JP2002270981A - Conductive member mounting structure and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect a flexible board to an electronic component such as a board, without using any connector. SOLUTION: A lock hole 3 is formed at a board 1. A flexible board 2 has a lock part 5 composed of first and second locks 6a, 6b; the first lock 6a formed by bending a portion to be inserted into the lock hole 3 like a ridge along its entire width and the second hole 6b formed by bending a portion like a groove with a space equal to the thickness of the board 1 from the first lock 6a. The flexible board 2 tightly holds the board 1 between the first and second locks 6a, 6b to fasten the board 2 perpendicularly to the board 1. Connections 7 formed on tops of the first and second locks 6a, 6b are soldered to an electrode pattern 4 on the board 1 with solder 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive member having flexibility in which a conductor is arranged in a plane and covered with an insulator, and a conductive member for electrically connecting an electronic component such as a substrate. The mounting structure and mounting method. More specifically, the present invention relates to a technique capable of connecting a conductive member without using a connector.

[0002]

2. Description of the Related Art As a flexible conductive member in which a conductor is arranged in a plane and covered with an insulator, a flexible printed circuit board formed by covering a conductor made of copper foil or the like with a film-like insulator is used. Hereinafter, it is referred to as a flexible substrate), or a flat cable in which a plurality of cables each having a conductor covered with an insulator are arranged in a plane and integrally formed. Conventionally, connectors have been used to electrically connect these conductive members to electronic components such as substrates.

FIG. 3 is a perspective view showing a conventional mounting structure of a flexible substrate as an example of a conductive member.
As shown in (a), a substrate 10 as an example of an electronic component
1, a connector 102 is attached by soldering or the like. The connector 102 has a flexible substrate 103
Is provided with an insertion portion 102a having a structure in which electrical connection and fixation are performed by insertion. And
By inserting the distal end of the flexible substrate 103 into the insertion portion 102a of the connector 102, the flexible substrate 103 is electrically connected to and fixed to the substrate 101 via the connector 102, as shown in FIG. Was something.

[0004]

The above-described conventional structure for mounting a conductive member has a problem that it is difficult to reduce the size of the connecting portion between the conductive member and the substrate because a connector is required. In addition, since a connector is required, there is a problem that it is difficult to reduce the cost. The present invention has been made to solve such a problem, and an object of the present invention is to provide a mounting structure and a mounting method of a conductive member that can connect a conductive member to a substrate without using a connector.

[0005]

According to the present invention, there is provided a mounting structure for a conductive member, wherein a flexible conductive member formed by arranging a conductor in a plane and covered with an insulator is perpendicular to an electronic component. In the mounting structure of a conductive member connected in a state, a locking hole is provided in the electronic component, and both sides of a portion passed through the locking hole are deformed in the conductive member so that edges of both surfaces of the locking hole are formed. And a connecting portion that is electrically connected to the electronic component by exposing a part of the conductor of the conductive member.

In a method for mounting a conductive member according to the present invention, a conductive member having flexibility, which is formed by arranging a conductor in a plane and covered with an insulator, is passed through a locking hole provided in an electronic component, and the conductive member is mounted on the conductive member. After fixing the conductive member in a state perpendicular to the electronic component with locking portions formed by deforming both sides of a portion of the member passing through the locking hole, a portion of the conductor of the conductive member is exposed. And the electrodes of the electronic component are soldered.

In the mounting structure of the conductive member according to the present invention, the conductor of the conductive member is exposed and soldered directly to the electrode of the electronic component, so that it is not necessary to use a connector. Then, the engaging portion formed by deforming both sides of the portion of the conductive member that is passed through the locking hole provided in the electronic component is brought into contact with the edges of both sides of the locking hole, thereby forming the conductive member. Since it can be fixed in a state perpendicular to the electronic component, even if the conductive member is connected in a state perpendicular to the electronic component only by soldering without using a connector, the connection strength can be secured.

According to the method of mounting a conductive member of the present invention, a locking member formed by passing a conductive member through a locking hole provided in an electronic component and deforming both sides of a portion of the conductive member passed through the locking hole is provided. The conductive member is fixed in a state perpendicular to the electronic component by making contact with the edges of both surfaces of the locking hole. This makes it possible to use a jig or manually to connect the conductive member to the electronic component before soldering the connection part, which exposes a part of the conductor of the conductive member, to the electrode on the electronic component. It is not necessary to fix in a state perpendicular to the soldering, and the workability of soldering is improved. Then, since the conductor of the conductive member is exposed and soldered directly to the electrode of the electronic component, there is no need to use a connector. Therefore, the step of attaching the connector to the electronic component and the step of attaching the conductive member to the connector are omitted. Can be.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing an embodiment of a mounting structure and a mounting method of a flexible substrate as an example of a conductive member according to the present invention, and FIG. FIG. 1B shows a state before the flexible substrate 2 is attached to the substrate 1 as shown in FIG.

When the substrate 1 is provided with a portion to which the flexible substrate 2 is attached, for example, a portion for connecting the flexible substrate 2 to an end of the substrate 1, one locking hole is provided near the end of the substrate 1. 3 is open. This locking hole 3
Is a rectangular hole that penetrates through the substrate 1, and has a width slightly longer than the width of the flexible substrate 2 in the longitudinal direction.

An electrode pattern 4 is formed in the vicinity of the locking hole 3 of the substrate 1. This electrode pattern 4 is
On one surface, for example, the front surface side, the locking holes 3 are formed in a line in the short direction, and formed on the end side of the substrate 1. On the back side, the locking holes 3 are arranged in the short direction and the substrate 1
Is formed on the back side.

The flexible substrate 2 is a film-like flexible member, and the flexible substrate 2 is attached in a state perpendicular to the substrate 1. The flexible board 2 is provided with a predetermined interval in the extending direction, and protrudes from the surface of the flexible board 2 in a substantially V-shape and a substantially inverted V-shape over the entire width direction thereof. A part 5 is provided.

That is, the locking portion 5 is formed on the front surface side of the substrate 1 with respect to the electrode pattern 4 formed on the front surface side of the flexible substrate 2, with a portion passing through the locking hole 3 of the substrate 1 interposed therebetween. And a first locking portion 6a having a surface along the surface of the substrate 1 and projecting in a direction opposite to the first locking portion 6a on the back surface side of the substrate 1;
And a second locking portion 6b having a surface along the rear surface of the second locking portion. The distance between the first locking portion 6a and the second locking portion 6b is substantially equal to the thickness of the portion of the substrate 1 where the locking hole 3 is provided.

The flexible substrate 2 has a plurality of conductors (not shown) provided in parallel along the extending direction thereof.
At each apex of the first locking portion 6a and the second locking portion 6b of the flexible substrate 2, a connection portion 7 is formed by exposing a part of the conductor. Then, the connection portion 7 and the electrode pattern 4 on the substrate 1 are connected by solder 8.

FIG. 2 is a cross-sectional view showing a process of attaching the flexible substrate 2 to the substrate 1. A method of attaching the flexible substrate in the present embodiment will be described below with reference to FIGS. In advance, the flexible substrate 2 is deformed using a mold or the like (not shown), and as shown in FIG. An engaging portion 5 is formed to project from the surface of the flexible substrate 2 in a substantially V-shape and a substantially inverted V-shape. At this time, the interval between the V-shaped side, for example, the second locking portion 6b on the side opposite to the first locking portion 6a and the opposite V-shaped side is substantially equal to the thickness of the substrate 1. The apex of the first locking portion 6a is slightly downward and the apex of the second locking portion 6b is set so that the distance between the vertexes in the thickness direction of the substrate 1 is slightly smaller than the thickness of the substrate 1. Should be slightly upward.

At the vertices of the first locking portion 6a and the second locking portion 6b, a connection portion 7 is formed by exposing the conductor to expose the conductor. Attachment of the flexible substrate 2 to the substrate 1 is performed by first deforming the flexible substrate 2, for example, by elastically deforming the second locking portion 6 b so that the flexible substrate 2 can pass through the locking hole 3. Pass through hole 3. The shape of the second locking portion 6b is returned by passing through the locking hole 3, and as a result, as shown in FIG. The first locking portion 6a and the second locking portion 6b are provided on both sides of the first locking portion 6a and the second locking portion 6b, and the interval between the first locking portion 6a and the second locking portion 6b is substantially equal to the thickness of the substrate 1. The board 1 is held by the locking portion 6b.

As a result, the flexible substrate 2 is
Is fixed in a state perpendicular to. At this time, the connecting portion 7 formed at the vertex of the first locking portion 6a and the connecting portion 7 formed at the vertex of the second locking portion 6b correspond to the electrode pattern 4 on the substrate 1, respectively. It is in the position to do. That is, the connecting portion 7 formed on the first locking portion 6a contacts the electrode pattern 4 formed on the surface of the substrate 1, and the connecting portion 7 formed on the second locking portion 6b is It contacts the electrode pattern 4 formed on the back surface. At this time, the distance between the vertexes of the first locking portion 6a and the second locking portion 6b in the thickness direction of the substrate 1 is made slightly smaller than the thickness of the substrate 1 so that the connection portion 7 Can be prevented from floating from the electrode pattern 4.

Then, the flexible board 2 is sandwiched between the first locking portion 6a and the second locking portion 6b, whereby
Since the flexible substrate 2 is fixed in a state perpendicular to the substrate 1, the flexible substrate 2 does not come off from the substrate 1 while maintaining the state perpendicular to the substrate 1, and the first flexible substrate 2 The state where the connection portions 7 formed on the locking portions 6a and the second locking portions 6b are in contact with the respective electrode patterns 4 on the substrate 1 can be maintained.

Therefore, soldering is performed without pressing the flexible substrate 2 using a jig or a hand, and FIG.
As shown in FIG. 2B and FIG. 2, each connection portion 7 of the flexible substrate 2 is connected to each electrode pattern 4 on the substrate 1 by solder 8.

In the above-described embodiment, the first locking portion 6a and the second locking portion 6b are formed so as to protrude in opposite directions to each other, so that the flexible substrate 2 can be stably fixed to the substrate 1. Can be fixed vertically.

In this embodiment, the flexible substrate 2 has been described as an example of the conductive member. However, the flexible circuit board is a flexible circuit board formed by covering a conductive pattern with a film-like insulator. The present invention can also be applied to a connection point between a circuit and a substrate or the like.

In the present embodiment, the flexible substrate 2 as an example of the conductive member can be fixed to the substrate 1 only by deforming the substrate without cutting it. Regardless, it is possible to connect to the board 1 without using a connector.

Further, it is also possible to use a flat cable as the conductive member. That is, the flat cable protrudes in opposite directions on both sides of a portion through which the locking hole 3 of the substrate 1 is inserted.
A first locking portion having a surface parallel to the surface of the substrate 1 and a second locking portion;
And a connecting portion formed by exposing the conductor to the first and second locking portions to expose the conductive wire, so that the flat cable can be directly connected to the substrate 1 without using a connector. In addition to being connectable by soldering, the flat cable can be fixed vertically to the board 1 without using a separate member.

[0024]

As described above, the structure for mounting a conductive member according to the present invention is a part of the conductor of a flexible conductive member in which a conductor is arranged in a plane and covered with an insulator. Is exposed and the connection portion electrically connected to the electronic component is provided, so that the conductive member can be directly soldered to the electrode of the electronic component.

Further, in the mounting structure of the conductive member according to the present invention, the electronic component is provided with a locking hole, and the conductive member is formed by deforming both sides of a portion passing through the locking hole. Since the locking portions are provided to contact the edges of both surfaces of the electronic component, the conductive member can be fixed in a state perpendicular to the electronic component, and the conductive component can be fixed only by soldering without using a connector. Connection strength can be secured.

Thus, in the structure for mounting a conductive member according to the present invention, the conductive member can be mounted vertically to the electronic component without using a connector. It is possible to reduce the size of the device and to reduce the number of components and cost by not using a connector.

In the method for mounting a conductive member according to the present invention, the conductive member is passed through a locking hole provided in the electronic component, and both sides of a portion of the conductive member passed through the locking hole are deformed. The stop portion is brought into contact with the edges on both sides of the locking hole, so that the connection portion, which exposes a part of the conductor of the conductive member, and the electrode on the electronic component are connected by soldering. In addition, the state in which the conductive member is vertically fixed to the electronic component can be maintained without using a jig or manual operation, and the workability of soldering is improved.

Thus, in the method for attaching a conductive member according to the present invention, the conductive member can be attached vertically to the electronic component without using a connector. The step of attaching the conductive member to the connector can be omitted.

When the structure and method for mounting a conductive member according to the present invention are applied to various electronic devices, the size of the device can be reduced, the number of parts can be reduced, and the manufacturing process can be shortened. Thus, the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of a mounting structure and a mounting method of a flexible substrate as an example of a conductive member according to the present invention.

FIG. 2 is a cross-sectional view illustrating a process of attaching a flexible substrate to the substrate.

FIG. 3 is a perspective view showing a conventional mounting structure of a flexible substrate as an example of a conductive member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Flexible board 3 Locking hole 4 Electrode pattern 5 Notch 5 Locking part 6a First locking part 6b Second locking part 7 Connection part 8 Solder

Claims (3)

[Claims] 1. A conductive member mounting structure for connecting a conductive member having flexibility, which is formed by arranging conductors in a plane and covered with an insulator, in a state perpendicular to an electronic component, wherein: A locking hole is provided, and the conductive member is provided with a locking portion that deforms both sides of a portion passing through the locking hole and abuts on edges of both surfaces of the locking hole, respectively. A mounting structure for a conductive member, characterized in that a connection portion for exposing a part of the conductor and electrically connecting to the electronic component is provided. 2. The locking portion sandwiches a portion of the conductive member that passes through the locking hole,
A first locking portion that is bent in a direction perpendicular to the extending direction of the conductive member and protrudes to one side over the entire width direction, and the electronic component is provided through the first locking hole. At intervals equivalent to the thickness of the portion provided with the locking holes, the conductive member is bent over the entire width direction of the conductive member in a direction orthogonal to the extending direction, and is opposite to the first locking portion. 2. A second locking portion projecting from the first locking portion, wherein the connection portion is provided on at least one of the first locking portion and the second locking portion. Mounting structure of the conductive member. 3. A flexible conductive member comprising a conductor arranged in a plane and covered with an insulator is passed through a locking hole provided in an electronic component, and is passed through the locking hole of the conductive member. After fixing the conductive member in a state perpendicular to the electronic component with a locking portion formed by deforming both sides of the part, the connecting portion formed by exposing a part of the conductor of the conductive member and the electronic component A method for mounting a conductive member, comprising soldering an electrode.