JP2002270532A - Heating device and thermal treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heating device which enables the rapid temperature rise of an object to be treated and also is excellent in an economical efficiency, and to provide a thermal treatment apparatus. SOLUTION: The heating device comprises lamps and a lamp house. The lamps have a first lamp and a second lamp having an irradiation area narrower than that of the first lamp, respectively, The lamp house has a first lamp housing part for housing the first lamps in the center of the lamp house, and a second lamp housing part for housing the second lamps around the first lamp housing part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating apparatus and a heat treatment apparatus for heating an object to be processed such as a single crystal substrate and a glass substrate. The present invention provides, for example, rapid thermal processing (RTP: Ra) suitable for manufacturing a semiconductor device such as a memory or an IC.
It is suitable for a pid thermal processing apparatus. Here, RTP is a technology including rapid thermal annealing (RTA), rapid cleaning (RTC), rapid thermal chemical vapor deposition (RTCVD), rapid thermal oxidation (RTO), rapid thermal nitridation (RTN), and the like.

[0002]

2. Description of the Related Art Generally, in order to manufacture a semiconductor integrated circuit, various heat treatments such as a film forming process, an annealing process, an oxidative diffusion process, a sputtering process, an etching process, and a nitriding process are performed on a silicon substrate such as a semiconductor wafer. Is repeated a plurality of times.

For the purpose of improving the yield and quality of semiconductor manufacturing processing, RTP technology for rapidly increasing and decreasing the temperature of an object to be processed has attracted attention. Conventional RTP
The apparatus typically includes an object to be processed (eg, a semiconductor wafer,
A support ring for mounting a glass substrate for a photomask, a glass substrate for a liquid crystal display, and a substrate for an optical disk (also referred to as a guard ring or other names), and a single-wafer-type chamber (processing chamber) for accommodating these. A window disposed in the processing chamber, and a heating lamp (e.g., a halogen lamp) disposed on the upper outside or upper and lower portions of the window.
And a reflector (reflecting plate) arranged on the opposite side of the lamp from the object to be processed.

[0004] The reflector is made of, for example, aluminum, and its reflection part is typically plated with gold. The reflector is provided with a cooling mechanism (a cooling pipe or the like) for preventing the reflector from hindering the cooling at the time of temperature damage (for example, gold plating peeling due to high temperature) due to the lamp of the reflector and cooling. The rapid temperature rise required in the RTP technology depends on the power density of the lamp and the directivity of light irradiation from the lamp to the object.

The window is formed of quartz (hereinafter, a quartz window) and is formed in a plate shape or in a tubular shape capable of storing an object to be processed therein. When the processing chamber is evacuated by the vacuum pump and the inside is maintained in a reduced pressure environment, the quartz window has a thickness of several tens of mm (for example, 30 to 40 mm) to maintain a pressure difference between the reduced pressure and the atmosphere. . In some cases, the quartz window is formed into a thin and pressure-resistant curved shape in order to prevent thermal stress due to each temperature difference caused by a rise in temperature.

A plurality of halogen lamps are arranged to uniformly heat the object to be processed, and the reflector uniformly emits infrared rays from the halogen lamp toward the object to be processed. The halogen lamp and the reflector are integrally formed as one lamp house. Processing chambers are typically
The side wall is connected to a gate valve for introducing and receiving an object to be processed, and the side wall is connected to a gas supply nozzle for introducing a processing gas used for heat treatment.

[0007] The temperature of the object to be processed needs to be accurately grasped in order to affect the quality of processing (for example, the film thickness in the film forming process). A temperature measuring device for measuring the temperature of the processing object is provided in the processing chamber. The temperature measuring device may be constituted by a thermocouple. However, since the temperature measuring device must be brought into contact with the object to be processed, the object to be processed may be contaminated by the metal constituting the thermocouple. Therefore, the intensity of infrared rays radiated from the back surface of the object to be processed is detected, the emissivity ε of the object to be processed is calculated according to the following equation 1 to convert the temperature to the temperature of the object to be processed. A pyrometer for calculating a temperature has been conventionally proposed as a temperature measuring device.

[0008]

(Equation 1)

[0009] Here, the radiation intensity, E _m (T) is the radiation intensity measured from the workpiece temperature T from blackbody of E _BB (T) is the temperature T, epsilon is the emissivity of the object is there.

In operation, an object to be processed is introduced into the processing chamber from the gate valve, and its periphery is supported by a hollow support ring. During the heat treatment, a processing gas such as a nitrogen gas or an oxygen gas is introduced from a gas supply nozzle. On the other hand, infrared rays emitted from the halogen lamp are absorbed by the object, and the temperature of the object increases.

[0011]

In recent years, demands for rapid temperature rise of RTP have been increasing due to high quality processing of a processing object and improvement of throughput. For example, the temperature rise is changed from the current 90 ° C./sec to 250 ° C./sec. However, a support ring on which an object to be processed (for example, a silicon substrate) is placed is usually made of ceramics (for example, SiC) having excellent heat resistance, but the temperature rise between the two due to a difference in heat capacity. Are different. For this reason, there is a problem that the temperature of the object to be processed is lower at the peripheral temperature in contact with the support ring than at the center temperature, and it is difficult to uniformly and rapidly increase the temperature over the entire surface of the object to be processed. As a means for solving this, the present inventors have studied heating the periphery of the object to be processed with a larger power than the center of the object. The reflector is also deteriorated by heating with a large power.
However, high power lamps are shorter lived than low power lamps. Similarly, high power lamp reflectors are shorter lived than low power lamp reflectors. As a result, in order to replace the lamp and reflector around the expired lamp house, the lamp house including the lamp and reflector at the center of the lamp house, which can still be used, must be replaced integrally, which is inconvenient. Economy.

Accordingly, it is a general object of the present invention to provide a new and useful heating device and heat treatment device that solve such problems.

[0013] More specifically, it is an exemplary object of the present invention to provide a heating device and a heat treatment device capable of rapidly increasing the temperature of an object to be processed and excellent in economical efficiency.

[0014]

In view of the above problems, a heating device according to one aspect of the present invention is a heating device including a lamp and a lamp house, wherein the lamp includes a first lamp and the first lamp. A second lamp having an irradiation area smaller than that of the first lamp housing, wherein the lamp house includes a first lamp housing unit that houses the first lamp in the center of the lamp house;
A second lamp accommodating portion accommodating a second lamp around the first region. Such a heating device includes a first lamp having a large irradiation area at the center of the lamp house,
And a second lamp having a smaller irradiation area than the first lamp around the first lamp. Such a heating device can irradiate the central portion of the surface to be irradiated of the heating device with a large irradiation area and the periphery thereof with a small irradiation area. Further, a configuration may be employed in which the irradiation energy per unit area of the second lamp is increased. With this configuration, it is possible to intensively heat the peripheral portion of the irradiated portion on the irradiated surface. Further, by increasing the number of lamps per unit area in the second region from the number of lamps per unit area in the first region, such an effect becomes more remarkable. Further, the heating device may have a structure in which one of the lamps is detachable from the base. With such a configuration, for example, only a deteriorated lamp can be easily replaced, and a lamp that can still be used is not removed. Further, it is not necessary to replace the entire base when replacing the lamp, and only the deteriorated lamp can be replaced.

A heat treatment apparatus according to another aspect of the present invention is a heat treatment apparatus for performing a predetermined heat treatment on an object to be processed by using a heat source, the first lamp constituting the heat source;
A second lamp having an irradiation area smaller than that of the first lamp, and a lamp house holding the first and second lamps, wherein the lamp house is located at a center of the lamp house; A first lamp accommodating portion for accommodating a first lamp, and a second lamp accommodating portion for accommodating a second lamp around the first region. Such a heat treatment apparatus has the above-described heating apparatus and has the same effect.
More specifically, the object to be processed can efficiently irradiate a narrow area, which is a part where the temperature rise of the peripheral temperature in contact with the support ring is lower than the center temperature, with the second lamp having a small irradiation area. Further, by increasing the irradiation energy of the second lamp or increasing the number of lamps per unit area of the second region, the central portion and the outer peripheral portion of the object to be processed can be uniformly heated. Therefore, a high-quality heat treatment can be performed, and the object to which the heat treatment has been performed is also high-quality. Further, the heat treatment apparatus may be configured so that one lamp can be detached from the base. With such a configuration, for example, only a deteriorated lamp can be easily replaced, and a lamp that can still be used is not removed. Further, it is not necessary to replace the entire base when replacing the lamp, and only the deteriorated lamp can be replaced. Therefore, the maintainability of the heat treatment apparatus can be improved.

[0016] Other objects and further features of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An exemplary heat treatment apparatus 100 according to the present invention will be described below with reference to the accompanying drawings. In the drawings, the same reference numerals indicate the same members. In addition, the same reference number with a capital letter added thereto is a modification of the reference number without a letter. I do. Here, FIG. 1 is a schematic cross-sectional view of a heat treatment apparatus 100 as an exemplary embodiment of the present invention. As shown in FIG. 1, the heat treatment apparatus 100 includes a processing chamber (process chamber) 110, a window 120, and a heating unit 14.
0, a support ring 150, a bearing 160,
Permanent magnet 170, gas introduction unit 180, exhaust unit 190
And a radiation thermometer 200 and a control unit 300. In FIG. 1, it should be understood that the shapes of the heating unit 140 and the lamp 130 are simplified. It should be noted that such a configuration will be further clarified in the drawings described later and in this specification.

The processing chamber 110 is formed of, for example, stainless steel, aluminum, or the like.
0 is connected. The processing chamber 110 defines a processing space for performing a heat treatment on the workpiece W by the cylindrical side wall 112 and the window 120. In the processing space,
A support ring 150 on which a workpiece W such as a semiconductor wafer is placed, and a support 152 connected to the support ring 150 are arranged. These members will be described in the rotation mechanism of the workpiece W. Further, a gas introduction unit 180 and an exhaust unit 190 are connected to the side wall 112. The processing space is maintained in a predetermined reduced-pressure environment by the exhaust unit 190. A gate valve for introducing and discharging the workpiece W is omitted in FIG.

The bottom 114 of the processing chamber 110 is provided with a cooling pipe 116.
a and 116b (hereinafter simply referred to as "116") and function as a cooling plate. If necessary, the cooling plate 114 may have a temperature control mechanism. The temperature control mechanism includes, for example, a control unit 300, a temperature sensor, and a heater, and is supplied with cooling water from a water source such as a tap. Other types of refrigerants (alcohol, Galden, Freon, etc.) may be used instead of the cooling water. As the temperature sensor, a well-known sensor such as a PTC thermistor, an infrared sensor, and a thermocouple can be used. The heater is configured, for example, as a heater wire wound around the cooling pipe 116. By controlling the magnitude of the current flowing through the heater wire, the temperature of the water flowing through the cooling pipe 116 can be adjusted.

The window 120 is airtight to the processing chamber 110.
Is attached to the decompression environment in the processing chamber 110 and the atmosphere.
And a light from a lamp 130 described later.
Through. The window 120 has a radius of about 400 mm,
Cylindrical play about 5 to 10 mm thick, for example 5 mm
121, made of translucent ceramics
You. In this embodiment, the transparent material used for the plate 121 is used.
Light ceramics is Al _TwoO_ThreeIt will be described later.
However, the present invention is not limited to this.

Ceramics are polycrystals obtained by sintering raw material powders, and their fine structure is generally composed of precipitates and pores (voids) in addition to crystal grains and grain boundaries. Basically, ceramics show opacity, but the sintering process,
The ceramics can be made transparent by controlling the raw material powder and additives and changing the microstructure. Note that a ceramic having a light-transmitting property is generally referred to as a light-transmitting ceramic. The microstructure of the translucent ceramic is composed of only crystal grain boundaries with few pores and precipitates. Accordingly, light passing through the translucent ceramics hardly causes energy loss due to the substance, and can pass through the object without being diffused light, and exhibits translucency. On the other hand, the phenomenon of light energy absorption due to electronic transitions in a substance is also one of the factors that indicate translucency, and materials that do not have an element of the absorption phenomenon in the desired wavelength region are targets for transparent ceramics. . Note that any technology in the art can be applied to the translucent ceramics, and a detailed description in this specification is omitted.

Translucent ceramics have high strength at high temperatures,
Further, since the porosity of the sintered body is almost 0, it has features such as obtaining a smooth surface and no gas emission. The translucent ceramics suitable for the plate 121 used in the present invention further has the following properties. First, the transmittance wavelength dependence is equal to or higher than that of quartz. For example, quartz transmits 80 to 90% or more of light having a wavelength of 0.3 to 2.5 μm. Second, the bending strength is better than the maximum bending stress σ _MAX = 68 MPa of quartz. Third, the thermal conductivity is superior to that of quartz (1.4 to 1.9 W / mK). Fourth, it has good productivity.

The plate 121 is made of Al ₂ O ₃ as described above.
According to the literature, a plate 121 having a thickness of 5 mm has a transmittance of 80% or more in a wavelength region of 3.5 to 6.0 μm according to the literature. Also,
Maximum bending stress sigma _{MA X} of Al ₂ O ₃ is 500 MPa,
It is better than quartz. Therefore, the plate 121 does not need to be formed in a dome shape curved in a direction away from the processing chamber 110 as in the related art, and has a planar shape. The dome-shaped quartz window has the problem that the directivity of the lamp is deteriorated because the distance of the object to be processed from the lamp is increased, but this embodiment solves this problem.

In a disk (radius a, thickness t) with a fixed circumference and uniformly distributed load p under the same conditions as the window 120,
The maximum bending stress σ _MAX acting on such a disk is obtained by the following equation.

[0025]

(Equation 2)

When the radii are the same in a disk fixed at the periphery and uniformly distributed, the maximum bending stress is inversely proportional to the square of the plate pressure. Therefore, the plate 121 of the present invention, which has a maximum bending stress of about 7.4 times that of quartz, has a plate pressure of about 1 against quartz.
/2.7 times. As a result, the plate 121 of the present invention can obtain the same strength with a thickness of about 1/3 of the conventional quartz, and
Can be made thinner.

The thickness of the plate 121 of this embodiment is 5 to 10 mm or less, for example, about 5 mm, which is smaller than the thickness of a conventional quartz window of 30 to 40 mm. As a result, the window 120 of the present embodiment absorbs less light from the lamp 130 described later than the conventional quartz window. Therefore, firstly, the efficiency of irradiation of the object W from the lamp 130, which will be described later, can be improved as compared with the related art, so that high-speed temperature rise can be achieved with low power consumption. That is, conventionally, there was a problem that the lamp light was absorbed by the quartz window and the irradiation efficiency to the object to be processed W was reduced, but this embodiment solves the problem. Second, the plate 12
Since the temperature difference (that is, the thermal stress difference) between the front and back surfaces of No. 1 can be kept lower than before, it is hard to break. That is,
Conventionally, there has been a problem that a temperature difference occurs between the surface of the quartz window facing the lamp and the surface on the opposite side, and the quartz window is easily broken due to the difference in thermal stress between the front and back surfaces during rapid temperature rise such as RTP. However, this embodiment solves that.
Third, since the temperature rise of the window 120 is lower than that of the conventional quartz window, it is possible to prevent a deposited film and a reaction by-product from adhering to the surface in the case of the film forming process, and to improve the temperature reproducibility. Processing chamber 1 that can be secured
10 can reduce the frequency of cleaning. That is, conventionally, the temperature of the quartz window has risen, and particularly in the case of a film forming process, a deposited film or a reaction by-product adheres to the surface thereof, so that the temperature reproducibility cannot be ensured and the frequency of cleaning the processing chamber is increased. There was a problem that increases
This embodiment solves that.

The thermal conductivity of the plate 121 is 34 W
/ M · K, which is larger than the thermal conductivity of the conventional quartz window, which is 1.4 to 1.9 W / m · K. The value is 18 to 24 times higher than that of quartz. As a result, the window 120 of the present embodiment has a smaller temperature difference in the window 120 during heating than the quartz window. Therefore, the energy from the lamp 130 reaches the workpiece W uniformly, and the workpiece W can be uniformly heated. Therefore, the object to be processed W can be uniformly heated, and the object to be processed W can be provided with higher quality than before.

Further, the plate 121 made of translucent ceramics is easier to process than quartz and has excellent manufacturability. As described later, a configuration in which a cooling pipe is arranged inside the plate 121 is also possible.

In this embodiment, the plate 121 is made of Al
_TwoO_ThreeHowever, as described above, the present invention
It is not limited to the material. Plate 121 is described above.
Is sufficient to have the function and effect as described above.
Translucent ceramics applicable to the examples include, for example, A
1N, Sc_TwoO_Three, MgO, Ca_Five(PO_Four)_ThreeOH, Si_Three
N_Four, PLZT-8 / 65/35, Y_TwoO_Three, ZrO_Two, T
hO_Two-5mol% Y _TwoO_Three, Y_TwoO_Three-10 mol% Th
O_TwoAnd so on.

Hereinafter, referring to FIGS. 2 and 3, a window 120 as a modified example of the window 120 of the present embodiment will be described.
A will be described. Here, FIG. 2 shows the window 1 shown in FIG.
It is a bottom view of the window 120A which is a modification of 20. FIG. 3 is a partially enlarged cross-sectional view taken along the line AA of the window 120A shown in FIG. Window 12 of this embodiment
OA has a reinforcing member (or column) 124 made of aluminum or stainless steel (SUS) having a rectangular cross section immediately below the plate 121 shown in FIG. In FIG. 2, for example, a plurality of reinforcing members 124 are linearly formed. When using such a window 120A, it is preferable that the lamps 130 are linearly arranged.
24 avoids the area directly below the lamp 130 (that is, the lamp 13
0 lamp light is not shielded by the reinforcing material). However, the reinforcing member 124 may have a shape such as a bend, and the lamp 130 may be shaped like the heating unit 140 of the present embodiment.
Are arranged concentrically, a bending process may be performed so as to avoid a position directly below the lamp 130. Since the reinforcing member 124 has a good thermal conductivity and is made of the same material as the processing chamber, it does not become a source of contamination for the workpiece W. Due to the reinforcing member 124, the thickness of the plate 121 of the window 120A is 5 to 10 mm or less, preferably 5 mm or less, more preferably, for example, about 3 mm. In this embodiment, the cross-sectional dimension of the reinforcing member 124 is as shown in FIG.
Is about 18 mm in height and about 12 mm in width, and the diameter of the water cooling tube 125 is about 6 mm, but is not limited thereto. As shown by the arrow in FIG. 3, light from the lamp 130 is reflected by the side surface of the reinforcing member 124 and is introduced into a workpiece W (not shown) arranged below.

The reinforcing member 124 has a cooling pipe (water-cooling pipe) 125 inside, and further increases the strength of the window 120A. The cooling pipe 125 of the present embodiment includes a reinforcing material 124.
And a function of cooling both the plate 121. The cooling pipe 125 has an effect of cooling the plate 121 and preventing thermal deformation due to lamp light. Also, if the reinforcing material 124 is made of aluminum, it melts or deforms at 200 to 700 ° C., so that appropriate temperature control is necessary.
The temperature control by the cooling pipe 125 may be the same as that of the cooling pipe 116, and any method known in the art can be applied.

Referring now to FIG. 4, a description will be given of a window 120B as another modified example of the window 120 of the present embodiment. Here, FIG. 4 shows the window 12 shown in FIG.
It is a partially expanded sectional view of the window 120B which is a modification of FIG. The window 120B of this embodiment has a plate 121 composed of two thin plates 126 and 127 formed of translucent ceramics, and a cooling pipe 125 arranged between the plates 126 and 127.

The plate 121 has a bonding surface 128 for bonding the plates 126 and 127 shown by dotted lines in the figure.
In contrast, plates 126 and 127 are configured to be line symmetric. A groove is formed in the plates 126 and 127 so as to fit the cooling pipe 125, and the cooling pipe 128 is disposed in such a groove and bonded from both sides. The groove is located between the lamps of the lamp 130 and is arranged so as not to be directly below the lamp. Translucent ceramics have the advantage that local processing is easier than quartz, and such a configuration is possible. Further, it is preferable that the thickness of the plate 121 when the plates 126 and 127 are attached to each other is the same as the plate 121 of the window 120.

The cooling pipe 125 is a cooling pipe having a circular or elliptical cross section.
27. Since the cooling pipe 125 is disposed between the plates 126 and 127, the cooling pipe 125 has an advantage of improving the cooling efficiency of the plate 121 as compared with the window 120A. The cooling pipe 125 is connected to the window 12 described above.
It has the same effect as 0A, and the detailed description is omitted here.

The heating section 140 of the present invention will be described below with reference to FIGS. Here, FIG. 5 is a schematic bottom view of the heating unit 140 shown in FIG. 1, and FIG. 6 is an enlarged sectional view showing a part of the heating unit 140 shown in FIG. FIG.
6 is a diagram corresponding to FIG. 6 when the lamp 130 is removed from the lamp heating unit 140 shown in FIG. FIG. 8 shows FIG.
3 is a schematic sectional view of a lamp 130a shown in FIG. FIG. 9 is a schematic cross section of the lamp 130b shown in FIG. FIG.
FIG. 7 is a schematic bottom view of the lamp 130 shown in FIG. 6. It should be understood that the heating unit 140 and the lamp 130 are somewhat exaggerated in FIGS. 5 to 10 and are characteristic of the present invention. The heating unit 140 includes two types of lamps 130a and 130b and a lamp holding unit 142 as a lamp house, and functions as a heating device that performs a predetermined heat treatment on the workpiece W. Here, it is assumed that the lamp 130 includes the lamps 130a and 130b. In this embodiment, the heating unit 140 is separated from the processing target W such that the distance between the irradiation surface of the lamp 130 and the processing target W is about 40 mm.

Although the lamp 130 is of a single-ended type in this embodiment, other energy sources such as a heating wire heater may be used. Here, the single-ended type refers to a type of lamp having one electrode portion 132 as shown in FIG. The lamp 130 has a function of heating the workpiece W and is a halogen lamp in this embodiment.
The lamp applicable to 0 is not limited to this. The output of the lamp 130 is output from the lamp driver 310.
The lamp driver 310 is controlled by the control unit 300 as described later, and supplies electric power to the lamp 130 in accordance with the control. In this embodiment, the power is controlled by the control unit 300 such that the power density of the lamp 130b is higher than the power density of the lamp 130a. More specifically, lamp 130b has a power density that is two to three times that of lamp 130a.

As shown in FIG. 5, in this embodiment, the lamps 130 are arranged substantially concentrically so as to correspond to the substantially circular workpiece W (in FIG. 5, the number of the lamps 130 is omitted. Is drawn). The lamp 130 has a large-diameter lamp 130a at a position corresponding to the vicinity of the center of the workpiece W, and a small-diameter lamp 130b at a position corresponding to the vicinity of the end of the support ring 150 and the workpiece W. . The arrangement of the lamp 130 will be described in the lamp holding unit 142, and a detailed description thereof will be omitted.

Typically, the lamp 130 has one electrode 13
2, the intermediate portion 134, and the electrode portion 13 via the intermediate portion 134.
The light emitting unit 136 includes a coil 138 portion of a filament 137 connected to the electrode unit 132 via the intermediate unit 134, and a reflector 139.

In this embodiment, the lamp 130 has a thread (male thread) 131 formed on a side surface portion of the lamp holding portion 142 which inscribes a groove 143 described later. Thread 131
Is a triangular screw in the present embodiment, and a substantially triangular thread is formed. The shape of the thread 131 is not limited to such a shape, and may be a square screw, a trapezoidal screw, or the like. However, the thread 131 is the lamp 1
30 shows an exemplary configuration of a lamp 130
Is not limited to this in shape. The lamp 130B without the thread 131 may be used as described later.

In this embodiment, for example, the lamp 130a
The height of the electrode part 132 is about 25 mm, the height of the middle part 134 is about 45 mm, and the height of the light emitting part 136 is about 25 mm. The diameter of the middle part 134 is about 10 mm,
The diameter of 36 is about 40 mm. Meanwhile, for example, the height of the electrode part 132 of the lamp 130b is about 25 mm, the height of the middle part 124 is about 55 mm, and the height of the light emitting part is about 10 mm. The diameter of the middle part 134 is about 10 mm, and the diameter of the light emitting part 136 is 20 mm.

The electrode section 132 has a pair of electrodes 133,
The electrode 133 is electrically connected to the lamp driver 310 via the lamp holding portion 142, and the electrode 133 is electrically connected to the filament 137. Electrode part 132
The power supplied to is determined by the lamp driver 310, and the lamp driver 310 is controlled by the control unit 300. The electrode section 132 and the lamp driver 310 are connected by a sealing section 143c described later.

The intermediate portion 134 is formed integrally with the light emitting portion 136 and is hermetically sealed. Nitrogen, argon, or a halogen gas is sealed in the inside. The intermediate portion 134 is a cylinder having a predetermined length and located between the electrode portion 132 and the light emitting portion 136, and separates the electrode portion 132 from the light emitting portion 136. The intermediate portion 134 has an advantage that such a length is preferable in controlling the temperature of the lamp 130 described later. Since the filament 137 located inside the intermediate portion 134 also emits light, the light emitting portion 136 is naturally
Part of. However, in this specification, since the electrode portion 132 and the light emitting portion 136 (the portion that emits the strongest light) are separated by a predetermined distance, it should be understood that such a region is merely defined as the intermediate portion 134. In the present embodiment, the intermediate portion 1
34 is made of ceramic. The intermediate portion 134
Is a metal material such as aluminum or S besides ceramic.
It may be formed from US (stainless steel).

The light emitting section 136 is the intermediate section 1 in this embodiment.
It has a cylindrical shape with a diameter larger than 34, and includes a side surface 136a inscribed in the groove 143, and an emission surface 136b facing the workpiece W and emitting lamp light. Light emitting unit 136
Has a coil 138 portion of a filament 137 and a reflector 139 therein. In this embodiment, the light emitting unit 1
The side surface 136a of 36 is formed integrally with the intermediate portion 134 from the same material as the intermediate portion 134. On the other hand, the emission surface 136b of the light emitting unit 136 is formed of a material that easily transmits lamp light, such as quartz or translucent ceramics.

The light-emitting portion 136 basically has a side surface 136 formed in a hemisphere, a semi-elliptical sphere, and a conical shape. On the side surface of the lamp 130, a thread 131 as described later is formed. Therefore, as shown in FIGS. 6, 8 and 9, in the present embodiment, the light emitting portion 136 has a shape of the side surface 136b different from the hemispherical shape and the conical shape in order to form the screw thread 131. It should be understood that it has been transformed. The shape of a reflector 137 described later is changed to the side surface 13.
It has a hemispherical shape instead of the same shape as 6a, because the shape of the side surface 136a is only exemplarily deformed.

The filament 137 is made of, for example, tungsten (W). 8 to 10, the filament 137 is connected to the electrode 133 and the coil 1 which can be a light source in the light emitting unit 136.
38. The axis of the coil 138 is formed so as to be parallel to the workpiece W. Filament 13
The light emitted from 7 is irradiated in the normal direction of the coil 138 (the direction orthogonal to the axial direction of the coil 138). Therefore, light from at least the side of the coil 138 facing the object W is directly irradiated to the object W (not through the reflector 139). Such light is reflected by the reflector 1
The reflection loss due to 39 is 0, and the object to be processed W is irradiated with high energy. On the other hand, light excluding such light is efficiently reflected by the reflector 139 described later and is irradiated onto the processing target W.

The reflector 139 covers the coil 138,
It has a hemispherical shape that is convex in a direction away from the processing target object W. The reflector 139 is a reflecting portion that reflects light toward the processing target object W, and more specifically, the light emitting portion 136.
Is formed in the same shape as the side surface 136a. However, FIG.
In FIGS. 8 and 9, it should be understood that the shape of the light emitting unit 136 is changed as described above because the light emitting unit 136 forms the thread 131. Also, the reflector 139
Is not limited to a hemispherical shape, and other shapes are not excluded as long as the shape is the same as the side surface of the light emitting unit 136. For example, the reflector 139 may have a semi-elliptical spherical shape or a conical shape. The reflector 139 has a through hole (not shown), and allows the filament 137 to be connected to the electrode 133 from the through hole, and covers the coil 138. However, it is preferable that the through hole is formed in a size that does not hinder the reflection function of the reflector 139. Further, the surface of the reflector 139 on the side covering the coil 138 is subjected to a coating process for efficiently reflecting light including visible light and infrared light. Gold (Au), gold (Au)
And rhodium (Rh), gold (Au) and nickel (N
It is conceivable to use i).

The reflector 139 has a function of reflecting the light emitted from the coil 138 of the filament 137 toward the object to be processed W and increasing the directivity of the lamp 130. The reflector 139 efficiently irradiates the light radiated from the coil 138 portion of the filament 137 with the above-described shape to the workpiece W by preferably at least one or less reflection, and substantially emits lamp light to the workpiece. Focus in the vertical direction. The optical path of the lamp 130 will be described with reference to FIGS. here,
FIG. 11 shows the filament 13 of the lamp 130 shown in FIG.
FIG. 7 is a schematic side view showing an optical path of light L (L is a general term of L ₁ , L ₂ , and L ₃ ) emitted from the light emitting device 7.
FIG. 12 shows the filament 13 of the lamp 130 shown in FIG.
FIG. 7 is another schematic side view showing an optical path of light L emitted from 7. Light L ₁ emitted from the upper surface side of the coil 138 (the side facing the processing target W) travels in a direction away from the processing target W, that is, toward the reflector 139. As described above, since the reflector 139 reflects the light toward the processing target W, the light L ₁ is reflected once by the reflector 139 and advances toward the processing target W. A part of the light L ₁ is are those not irradiated on the target object W reaches the filament 137 again. However, the energy of such light is
Since it contributes to the heating and light emission of 38, it is not relatively possible to lose energy. The light L ₂ emitted from the side surface of the coil 138 is incident on the reflector 139, most of the light L ₂ is irradiated on the target object W, and the rest returns to the filament 137 and contributes to the light emission of the coil 138 as described above. . Finally, the light L3 emitted from the lower surface side of the coil 138 (the side facing the workpiece W) is reflected by the reflector 139.
The target object W is directly irradiated without passing through.

As described above, the lamp 1 of this embodiment is
Numeral 30 designates a coil 138 portion of the filament 137 arranged in parallel, so that light is emitted in a direction perpendicular to the workpiece W. One light is directly applied to the object to be processed W, while the other light is directed to the reflector 139. Further, as described above, the shape of the reflector 139 is formed so as to reflect light toward the processing target object W. Therefore, the lamp 130
The light emitted from the object is irradiated on the object to be processed by only one reflection. Further, the light emitted from the lamp 130 is concentrated in the tangential range of the opening of the reflector 139.
That is, the lamp 130 of this embodiment is transmitted to the processing object W with a small energy loss because the number of reflections on the reflector 139 is smaller than that of the conventional lamp as shown in FIG. 26, and has excellent directivity. . Conventionally, there has been a problem that the energy of lamp light is reduced due to reflection loss caused by multiple reflection of light by a reflector, but this embodiment solves this problem. Thus, the lamp 130 can improve the irradiation efficiency of the object to be processed W more than before, and can achieve high-speed temperature rise with low power consumption. In addition, the reflector 1
The curvature and opening of the lamp 39 differ depending on the directivity required of the lamp 130.

In this embodiment, the thread 131 applicable to a groove 143 of the lamp holding portion 142 described later
30 formed on the side surface of the lamp 130,
The light-emitting portion 34 and the light-emitting portion 136 are formed of the above-described members in consideration of strength and workability. However, the lamp 13 of the present invention
0 is not limited to such a member, and
The entirety of the light emitting portion 34 and the light emitting portion 136 may be formed of quartz or translucent ceramics. However, in the case of such a configuration, it is needless to say that a cover material must be provided on the lamp 130 to obtain the strength and workability of the lamp 130 with respect to the lamp holding portion 142 in the cover. Further, such a cover material is used for a lamp 130 described later.
It is preferable to select a member having a high thermal conductivity so as not to hinder the cooling. On the other hand, in the lamp 130, typically, the side surface 136b of the light emitting unit 136 may be formed in a hemispherical or conical shape as described above. Further, the lamp 130 may be formed in a cylindrical shape in which the light emitting part 136 and the intermediate part 134 have the same diameter. However, the lamp 1 described above
The shape of 30 has the advantage that it has many of the advantages described below.

Hereinafter, a lamp 130A as a modification of the lamp 130 of the present embodiment will be described with reference to FIG.
Here, FIG. 13 is a schematic bottom view of a lamp 130A which is a modification of the lamp 130 shown in FIG. Lamp 130
A has a filament 137A constituting a plurality of coils 138a to 138c. Coils 138a to 138
c is disposed so as to be parallel to the processing target W, similarly to the filament 137 described above. Coil 138
a to 138c are arranged in parallel, so that when the lamp 130A is viewed from FIG.
6 can be considered as a surface light source. That is, the lamp 130
A increases irradiation energy more than the lamp 130.
Therefore, the irradiation efficiency of the object to be processed W can be higher than that of the lamp 130, so that a high-speed temperature rise can be achieved. Further, it is needless to say that the lamp 130A has a small reflection loss of the reflector 139 as described in the lamp 130 and has directivity.

In the lamp 130A, the number of coils 138a to 138c constituting the filament 137A is illustrative, and can be appropriately changed according to desired irradiation energy. The arrangement and shape of the filament 137A are sufficient so that the lamp 130A can be regarded as a surface light source for the object W to be processed. That is, FIGS. 14 to 1
The arrangement of the filament 137 as shown in FIG. Here, FIGS. 14 to 16 are schematic plan views showing filaments 137B to 137D which are modified examples of the filament 137A of the lamp 130A shown in FIG. FIG. 17 is a schematic side view showing the filament 130D shown in FIG. FIG. 14 shows a plurality of coils 138d.
To 139 g are filaments 137B arranged so as to intersect. FIG. 15 shows a coil 13 formed wide.
Filament 137C with 8h. 16 and 17 show a filament 137D in which the coil 138i forms a spiral. Even with the above-described shape, the lamp 13
0A can be regarded as a surface light source, and the irradiation energy of the lamp can be increased.

Referring to FIGS. 5 to 7 and FIG. 18, the lamp holding portion 142 functioning as a lamp house has a substantially rectangular parallelepiped shape, and has a groove 143 for accommodating each lamp 130 and a partition 148. I have. Here, FIG. 18 is a partially enlarged cross-sectional view when the lamp 130 of the lamp holding unit 142 shown in FIG. 6 is not thermally expanded.

The groove 143 has a function as a lamp accommodating portion for accommodating the lamp, and has a groove 14 accommodating the lamp 130a.
3a and a groove 143b for accommodating the lamp 130b. The groove 143 generally includes the groove 143a and the groove 143b. The detailed shape of the groove 143 will be described later, and the arrangement of the groove 143 will be described below.

As shown in FIG. 5, the groove 143a extends radially from the center of the lamp holding portion 142 (the intersection of the line X and the line Y in the figure), that is, the portion corresponding to the center of the workpiece W. Are formed so as to draw concentric circles up to the support ring 150. More specifically, the groove 143a has a first radius from the center of the lamp holding portion 142 and from the center.
On the circumference of a plurality of concentric circles formed large by the distance of
A plurality of grooves 143a are formed so that the center of groove 143a is located. The first distance is about 0.5 to 1.5 of the half width of the radiation distribution of the lamp 130a (the width of the radiation distribution when the light intensity of the lamp 130a is half the peak value). Set to double. In this embodiment, the lamp 130a has a half-width of about 40 mm at a point of about 40 mm from the emission surface 136b in the direction of emission of the lamp light (the distance from the lamp 130 to the object W in this embodiment).
Is shown. The width varies depending on the lamp used, and does not limit the present invention. Also,
In this embodiment, since the cooling tube 148 described later is provided on the light emitting unit 136 side, the first distance is equal to the light emitting unit 13 of the lamp 130a.
50 which is a value larger than the diameter of No. 6 (half-width 40 mm
1.25). It is assumed that the concentric circle is expanded to a position that does not overlap with a groove 143b described later. Also, each groove 143a formed on one circle
Are preferably formed at every first distance.

On the other hand, the groove 143b is
Are formed so as to draw a plurality of concentric circles at a position corresponding to a portion where the object and the processing object W overlap and at a position corresponding to the vicinity thereof. More specifically, the groove 143b is a region that overlaps the support ring 150 described later and the object W, the first circle C ₁ that shows the approximate center, a large second distance radius from the circle C ₁ a second circle C _2, the radius from the circle C ₁ is arranged so as to be located a second distance smaller by a third each on the circumference of the circle C _3. The second distance is set to about 0.5 to 1.5 times the half width of the radiation distribution of the lamp 130b. The lamp 130b has a half width of about 20 mm at a point of about 40 mm from the emission surface 136b in the direction of emission of the lamp light (the distance from the lamp 130 to the object W in this embodiment). The width varies depending on the lamp used, and does not limit the present invention. Groove 143a
Similarly to the above, since the cooling tube is provided on the light emitting unit 136 side, the second distance is set to 25 mm (half-width 20 mm × 1.25). Further, it is preferable that the interval between the grooves 143b formed on one circle is formed at every second distance.

[0057] In this embodiment, the grooves 143b are formed on the three circles C _1, C _2, and C _3, according circle (C _1,
The numbers C ₂ , C ₃ ) are exemplary. As described above, the groove 143b is formed so that the lamp 130b can irradiate the overlapping portion of the support ring 150 and the workpiece W and the vicinity thereof. For example, if the end portion of the specimen W is greater than the circle C _2, the grooves 143b on a circle (not shown) having a radius greater second distance is further formed on the outside of the circle C _2. Similarly, if the support ring 150 is circular C ₃ smaller than, the groove 143b on a circle (not shown) having a smaller radius by the second distance is further formed on the inside of the circle C _3.

In the above configuration, the lamp holding portion 14
2 is a lamp 13 at a position corresponding to the vicinity of the center of the workpiece W.
0a enables the lamp 130b to be arranged in a portion where the workpiece W overlaps the support ring and in the vicinity of the portion. Referring to FIGS. 21 and 22, when the lamp 130 is irradiated in such a state, a larger irradiation area can be obtained by the lamp 130a at the center of the object W to be processed. On the other hand, an irradiation area smaller than the irradiation area of the lamp 130a can be obtained by the lamp 130b near the end of the processing target W. Here, FIG. 21 shows the heating unit 14 shown in FIG.
FIG. 5 is a diagram showing lamp light emitted from a 0 lamp 130a to a workpiece W. FIG. 22 shows the heating unit 14 shown in FIG.
FIG. 5 is a diagram showing lamp light emitted from a 0 lamp 130b to a workpiece W. FIG. 21 and FIG. 22 exemplarily show lamp light, and the lamp 1 of this embodiment is shown.
It does not match the number of 30.

In this embodiment, the small-diameter lamp 130b is used.
Is disposed around the lamp 130a, so that the workpiece W
It is possible to efficiently irradiate a portion where the end portion of the support ring 150 and the support ring 150 overlap, and a narrow area near the portion. Also, as described above, the lamp 13
The power supplied to Ob is greater than the power supplied to lamp 130a. The energy per unit area irradiated from one lamp is larger in the lamp 130b. In the lamp arrangement of the conventional heat treatment apparatus, only one kind of lamp is used, and it is impossible to control the irradiation area of the lamp at the center and the end of the object W to be processed. Portion 15 where workpiece W overlaps support ring 150
The specific heat of the support ring 150 and that of the workpiece W are different between 0 and the vicinity of the portion. More specifically, the specific heat of the support ring 150 is smaller than the specific heat of the workpiece W. Therefore, such a portion has a problem that the temperature is hard to rise as compared with the central portion. However, in the present embodiment, by irradiating the narrow area which is the end of the processing target W where the temperature does not easily rise with the small-diameter lamp 130b, the lamp light can be efficiently heated without leakage of the lamp light. Furthermore, lamp 1
By increasing the power density of 30b, uneven heating at the center can be prevented, and high-quality processing can be performed. In addition, the use of the large-diameter lamp 130a near the center where the temperature is relatively easy to increase is one lamp 130a
And a large irradiation area can be obtained. Therefore, the number of lamps 130 near the center can be reduced as compared with the conventional case, and power consumption can be reduced. In this embodiment, such a problem is solved by using lamps 130 having different diameters and changing the input power.

Referring to FIG. 23, the outermost lamp 130b in the radial direction is set so that the lamp light overlaps the adjacent lamp 130b on the object W to be processed.
It is also conceivable to incline b. Here, FIG.
FIG. 7 is a schematic sectional view showing a modification of the arrangement of the lamp 130 shown in FIG. 6. This configuration has the effect of increasing the irradiation density of the lamp at the end of the processing target W, and is more effective in preventing uneven heating with the center.

The arrangement of the grooves 143 is not limited to the concentric arrangement, but may be any other arrangement as long as the above conditions are satisfied. For example, the arrangement may be linear or spiral. It may be arranged. Further, in this embodiment, since the opening shape of the reflector 139 of the lamp 130 is circular, the irradiation shape of the lamp light is circular. However, considering the concept of arranging a lamp with a large irradiation area at the center of the workpiece W and a lamp with a small irradiation area at the end, the lamp 130 has no limitation on the irradiation shape. For example, the shape of the lamp 130 and / or the reflector 139 may be changed so that the irradiation area becomes a triangle. The shape of the lamp light is not limited to a triangle, but may be a square, a hexagon, or another polygon.
In addition, any irradiation method having the same effect can be applied.

Hereinafter, the shape of the groove 143 will be described.
The groove 143 has the same shape as the lamp 130,
A portion 143c for housing the 30 electrode portions 132, a portion 143d for housing the intermediate portion 134, and a portion 143e for housing the light emitting portion 136. The portion 143c is the electrode portion 13.
2 and a lamp driver 310 shown in FIG. 1 and not shown in FIGS. 6 and 7, and functions as a sealing portion 143c for sealing between the two. In the groove 143, a screw thread (female thread) 147 corresponding to the lamp 130 is formed at a portion where the lamp 130 is inscribed. In the present embodiment, the thread 147 is a triangular screw that is compatible with the lamp 130, and has a substantially triangular thread. The shape of the thread is not limited to such a shape. If the thread 131 of the lamp 130 is a square screw or a trapezoidal screw, the thread 147 of the groove 143 is formed correspondingly. The groove 143 is formed with a screw thread 147 so as to optimally match the lamp 130 when the lamp 130 thermally expands. That is, when the lamp 130 is in a normal form (in a state where it is not thermally expanded), the outer diameter, the inner diameter, and the pitch of the threads 147 formed in the groove 143 are determined by the outer diameter of the threads of the lamp 130. , Inner diameter, and dimensions slightly larger than the thread pitch. However, it should be understood that such a dimensional difference does not prevent insertion of the lamp 130 and engagement with the groove 134.

In the above-described configuration, the groove 143 and the lamp 130 are in a relation of a nut and a bolt. Hold 130. As shown in FIG. 18, when the lamp 130 is in a normal form (not thermally expanded), the lamp 130 and the groove 1
The corresponding threads 43 are in contact in the direction of gravity. That is, the contact area between the lamp 130 and the groove 143 is secured at the thread. The contact area is the lamp 13
It is necessary to keep 0, and at the same time, solves the following disadvantages. The groove of the conventional lamp holding portion has a cylindrical shape similar to that of the lamp, and is formed such that the groove and the lamp coincide with each other when the lamp is maximized by expansion in consideration of the thermal expansion of the lamp. That is, conventionally, when the lamp is not completely expanded, the contact area with the groove is small, and the cooling efficiency of the cooling pipe arranged in the lamp holding portion for cooling the lamp is reduced. This embodiment solves that problem. Also, the groove 143
Since the thread 147 is slightly larger than the thread of the lamp 130, some space is formed between the groove 143 and the lamp 130. When the lamp 130 is heated and thermally expanding, the groove 143 and the lamp 130 are formed so as to coincide with each other, and the space allows the lamp 130 to expand.

Further, the lamp 130 and the groove 1 having such a shape are used.
The shape of 43 has the following advantages. Increasing the output of some of the lamps, as in the configuration described above, hasten the deterioration of such lamps. The reflector is also deteriorated by heating with a large power. Thus, high power lamps are shorter lived than low power lamps. Similarly, high power lamp reflectors are shorter lived than low power lamp reflectors. As a result, the conventional lamp holding part (lamp holding part) is replaced with a lamp including a lamp in the center of the lamp holding part and a reflector which can still be used in order to replace the lamp and the reflector around the lamp holding part whose life has expired. The holder must be replaced as a unit,
It was uneconomic. However, the lamp holding unit 14 of the present embodiment
The second groove 143 and the lamp 130 are in a relation between the nut and the bolt as described above, and the one lamp 130 can be easily removed. Therefore, by replacing only the deteriorated lamp 130, it is possible to continue using the lamp 130 that can still be used. Therefore, conventionally, it was necessary to replace the entire lamp by completely replacing the lamp holding unit, which was uneconomical. However, this embodiment solves such a problem. In addition, although replacing the entire lamp holding unit is troublesome, the present embodiment only has to replace only the deteriorated lamp, and thus has the further advantage of improving the maintenance efficiency.

Referring to FIGS. 19 and 20, a description will be given of a groove 143A which is a modification of the groove 143 of the lamp holding portion 142. FIG. Here, FIG. 19 shows the heating unit 1 shown in FIG.
It is a schematic sectional drawing which shows the structure of 40 lamp holding parts 142. FIG. 20 shows a lamp holding unit 142 of the heating unit shown in FIG.
It is a schematic bottom view which shows the structure of. In FIG. 20, the lamp 130 is removed. Further, the thread 131 is not required for the lamp 130 applicable to the groove 143A, and a lamp 130B without the thread 131 is used.

The groove 143A has a slightly larger shape than the lamp 130B and accommodates the lamp 130B. Groove 1
43A has a plurality of thin plates 144 inscribed in the grooves 134A, and the thin plates 144 have a function of a leaf spring, and
Holds the lamp 130B.

The thin plate 144 is formed in a rectangular shape in this embodiment, and is formed of aluminum or stainless steel. The thin plate 144 is bent so that both ends in the longitudinal direction of the member become substantially L-shaped. Further, the thin plate 144 has a curvature, and the curvature is formed to be the same as the curvature of the side surface of the lamp 130B. As best shown in FIGS. 17 and 18, the thin plate 144 is inscribed in the groove 143A,
For example, the substantially L-shaped tip is formed into a groove
3A. In such a state, the thin plate 144 forms a space 145 between the groove 143A and the thin plate 144.
The space 145 is a space generated by bending the thin plate 144 described above, and can be set to a desired size depending on the bending start position of the thin plate 144. Space 1
Numeral 45 is set to be a space in which the thin plate 144 can expand and contract with respect to the thermal expansion of the lamp 130B as described later. Eight thin plates 144 are arranged along the circumference of the groove 143A while maintaining a predetermined gap 146 with the adjacent thin plates 144. In such a configuration, the thin plate 144 is
A substantially octagon is formed in A. When the thin plate 144 expands and contracts in the radial direction, the gap 146 becomes adjacent to the thin plate 144.
They are set to such an extent that they do not touch each other. Furthermore, the thin plate 144
Are similarly arranged along the side surface of the groove 143A.
That is, in this embodiment, the groove 143A has a total of 24 (8 × 3) thin plates 144. The groove 143A has the thin plate 144, and is configured to be the same as or close to the lamp 130B.

In such a configuration, the groove 143A is
The lamp 130B is held via 44. More specifically, the lamp 130B is inserted into the groove 143A by forcing the lamp 130B into the space defined by the thin plate 144. At this time, the groove 143A is elastically deformed with the insertion of the lamp 130B, and is inscribed in the wall surface constituted by the thin plate 144. Therefore, the lamp 130B is held by the restoring force and the frictional force of the thin plate 144, and comes into contact with the thin plate 144 over the entire surface. Even when the lamp 130B thermally expands, the groove 143A holds the lamp 130B by the expansion and contraction of the thin plate 144 following the lamp 130B. That is, conventionally, when the lamp was not completely expanded, there was a disadvantage that the contact area with the groove was small and the cooling efficiency of the cooling pipe described later was reduced, but this embodiment solves this. Further, even in such a configuration, the lamp 130 can be partially replaced, and the deteriorated lamp 1 can be replaced.
Lamp 1 still usable by replacing only 30
30 can be used continuously. Also, replacing the entire lamp holder is complicated, but
In this embodiment, since only the deteriorated lamp is replaced, there is a further advantage that the efficiency of maintenance is improved.

The number and shape of the thin plates 144 described in the specification in the present embodiment are illustrative, and are not limited to the above description. For example, the space defined by the thin plate 144 may be a polygon. But lamp 1
In order to increase the contact area with the polygon 30, it is preferable that the polygon can be regarded as a substantially circle.

The preferred embodiment of the groove 143 for holding the lamp 130 has been described above, but the present invention is not limited to this, and other embodiments are not excluded as long as the above-described functions and effects can be achieved. Further, the shape of the groove 143 is not limited to the lamp 130, and can be applied to any known lamp.

As shown in FIG. 6 and FIG.
It is arranged between a plurality of adjacent grooves 143 aligned on a concentric circle. In this embodiment, the partition 148 is formed by the groove 143.
The distance between the parts 143c is about 50 mm, and the distance between the parts 143e is about 10 mm. Also, a portion 143c of the groove 143b
It is about 15 mm between them and about 5 mm between the parts 143e. A pair of cooling pipes (water cooling pipes) 148a and 148b are inscribed along the partition 148 along the partition 148 (the cooling pipe 148 is a cooling pipe 148a and a cooling pipe 148b).
Shall be summarized)). More specifically, the cooling pipe 148
a is located at a location corresponding to the electrode section 132 of the lamp 130, and the cooling pipe 148 b is located at a location corresponding to the light emitting section 136 of the lamp 130.

The cooling pipe 148 is connected to a temperature control mechanism (not shown). The temperature control mechanism is, for example, the control unit 300
, A temperature sensor or a thermometer, and a heater, and cooling water is supplied from a water source such as tap water. Other types of refrigerants (alcohol, Galden, Freon, etc.) may be used instead of the cooling water. As the temperature sensor, for example, a well-known sensor such as a PTC thermistor, an infrared sensor, or a thermocouple can be used. The heater is configured, for example, as a heater wire wound around the cooling pipe 116. By controlling the magnitude of the current flowing through the heater wire, the temperature of the water flowing through the cooling pipe 148 can be adjusted.

When the electrode 133 is made of molybdenum, the cooling pipe 148a keeps the temperature of the sealing portion 143c at 350 ° C. or lower in order to prevent the electrode portion 133 and the sealing portion 143c from being broken by molybdenum oxidation. I do. Also,
The cooling pipe 148b maintains the temperature of the light emitting unit 134 at 250 to 900 ° C. so that the intermediate unit 134 and the light emitting unit 136 maintain the halogen cycle. Here, in the halogen cycle, the tungsten constituting the filament 137 evaporates and reacts with the halogen gas to generate a tungsten-halogen compound, which floats in the lamp 130. When the lamp 130 is maintained at 250 to 900 ° C., the tungsten-halogen compound maintains that state. When the tungsten-halogen compound is carried to the vicinity of the filament 137 by convection, it is decomposed into tungsten and a halogen gas due to high temperature. Thereafter, the tungsten precipitates on the filament 137, and the halogen gas repeats the same reaction again. The lamp 13
0 is generally devitrified when the temperature exceeds 900 ° C. (light emitting portion 134
When the temperature is lower than 250 ° C., blackening (a phenomenon in which a tungsten-halogen compound adheres to the inner wall of the lamp 130 and turns black) occurs.

In this embodiment, the cooling pipe 149a is set to a temperature in the range of the halogen cycle and a common temperature for preventing oxidation of molybdenum, preferably 250 to 350 ° C., and the cooling pipe 149b is set to a temperature in the range of the halogen cycle, preferably 800 to 9
Maintain at 00 ° C. Here, the cooling temperature of the light emitting unit 136 can be in the range of 250 to 900 ° C., but if the cooling temperature is set to the upper limit of the halogen cycle in consideration of the cooling efficiency, the cooling can be performed with less power. . The cooling pipe 149a has a common temperature for preventing the halogen cycle and the oxidation of molybdenum, and the light emitting section 136 is maintained within the halogen cycle temperature by the cooling pipe 149b. Also, the lamp 1 is controlled by the cooling pipes 149a and 149b.
30 has a temperature gradient due to the length of the middle portion 134 of the lamp 130, such a temperature gradient (250-950 ° C.) maintains the entire lamp 130 within the halogen cycle temperature. That is, when the light emitting unit 136 is close to the sealing unit 143c, the temperature of the light emitting unit 136 (800 to 950 ° C.) is reduced.
Although this may affect the temperature of c (250 to 350 ° C.), in the present embodiment, this is prevented by providing the lamp 130 with the intermediate portion 134.

In this embodiment, the lamp 130 can suppress the occurrence of devitrification and blackening. Further, the molybdenum of the electrode 133 is oxidized to form the electrode portion 132 and the sealing portion 143c.
To prevent damage. Further, lamp 130 is cooled to be within the halogen cycle. The conventional cooling mechanism of the lamp 130 merely cools the sealing portion 143c, and the cooling of the lamp 130 in consideration of the halogen cycle is not performed as described above. Therefore, the cooling pipe 148 has an advantage of extending the life of the lamp 130 and is economically excellent. As described above, the contact area between the groove 143 and the lamp 130 is larger than that of the related art, and sufficient cooling efficiency can be obtained.

The light emitting section 1 of the lamp 130 is exemplified.
A cooling method is also conceivable in which the partition corresponding to 36 is not provided and the light-emitting unit 136 is air-cooled by using such a space as a space. The sealing section 143c is cooled by the cooling pipe 149a described above. The light emitting unit 136 is 8
Since the cooling temperature is relatively high at 00 to 900 ° C., such a portion can be cooled even if it is air-cooled, and the same operation and effect as the above-described configuration can be obtained. A known air cooling mechanism, for example, a method of forcibly cooling the light emitting unit 136 by a blower may be used. Further, for example, a cooling method in which a common cooling pipe capable of cooling the sealing portion 143c and the light emitting portion 136 is provided in the partition wall 148 is also conceivable.
In such a configuration, the cooling tubes are cooled to a temperature that is common to the range of halogen cycles, such as molybdenum oxidation protection, eg, 250-350 ° C. Even with such a configuration, the same effect as that of the cooling pipe 149 described above can be obtained.

Next, the radiation thermometer 200 will be described. The radiation thermometer 200 is provided on the opposite side of the lamp 130 with respect to the workpiece W. Although the present invention does not exclude the structure in which the radiation thermometer 200 is provided on the same side as the lamp 130, it is preferable to prevent light from the lamp 130 from being incident on the radiation thermometer 200.

The radiation thermometer 200 is located at the bottom 1 of the processing chamber 110.
14 attached. Processing chamber 110 at bottom 114
The surface facing the inside is plated with gold and functions as a reflector (high reflectance surface). This is because if such a surface is a low-reflectance surface such as black, the heat of the workpiece W is absorbed and the lamp 1
This is because the irradiation output of the 30 must be increased uneconomically. The bottom 114 has a cylindrical through-hole.
The radiation thermometer 200 can apply any of the known techniques, and a detailed description thereof will be omitted. The radiation thermometer 200 is connected to the control unit 300, and the control unit 30
0 calculates the temperature T of the workpiece W. This calculation may be performed by a calculation unit (not shown) in the radiation thermometer 200. In any case, the control unit 300 can obtain the temperature T of the workpiece W.

The control unit 300 has a CPU and a memory inside, and recognizes the temperature T of the object W to be processed, and
By controlling 10, the output of the lamp 130 is feedback-controlled. In the present embodiment, the control unit 300
Once the lamp 130 is powered on, it controls the lamp driver 310 to keep the temperature of the lamp 130 within the halogen cycle range. That is, the main power of the cluster tool (not shown) including the heat treatment apparatus 100 is turned on, and thereafter, the lamp driver 31 is driven from the time when the lamp driver 310 is driven in accordance with the heat treatment until the main power of the cluster tool including the heat treatment apparatus 100 is turned off.
Power continues to be supplied to 0. At this time, power is also continuously supplied to the lamp 130 via the lamp driver 310 at the same time. As described above, the lamp 130 is controlled within the range of the halogen cycle. Therefore, the lamp 13
0 rises to about 900 ° C. during heating and is maintained at 250 ° C. even during cooling. The heat treatment of the workpiece W is performed within such a temperature range. Note that the temperature control of the lamp 130 may be feedback control using a temperature sensor or a thermometer of a temperature control mechanism connected to the cooling pipe 149b and changing the input power according to the temperature. Further, a function of the temperature of the lamp 130 and the input power may be calculated in advance by an experiment, and the power may be input by estimating the temperature of the lamp 130 using such a function.

In the conventional heat treatment apparatus 100, power is not supplied to the lamp driver 310 and the lamp 130 except for the heat treatment operation.
0 was controlled to supply the desired power to the lamp 130. However, the resistance of the filament 137 of the lamp 130 is very low at room temperature, and the moment of voltage application is almost a short circuit. In such a state, the rated current value of 7
If there is no external circuit resistance, a rush current phenomenon of 13 to 17 times occurs.
Deriving a rush current phenomenon each time in a heat treatment apparatus that rapidly turns on and off the lamp 130 in response to a rise and fall in the temperature of the workpiece W causes deterioration of the lamp and the lamp driver 310.

In the present embodiment, the power is turned on to the lamp 130 at the minimum required when the cluster tool including the heat treatment apparatus 100 is started. It does not turn on / off.
That is, this embodiment solves the above-described problem, and makes it possible to achieve a longer life of the lamp 130 and the lamp driver 310. Further, since the lamp 130 is controlled within the range of the halogen cycle, the lamp 130 is also controlled for this reason.
It is effective for prolonging the service life.

The cooling pipe 14 is used for cooling the lamp 130.
Although 9 is located, control in conjunction with the lamp driver 310 further facilitates maintaining the lamp 130 within the halogen cycle. Further, the present embodiment excludes a cooling method using either the method of controlling the temperature of the lamp 130 using the cooling pipe 149 or the method of controlling the temperature of the lamp 130 using the lamp driver 310. is not.

Further, as described later, the control unit 300
A drive signal is sent to the motor driver 320 at a predetermined timing to control the rotation speed of the processing target W. Further, the control unit 300 recognizes the temperature of the lamp 130 and controls the heater in cooperation with the temperature control mechanism, thereby performing feedback control of the temperature of the lamp 130.

The gas introducing section 180 includes, for example, a gas source (not shown), a flow control valve, a mass flow controller, a gas supply nozzle, and a gas supply path connecting these.
A gas used for the heat treatment is introduced into the processing chamber 110. In the present embodiment, the gas introduction unit 180 is provided on the side wall 112 of the processing chamber 110 and is introduced from the side of the processing chamber 110. However, the position is not limited. The processing gas may be introduced from the upper part of the chamber 110.

[0085] If the annealing gas source such as N _2, Ar, if oxidation treatment _{O 2, H 2, H 2} O, NO 2, etc. N _2, NH ₃ if nitriding treatment, the film formation process If there is NH ₃ ,
Although SiH ₂ Cl ₂ or SiH ₄ is used, it goes without saying that the processing gas is not limited to these. The mass flow controller controls the gas flow rate, for example, has a bridge circuit, an amplification circuit, a comparator control circuit, a flow control valve, etc., and measures the flow rate by detecting heat transfer from upstream to downstream accompanying the gas flow. To control the flow control valve. The gas supply path uses, for example, a seamless pipe or a bite joint or a metal gasket joint at a connecting portion to prevent impurities from entering the supply gas from the pipe. In order to prevent dust particles caused by dirt and corrosion inside the pipe, the pipe is made of a corrosion resistant material, or the inside of the pipe is made of PTFE.
(Teflon (registered trademark)), PFA, polyimide, PB
I Insulated with other insulating materials, subjected to electrolytic polishing, and further provided with a dust particle capturing filter.

Although the exhaust section 190 is provided substantially horizontally with the gas introduction section 180 in the present embodiment, the position and number thereof are not limited. A desired exhaust pump (a turbo molecular pump, a sputter ion pump, a getter pump, a sorption pump, a cryopump, etc.) is connected to the exhaust unit 190 together with a pressure adjusting valve. In this embodiment, the processing chamber 110 is maintained in a reduced-pressure environment. However, the present invention does not necessarily require the reduced-pressure environment as an essential component, and is applicable, for example, in a range of 133 Pa to atmospheric pressure.

Hereinafter, the rotation mechanism of the object W will be described with reference to FIG.
This will be described with reference to FIG. In order to maintain the electrical characteristics of each element of the integrated circuit and the yield of products at a high level, it is required that the heat treatment be performed more uniformly over the entire surface of the workpiece W. If the temperature distribution on the workpiece W is not uniform,
For example, the RTP apparatus 100 cannot provide high-quality heat treatment, for example, the film thickness becomes uneven in the film formation process, or a slip occurs in the silicon crystal due to thermal stress. The non-uniform temperature distribution on the processing target W may be caused by the non-uniform illuminance distribution of the lamp 130, and the processing gas introduced in the vicinity of the gas introduction unit 180 takes heat from the surface of the processing target W. In some cases.
The rotation mechanism rotates the wafer so that the object W
0 allows for more uniform heating.

The rotating mechanism of the workpiece W includes a support ring 150, a ring-shaped permanent magnet 170, and a ring-shaped S
A magnetic body 172 such as a US, a motor driver 320,
And a motor 330.

The support ring 150 has a circular ring shape made of ceramics having excellent heat resistance, such as SiC. The support ring 150 functions as a mounting table for the object to be processed W and has a ring-shaped notch along the circumferential direction in an L-shaped cross section in the hollow circular portion. Since the notch radius is designed to be smaller than the radius of the workpiece W, the support ring 150 can hold (the back surface peripheral portion of) the workpiece W in the notch. If necessary, the support ring 150 may have an electrostatic chuck or a clamp mechanism for fixing the workpiece W.
The support ring 150 prevents deterioration of uniform heat due to heat radiation from the end of the workpiece W.

The support ring 150 is connected at its end to the support 152. If necessary, a heat insulating member such as quartz glass is inserted between the support ring 150 and the support portion 152 to thermally protect a magnetic body 172 described later. The support part 152 of this embodiment is formed as a hollow cylindrical opaque quartz ring member. The bearing 160 is connected to the support 152 and the processing chamber 110.
And allows the support 152 to rotate while maintaining a reduced pressure environment in the processing chamber 110.
A magnetic body 172 is provided at the tip of the support section 152.

The ring-shaped permanent magnet 170 and the magnetic body 172 arranged concentrically are magnetically coupled, and the permanent magnet 170 is driven to rotate by the motor 330. Motor 3
30 is driven by a motor driver 320, and the motor driver 320 is controlled by the control unit 300.

As a result, when the permanent magnet 170 rotates, the magnetic body 172 that has been magnetically coupled rotates with the support 152, and the support ring 150 and the workpiece W rotate. The rotation speed is illustratively 90 RPM in the present embodiment,
Actually, a uniform temperature distribution is provided to the processing target W, and a turbulent gas flow in the processing chamber 110 and the processing target W
It will be determined according to the material and size of the object W to be processed, the type and temperature of the processing gas, etc. so as not to bring about the effect of cutting off the surrounding wind. Magnet 170 and magnetic body 172
May be reversed as long as they are magnetically coupled, or both may be magnets.

Next, the operation of the RTP device 100 will be described. With the operation, the power of the cluster tool including the heat treatment apparatus 100 is turned on. A transfer arm such as a cluster tool carries the workpiece W into the processing chamber 110 via a gate valve (not shown). When the transfer arm supporting the object W reaches the upper part of the support ring 150, a lifter pin lifting / lowering system (not shown) projects (eg, three) lifter pins (not shown) from the support ring 150 to support the object W. . As a result, the support of the object W is transferred from the transfer arm to the lifter pin, and the transfer arm is returned from the gate valve. Thereafter, the gate valve is closed. The transfer arm may then move to a home position (not shown).

On the other hand, the lifter pin lifting / lowering system then returns the lifter pin (not shown) into the support ring 150,
As a result, the workpiece W is arranged at a predetermined position on the support ring 150. The lifter pin elevating system can use a bellows (not shown) to maintain the decompressed environment of the processing chamber 110 during the elevating operation and prevent the atmosphere in the processing chamber 102 from flowing out.

Thereafter, heat treatment apparatus 100 performs a heat treatment. Referring to FIG. 24, first, the control unit 300 drives the lamp driver 310 to supply power to the lamp 130 (steps 1000 to 1005). Here, FIG. 24 is a control flowchart showing driving of the lamp 130 of the present invention. In response, the control unit 300
Further, the power supply amount of the lamp 130 is increased via the lamp driver 310 (step 1010). Next, the control unit 30
When the temperature of the lamp 130 (for example, the temperature of the light emitting unit 136) reaches 900 ° C., which is the upper limit of the halogen cycle, the control unit 300 sets the power supply amount of the lamp 130 via the lamp driver 310 to the value. Maintain (steps 1015 and 1025). Then, the control unit 300 heats the target object W until a predetermined temperature (for example, about 800 ° C.) is reached (Step 1030). The lamp 13
If the temperature of the object W reaches a predetermined temperature before 0 becomes 900 ° C. (Step 1020), a predetermined heat treatment described later is performed at that time (Step 1032).

The heat rays radiated from the lamp 130 are applied to the upper surface of the processing object W in the processing space through the window 120, and the temperature of the processing object W is rapidly increased to, for example, 800 ° C. In general, the amount of heat radiated in the peripheral portion of the object to be processed W tends to be larger than that in the center side thereof.
30 is a lamp 130a and a lamp 1 arranged concentrically.
30b provides higher directivity and temperature control capability.

Further, the controller 300 controls the temperature control mechanism to cool the lamp 130. The control unit 300 performs feedback control based on information from a thermometer (not shown), and controls the temperature of the cooling pipe 149a so that the temperature of the sealing unit 143c is 250 to 350 ° C., for example, 300 ° C. More specifically, referring to FIG. 25, control unit 300 measures the temperature of sealing unit 143c and checks whether the temperature is 350 ° C. or lower (steps 1500 to 1505). Here, FIG. 25 is a control flowchart showing cooling of the lamp 130 of the present invention. If the temperature of the sealing portion 143c is equal to or higher than 350 ° C., the cooling of the sealing portion 143c is started using the cooling pipe 149a (step 1510). The control unit 300 again measures the temperature of the sealing unit 143c, and when the temperature of the sealing unit 143c is 25
Check whether the temperature is 0 ° C. or less (Steps 1515 to 1515)
20). If the temperature of the sealing portion 143c is equal to or lower than 250 ° C., the cooling is stopped (step 1525). Otherwise, the cooling is continued until the temperature reaches 250 ° C. By repeating the above steps, the sealing portion 143c is heated at 250 to 350 ° C.
Is maintained in the range.

Further, the heating section 136 also performs feedback control in the same manner (steps 1530 to 1555), and controls the temperature of the cooling pipe 149b so that the heating section 136 becomes 800 to 900 ° C., for example, 850 ° C. Such control prevents oxidation of molybdenum constituting the electrode 133 of the electrode section 132 of the lamp 130. In addition, the light emitting unit 136 of the lamp 130 is controlled in the halogen cycle. As a result, elements that may cause damage to the lamp 130 are reduced, and the life of the lamp 130 can be extended.

At the same time, the control unit 300
20 to command the motor 330 to be driven. In response, the motor driver 320
30 is driven, and the motor 330 rotates the ring-shaped magnet 170. As a result, the support 152 (or 152A) rotates, and the workpiece W rotates together with the support ring 150. Since the object to be processed W rotates, the temperature in the plane is maintained uniformly during the heat treatment.

During heating, the window 120 is
21 have several advantages due to their relatively small thickness and high thermal conductivity. These advantages are (1) lamp 13
Since the light from 0 is uniformly transmitted, heat spots are less likely to be generated on the target object W. (2) The light from the lamp 130 is not absorbed so much that the irradiation efficiency on the target object W is not reduced.
(3) Thermal stress destruction is unlikely to occur due to a small temperature difference between the front and back surfaces of the plate 121; (5) Translucent ceramics have high bending strength and high strength of the window 120. Therefore, even if the plate 120 is thin, the pressure difference between the reduced pressure environment in the processing chamber 110 and the atmospheric pressure is maintained. Can be included.

The temperature of the object to be processed W is measured by the radiation thermometer 200, and the controller 300 performs feedback control of the lamp driver 310 based on the measurement result. Since the object to be processed W is rotating, it is expected that the temperature distribution on the surface is uniform. However, if necessary, the radiation thermometer 200 measures the temperature of the object to be processed W at a plurality of points (for example, (Central and end portions thereof), and if the radiation thermometer 200 determines that the temperature distribution on the object to be processed W is non-uniform,
The control unit 300 controls the lamp 13 in a specific area on the workpiece W.
It is also possible to instruct the lamp driver 310 to change the output of 0.

Next, a processing gas whose flow rate is controlled is introduced into the processing chamber 110 from a gas introduction unit (not shown). When a predetermined heat treatment (for example, 10 seconds) is completed (Step 1)
032), the controller 300 reduces the power supply amount of the lamp 130 via the lamp driver 310 (step 103).
5). In response, lamp driver 310 checks whether lamp 130 has reached 250 ° C. (step 1040). If the temperature of the lamp 130 reaches 250 ° C., the control unit 300 maintains the power supply amount at such a value (step 1045). If not, the power supply is further reduced and the temperature of lamp 130 is reduced to 250 ° C.

After the heat treatment, the object to be processed W is drawn out of the processing chamber 110 from the gate valve by the transfer arm of the cluster tool in a procedure reverse to that described above. Next, if necessary, the transfer arm transfers the target object W to the next device (such as a film forming device). Further, when the control unit 300 receives the next heat treatment command, the control unit 300 repeats the above steps to perform the heat treatment. At this time, the control of the lamp 130 is performed in step 10.
The process is repeated from Step 10 (Step 1050). If there is no heat treatment command, the power supply to the lamp 130 is stopped, and the driving of the lamp driver 310 is also stopped (step 10).
55 to 1060).

The series of heat treatment methods described above
The power is turned on to the 0 and the lamp driver 310 only once at the start of the heat treatment operation, and it is not necessary to turn on / off the power in response to the temperature rise and fall of the workpiece W. In other words, such a heat treatment method can reduce the rush current at least once, and can achieve a longer life of the lamp 130 and the lamp driver 310. Further, since the lamp 130 is controlled within the range of the halogen cycle, it is effective for extending the life of the lamp 130 for such a reason.

Although the preferred embodiment of the present invention has been described above, the present invention can be variously modified and changed within the scope of the gist.

[0106]

According to the heating device and the heat treatment device according to an exemplary embodiment of the present invention, the first lamp having a large irradiation area is provided at the center of the lamp holding portion, and the first lamp is provided around the first lamp. And a second lamp having an irradiation area smaller than that of the second lamp. The object to be processed can efficiently irradiate a narrow region, which is a portion where the temperature rise of the peripheral temperature in contact with the support ring is lower than the center temperature, with the second lamp having a small irradiation area. Further, by increasing the irradiation energy of the second lamp or increasing the number of lamps per unit area of the second region, the central portion and the outer peripheral portion of the object to be processed can be uniformly heated. Therefore, a high-quality heat treatment can be performed, and the object to which the heat treatment has been performed is also high-quality.

Further, the heat treatment apparatus may be configured so that one lamp can be detached from the base. Such a configuration,
For example, it is possible to easily replace only a deteriorated lamp without removing a still usable lamp. Further, it is not necessary to replace the entire base when replacing the lamp, and only the deteriorated lamp can be replaced. Therefore, the maintenance of the heat treatment apparatus is facilitated as compared with the conventional operation of integrally replacing the lamp holding unit.

[0108]

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a heat treatment apparatus as an exemplary embodiment of the present invention.

FIG. 2 is a bottom view of a window which is a modification of the window shown in FIG.

FIG. 3 is a partially enlarged cross-sectional view taken along line AA of the window shown in FIG. 2;

FIG. 4 is a partially enlarged sectional view of a window which is a modification of the window shown in FIG.

FIG. 5 is a schematic bottom view of the heating unit shown in FIG.

FIG. 6 is an enlarged sectional view showing a part of the heating unit shown in FIG.

FIG. 7 is a diagram corresponding to FIG. 6 when the lamp is removed from the lamp heating unit shown in FIG. 5;

8 is a schematic sectional view of the lamp shown in FIG.

FIG. 9 is a schematic cross section of the lamp shown in FIG.

FIG. 10 is a schematic bottom view of the lamp shown in FIG. 6;

11 is a schematic side view showing an optical path of radiation light emitted from a filament of the lamp shown in FIG.

12 is another schematic side view showing the optical path of radiation emitted from the filament of the lamp shown in FIG.

FIG. 13 is a schematic bottom view of a lamp which is a modified example of the lamp shown in FIG.

FIG. 14 is a schematic plan view showing a filament which is a modification of the filament of the lamp shown in FIG.

FIG. 15 is a schematic plan view showing a filament which is a modification of the filament of the lamp shown in FIG.

16 is a schematic plan view showing a filament which is a modification of the filament of the lamp shown in FIG. 13;

FIG. 17 is a schematic side view showing the filament shown in FIG. 16;

18 is an enlarged cross-sectional view when the lamp of the lamp holding unit shown in FIG. 6 is not thermally expanded.

FIG. 19 is a schematic sectional view showing a more detailed structure of a lamp holding section of the heating section shown in FIG.

20 is a schematic bottom view showing a more detailed structure of a lamp holding unit of the heating unit shown in FIG.

FIG. 21 is a view showing a target object W from the lamp of the heating unit shown in FIG. 1;
FIG. 5 is a diagram showing lamp light applied to the light source.

FIG. 22 is a view showing a processing object W from a lamp of a heating unit shown in FIG. 1;
FIG. 5 is a diagram showing lamp light applied to the light source.

FIG. 23 is a schematic sectional view showing a modification of the arrangement of the lamp shown in FIG.

FIG. 24 is a control flowchart showing driving of the lamp of the present invention.

FIG. 25 is a control flowchart showing cooling of the lamp according to the present invention.

FIG. 26 is a schematic sectional view showing a conventional lamp shape.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 heat treatment apparatus 110 processing chamber 120 window 121 plate 124 reinforcing material 125 cooling pipe 130 lamp 131 screw thread 132 electrode part 134 intermediate part 136 light emitting part 140 heating part 142 lamp holding part 143 groove 147 screw thread 150 support ring 160 bearing 170 permanent magnet 180 Gas introduction unit 190 Exhaust unit 200 Radiation thermometer 300 Control unit 310 Lamp driver

Claims (8)

[Claims] 1. A heating device comprising a lamp and a lamp house, wherein the lamp has a first lamp and a second lamp having an irradiation area smaller than that of the first lamp. A first lamp housing the first lamp in the center of the lamp house;
And a second lamp housing for housing a second lamp around the first area. 2. The heating device according to claim 1, wherein the second lamp has irradiation energy per unit area larger than irradiation energy per unit area of the first lamp. 3. The heating device according to claim 1, wherein the number of lamps per unit area of the second region is larger than the number of lamps per unit area of the first region. 4. A heating device in which the first and second lamps are detachably housed from the first and second housings. 5. The heating device according to claim 4, wherein said lamp has a reflecting portion for reflecting light emitted from a light source. 6. The heating device according to claim 4, wherein the lamp has a thread on an outer peripheral portion of the lamp, and the first and second lamp housings have threads matching the threads of the lamp. . 7. The heating device according to claim 4, wherein the lamp housing has a plurality of thin plates inscribed in the lamp housing, and holds the lamp by elastically deforming the thin plates. 8. A heat treatment apparatus for performing a predetermined heat treatment on an object to be processed using a heat source, comprising: a first lamp constituting the heat source; and an irradiation area larger than the first lamp constituting the heat source. A lamp house that holds the first and second lamps, wherein the lamp house has a first lamp that accommodates the first lamp in the center of the lamp house;
And a second lamp housing for housing a second lamp around the first region.