JP2002279389A - Method and apparatus for manufacturing ic label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing an IC label, in which the ratio of breakage of ICs is reduced. SOLUTION: This manufacturing method 10 comprises a supply step of supplying an inlet 12 of a roll, a temporary fitting step 22 of temporarily fitting released paper 50 to the inlet 12, an affixing step 24 of affixing an upper paper 54 to the inlet 12, and a winding step 32 of winding a label continuous body 77. Static elimination devices 36, 38, 40 and 42 are provided in the respective steps 14, 22, 24 and 32 to remove static electricity charged on the inlet 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for manufacturing an IC label, and more particularly to a method and an apparatus for manufacturing an IC label for manufacturing an IC label from a belt-shaped IC inlet having an IC.

[0002]

2. Description of the Related Art In recent years, an IC including an IC and an antenna has been developed.
Labels are being developed. This IC label is attached to the object to be managed, and the RFID (Radio Frequency Identif
ication) system. IC label is I
Since a large amount of data can be stored in C and data can be read and written in a non-contact manner with a scanner via an antenna, it is suitable for managing information.

[0003] By the way, an IC label is manufactured using a band-shaped IC inlet holding a large number of IC units (IC and antenna) at predetermined intervals. First, a strip-shaped release paper having an adhesive applied to the front surface is temporarily attached to the back surface of the IC inlet. Then, after attaching a band-shaped upper paper having an adhesive on the back surface to the front surface of the IC inlet, the upper paper and the inlet are cut into a predetermined shape, and an unnecessary portion (waste) is wound up. In this way, a band-shaped material in which an IC label having a predetermined shape is temporarily attached to a band-shaped release paper, that is, a label continuous body is manufactured.

[0004]

However, in the conventional manufacturing apparatus, the static electricity generated in the manufacturing process causes
C was damaged. Since data cannot be accurately written to a damaged IC, the damaged IC must be replaced with a normal IC, and the production efficiency of the IC label is low.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method and an apparatus for manufacturing an IC label that can reduce the breakage rate of an IC.

[0006]

According to a first aspect of the present invention, there is provided a method of manufacturing an IC label having an IC, the method comprising: supplying an IC inlet; And temporarily attaching the IC inlet to the upper layer of the release paper;
A sticking step of sticking a label on the upper layer of the inlet, a printing step of printing an identification mark on the release paper or the label, detecting the identification mark, and detecting the label and the IC
A die-cutting step of die-cutting an inlet at regular intervals; a scrap removing step of winding up a die-cut unnecessary portion; a winding step of winding up a die-cut IC label; and the IC inlet, the label, and the IC A static elimination step of removing at least one static electricity among the labels.

According to a third aspect of the present invention, there is provided an apparatus for manufacturing an IC label having an IC.
Supply means for supplying the IC inlet, temporary adhesive means for applying an adhesive to a strip-shaped release paper, and temporarily attaching the IC inlet to the upper layer of the release paper, and sticking for attaching a label to the upper layer of the IC inlet Attaching means, printing means for printing an identification mark on the release paper or the label, die-cutting means for detecting the identification mark, and die-cutting the label and the IC inlet at regular intervals, and unnecessary die-cutting. A scrap removing means for winding a part, a winding means for winding a die-cut IC label, the IC inlet, the label,
A static eliminator for removing at least one static electricity from the IC label.

According to the first and third aspects of the present invention, an IC
Since the static electricity charged in the inlet is removed, the IC in the IC inlet is not damaged by static electricity. Therefore, the breakage rate of the IC in the manufacturing process of the IC label is reduced, and the IC label can be manufactured efficiently.

According to the second and fourth aspects of the present invention, a static elimination step or a static elimination means is provided in the step or means for generating static electricity.
Are not electrostatically damaged.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a method and an apparatus for manufacturing an IC label according to the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic diagram showing an apparatus 10 for producing a continuous label body.

The manufacturing apparatus 10 shown in FIG.
The inlet 1 is connected to the supply shaft 16 of the supply step 14.
2 of the roll body is attached. As shown in FIG. 2, the inlet 12 has an I
It is a belt-like material holding the C units at predetermined intervals. The inlet 12 is rewound from the supply shaft 16 as shown in FIG.
6. After forming the label continuous body 77 through the die removing step 28 and the scrap removing step 30, the winding shaft 34 in the winding step 32
It is wound up.

The supply step 14 is provided with a static eliminator 36 after the supply shaft 16. This static eliminator 36 removes static electricity generated in the supply step 14. The static eliminator 36
Will be described later together with the other static eliminators 38, 40, and 42.

The temporary attachment step 22 includes a release paper supply shaft 44, a coating section 46, a roller 48, and an ear slit section 52. A strip-shaped release paper 50 wound in a roll shape is mounted on the release paper supply shaft 44. The release paper 50 is rewound from the release paper supply shaft 44 and sent out to the application unit 46, where the hot melt adhesive 47 is applied by the application unit 46 as shown in FIG. Therefore, the roller 4 shown in FIG.
When the inlet 12 is pressed toward the release paper 50 by 8, the inlet 12 and the release paper 50 are temporarily attached. The temporarily attached inlet 12 and release paper 50 are cut to a predetermined width by the ear slit 52.

In the temporary attachment step 22, a static eliminator 38 is provided downstream of the roller 48. The static eliminator 38 includes a roller 4
8 removes static electricity generated when the inlet 12 is pressed.

The sticking step 24 is a step of sticking a band-shaped top paper 54 having an adhesive 66 (see FIG. 2) on the back surface to the front surface of the inlet 12.
6 is unwound from the upper paper supply shaft 58 together with the release plate 6
Sent to 0. Then, only the release paper for top paper 56 is turned by the release plate 60 and wound on the release paper winding shaft 62. On the other hand, the upper paper 54 peeled from the upper paper release paper 56 is pressed against the inlet 12 by the rollers 64. Thereby, the upper paper 54 is adhered to the surface of the inlet 12 via the adhesive 66 (see FIG. 2).

In the attaching step 24, a static eliminator 40 is provided downstream of the roller 64. The static eliminator 40 performs the attaching step 24
Remove static electricity generated in

In the printing step 26, the inlet 12 is detected by a transmission type sensor (not shown), and intermittent printing is performed based on the detection timing. Then, as shown in FIG. 2, the identification mark 68 is printed on the back surface of the release paper 50 and the temporary identification mark 70 is printed on the front surface of the upper paper 54.

The stamping step 28 has a sensor 74 for detecting a temporary identification mark 70 (see FIG. 2).
Based on the timing at which the temporary identification mark 70 is detected,
The inlet 12 and the upper paper 54 are cut into a predetermined shape. Each of the cut-out inlets 12 has an IC 1
8 and an antenna 20 are provided. Thereby, IC18
And an IC label 76 having the antenna 20 is formed.

The waste (unnecessary portion) 72 of the inlet 12 and the upper paper 54 that has been die-cut in the die-cutting step 28 is removed in the waste-cutting step 30. In the scrap removing step 30, the scrap 72 is wound by the scrap winding shaft 80 together with the temporary identification mark 70 printed in the printing step 26. As a result, FIG.
., A label continuous body 77 is formed in which IC labels 76, 76... Are temporarily attached to the strip-shaped release paper 50 at predetermined intervals.

The continuous label body 77 is wound in a roll around the winding shaft 34 in the winding step 32. In the winding step 32,
A static eliminator 42 for removing static electricity charged on the label continuum 77 is provided.

Next, the configuration of each of the static eliminators 36, 38, 40 and 42 will be described by taking the static eliminator 38 as an example.

FIG. 4 is a perspective view showing the static eliminator 38. As shown in the figure, the static eliminator 38 includes a support member 82.
The support member 82 is disposed in the width direction of the inlet 12. The static elimination cloth 84 supports the support member 8.
2 and is in sliding contact with the inlet 12. (Note that
The static elimination cloth of the static eliminator 36 is slid on the inlet 12, the static elimination cloth of the static eliminator 40 is slid on the upper paper 54, and the static elimination cloth of the static eliminator 42 is slid on the label continuous body 77. The static elimination cloth 84 includes conductive fibers, and removes static electricity charged in the inlet 12 by slidingly contacting the inlet 12.

Next, the operation of the manufacturing apparatus 10 configured as described above will be described.

It is known that when a strong external force is applied due to friction or the like, static electricity is generated on the surface of the substance and the substance is charged. Accordingly, static electricity is generated when the inlet 12 is pressed by pressing the inlet 12 by winding the inlet 12 or bonding the release paper 50 or the like to the inlet 12.
The static electricity is the main cause of damage to the IC 18, and the static elimination cloth 84 prevents the static electricity from charging the inlet 12. That is, each of the processes 14, 22, in which static electricity is generated,
The static eliminators 36, 38, 40, and 42 are provided at 24 and 32, respectively.
Is provided, the static electricity is quickly removed and the inlet 12 is prevented from being charged. For example, supply step 1
A static eliminator 36 is provided downstream of the supply shaft 16 of No. 4.
This static eliminator 36 quickly removes static electricity generated when the inlet 12 is rewound. A static eliminator 38 is provided downstream of the roller 48 in the temporary attachment step 22, and the static eliminator 38 quickly removes static electricity generated when the roller 48 presses the inlet 12. Further, a static eliminator 40 is provided at a stage subsequent to the roller 64 in the sticking step 24. Static electricity generated when 56 is peeled off is removed. Further, a static eliminator 42 is provided in the winding step 32, and the static eliminator 42 removes static electricity generated when the waste 72 is peeled off and static electricity generated when the label continuous body 77 is wound. You.

As described above, according to the manufacturing apparatus 10 of the present embodiment, each of the steps 14, 2,
Since the static eliminators 36, 38, 40, and 42 are provided at 2, 24, and 32 to quickly remove static electricity and prevent the charging of the inlet 12, the breakage rate of the IC 18 can be significantly reduced. Therefore, the manufacturing efficiency of the IC label 76 can be improved.

Each of the static eliminators 36, 38, 40, 42
Is a simple configuration made of the charge eliminating cloth 84, so that the cost is low.

In the above-described embodiment, the charge removing cloth 84 is used as the charge removing means, but the present invention is not limited to this. For example, as shown in FIG.
6 may be used. Discharging brush 86 is attached to the support member 82, the tip portion is in sliding contact with the inlet 12.
Since the neutralizing brush 86 has appropriate rigidity, it can be installed below the inlet 12. In addition, by grounding the neutralization brush 86 and the neutralization cloth 84, the neutralization efficiency can be further improved.

Further, as the charge removing means, a device for discharging electrons having a charge opposite to the charge charged in the inlet 12 toward the inlet 12 may be used.

The places where the static eliminators 36, 38, 40 and 42 are installed are not limited to the above-described embodiments, but are preferably installed in places where static electricity is likely to be generated. For example, if a static eliminator is provided in the scrap removing step 30, the static electricity generated when the scrap 72 is peeled off from the label continuous body 77 can be quickly removed. Further, when a platen roller (not shown) is used in the printing step 26, it is preferable to provide a static eliminator after the platen roller. Further, when a roller with a blade is used in the die-cutting step 28, it is preferable to provide the roller after the roller.

[0031]

As described above, according to the method and apparatus for manufacturing an IC label according to the present invention, the static electricity charged in the IC inlet is removed and the electrostatic breakdown of the IC is prevented. Labels can be processed efficiently.

[Brief description of the drawings]

FIG. 1 is a schematic view showing the configuration of an IC label manufacturing apparatus according to the present invention.

FIG. 2 is a schematic diagram showing a configuration of an inlet, a release paper, and a top paper.

Figure 3 is a schematic view showing the structure of the label continuum

FIG. 4 is a perspective view showing a static eliminator;

Figure 5 is a perspective view showing the FIG. 4 differs from the static eliminator

[Explanation of symbols]

10 manufacturing apparatus, 12 inlet, 14 supply step,
16: Supply shaft, 18: IC, 20: Antenna, 22: Temporary attachment process, 24: Adhesion process, 26: Printing process, 28: Die removal process, 30: Dust removal process, 32: Winding process, 34 ...
Winding shaft, 36, 38, 40, 42 ... static eliminator, 50 ...
Release paper, 54 ... over paper, 72 ... waste, 76 ... IC label,
77… Continuous label

Claims (4)

[Claims] 1. A method of manufacturing an IC label having an IC, comprising: a supply step of supplying an IC inlet; a temporary adhesive for applying an adhesive to a strip-shaped release paper and temporarily attaching the IC inlet to an upper layer of the release paper. A step of attaching a label to an upper layer of the IC inlet; a printing step of printing an identification mark on the release paper or the label; and detecting the identification mark to keep the label and the IC inlet constant. A die-cutting step of die-cutting at an interval, a scrap-removing step of winding up a die-cut unnecessary part, a winding-up step of winding up a die-cut IC label, and the IC inlet, the label, and the IC label A method of manufacturing an IC label, comprising: a step of removing at least one static electricity. 2. The IC according to claim 1, wherein the charge removing step is included in at least one of the supplying step, the temporary attaching step, the attaching step, and the winding step. Label manufacturing method. 3. An apparatus for manufacturing an IC label having an IC, a supply means for supplying an IC inlet, a temporary adhesive for applying an adhesive to a strip-shaped release paper, and temporarily attaching the IC inlet to an upper layer of the release paper. Means, a sticking means for sticking a label on the upper layer of the IC inlet, a printing means for printing an identification mark on the release paper or the label, and detecting the identification mark to keep the label and the IC inlet constant. Die-cutting means for die-cutting at intervals, scrap-removing means for winding the die-cut unnecessary part, winding means for winding-up the die-cut IC label, among the IC inlet, the label, and the IC label An IC label manufacturing apparatus, comprising: at least one static eliminator for removing static electricity. 4. The IC according to claim 3, wherein said static elimination means is included in at least one of said supply means, said temporary attachment means, said sticking means and said winding means. Label manufacturing equipment.