JP2002275677A - Method for manufacturing shadow mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a shadow mask having good dimensional accuracy by a plating process. SOLUTION: The surface of a titanium plate used in the method for obtaining the shadow mask by forming a resist layer on the surface of the titanium plate and applying electroplating on the surface of the titanium plate exposed after patterning to obtain an electrodeposit, then peeling this electrodeposit from the surface of the titanium plate is subjected to blasting by a blasting agent of >=#240 in grain size stipulated in Japanese Industrial Standards(JIS) R 6001 and thereafter the surface of the titanium plate is provided with the resist layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method of forming a resist layer on a titanium plate surface, patterning the resist layer, forming an electrodeposit on a surface of the exposed titanium plate by electroplating, and peeling the electrodeposit. The present invention relates to a method for manufacturing a shadow mask.

[0002]

2. Description of the Related Art Conventionally, a shadow mask is formed by forming a resist layer on a steel plate, patterning a desired shape, and then forming an electron beam passage hole in an exposed rope by an etching method using a ferric chloride solution. Thereafter, the resist layer is removed to manufacture the device.

A shadow mask provided in a color picture tube for a display, which requires a high-precision and high-definition screen, has an extremely fine hole diameter and pitch of an electron beam passage hole corresponding to the screen. Is used,
Devices having a dimensional accuracy of about several μm are required. However, the shadow masks manufactured by the conventional method have a problem that the dimensional accuracy is coarse, few of them satisfy the requirements of the dimensional accuracy, and the product yield is low. In addition, there is a disadvantage that it takes time to process the waste etching solution.

Some attempts have been made to overcome these drawbacks. For example, an attempt has been made to produce a shadow mask by plating. The shadow mask formed by this plating method uses a titanium plate having a BA and 2B finish specified in JIS G 4305 as a conductive substrate, forms a resist layer on the titanium plate surface, and performs patterning. Plating is performed to form a shadow mask-like electrodeposit, and then the titanium plate is distorted by applying an external stress, and the electrodeposit is peeled from the titanium plate to use the electrodeposit as a shadow mask.

[0005]

However, when a shadow mask is manufactured by using the above-described plating method, although the dimensional accuracy is satisfied in the state of an electrodeposit formed by electroplating on a titanium plate, it is removed. When the shadow mask is used, it is difficult to satisfy the dimensional accuracy.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method of manufacturing a shadow mask by a plating method, which does not have the above-mentioned disadvantages.

[0007]

The present inventors have conducted intensive studies to achieve the above-mentioned object, and as a result, the reason why the shadow mask obtained by peeling the electrodeposit does not satisfy the dimensional accuracy is mainly that the electrodeposit is made of a titanium plate. Before the step of peeling from the electrodeposit, the electrodeposit was partially peeled off from the titanium plate, and distortion was generated by washing with water or the like, and the distortion was found to be closely related to the shape of the surface of the titanium plate, leading to the present invention. .

That is, the method of the present invention for solving the above-mentioned problem is to form a resist layer on the surface of a titanium plate, pattern it, expose it, apply electroplating to the surface of the titanium plate, obtain an electrodeposit, and then In the method of obtaining a shadow mask by peeling the electrodeposit from the surface, the surface of the titanium plate to be used has a particle size of # 24 defined by JIS standard R6001.
After blasting with 0 or more abrasives, a resist layer is provided on the surface of the titanium plate.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Conventional BA and 2B-finished titanium plates are manufactured by subjecting them to heat treatment, pickling treatment and cold rolling after cold rolling, so that the titanium surface lacks complexity and is relatively smooth. Surface. As a result, it is considered that the anchor effect does not occur between the substrate and the electrodeposit, and the substrate is easily peeled.

In the present invention, a titanium plate is blasted in advance to roughen the surface, and an electrodeposit having good adhesion is formed on the surface by electroplating. That is, an anchor effect is generated between the surface of the titanium plate and the electrodeposit by using the titanium plate which has been subjected to blast treatment with an abrasive of # 240 or more in advance, and the electrodeposit is removed from the titanium plate before the peeling step. Prevents peeling.

As a material of the shadow mask, it is preferable to use iron, nickel, copper, and alloys thereof as already proposed.

On the other hand, if the titanium plate is blasted with an abrasive less than # 240, the abrasive particles are too large and the surface smoothness of the titanium plate is impaired. As a result, the dimensional accuracy of the obtained shadow mask deteriorates.

[0013]

(Example 1) 650 mm long and 650 mm wide blasted with an abrasive of alumina having a particle size of # 240
A photoresist having a thickness of 40 μm is laminated on a surface of a titanium plate having a thickness of 0.5 mm and a slit having a width of 200 μm is formed.
Exposure was performed using a number of photolithography masks provided at intervals of 0 μm, followed by development to form a plating mask having openings in the shape of a shadow mask. Thereafter, the exposed surface of the titanium plate was subjected to electric iron plating under the plating solution composition and conditions shown in Table 1 to obtain a 35 μm thick electrodeposit in the form of a shadow mask. Thereafter, the titanium plate is washed with water while the electrodeposit is still attached thereto, and then the end of the titanium plate is slightly bent by applying stress, and the electrodeposit at that portion is peeled off from the titanium plate. Peeling from the plate gave a shadow mask.

The shadow mask obtained by the above method is pressed with a glass plate having a thickness of 5 mm from the top, and the minimum reading width is 1 μm.
The slit width of a portion 1 mm from the end of the slit was measured for all the slits formed using an optical length measuring device of m, and the adjacent dimensional differences were determined. As a result, it was found that the dimensional error between the adjacent slits was ± 5 μm, satisfying the requirement of the dimensional accuracy required for the shadow mask within ± 5 μm.

Example 2 A shadow mask was manufactured in the same procedure as in Example 1 except that a titanium plate blasted using an abrasive of alumina having a grain size of # 600 was used. In the obtained shadow mask, the dimensional error between the adjacent slits was ± 3 μm, and the requirements for dimensional accuracy could be satisfied.

Comparative Example 1 A shadow mask was manufactured in the same procedure as in Example 1 except that a titanium plate having the same BA finish as that of the related art was used. The resulting shadow mask was distorted and had a dimensional error between adjacent slits of ± 10 μm, failing to meet the dimensional accuracy requirements.

Comparative Example 2 A shadow mask was produced in the same procedure as in Example 1 except that a titanium plate polished with an abrasive of alumina having a particle size of # 100 was used. In the obtained shadow mask, the dimensional error between adjacent slits was ± 8 μm, and the requirements for dimensional accuracy could not be satisfied.

Table 1 Composition and conditions of plating solution (solution composition) FeCl ₂ .4H ₂ O 2.01M CaCl ₂ 1.62M Saccharin 9.13mM CH ₃ (CH ₂ ) ₆ CH ₂ OSO ₃ Na 0.30mM (Plating conditions) Temperature 90 ° C Cathode current density 5A / dm ² Positive electrode Pt time 46min. Will be further described.

[0019]

According to the manufacturing method of the present invention, it is possible to peel off the shadow mask and the conductive substrate without distorting the shadow mask, and to obtain a shadow mask excellent in mechanical reliability, especially in dimensional accuracy. Became possible. In addition, the method of the present invention can be applied to a method of manufacturing other electronic components and the like that involves peeling from a conductive substrate, and the effect is extremely large.

Claims (1)

[Claims] 1. A method for forming a resist layer on a surface of a titanium plate, patterning and then exposing the surface of the titanium plate to electroplating to obtain an electrodeposit, and thereafter removing the electrodeposit from the surface of the titanium plate to obtain a shadow mask. In the method, the surface of the titanium plate to be used is subjected to a grain size # defined by JIS standard R6001.
A method for manufacturing a shadow mask, comprising providing a resist layer on the surface of a titanium plate after blasting with 240 or more abrasives.