JP2006178807A - Apparatus and method for manufacturing ic sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture an IC sheet without performing pressure-contact. <P>SOLUTION: In this IC sheet manufacturing apparatus 100, a release paper supplier 110 continuously supplies release paper 113 in one direction. An adhesive applier 132 applies a heated and melted hot melt adhesive on the release paper 113. An IC inlet sticking machine 130 places a planar IC inlet 135 on the hot melt adhesive. A seal member sticking machine 150 sticks a band shaped seal member 153 with the adhesive applied on one surface onto the upper surface of the IC inlet 135. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a manufacturing apparatus and a manufacturing method for a non-contact type IC sheet including an IC chip and an antenna.

  In recent years, an antenna and an IC chip are included in a base material, data is transmitted and received via radio waves from an external reader / writer, and data in the IC chip can be read or rewritten, A non-contact type data management system capable of transmitting and receiving data without directly contacting an IC chip with an external reader / writer is used.

  In such a non-contact type data management system, for example, by attaching an IC sheet including an antenna and an IC chip to an ID card, employee ID card, commuter pass, pass ticket, credit card, product tag, delivery tag, etc. Management of information stored in the IC chip is performed.

  As an IC sheet manufacturing apparatus to be affixed to an ID card, an employee ID card, a commuter pass, a pass ticket, a credit card, a product tag, a delivery tag, etc., an apparatus described in Patent Document 1 has been adopted.

  Here, an IC sheet manufacturing apparatus 500 described in Patent Document 1 will be described with reference to FIG.

  In the IC sheet manufacturing apparatus 500 described in Patent Document 1, a belt-shaped heat-fusible base material 501 is transported by a belt conveyor 502, and the transported base material 501 is provided with an IC chip and an antenna coil. The IC inlet 503 is placed, the base member 501 is heated by the heater 504A, and the IC inlet 503 is pressed against the base member 501 by the pressing machine 505A to press-contact them.

Further, a heat-fusible sealing member 506 is placed on the IC inlet 503, the sealing member 506 is heated by the heater 504B, and the IC inlet 503 is pressed against the sealing member 506 by the pressing machine 505B. The IC sheet 507 in which the base member 501, the IC inlet 503, and the seal member 506 are bonded together has been manufactured.
Japanese Patent No. 3372214

  However, as described in Patent Document 1, if the IC inlet 503 is pressed by pressing against the base member 501 or the seal member 506, the IC chip may be damaged or the antenna may be disconnected when pressed. As described above, the IC module was lost.

  In particular, when the IC chip is miniaturized and the antenna wire is reduced in diameter, there are many defects in the pressing process, which is inconvenient.

  Accordingly, an object of the present invention is to provide an IC sheet manufacturing apparatus and a manufacturing method which prevent an IC module from being damaged by manufacturing an IC sheet without pressure contact.

  In order to solve the above problems, the present invention provides a release paper supply means for continuously supplying a strip-like release paper in one direction, a downstream side of the release paper supply means in the one direction, IC inlet sticking means for placing the IC inlet on the adhesive applied to the release surface of the release paper, and disposed on the downstream side of the IC inlet sticking means in the one direction, the surface of the IC inlet. A sealing member attaching means for placing a belt-like sealing member coated with an adhesive on one side on a surface facing the surface attached to the release paper, and a downstream side of the sealing member attaching means in the one direction And an IC sheet winding unit that winds an IC sheet on which the release paper, the IC inlet, and the seal member are bonded to each other.

  By providing such an IC sheet manufacturing apparatus, the IC inlet containing the IC chip and the antenna is not pressed against the release paper and the seal member, so that the IC inlet is not damaged.

  Here, it is desirable to provide an adhesive application means for applying an adhesive to the release surface of the release paper between the release paper supply means and the IC inlet sticking means.

  By providing such an adhesive application means, the IC inlet and the release paper can be easily bonded together by simply placing the IC inlet before the applied adhesive hardens.

  Here, with respect to the pressure-sensitive adhesive application means, it is possible to easily apply the IC inlet and the release paper simply by placing the IC inlet on the molten hot-melt pressure-sensitive adhesive by using a device that applies a hot-melt pressure-sensitive adhesive. Can be pasted together.

  As for the IC inlet sticking means, it is desirable that each IC inlet is cut from a strip-shaped IC inlet roll in which a large number of IC inlets are continuous and bonded to a release paper.

  And, between the IC inlet adhering means and the seal member adhering means, an excess adhesive is removed by providing an adhesive removing means for removing the adhesive protruding from the bonded IC inlet. Will be able to.

  Further, between the sealing member adhering means and the IC sheet winding means, an IC inlet, or a cutting means for cutting the IC inlet and the sealing member into a predetermined size and shape, are disposed downstream of the cutting means. In addition, by providing the IC inlet cutting waste cut by the cutting means, or the IC inlet and the cutting waste collecting means for collecting the cutting waste of the sealing member, the seal member and the IC inlet have a desired size. -It can be cut into shapes, and these cutting wastes can be collected.

  The present invention also provides a release paper supply process for continuously supplying a strip-like release paper in one direction, and an IC inlet on which a flat-plate IC inlet is placed on an adhesive applied to the release surface of the release paper. A sticking process, and a sealing member sticking process of placing a band-shaped sealing member coated with an adhesive on one side on the surface of the IC inlet and facing the surface pasted to the release paper; An IC sheet manufacturing method comprising: an IC sheet winding process for winding an IC sheet on which a release paper, the IC inlet, and the seal member are bonded together.

  By providing such an IC sheet manufacturing method, the IC inlet containing the IC chip and the antenna is not pressed against the release paper and the seal member, so that the IC inlet is not damaged.

  Here, it is desirable to provide an adhesive application process for applying an adhesive to the release surface of the release paper between the release paper supply process and the IC inlet attaching process.

  By providing such an adhesive application process, it is possible to easily attach the IC inlet and the release paper only by placing the IC inlet before the applied adhesive hardens.

  Here, the adhesive application process is a process of applying a hot-melt adhesive that has been heated and melted, so that the IC inlet and the release paper can be easily placed by simply placing the IC inlet on the molten hot-melt adhesive Can be pasted together.

  And about an IC inlet sticking process, it is desirable to cut | disconnect each IC inlet from the strip | belt-shaped IC inlet roll in which many IC inlets continued, and to affix on a release paper.

  Also, between the IC inlet attaching process and the sealing member attaching process, an adhesive removing process for removing the adhesive protruding from the bonded IC inlet is provided to remove excess adhesive. Can do.

  Furthermore, between the sealing member attaching process and the IC sheet winding process, the sealing member, or the cutting process of cutting the IC inlet and the sealing member into a predetermined size and shape, and the cutting process are performed. It is possible to cut the seal member and the IC inlet into a desired size and shape by providing a sealing member or a cutting waste collecting process for collecting cutting waste of the IC inlet and the sealing member. These cutting wastes can be collected.

  As described above, according to the present invention, since the IC inlet is not pressed against the release paper and the seal member, the IC inlet is not damaged.

  In addition, by cutting individual IC inlets from the IC inlet roll and then bonding them to the release paper, it is possible to cut easily compared to the case where the release paper and the seal member are bonded to the IC inlet and then cut. Thus, damage to the IC inlet can be prevented.

  Furthermore, it is possible to remove excess adhesive by removing the adhesive protruding from the bonded IC inlet.

  FIG. 1 is a schematic configuration diagram of an IC sheet manufacturing apparatus 100 according to the first embodiment of the present invention.

  The IC sheet manufacturing apparatus 100 according to the present embodiment includes a release paper supply machine 110 as a release paper supply means, a hot melt gun 120 as an adhesive application means, and an IC inlet sticking machine 130 as an IC inlet sticking means. And a seal member sticking machine 150 as a seal member sticking means and an IC sheet winder 180 as an IC sheet winding means.

  The release paper feeder 110 is configured so that the release paper roll 112 can be detachably attached to the rotary shaft 111, and the release paper 113 is removed from the release paper roll 112 attached to the rotary shaft 111 at a predetermined speed. The rotating shaft 111 rotates at a predetermined speed so that it can be continuously supplied in one direction (here, the direction of the IC sheet winder 180 described later).

  The release paper 113 may be appropriately selected and used as long as it can be easily removed from a hot melt adhesive sprayed from a hot melt gun 120 described later. What formed the peeling surface which has silicon as a main component is used.

  Note that the release paper roll 112 is attached to the rotating shaft 111 so that the release surface comes to the upper side of FIG. 1 (the side where a hot melt gun 120 described later is installed).

  In addition, tension rolls 190 that rotate in the traveling direction of the release paper 113 are provided at appropriate intervals in the supply path of the release paper 113 so that the release paper 113 travels on the tension roll 190. Therefore, the release paper 113 is prevented from being excessively bent.

  The hot melt gun 120 is installed on the most upstream side on the supply path of the release paper 113 supplied from the release paper supply machine 110.

  The hot melt gun 120 heats and melts the hot melt adhesive and applies the hot melt adhesive to the release surface of the release paper 113 at a predetermined interval and with a uniform thickness.

  What is necessary is just to select suitably the space | interval which the hot-melt gun 120 apply | coats a hot-melt adhesive according to the magnitude | size and shape of IC inlet 135 stuck with the IC inlet sticking machine 130 mentioned later.

  Also, the hot melt adhesive applied with the hot melt gun 120 may be appropriately selected according to the release paper 113 to be used, but in the present embodiment, an elastomeric hot melt adhesive is used. .

  The IC inlet sticking machine 130 is composed of an IC inlet supply part 131 and an IC inlet sticking part 132, which is downstream of the hot melt gun 120 on the supply path of the release paper 113 and is hot It is installed at a position adjacent to the melt gun 120.

  The IC inlet supply unit 131 forms a non-contact type IC module composed of an IC chip and an antenna to which the IC chip is connected in a row in a strip-like base material so as to have a predetermined interval, and is in a roll shape. The IC inlet roll 133 wound around is attached to the rotating shaft 134, and the rotating shaft 134 is rotated at a predetermined speed so that the strip-shaped IC inlet is supplied from the IC inlet roll 133 to the IC inlet attaching portion 132. Has been.

  The IC inlet sticking unit 132 divides the strip-shaped IC inlet supplied from the IC inlet supply unit 131 into individual IC inlets 135 by cutting into a predetermined size and shape. Each IC inlet 135 is placed on the applied hot melt adhesive.

  Any IC inlet 135 may be used as long as it can mount an IC chip and an antenna and exchange data without contacting a data reader / writer.

  The seal member sticking machine 150 is configured by a seal member supply unit 151 and a seal member sticking roll 152, and is downstream of the IC inlet sticking machine 130 on the supply path of the release paper 113, and , Installed at a position adjacent to the IC inlet sticking machine 130.

  The seal member supply unit 151 is configured such that a seal member roll 154 wound with a belt-like seal member 153 coated with an adhesive on one side can be detachably attached to the rotary shaft 155. By rotating 155 at a predetermined speed, the seal member 153 can be supplied to the seal member sticking roll 152.

  The seal member attaching roll 152 is attached by placing the seal member 153 supplied from the seal member supply unit 151 on the IC inlet from above the IC inlet 135.

  That is, the seal member sticking roll 152 has a surface on which the adhesive of the seal member 153 is applied facing the IC inlet 135, and the IC inlet 135 is placed between the seal member sticking roll 152 and the release paper 113. It is formed in the shape of a shaft having a shape and size such that an interval similar to the thickness is provided.

  When the IC inlet 135 comes into contact with the seal member sticking roll 152 by attaching an elastic cushioning material (for example, rubber) to the contact surface of the seal member sticking roll 152 with the seal member 153. However, damage to the IC inlet 135 can be prevented.

  As for the size and shape of the seal member 153, those having a size and shape that can cover the upper surface of the IC inlet 135 may be appropriately selected and used.

  An IC sheet winder 180 is provided at the most downstream position on the supply path of the release paper 113, and the IC sheet winder 180 includes the release paper 113, the IC inlet 135, and the seal member 153 as described above. The rotating shaft 181 can be rotated at a predetermined speed so that the bonded IC sheet 182 can be wound around the rotating shaft 181.

  A method of manufacturing the IC sheet 182 by the IC sheet manufacturing apparatus 100 configured as described above will be described with reference to the flowchart shown in FIG.

  The release paper 113 is supplied in one direction at a predetermined speed from the release paper roll 112 attached to the rotating shaft 111 of the release paper feeder 110 (S200).

  The hot melt adhesive heated and melted by the hot melt gun 120 is applied to the release paper 113 supplied from the release paper feeder 110 at a predetermined interval and a uniform thickness (S201).

  Further, the IC inlet 135 individually divided by the IC inlet sticking machine 130 is placed on the hot melt adhesive applied by the hot melt gun 120 (S202).

  A band-shaped seal member 153 having a pressure-sensitive adhesive applied on one side is placed on the IC inlet by the seal member sticking machine 150 on the IC inlet 135 (S203).

  The IC sheet 182 to which the release paper 113, the IC inlet 135, and the seal member 153 are bonded as described above is wound up by the IC sheet winder 180 (S204).

  As described above, according to the IC sheet manufacturing apparatus 100 according to the present embodiment, when the release paper 113, the IC inlet 135, and the seal member 153 are bonded together, they are mounted on the IC inlet 135 because they are not pressed. The IC chip and antenna are not damaged.

  FIG. 3 is a schematic configuration diagram of an IC sheet manufacturing apparatus 300 according to the second embodiment of the present invention.

  The IC sheet manufacturing apparatus 300 according to the present embodiment includes a release paper supply machine 110 as a release paper supply means, a hot melt gun 120 as an adhesive application means, and an IC inlet sticking machine 130 as an IC inlet sticking means. A vacuum machine 340 as an adhesive removing means, a seal member sticking machine 150 as a seal member sticking means, a cutter machine 360 as a cutting means, a cutting waste collecting machine 370 as a cutting waste collecting means, And an IC sheet winder 180 serving as an IC sheet winding means.

  Here, the IC sheet manufacturing apparatus 300 according to the present embodiment has a configuration in which a vacuum machine 340, a cutter machine 360, and a cutting waste collecting machine 370 are added to the IC sheet manufacturing apparatus 100 according to the first embodiment. Since the configuration is the same, only these will be described below.

  The vacuum machine 340 is installed between the IC inlet sticking machine 130 and the seal member sticking machine 150.

  Here, the vacuum machine 340 is installed for sucking out the hot melt adhesive protruding from the IC inlet 135 placed by the IC inlet sticking machine 130, and can reach such a purpose. The specific configuration may be selected as appropriate.

  The cutting machine 360 is installed between the seal member sticking machine 150 and a cutting waste collecting machine 370 described later.

  The cutting machine 360 cuts the sealing member 153 pasted by the sealing member sticking machine 150, and has a blade 361 formed in a size and shape that matches the shape of the upper surface of the IC inlet 135, and the blade 361. And a drive unit 362 that displaces the release sheet 113 in a direction perpendicular to the traveling direction of the release paper 113 (up and down direction in FIG. 1). The blade 361 cuts only the seal member 153, and the release paper 113 is The position that does not cut is displaced.

  Here, as for the size and shape of the sealing member 153 to be bonded by the sealing member bonding machine 150, a size and shape that can cover the upper surface of the IC inlet 135 may be appropriately selected and used. In addition, there is a blank around the entire periphery of the IC inlet 135, and the cutting waste 356 cut by the cutting machine 360 is formed into a continuous band shape. Will be able to take.

  The cutting waste collecting machine 370 is installed between the cutting machine 360 and the IC sheet winder 180.

  The cutting waste collecting machine 370 can rotate the rotary shaft 371 at a predetermined speed so that the cutting waste 356 of the seal member 153 cut by the cutting machine 360 can be wound around the rotary shaft 371. ing.

  A method of manufacturing the IC sheet 382 by the IC sheet manufacturing apparatus 300 configured as described above will be described with reference to the flowchart shown in FIG.

  The release paper 113 is supplied in one direction at a predetermined speed from the release paper roll 112 attached to the rotating shaft 111 of the release paper feeder 110 (S400).

  The hot melt adhesive heated and melted by the hot melt gun 120 is applied to the release paper 113 supplied from the release paper feeder 110 at a predetermined interval and a uniform thickness (S401).

  Also, the IC inlet 135 individually divided by the IC inlet sticking machine 130 is placed on the hot melt adhesive applied by the hot melt gun 120 (S402).

  The hot melt adhesive protruding from the IC inlet 135 placed by the IC inlet sticking machine 130 is sucked by the vacuum machine 340 (S403).

  A strip-shaped seal member 153 having a pressure-sensitive adhesive applied on one side is placed on the IC inlet by the seal member applicator 150 on the IC inlet 135 (S404).

  The sealing member 153 is cut by the cutting machine 360 in accordance with the shape of the upper surface of the IC inlet 135 (S405).

  The cutting waste 356 obtained by cutting the seal member 153 by the cutting machine 360 is wound up by the cutting waste collection machine 370 and collected (S406).

  The IC sheet 382 on which the release paper 113, the IC inlet 135, and the seal member 153 are bonded as described above is wound up by the IC sheet winder 180 (S407).

  As described above, according to the IC sheet manufacturing apparatus 300 according to the present embodiment, when the release paper 113, the IC inlet 135, and the seal member 153 are bonded together, they are not pressed as in the first embodiment. The IC chip and the antenna mounted on the IC inlet 135 are not damaged.

  Further, in the present embodiment, since the vacuum machine 340 is provided, the hot melt pressure-sensitive adhesive protruding from the bonded IC inlet 135 can be removed.

  Furthermore, in this embodiment, since the cutting machine 360 of the sealing member 153 and the cutting waste collection machine 370 that collects the cutting waste 356 are provided, the excess sealing member 153 can be removed and recovered.

  In the embodiment described above, the hot melt pressure-sensitive adhesive is used when the release paper 113 and the IC inlet 135 are bonded to each other. However, the present invention is not limited to this, and other pressure-sensitive adhesive is used. It is also possible.

  Here, in the case of using another adhesive instead of the hot melt adhesive, instead of the hot melt gun 120, the adhesive to be used is spaced from the release surface of the release paper 113 at a predetermined interval, and A material that can be applied to a uniform thickness can be selected and used as appropriate, and a material that has already been coated with a pressure-sensitive adhesive on the release surface of the release paper 113 and wound in a roll shape can also be used. Is possible.

  In addition, when using the thing which already applied the adhesive to the release surface of the release paper 113 and wound it in a roll shape, before attaching the IC inlet 135, the adhesive is applied by an appropriate melting means such as a heater. It is desirable to bond the IC inlet 135 after melting the agent.

The schematic block diagram of the IC sheet manufacturing apparatus 100 which concerns on 1st embodiment. The flowchart showing the method of manufacturing the IC sheet 182 with the IC sheet manufacturing apparatus 100. The schematic block diagram of the IC sheet manufacturing apparatus 200 which concerns on 2nd embodiment. The flowchart showing the method of manufacturing the IC sheet 382 with the IC sheet manufacturing apparatus 300. The schematic block diagram of the conventional IC sheet manufacturing apparatus 300. FIG.

Explanation of symbols

100, 300 IC sheet manufacturing apparatus 110 Release paper feeder 113 Release paper 120 Hot melt gun 130 IC inlet sticking machine 135 IC inlet 340 Vacuum machine 150 Seal member sticking machine 153 Seal member 360 Cutter machine 370 Cutting waste collecting machine 180 IC Sheet winder

Claims (12)

Release paper supply means for continuously supplying strip-shaped release paper in one direction;
IC inlet adhering means that is disposed on the downstream side of the release paper supply means in the one direction and places a flat-plate IC inlet on the adhesive applied to the release surface of the release paper;
A belt-like shape in which a pressure-sensitive adhesive is applied to one side of the surface of the IC inlet that is disposed on the downstream side of the IC inlet sticking means in the one direction and faces the surface pasted on the release paper. A sealing member attaching means for placing the sealing member;
An IC sheet winding means that is disposed downstream of the sealing member sticking means in the one direction and winds up the IC sheet on which the release paper, the IC inlet, and the sealing member are bonded;
An IC sheet manufacturing apparatus comprising:   2. The IC sheet manufacturing method according to claim 1, further comprising an adhesive application unit that applies an adhesive to a release surface of the release paper between the release paper supply unit and the IC inlet attachment unit. apparatus.   3. The IC sheet manufacturing apparatus according to claim 2, wherein the pressure-sensitive adhesive application unit applies a hot-melt pressure-sensitive adhesive that is heated and melted.   4. The IC inlet attaching means according to any one of claims 1 to 3, wherein each IC inlet is cut from a strip-shaped IC inlet roll in which a large number of IC inlets are continuous and bonded to the release paper. The IC sheet manufacturing apparatus according to claim 1.   The adhesive removal means for removing the adhesive protruding from the bonded IC inlet is provided between the IC inlet attaching means and the seal member attaching means. The IC sheet manufacturing apparatus according to claim 1. Between the sealing member sticking means and the IC sheet winding means,
Cutting means for cutting the seal member or the IC inlet and the seal member into a predetermined size and shape;
Cutting waste collecting means for collecting cutting waste of the sealing member, which is disposed downstream of the cutting means, and cut by the cutting means, or cutting waste of the IC inlet and the sealing member;
The IC sheet manufacturing apparatus according to any one of claims 1 to 5, further comprising: Release paper supply process for continuously supplying strip-shaped release paper in one direction,
IC inlet pasting process of placing a flat IC inlet on the adhesive applied to the release surface of the release paper;
A seal member attaching process of placing a band-shaped seal member coated with an adhesive on one surface on the surface of the IC inlet and facing the surface pasted to the release paper;
An IC sheet winding process for winding an IC sheet to which the release paper, the IC inlet, and the seal member are bonded;
An IC sheet manufacturing method comprising:   An IC sheet manufacturing method comprising an adhesive application process for applying an adhesive to a release surface of the release paper between the release paper supply process and the IC inlet pasting process.   The IC sheet manufacturing method according to claim 8, wherein the adhesive application process is a process of applying a hot-melt adhesive that is heated and melted.   10. The IC inlet sticking process is characterized in that individual IC inlets are cut from a strip-shaped IC inlet roll in which a large number of IC inlets are continuous and bonded to the release paper. An IC sheet manufacturing method according to claim 1.   The adhesive removal process for removing the adhesive protruding from the bonded IC inlet is provided between the IC inlet attaching process and the seal member attaching process. An IC sheet manufacturing method according to claim 1. Between the sealing member attaching process and the IC sheet winding process, the cutting process of cutting the sealing member or the IC inlet and the sealing member into a predetermined size and shape, and the cutting process. The IC sheet according to any one of claims 7 to 11, further comprising: a cut waste collecting process for collecting the cut seal member or the cut waste of the IC inlet and the seal member. Production method.

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