour. The temperature was raised to 130 ° C. and maintained for 2 hours. Here, 310 parts by weight of glycidyl methacrylate,
A mixture of 1.5 parts by weight of benzyldimethylamine and 1.5 parts by weight of hydroquinone was added, and the reaction was continued under an air stream for 8 hours. Weight average molecular weight is 15500, acid value is 9
It was 2.4 mgKOH / g. The amount of double bonds was 2.79 × 10 ⁻³ mol / g.

Production Example 3 (A) Radical polymerizable group and cal
Preparation of Resin Containing Boxyl Group Propylene glycol monomethyl ether 76 was placed in a 2 L separable flask equipped with a reflux tube, a temperature controller, and a stirring blade.
0 parts by weight were charged, and the temperature was adjusted to 110 ° C. A mixture of 170 parts by weight of styrene, 30 parts by weight of t-butyl methacrylate, 300 parts by weight of methacrylic acid, and 17.5 parts by weight of tert-butyl peroxy-2-ethylhexanoate was added dropwise over 2 hours. The reaction was continued for one hour. Then, 50 parts by weight of propylene glycol monomethyl ether, tert-butyl peroxy-2-
A mixture of 0.75 parts by weight of ethyl hexanoate was added dropwise over 30 minutes, and the reaction was continued for another 1 hour.
The temperature was raised to 0 ° C. and held for 3 hours. Here, 300 parts by weight of glycidyl methacrylate, benzyldimethylamine 1.
A mixture of 5 parts by weight and 1.5 parts by weight of hydroquinone was added, and the reaction was continued under an air stream for 8 hours. The weight average molecular weight was 14,700, and the acid value was 96.9 mgKOH / g. The amount of double bonds was 2.61 × 10 ⁻³ mol / g.

Production Example 4 (A) Production of water-soluble resin 20 g of triethylamine was added to 200 g of the resin solution of Production Example 3.
And 600 g of ion-exchanged water were added thereto, followed by stirring for 1 hour. Then, a part of the solvent and water was removed under reduced pressure, and the solid content was 30.
A 0% by weight aqueous solution was obtained.

Production Example 5 Radical polymerizable group and carboxy
Production of Epoxy Resin Containing Hydroxyl Group (Conventional Example ) 400 weight of EOCN-104S (cresol novolac epoxy resin manufactured by Nippon Kayaku Co., Ltd.) in a 2 L separable flask equipped with a reflux tube, a temperature controller, and a stirring blade Parts, 740.5 parts by weight of carbitol acetate, 0.50 parts by weight of hydroquinone and 1.20 parts by weight of triphenylphosphine, and the temperature was controlled at 90 ° C. under an air stream. Here, 148.3 parts by weight of acrylic acid was added dropwise over 30 minutes, and the reaction was further continued for 24 hours. At this point, the acid value was almost 0. Then, tetrahydrophthalic anhydride 1
92.2 parts by weight was added, and the reaction was continued for 10 hours. The acid value of the obtained reaction product was 93.2 mgKOH / g.

Production Example 6 Radical polymerizable group and carboxy
Production of Epoxy Resin Containing Hydroxyl Group (Conventional Example ) 400 weight of EOCN-104S (cresol novolac epoxy resin manufactured by Nippon Kayaku Co., Ltd.) in a 2 L separable flask equipped with a reflux tube, a temperature controller, and a stirring blade Parts, propylene glycol monomethyl ether acetate 740.
5 parts by weight, 0.50 parts by weight of hydroquinone and 1.20 parts by weight of triphenylphosphine were charged, and the temperature was controlled at 90 ° C. under an air flow. Here, 148.3 parts by weight of acrylic acid was added dropwise over 30 minutes, and the reaction was further continued for 24 hours. At this point, the acid value was almost 0. Next, 192.2 parts by weight of tetrahydrophthalic anhydride was added, and the reaction was continued for 10 hours. The acid value of the obtained reaction product was 93.9 m.
gKOH / g.

Production Example 7 Production of water-soluble resin (conventional example) 20 g of triethylamine was added to 200 g of the resin solution of Production Example 6.
And 600 g of ion-exchanged water were added thereto, followed by stirring for 1 hour. Then, a part of the solvent and water was removed under reduced pressure, and the solid content was 30.
A 0% by weight aqueous solution was obtained.

Production Example 8 Radical polymerizable group and carboxy
Production of Resin Containing Hydroxyl Group (Reference Example) Production was performed in the same manner as in Production Example 1 except that styrene was replaced with methyl methacrylate. The weight average molecular weight was 17,600 and the acid value was 94.0 mgKOH / g.

Production Example 9 (C) Production of photocurable mixture 150 parts by weight of trimethylolpropane trimethacrylate and 40 parts by weight of pentaerythritol tetraacrylate as a polyfunctional acrylic monomer (c1), and a photopolymerization initiator (c3) Irgacure 907
(Ciba Geigy photopolymerization initiator) 22.0 parts by weight, diethylthioxanthone 8.0 parts by weight, EHPE3150 as a compound (c2) having a cyclic ether group, 180 parts by weight of Daicel Chemical's polyfunctional epoxy compound,
A photocurable mixture was prepared by mixing 100 parts by weight of propylene glycol monomethyl ether acetate as an internal solvent.

Production Example 10 Production of Pigment Dispersion 360 parts by weight of the resin solution of Production Example 1 (solid content 50% by weight), 298 parts by weight of B-34 (barium sulfate manufactured by Sakai Chemical Co.), 2.0 parts by weight of phthalocyanine blue The parts were mixed by a roll mill.

Production Example 11 Production of Pigment Dispersion 360 parts by weight of the resin solution of Production Example 2 (solid content: 50% by weight), 298 parts by weight of B-34 (barium sulfate manufactured by Sakai Chemical Co.), 2.0 parts by weight of phthalocyanine blue The parts were mixed by a roll mill.

Production Example 12 Production of Pigment Dispersion 600 parts by weight of the aqueous resin solution (solid content: 30% by weight) of Production Example 4, 298 parts by weight of B-34 (barium sulfate manufactured by Sakai Chemical Co.), 2.0 parts by weight of phthalocyanine blue And 60 parts by weight of ion-exchanged water were mixed with a Dyno mill.

Production Example 13 Production of Pigment Dispersion 360 parts by weight of the resin solution of Production Example 5 (solid content: 50% by weight), 298 parts by weight of B-34 (barium sulfate manufactured by Sakai Chemical Co.), 2.0 parts by weight of phthalocyanine blue The parts were mixed by a roll mill.

Production Example 14 Production of Pigment Dispersion 600 parts by weight of the resin aqueous solution (solid content 30% by weight) of Production Example 7, 298 parts by weight of B-34 (barium sulfate manufactured by Sakai Chemical Co.), 2.0 parts by weight of phthalocyanine blue And 60 parts by weight of ion-exchanged water were mixed with a Dyno mill.

Production Example 15 Production of Pigment Dispersion 360 parts by weight of the resin solution of Production Example 8 (solid content: 50% by weight), 298 parts by weight of B-34 (barium sulfate manufactured by Sakai Chemical Co.), 2.0 parts by weight of phthalocyanine blue The parts were mixed by a roll mill.

Example 1 Photo solder resist composition
Production 1 50 parts by weight of the solution of the photocurable mixture (C) obtained in Production Example 9 and 220 parts by weight of the pigment dispersion of Production Example 10 were mixed.

Example 2 Photo solder resist composition
Production 2 50 parts by weight of the solution of the photocurable mixture (C) obtained in Production Example 9 and 220 parts by weight of the pigment dispersion of Production Example 11 were mixed.

Example 3 Aqueous Photo Solder Resist Set
Production of product 1 (1) 50 parts by weight of the solution of the photocurable mixture (C) obtained in Production Example 9 and 320 parts by weight of the pigment dispersion of Production Example 12 were mixed.

Comparative Example 1 Photo Solder Resist Composition
Production 3 The solution of 50 parts by weight of the photocurable mixture (C) obtained in Production Example 9 and 220 parts by weight of the pigment dispersion of Production Example 13 were mixed.

Comparative Example 2 Aqueous Photo Solder Resist Set
Production of Product 2 50 parts by weight of the solution of the photocurable mixture (C) obtained in Production Example 9 and 320 parts by weight of the pigment dispersion of Production Example 14 were mixed.

Comparative Example 3 Photo Solder Resist Composition
Production 4 50 parts by weight of the solution of the photocurable mixture (C) obtained in Production Example 9 and 220 parts by weight of the pigment dispersion of Production Example 15 were mixed.

The compositions of Examples 1 to 3 and Comparative Examples 1 to 3 are summarized in Table 1. Table 1 shows that [the carboxyl group in the resin (A) / the cyclic ether group in the photocurable mixture (C)] in each photo solder resist composition.
And the content of the inorganic filler in each photo solder resist composition (parts by weight based on 100 parts by weight of the solid content of the photo solder resist composition) is also shown.

[0065]

[Table 1]

<Evaluation Tests> Examples 1 to 3 and Comparative Examples 1 to
3. A copper foil substrate on which a pattern is formed for evaluation of developability, solder heat resistance, gold plating resistance, and thermal shock resistance by screen-printing the photo solder resist composition of No. 3 to a thickness of 23 to 27 μm. And an IPC B-25 comb-type electrode coupon for evaluating electrical insulation, and dried at 80 ° C. for 20 minutes. After drying, the film was exposed to a negative film at 200 mj / cm ² , developed with a sodium carbonate aqueous solution having a spray pressure of 1 kg / cm ² , and then dried.
It was cured by heating to 0 ° C. Each of the obtained resist films was evaluated based on the following evaluation criteria. Further, the storage stability of the pigment dispersion was evaluated.

Developability: 50/50 of the obtained copper foil substrate
(Μm) Judgment was made visually from the degree of line omission. Solder heat resistance: A rosin-based flux is applied to the obtained copper foil substrate, immersed in a solder bath set at 260 ° C. in advance, and the flux is washed with denatured alcohol. Then, the resist layer is visually swollen and peeled. Was evaluated. The criteria are as follows.

◎: No peeling was observed even when immersion was repeated 6 times or more for 10 seconds. ：: No peeling was observed even when immersion was repeated 3 to 5 times for 10 seconds. Δ: 3 or more times immersion for 10 seconds. When peeling is repeated, slight peeling is observed. ×: When immersion is performed once for 10 seconds, swelling and peeling are observed. Electrical insulation: Volume specific resistivity was measured based on ASTM D257.

Gold plating resistance: The plating thickness was set to 0.1 μm, and evaluation was performed by peeling the tape after plating. Cold and thermal shock resistance: Maximum temperature 125 ° C, minimum temperature -65 ° C,
After 200 cycles were repeated with the holding time at each temperature being 10 minutes, a tape peeling test was performed.

Storage stability of pigment dispersion: The appearance was checked after standing at 40 ° C. for 2 weeks. Table 2 shows the evaluation results.

[0071]

[Table 2]

As is clear from the results shown in Table 2, the photoresist compositions of Examples 1 to 3 according to the present invention are excellent in developability, high in volume resistivity and excellent in electrical insulation. You can see that. In addition, solder heat resistance,
It can be seen that the plating resistance and the thermal shock resistance are excellent. Further, it can be seen that the storage stability of the pigment dispersion is excellent.

[0073]

According to the present invention, it is possible to obtain a photo solder resist composition having excellent properties such as gold plating resistance, cold shock resistance, and electrical insulation.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08K 5/00 C08K 5/00 4J100 5/103 5/103 C08L 25/02 C08L 25/02 G03F 7/004 501 G03F 7/004 501 7/027 502 7/027 502 7/028 7/028 7/40 501 7/40 501 // (C08L 25/02 C08L 63:00 Z 63:00) (72) Inventor Namba Osamu 19-17 Ikedanakamachi, Neyagawa-shi, Osaka Japan Paint Co., Ltd. (72) Inventor Keiichi Okajima 19-17 Ikedanakamachi, Neyagawa-shi, Osaka Japan Paint Co., Ltd. F-term (reference) 2H025 AA00 AA20 AB15 AC01 AD01 BC14 BC42 BC81 BC85 CB13 CB14 CB54 CC08 CC12 CC20 FA03 FA17 FA29 2H096 AA00 AA26 BA05 BA06 BA20 EA02 GA08 HA01 LA17 4F070 AA17 AA18 AA29 AB01 AB09 AC14 AC46 AE30 CA11 CA13 CB01 CB02 CB12 4J00 2 BC011 BC021 BG011 CD002 CD052 CD062 DG046 DJ006 DJ016 DJ046 DJ056 ED088 EE028 EE058 EH077 EN058 EU238 EV318 EW148 FD016 FD090 FD142 FD207 FD208 GP03 4J036 AA01 AD01 AF01 AF06 AJ08 FA01 FA08AB04 JA01 FA04

Claims (7)

[Claims] 1. A cyclic ether group of a vinyl monomer having a cyclic ether group is added to a carboxyl group of a radical copolymer containing (A) at least a vinyl aromatic compound and a carboxyl group-containing vinyl monomer as monomer units. A resin containing a radical polymerizable group and a carboxyl group, (B) an inorganic filler, (C) a polyfunctional acrylic monomer (c1), a compound having a cyclic ether group (c2), and a photopolymerization initiator (C
A photo solder resist composition containing a photocurable mixture comprising 3). 2. The resin (A) has a double bond amount of 1.0 × 10 ^{−3 to} 3.0 × 10 ⁻³ mol / g and a carboxyl group content of 30 to 200 mg KOH / g. 2. The photo solder resist composition according to item 1. 3. The molar ratio of the carboxyl group in the resin (A) to the cyclic ether group in the photocurable mixture (C) is 1.3 / 0.7 to 0.7 / 1 in molar ratio. 3. The photo solder resist composition according to claim 1, wherein 4. The method according to claim 1, further comprising a coloring pigment.
4. The photo solder resist composition according to any one of 3. 5. The photo solder resist according to claim 1, wherein the content of the inorganic filler (B) is 5 to 75 parts by weight based on 100 parts by weight of the solid content of the resist composition. Composition. 6. The aqueous emulsion-type photo solder resist composition according to claim 1, wherein the resin (A) is neutralized with a base and made water-soluble. 7. The photo solder resist composition according to claim 1, which is applied to a substrate, and
After drying at 90 ° C., exposure to active energy rays was carried out, and the unexposed portions were developed and removed with an alkaline cleaning solution.
A solder resist film obtained by heating at -170 ° C and curing.