JP2002270995A - Manufacturing method for circuit part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for circuit parts which can form a smooth plated face with good workability. SOLUTION: A molding part 1 is formed by molding a synthetic resin material into a prescribed outer shape. The surface of the circuit molding face of the molding part is wet-blasted to perform substrate treatment. A plated catalyst is given to the circuit molding face which is substrate-treated, and the plated catalyst is activated. Parts being conductive parts 2a and 2b are electrolessly plated an electroless plating part is electrolytically plated. Thus, conductive parts 2a and 2b are formed on the circuit molding face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an injection molded circuit part (MID), and more particularly to a method for manufacturing a circuit part for forming conductive circuit wiring on the surface of a molded part such as a synthetic resin.

[0002]

2. Description of the Related Art As a conventional method for manufacturing an injection molded circuit component (MID), a two-shot method, a one-shot method, and the like are generally well known.

A method of manufacturing a circuit component using the two-shot method will be described. First, a circuit forming portion is formed into a predetermined outer shape with a molding material such as a synthetic resin (primary molding).
Next, the primary molded article is subjected to an etching treatment (surface roughening) as a base treatment and a plating catalyst. In this case, the primary molded article may be molded in advance using a resin containing a plating catalyst. Next, in a state where the circuit forming portion of the primary molded product is exposed, the primary molded product is wrapped with the second molded material and secondary molding is performed. In this case, a resin that does not contain a plating catalyst is used as the resin for secondary molding. Next, electroless plating and electrolytic plating are performed on the secondary molded product, and plating is applied to the exposed circuit forming portion of the primary molded product, whereby a desired circuit component can be obtained.

Next, a method of manufacturing a circuit component using the one-shot method will be described. First, a circuit forming portion is formed into a predetermined outer shape with a molding material such as a synthetic resin. Next, an etching treatment (surface roughening) as a base treatment and the application of a plating catalyst are performed on the entire surface of the molded article. Next, electroless plating is performed on the entire surface of the molded product. Next, a portion other than a shape to be a circuit forming portion is covered with a mask or a resist material,
After removing the parts other than the parts covered by a chemical or physical method, electrolytic plating is performed on the necessary parts to be the circuit forming parts, and the desired circuit parts can be obtained by plating the circuit forming parts. Become.

[0005]

However, in the above-described conventional method for manufacturing a circuit component, the two-shot method requires a plurality of dies to form the circuit component.
The process is complicated and expensive because of the two moldings of primary and secondary, and there is a problem that the combination of molding materials is limited.In the one-shot method, in addition to the circuit forming part, However, there is a problem that unnecessary plating is attached and the plating material is wasted in order to remove the unnecessary plating.

[0006] Prior to the electroless plating of the resin, it is necessary to perform a base treatment (surface roughening) on the resin surface, and when this base treatment is performed using a strong acid-based chemical such as chromic acid, The process is time-consuming and the chemicals affect the resin and the environment, which makes the handling complicated. In addition, the sandblasting method (a method of blasting abrasive particles with air pressure to remove them) In the case where the polishing is carried out, there is a problem that the abrasive particles are liable to be scratched due to scattering and unevenness occurs, so that a smooth plated surface cannot be formed.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a method of manufacturing a circuit component which has good workability and can form a smooth plated surface.

[0008]

According to the present invention, as a first means, a molded part is formed by molding a synthetic resin material into a predetermined external shape, and a circuit forming surface of the molded part is formed. The surface of the substrate is subjected to a wet blasting process to perform a base treatment, a plating catalyst is applied to the circuit forming surface subjected to the base treatment, and after activating the plating catalyst, electroless plating is performed on a portion to be a conductive portion. A conductive portion is formed on the circuit forming surface by electroplating the electroless plating portion.

[0009] As a second means, the plating catalyst is a photoreactive or heat reactive plating catalyst, and selectively reacts and activates a plating catalyst corresponding to a portion to be a conductive portion. It is characterized by having.

[0010] As a third means, the plating catalyst is applied to the entire surface of the circuit forming surface, and at the same time, only the shape serving as the conductive portion is irradiated with ultraviolet rays or partially heated to form a plating catalyst. Is selectively reacted, and after removing the unreacted plating catalyst, electroless plating and electrolytic plating are performed on a portion to be a conductive portion.

As a fourth means, the plating catalyst is selectively applied to a portion to be a conductive portion of the circuit forming surface, and the selectively applied plating catalyst is irradiated with ultraviolet rays or heated. After reacting the plating catalyst with
It is characterized in that electroless plating and electrolytic plating are performed on portions that become conductive portions.

As a fifth means, the wet blasting is performed by using a nozzle wider than the entire width of a portion to be a conductive portion of the circuit forming surface of the molded part.

[0013] As a sixth means, a plurality of the molded parts are connected to each other via a connecting portion to be integrally formed, and a plating catalyst is formed on a conductive portion of each of the formed parts and on the connecting portion. After activating the plating catalyst, electroless plating is performed to form a conductive path connecting the plurality of molded parts, and a plurality of the molded parts connected using the conductive path. After the electroplating of the conductive portions is performed at a time, the connecting portions are cut to form individual molded parts.

As a seventh means, a conductive portion formed on a circuit forming surface of the molded part is formed as a sliding contact portion of a switch.

According to an eighth aspect of the present invention, the molded part is formed in a bottomed box shape having a slope having an inner wall extending outward from the bottom toward the opening, and the conductive portion is formed at the bottom of the molded part. From the inner wall to the slope of the inner wall.

[0016]

1 to 8 show one embodiment of the present invention. FIG. 1 is an explanatory view showing a manufacturing process of a circuit component of the present invention, FIG. 2 is an explanatory view showing a processing method of a base treatment by a wet blast method, FIG. 3 shows a state of etching which is a base treatment, and FIG. Without etching,
3B is an explanatory view showing a flow of plating, FIG. 3C is an explanatory view showing a flow of plating, and FIG.
4A is an explanatory view showing the case of the entire coating, FIG. 4B is an explanatory view showing the case of the selective coating, FIG. 5 is a plan view showing a plurality of circuit components integrally connected by a connecting portion, and FIG. FIG. 7 is a plan view, FIG. 7 is a perspective view showing a circuit component formed in a box shape with a bottom, and FIG. 8 is a longitudinal sectional view of the same.

5 and 6, the configuration of the circuit component 100 of the present invention will be described. The circuit component 100 includes a substrate 1 which is a molded component formed in a substantially circular plate shape from a molding material such as a synthetic resin, and a plurality of fixed contact portions as conductive portions are provided on the surface of the substrate 1. 2a and 2b are provided. The fixed contact portions 2a and 2b are smooth plated surfaces made of a metal such as silver or copper, and the plated surfaces are sliding surfaces of movable contact portions of electronic components (not shown). That is, by configuring the circuit component 100 as a sliding contact portion of an electronic component such as a switch, an electronic component such as a switch can be easily formed.

Further, the circuit component 100 includes a connecting portion 3
a, a plurality of molding materials 10 connected by 3b
The connecting portion 3b includes a plurality of fixed contact portions 2a and 2b which are conductive portions.
Is formed. This conductive path 4
Is formed on the connecting portion 3b, so that the fixed contact portions 2a and 2b of the plurality of circuit components 100 are electrically connected to each other via the conductive path 4.

By forming the conductive path 4 in the connecting portion 3b, a plurality of the circuit components 100 connected using the conductive path 4 can be collectively electroplated. By cutting the connecting portions 3a and 3b along cutting lines indicated by P1 and P2 in FIG. 5 to form the individual circuit components 100, a large number of circuit components 100 can be obtained. Significant improvement can be achieved.

As shown in FIG. 5, a base treatment (etching) by a wet blast method, which will be described later, is performed on the fixed contact portion 2a, which is a conductive portion of the circuit forming surface, which is the substrate portion 1 of the circuit component 100, The process is performed by using a wide nozzle having a nozzle width W so as to be wider than the entire width of the formation portion 2b. As described above, by using a wide nozzle for the base treatment, there is no overlapping part of the spraying range of the abrasive grains on the substrate part 1 and a smooth base formation without any step can be performed, so that a smoother plated surface is formed. It can be done.

FIG. 7 and FIG.
Slope 1a whose inner wall spreads outward from the bottom toward the opening
The conductive path 4, which is a conductive portion, is formed from the bottom of the circuit component 100 to the slope 1a of the inner side wall.

The inner wall of the circuit component 100 is
By forming it in the a-shape, the abrasive material 11 projected from the nozzle 15 and the irradiated ultraviolet light X, etc., are exposed to the entire bottom at the time of the base treatment (etching) and the reaction treatment of the plating catalyst by the wet blast method described later. , The uniform processing can be performed on the bottom of the circuit component 100, and the fixed contact portions 2a and 2b (see FIG. (Not shown)) can be formed as a smooth plated surface.

Next, a method of manufacturing the circuit component 100 of the present invention will be described with reference to FIGS. Note that the present invention relates to a manufacturing method in a one-shot method. In FIG. 1, first, a synthetic component is formed into a predetermined external shape by an injection molding machine to form a molded component to be the substrate unit 1 (FIG. 1A).

Next, the surface of the circuit-formed surface of the molded component is subjected to a base treatment (etching) necessary for performing electroless plating by a wet blast method (FIG. 1B). As shown in FIG. 2, the wet blasting method is to spray abrasive particles 11 for blasting as a mixture of compressed air 12 and water 13 from a nozzle 15 of a projection gun by means of a blast pump 14 so that the surface of a workpiece 16 This method is known as a processing method mainly for treating a metal surface or deburring a through hole.

The features of this waist blast method are as follows:
The point that the machined surface can be used only by simple cleaning without leaving any abrasive grains remaining,
In addition, it is highly reliable because there is no unevenness that can be finely and uniformly processed and it is easy to come out to chemicals, etc. Also, it is easy to control because of the fluid, the sharpness of the processing area is high, and there is no scratch damage and no flying In addition, it is environmentally clean and the processing is easy without the abrasive material rising.

FIG. 3 shows the state of the circuit forming surface of the molded part subjected to the base treatment (etching). In general, the formation of a plating film on a non-conductor is performed by an anchor effect that hooks the plating film microscopically. FIG.
A shows the surface of the molded part without a base treatment. In this case, since the surface area is in a minimum state, the number of catalyst particles 17 applied to the surface is small. Since the plating film growing on the nucleus can only grow in the plane direction, the stability of fixing the plating film is poor.

FIG. 3B shows the surface of the molded part with a base treatment. In this case, the absolute amount of the catalyst agent particles 17 is large because the catalyst agent particles 17 are applied by entering the uneven portions 18 on the surface. In addition, the plating film that grows with the catalyst agent particles 17 as nuclei grows three-dimensionally in the height direction in the uneven portion 18 in addition to the surface direction, and a part thereof is caught by the uneven portion 18, so that a strong plating is performed. The coating is fixed. FIG. 3C
FIG. 4 is an explanatory diagram showing a flow of an electroless plating process.

Next, a plating catalyst is applied to the undercoated circuit forming surface (FIG. 1C). In this case, the plating catalyst to be used is a plating catalyst having photoreactivity or thermal reactivity, for example, a Sensitive Catalyst (SENSY).
Company name). The feature of this plating catalyst is that it can be activated by reacting to light in a specific wavelength region or heat in a specific temperature range, while a normal plating catalyst is insensitive to light or heat. By using the photoreactive or heat-reactive plating catalyst as described above, activation and fixing on the circuit forming surface are easy,
As a result, the plating process can be performed stably.

The light to be irradiated in the case of this photoreactive plating catalyst may be light in the ultraviolet region having a wavelength of not more than 254 nanometer peak value. As heat to be generated, it is sufficient to apply heat at about 150 ° C. for about 30 minutes.

Next, in the case of a photoreactive plating catalyst, the coated surface is partially masked or the like as necessary and irradiated with light from above, or an ultraviolet laser beam is irradiated without masking. The irradiation is activated to cause the plating catalyst to react and activate. In the case of a heat-reactive plating catalyst, the coating surface is irradiated with a heat laser beam or the like and heated to react with the plating catalyst and activate. (Figure 1
D)

In this case, as shown in FIG. 4A and FIG. 4B, the plating catalyst on the circuit forming surface is applied to the entire circuit forming surface (FIG. 4A) and to a portion to be a conductive portion. There is a case where only the coating is selectively performed (FIG. 4B).

The step of applying a plating catalyst to the entire circuit forming surface of FIG. 4A will be described. The base required for performing electroless plating by wet blasting on the surface of the circuit forming surface of the molded component is described. After performing the processing (etching), a plating catalyst is applied over the entire surface on which the circuit is formed.

Next, in the case of a photoreactive plating catalyst, masking is performed while leaving a necessary conductive portion on the circuit forming surface, and light irradiation is performed only on this portion, or masking is performed. The plating catalyst is reacted and activated by partially irradiating an ultraviolet laser beam without performing the above. In the case of a thermally reactive plating catalyst, the plating catalyst is partially heated by a thermal laser beam to react and activate the plating catalyst. Next, unreacted catalyst remaining in the masked unnecessary portion and the unheated portion is removed by washing with water or chemicals.

The process for selectively applying only the conductive portion of the circuit forming surface in FIG. 4B will be described. The electroless plating is performed on the surface of the circuit forming surface of the molded component by using a wet blast method. After performing a necessary base treatment (etching) at this time, a plating catalyst is selectively applied only to a portion to be a conductive portion of the circuit forming surface.

Next, by irradiating the applied photoreactive plating catalyst as a whole with light, the plating catalyst is reacted and activated. In the case of a heat-reactive plating catalyst, the entire surface of the plating surface is heated by a heating source to react and activate the plating catalyst.

In the case of the selective coating shown in FIG. 4B, the plating catalyst may be applied in accordance with the shape to be a desired conductive portion, as compared with the case of the entire coating shown in FIG. 4A. The amount can be reduced. In addition, there is no need to remove the catalyst for removing unnecessary portions, and the number of steps can be reduced.

Next, electroless plating is performed on a necessary portion activated and fixed (FIG. 1E). Thereafter, the circuit component 100 is formed by performing electroplating on the electroless plated portion to form a necessary conductive portion on the circuit forming surface (FIG. 1F).

According to the above-described present invention, a conductive part can be easily formed on a circuit forming surface of a molded part with good workability, and the conductive part is formed as a smooth plated surface. Therefore, the conductive portion can be applied to the fixed contacts 2a, 2b and the like of electronic components such as a switch, and an electronic component such as a switch having a sliding contact portion can be easily formed. Has become.

[0039]

As described above, according to the method of manufacturing a circuit component of the present invention, a synthetic resin material is molded into a predetermined outer shape to form a molded component, and a wetted surface is formed on the circuit-formed surface of the molded component. A blasting process is performed and a base treatment is performed. A plating catalyst is applied to the circuit-formed surface subjected to the base treatment, and after activating the plating catalyst, electroless plating is performed on a portion to be a conductive portion. Since the conductive part was formed on the circuit formation surface by performing electrolytic plating on the plating part,
Since no abrasive grains remain during the base treatment, and the processing of the processed surface is uniform and non-uniform, the contact portion of the electronic component, which is to be a conductive portion, can be formed as a smooth plated surface.

The plating catalyst is a photo-reactive or heat-reactive plating catalyst, and is selectively reacted with a plating catalyst corresponding to a portion to be a conductive portion to be activated. While the catalyst does not react to light or heat, it can be activated by reacting to light or heat, so that activation and fixing on the circuit forming surface is easy and reliable, and the plating process can be stably performed.

In addition, the plating catalyst is applied to the entire surface of the circuit formation surface, and only the shape serving as the conductive portion is partially irradiated with ultraviolet rays or partially heated to selectively apply the plating catalyst. After removing the unreacted plating catalyst, electroless plating and electrolytic plating are performed on the conductive part, making it easy to change the circuit of the contact part by the mask shape and partial heating operation Can be done.

Further, the plating catalyst is selectively applied to a portion to be a conductive portion on the circuit forming surface, and the selectively applied plating catalyst is irradiated with ultraviolet rays or heated to react the plating catalyst. Since the electroless plating and the electroplating are performed on the portion to be the conductive portion, the plating catalyst may be applied according to the shape to be the desired conductive portion. Can be. Further, there is no need to remove a catalyst for removing unnecessary portions, and the number of steps can be reduced.

Further, since the wet blasting is performed using a nozzle wider than the entire width of the conductive portion on the circuit forming surface of the molded part, there is no overlapping portion of the spraying range of the abrasive grains, and there is no step. Since a smooth underlayer can be formed without any defects, a smoother plated surface can be formed.

Also, a plurality of molded parts are connected to each other via a connecting portion to be integrally formed, and a plating catalyst is applied to a portion to be a conductive portion of each molded part and on the connecting portion, and this plating catalyst is activated. After conducting the electroless plating, a conductive path connecting the plurality of molded parts is formed by performing electroless plating, and the conductive portions of the plurality of molded parts connected using the conductive path are collectively subjected to electrolytic plating. After that, since the connecting portion is cut to form individual molded parts, it is possible to take a large number of circuit components, and thus the processing time can be greatly improved.

Further, since the conductive portion formed on the circuit forming surface of the molded component is formed as a sliding contact portion of the switch, an electronic component having a sliding contact such as a switch can be easily formed. .

Further, the molded part is formed in a box shape with a bottom having a slope whose inner wall extends outward from the bottom toward the opening, and the conductive portion is formed from the bottom of the molded part to the slope of the inner wall. Accordingly, it is possible to perform uniform processing on the bottom of the circuit component, and it is possible to form the fixed contact portion disposed on the bottom of the circuit component as a smooth plated surface.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a process of manufacturing a circuit component according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a processing method of a base treatment by the same wet blast method of the present invention.

3A and 3B show a state of etching, which is also a base treatment according to the present invention. FIG.
FIG. 3C is an explanatory diagram showing a state of etching, and FIG. 3C is a diagram showing a flow of plating.

4A and 4B are explanatory diagrams showing a step of activating a plating catalyst according to the present invention, wherein FIG. 4A shows a case of full-surface coating, and FIG.

FIG. 5 is a plan view showing a plurality of circuit components integrally connected by a connection unit according to the present invention.

FIG. 6 is a plan view showing a single circuit component of the present invention.

FIG. 7 is a perspective view showing a circuit component formed in a bottomed box shape of the present invention.

FIG. 8 is a longitudinal sectional view showing a circuit component formed in a box shape with a bottom according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate part (molded part) 1a Slope 2a, 2b Fixed contact (conductive part) 3a, 3b Connection part 4 Conductive path 10 Molding material 11 Abrasive material 12 Compressed air 13 Water 14 Blast pump 15 Nozzle 16 Processing part 17 Catalyst agent Particle 18 Uneven portion 100 Circuit component P1, P2 Cutting line W Nozzle width X Ultraviolet light

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C25D 7/00 C25D 7/00 J H05K 1/02 H05K 1/02 A 3/18 3/18 B CH 3/38 3/38 A

Claims (8)

[Claims] 1. A molded part is formed by molding a synthetic resin material into a predetermined outer shape, and a surface treatment is performed on the surface of a circuit forming surface of the molded part by wet blasting. After applying a plating catalyst to the surface and activating the plating catalyst, electroless plating is performed on a portion to be a conductive portion, and electroless plating is performed on the electroless plating portion, thereby forming a conductive film on the circuit forming surface. A method for manufacturing a circuit component, comprising forming a portion. 2. The plating catalyst according to claim 1, wherein the plating catalyst is a photo-reactive or heat-reactive plating catalyst, and is selectively activated by reacting a plating catalyst corresponding to a portion to be a conductive portion. A method for manufacturing a circuit component according to claim 1. 3. Applying the plating catalyst to the entire surface of the circuit forming surface and selectively irradiating ultraviolet rays or partially heating only a shape to be a conductive portion to selectively react the plating catalyst. 3. The method for manufacturing a circuit component according to claim 2, wherein after removing the unreacted plating catalyst, electroless plating and electrolytic plating are performed on a portion to be a conductive portion. 4. The plating catalyst is selectively applied to a portion to be a conductive portion of the circuit forming surface, and the selectively applied plating catalyst is irradiated or heated with ultraviolet rays to react the plating catalyst. 3. The method according to claim 2, wherein the electroless plating and the electroplating are performed on the conductive portion. 5. The method according to claim 1, wherein the wet blasting is performed using a nozzle having a width larger than a width of an entire portion to be a conductive portion on a circuit forming surface of the molded component.
5. The method for manufacturing a circuit component according to any one of claims 1 to 4. 6. A plurality of the molded parts are connected to each other via a connecting part to form an integral part, and a plating catalyst is applied to a part to be a conductive part of each of the molded parts and to the connecting part. After activating the catalyst, to form a conductive path connecting a plurality of the molded parts by performing electroless plating,
The method according to claim 1, wherein the electroconductive portions of the plurality of molded parts connected by using the conductive path are collectively subjected to electrolytic plating, and then the connected parts are cut to form individual molded parts. 6. The method for manufacturing a circuit component according to any one of 1 to 5. 7. The circuit component according to claim 1, wherein a conductive portion formed on a circuit forming surface of the molded component is formed as a sliding contact portion of a switch. Method. 8. The molded part is formed in a bottomed box shape having a slope whose inner wall extends outward from the bottom toward the opening, and the conductive portion extends from the bottom of the molded part to the slope of the inner wall. The method for manufacturing a circuit component according to claim 7, wherein the circuit component is formed.