JP2002270985A - Conductive member mounting structure and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect a flexible board to an electronic component such as a board, without using any connector. SOLUTION: First, second and third lock holes 3 are formed at a board 1. Two cuts 5 are formed at the end of the flexible board 2 to form three section at a top end with one center section bent down, thereby forming first and second locks 6a, 6b to be located on the front side of the board 1 and a third lock 6c to pass through the third lock hole 3c to locate on the backside of the board 1. Positioning parts 7 to be fitted into the first and second holes are formed a the first and second locks 6a, 6b each by folding a part of each lock like a groove. A connection 8 at the top end of the flexible board 2 is soldered to an electrode pattern 4 on the board 1 with solder 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive member having flexibility in which a conductor is arranged in a plane and covered with an insulator, and a conductive member for electrically connecting an electronic component such as a substrate. The mounting structure and mounting method. More specifically, the present invention relates to a technique capable of connecting a conductive member without using a connector.

[0002]

2. Description of the Related Art As a flexible conductive member in which a conductor is arranged in a plane and covered with an insulator, a flexible printed circuit board formed by covering a conductor made of copper foil or the like with a film-like insulator is used. Hereinafter, it is referred to as a flexible substrate), or a flat cable in which a plurality of cables each having a conductor covered with an insulator are arranged in a plane and integrally formed. Conventionally, connectors have been used to electrically connect these conductive members to electronic components such as substrates.

FIG. 3 is a perspective view showing a conventional mounting structure of a flexible substrate as an example of a conductive member.
As shown in (a), a substrate 10 as an example of an electronic component
1, a connector 102 is attached by soldering or the like. The connector 102 has a flexible substrate 103
Is provided with an insertion portion 102a having a structure in which electrical connection and fixation are performed by insertion. And
By inserting the distal end of the flexible substrate 103 into the insertion portion 102a of the connector 102, the flexible substrate 103 is electrically connected to and fixed to the substrate 101 via the connector 102, as shown in FIG. Was something.

[0004]

The above-described conventional structure for mounting a conductive member has a problem that it is difficult to reduce the size of the connecting portion between the conductive member and the substrate because a connector is required. In addition, since a connector is required, there is a problem that it is difficult to reduce the cost. The present invention has been made to solve such a problem, and an object of the present invention is to provide a mounting structure and a mounting method of a conductive member that can connect a conductive member to a substrate without using a connector.

[0005]

According to the present invention, there is provided a conductive member mounting structure for connecting a flexible conductive member, which is formed by arranging a conductor in a plane and covered with an insulator, to an electronic component. In the mounting structure of (1), at least 2
A plurality of locking holes are provided, and a part of the conductive member is deformed so as to pass through one of the locking holes to hold the electronic component. Along with providing a fitting portion for fitting, a part of the conductor of the conductive member is exposed,
A connection portion electrically connected to the electronic component is provided.

According to the method of mounting a conductive member according to the present invention, the electronic component has at least two locking portions formed by deforming a part of a flexible conductive member.
The electronic component is sandwiched by the conductive member, and the positioning member formed by deforming a part of the conductive member is fitted in another locking hole to position the conductive member with respect to the electronic component. Then, a connection portion of the conductive member, which exposes a part of the conductor, is soldered to an electrode of the electronic component.

In the mounting structure of the conductive member according to the present invention, the conductor of the conductive member is exposed and soldered directly to the electrode of the electronic component, so that it is not necessary to use a connector. Then, by passing the locking portion formed by deforming the conductive member through the locking hole of the electronic component, the electronic component is sandwiched by the conductive member,
Since the conductive member can be fixed to the electronic component, the strength of the connection can be ensured even if the conductive member is connected to the electronic component only by soldering without using a connector. Also,
The positioning at the time of soldering is performed by fitting a positioning portion formed by deforming the conductive member into another locking hole of the electronic component.

According to the method of mounting a conductive member of the present invention, the conductive member is fixed to the electronic component by fitting a locking portion formed by deforming the conductive member into a locking hole of the electronic component. . Also, by positioning the positioning portion formed by deforming the conductive member into another locking hole of the electronic component, positioning at the time of performing soldering is performed. This makes it possible to use a jig or manually to connect the conductive member to the electronic component before soldering the connection part, which exposes a part of the conductor of the conductive member, to the electrode on the electronic component. Therefore, it is not necessary to fix the soldering to the soldering, and the workability of soldering is improved. Then, since the conductor of the conductive member is exposed and soldered directly to the electrode of the electronic component, there is no need to use a connector. Therefore, the step of attaching the connector to the electronic component and the step of attaching the conductive member to the connector are omitted. Can be.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing an embodiment of a mounting structure and a mounting method of a flexible substrate as an example of a conductive member according to the present invention, and FIG. FIG. 1B shows a state before the flexible substrate 2 is attached to the substrate 1 as shown in FIG.

When the substrate 1 is provided with a portion to which the flexible substrate 2 is attached, for example, a portion for connecting the flexible substrate 2 to an end of the substrate 1, a first locking hole is provided near the end of the substrate 1. 3a, a second locking hole 3b, and a third locking hole 3c are provided. The first to third locking holes 3a
3 c are, for example, rectangular holes penetrating the substrate 1.

The flexible substrate 2 is a film-shaped member having flexibility. The flexible substrate 2 is mounted horizontally with respect to the substrate 1. The flexible substrate 2 is attached to the side.

The first to third locking holes 3a to 3c are
A third locking hole 3c is provided at the center in the width direction of the flexible substrate 2 connected to the substrate 1, and a first locking hole 3a and a second locking hole 3b are provided on both sides thereof. Further, the first and second locking holes 3a and 3b and the third locking hole 3c
The first and second locking holes 3a and 3b are provided on the flexible board 2 with respect to the third locking hole 3c. 2 is located in front of the mounting direction.

An electrode pattern 4 is formed in the substrate 1 near the first to third locking holes 3a to 3c. On the front surface side of the substrate 1, the electrode patterns 4 are provided with the first locking holes 3a.
Is provided at a position shifted forward in the mounting direction of the flexible board 2 with respect to the second locking hole 3b, and at a position shifted forward in the mounting direction of the flexible board 2 with respect to the second locking hole 3b. On the rear surface side of the substrate 1, the electrode pattern 4 is provided at a position shifted forward with respect to the third locking hole 3c in the mounting direction of the flexible substrate 2.

A plurality of conductors (not shown) are provided in parallel on the front end side of the flexible board 2 along the extending direction of the flexible board 2. Two notches 5 are cut in parallel from a tip of the flexible substrate 2 to a predetermined position so as to be located between conductors (not shown). The flexible substrate 2 has a shape in which the tip side is divided into three. is there. Then, the center 1 of the three divided parts
An engaging portion formed by bending a central portion of the book downward so that a step is formed at both sides thereof at a distance equivalent to the thickness of the substrate 1 so that the substrate 1 can be sandwiched between the book and both sides thereof. 6 are formed.

That is, the locking portion 6 according to the present embodiment comprises a first locking portion 6a, a second locking portion 6b, and a third locking portion 6c. The stop portion 6a and the second locking portion 6b are portions on both sides of a portion of the flexible substrate 2 divided into three by the cut 5, and have a shape in which the flexible substrate 2 extends as it is.

The third locking portion 6c is one in the center of the three divided portions, and is bent downward at the root of the two cuts 5 to form the first and second locking portions. 6a,
6b is bent forward so as to extend substantially parallel to the substrate 1 at an interval equal to the thickness of the substrate 1.

As a result, the first locking portion 6a and the second locking portion 6b are located on the front surface side of the substrate 1,
Is located on the back surface side of the substrate 1.
Since the third locking portion 6c passes through the locking hole 3 to the back surface of the substrate 1, the locking hole 3 has a slightly wider width than the third locking portion 6c.

The first locking portion 6a and the second locking portion 6b are formed by bending a part of the first locking portion 6a and the second locking portion 6b in a direction perpendicular to the extending direction of the flexible substrate 2 so as to project in a V-shape. Positioning parts 7 are provided respectively.

The first and second locking portions 6a and 6b have a shape in which the flexible substrate 2 extends as it is.
The positioning portion 7 provided on the locking portion 6a is provided with the first locking hole 3a.
And the positioning portion 7 provided on the second locking portion 6b fits into the second locking hole 3b from the front side of the substrate 1. For this reason, the first locking hole 3a is connected to the first locking portion 6a.
The second locking hole 3b has a slightly larger width than the second locking portion 6b.

At the tip of the flexible substrate 2, that is, at the tip of the first to third locking portions 6a to 6c, a connection portion 8 is formed by exposing the conductor. Then, the connecting portion 8 and the electrode pattern 4 on the substrate 1 are connected by solder 9.

FIG. 2 is a cross-sectional view showing a process of attaching the flexible substrate 2 to the substrate 1. The method of attaching the flexible substrate in the present embodiment will be described below with reference to FIGS. In advance, the front end side of the flexible substrate 2 is deformed using a mold (not shown) or the like, and FIG.
As shown in (1), the locking portion 6 including the first to third locking portions 6a to 6c and the positioning portion 7 are formed in advance. At this time, the distance between the connecting portion 8 formed at the tip of the first and second locking portions 6a and 6b and the connecting portion 8 formed on the third locking portion 6c is equal to the substrate 1 It is preferable that the tip of the third locking portion 6c is slightly upward so as to be slightly smaller than the thickness of the third locking portion 6c.

To attach the flexible substrate 2 to the substrate 1, first, the third locking portion 6c of the flexible substrate 2 is inserted into the third locking hole 3c and passed through the back surface of the substrate 1. Thereby, as shown in FIG. 2, the substrate 1 is sandwiched between the front and back sides by the flexible substrate 2, and the third locking portions 6 c pass through the third locking holes 3 c and move to the back surface side of the substrate 1. Accordingly, the horizontal movement of the flexible substrate 2 is prevented by the third locking holes 3c, and the flexible substrate 2 is fixed to the substrate 1. Also, the positioning portion 7 of the first locking portion 6a fits into the first locking hole 3a, and the positioning portion 7 of the second locking portion 6b fits in the second locking hole 3b. The horizontal movement of the flexible substrate 2 with respect to the substrate 1 is prevented, and the flexible substrate 2 is positioned with respect to the substrate 1.

At this time, the connecting portion 8 formed at the tip of the flexible substrate 2 is located at a position corresponding to the electrode pattern 4 formed on the substrate 1. That is, the connecting portion 8 formed at the distal end of the first locking portion 6a and the second locking portion 6b of the flexible substrate 2 comes into contact with the electrode pattern 4 on the front surface side of the substrate 1 and the third locking portion. The connection portion 8 formed at the tip of the portion 6c contacts the electrode pattern 4 on the back surface side of the substrate 1. The distance between the connecting portion 7 formed at the tip of the first and second locking portions 6a and 6b and the connecting portion 7 formed at the tip of the third locking portion 6c is set to the board 1 If the thickness is slightly smaller than the thickness of the contact pattern 7, it is possible to prevent the contact portion 7 from floating from the electrode pattern 4.

Since the flexible substrate 2 is fixed to the substrate 1 by the locking portions 6, the flexible substrate 2 does not come off the substrate 1 and the positioning of the first locking portions 6a. The portion 7 fits into the first locking hole 3a, and the positioning portion 7 of the second locking portion 6b is
b, the connection portions 8 of the flexible substrate 2 and the corresponding electrode patterns 4 on the substrate 1 are positioned, and soldering is performed without pressing the flexible substrate 2 using a jig or a hand. FIG. 1 (b) and FIG.
As shown in (1), each connection portion 8 of the flexible substrate 2 and each electrode pattern 4 on the substrate 1 are connected by solder 9.

In the above-described embodiment, the leading end side of the flexible substrate 2 is divided into three parts, and the first end parts on both end sides are divided.
And the second locking portions 6a and 6b are located on the front surface side of the substrate 1, and the central third locking portion 6c passes through the locking hole 3 and
Since the substrate 1 is located on the back surface side, the substrate 1 is pressed at three places in total on the front and back sides, and the stability at the time of soldering is good.

When an external force is applied to the substrate 1 or the flexible substrate 2 because the substrate 1 is attached to a movable member or the like, the positioning section 7
A part of the first locking part 6c and the second locking part 6b
The entire shape in the width direction is bent and deformed into a V-shape, so that when an external force is applied, it is elastically deformed and can be absorbed. Further, since the third locking portion 6c is formed by bending the flexible substrate 2, it can be elastically deformed when an external force is applied, and can absorb this. Therefore, no external force is directly applied to the connection between the substrate 1 and the flexible substrate 2 by the solder 9, and the detachment of the flexible substrate 2 can be prevented.

In this embodiment, the flexible substrate 2 has been described as an example of the conductive member. However, the flexible circuit board is a flexible circuit board formed by covering a conductor pattern with a film-like insulator. The present invention can also be applied to a connection point between a circuit and a substrate or the like.

Further, a flat cable can be used as the conductive member. That is, the end of the flat cable is peeled off to expose the conductive wire to form a connection portion, and the flat cable is cut into three parts by cutting the leading end side at a portion between predetermined conductive wires, and is divided into three parts. A locking portion is provided by deforming one of the centers of the portions so as to extend in parallel with the portions on both sides thereof at an interval equivalent to the thickness of the substrate 1 and to provide a locking portion. Is deformed into a V-shape over the entire width thereof to provide a positioning portion, so that a flat cable can be directly connected to the substrate 1 by soldering without using a connector, and without using a separate member. 1 can be fixed with the flat cable positioned.

[0029]

As described above, the structure for mounting a conductive member according to the present invention is a part of the conductor of a flexible conductive member in which a conductor is arranged in a plane and covered with an insulator. Is exposed and the connection portion electrically connected to the electronic component is provided, so that the conductive member can be directly soldered to the electrode of the electronic component.

In the mounting structure for a conductive member according to the present invention, at least two locking holes are provided in the electronic component, and the conductive member is partially deformed to form one of the locking holes.
The electronic component is fixed to the electronic component by holding the electronic component with the engaging part. The conductive component can be fixed to the electronic component. Connection strength can be secured.

Further, in the mounting structure of the conductive member according to the present invention, the positioning portion formed by deforming a part of the conductive member is fitted into another locking hole of the electronic component, so that the positioning when soldering is performed. It can be performed.

Thus, in the structure for mounting a conductive member according to the present invention, the conductive member can be mounted on the electronic component without using a connector, and the connecting portion between the conductive member and the electronic component can be reduced in size. It becomes possible,
By not using the connector, the number of components can be reduced, and the cost can be reduced.

In the method for mounting a conductive member according to the present invention, a locking portion formed by partially deforming the conductive member is passed through one of at least two locking holes formed in the electronic component. By sandwiching the electronic component with the conductive member and connecting the electrode on the electronic component by soldering to the connection part that exposes a part of the conductor of the conductive member, a jig or human intervention is required. In addition, the conductive member can be fixed to the electronic component without soldering, and the positioning part formed by deforming a part of the conductive member is fitted into another locking hole of the electronic component, so that soldering when performing soldering is performed. Since positioning can be performed, workability of soldering is improved.

Thus, in the method for attaching a conductive member according to the present invention, the conductive member can be attached to the electronic component without using a connector. Can be omitted.

If the structure and method for mounting a conductive member according to the present invention are applied to various electronic devices, the size of the device can be reduced, the number of parts can be reduced, and the manufacturing process can be shortened. Thus, the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of a mounting structure and a mounting method of a flexible substrate as an example of a conductive member according to the present invention.

FIG. 2 is a cross-sectional view illustrating a process of attaching a flexible substrate to the substrate.

FIG. 3 is a perspective view showing a conventional mounting structure of a flexible substrate as an example of a conductive member.

[Explanation of symbols]

 Reference Signs List 1 board 2 flexible board 3a first locking hole 3b second locking hole 3c third locking hole 4 electrode pattern 5 cut 6 locking portion 6a first locking portion 6b second locking portion 6c Third locking part 7 Positioning part 8 Connection part 9 Solder

Claims (3)

[Claims] 1. A conductive member mounting structure for connecting a flexible conductive member, which is formed by arranging a conductor in a plane and covered with an insulator, to an electronic component, wherein the electronic component has at least two locking members. A hole provided in the conductive member, a locking portion for deforming a part of the conductive member and passing the electronic component through one of the locking holes;
A positioning part that fits into another locking hole is provided, and a part of the conductor of the conductive member is exposed to provide a connection part that is electrically connected to the electronic component. Construction. 2. The locking portion cuts at least one notch from an end of the conductive member, divides a tip side of the conductive member into a plurality of cuts, and divides the conductive member by the cut. Bending at least one of the at least one of the at least one of the at least one of the conductive member, the at least one of the conductive member divided by the notch, the other part of the other The mounting structure for a conductive member according to claim 1, wherein the mounting structure is shaped to fit into the locking hole. 3. An electronic component having at least two locking portions formed by deforming a part of a flexible conductive member formed by arranging conductors in a plane and covering with an insulator. The electronic component is sandwiched by the conductive member by passing through one of the blind holes, and a positioning portion formed by partially deforming the conductive member is fitted into another locking hole to allow the conductive member to be electrically connected. A method of attaching a conductive member, comprising: positioning a part of a conductor of the conductive member, exposing a part of a conductor of the conductive member, and soldering an electrode of the electronic component.