JPH10144619A - Lamp heater heat-treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the durability of heater lamps by a method wherein a heating unit which has a plurality of heater lamps is provided in a treatment chamber with a transmitting window therebetween and the sealing parts and lamp main parts of the respective heater lamps in the heating unit are cooled to respective predetermined temperatures. SOLUTION: A heating chamber 22 is provided in connected with the outside of the bottom of a treatment chamber 10 with a transmitting window 19 therebetween. A base table 23 of which a turntable to turn a heating unit 12 horizontally is provided in the heating chamber 22 and heater lamps 24 and reflectors 25 are provided on the base table 23. A gas supply inlet 27 through which cooling gas is supplied is provided on the side of the heating chamber 22 on the rear side of the base table 23 with the base table 23 as a boundary and a gas exhaust outlet 28 is provided on the opposite side. The lamp main parts and the sealing parts of the heater lamps 24 are cooled by the cooling gas from the gas supply inlet 27 to respective predetermined temperature. With this constitution, problems which are caused by the overheat or the heating unevenness can be avoided and the durability of the heat lamps 24 can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a lamp heating type heat treatment apparatus.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, a semiconductor wafer to be processed is oxidized, diffused, and CVD.
(Chemical Vapor Deposition), various heat treatment apparatuses are used for performing processing such as annealing. As one of such heat treatment apparatuses, a lamp heating type heat treatment apparatus using a heating lamp as a heat source is known. In this lamp heating type heat treatment apparatus, a plurality of heating lamps are arranged in a processing chamber accommodating a semiconductor wafer through a transmission window, and the semiconductor wafer is heated by the heating lamps.

In such a lamp heating type heat treatment apparatus, in order to prevent a decrease in durability due to overheating of the heating lamp, cooling air is blown to the entire heating lamp group for cooling.

[0004]

However, in the lamp heating type heat treatment apparatus, it is difficult to uniformly cool all the heating lamps because of the structure in which cooling air is blown to the entire heating lamp group to cool the lamps. .

As a heating lamp, a halogen lamp is generally used. In this halogen lamp, a component (tungsten) of the filament evaporates to a halogen compound, and the halogen compound is decomposed to return the component to the filament. Repeat the halogen cycle.
However, if temperature unevenness occurs on the surface of the lamp body (also referred to as a bulb), a halogen compound adheres to a portion having a low temperature to generate and make it difficult to continue the halogen cycle smoothly. Lamp durability is reduced (lamp life is shortened).

[0006] The sealing portion of the heating lamp usually has a structure in which quartz glass of the lamp body is brought into close contact with a conductive material (molybdenum foil) and sealed. For this reason, if the sealing portion is overheated, a gap is generated between the conductive material and the quartz glass due to a difference in thermal expansion between the conductive material and the quartz glass, and the halogen gas easily leaks, and the durability of the heating lamp decreases.

It is an object of the present invention to provide a lamp heating type heat treatment apparatus which solves the above-mentioned problems and improves the durability of a heating lamp.

[0008]

In order to achieve the above object, according to the first aspect of the present invention, a heating unit having a plurality of heating lamps is provided in a processing chamber through a transmission window. In the lamp heating type heat treatment apparatus for heating an object to be processed in the processing chamber, the sealing portion of each heating lamp and the lamp body in the heating section are each cooled to a predetermined temperature.

According to a second aspect of the present invention, a heating section having a plurality of heating lamps and a reflector disposed on a base via a transmission window is provided in the processing chamber, and the heating section is used for processing the processing target in the processing chamber. In the lamp heating type heat treatment apparatus that heats the body, a ventilation port through which a cooling gas flows from the sealing portion side of each heating lamp to the lamp body side is provided on a base of the heating section, and the cooling gas is rectified into the ventilation port. A rectifier is provided.

According to a third aspect of the present invention, a heating chamber for accommodating the heating unit is connected to the processing chamber, and a cooling gas is supplied to the back surface of the heating chamber from a base of the heating unit. And a discharge port for discharging air from the opposite side.

According to a fourth aspect of the present invention, the base has a cooling structure, and the rectifying body is formed so as to expand from the sealing portion of the heating lamp toward the outlet side of the ventilation port. It is characterized by comprising a thermally conductive leaf spring pressed from the base side to the side of the sealing portion of the heating lamp.

According to a fifth aspect of the present invention, the rectifier includes:
A temperature sensor for controlling the temperature of the sealing portion is provided.

[0013]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

First, FIG. 2 shows a schematic plan configuration of a multi-chamber type processing apparatus having a plurality of processing chambers including a lamp heating type heat processing apparatus to which the present invention is applied. In FIG. 2, reference numeral 1 denotes a load lock having a transfer function. The transfer chamber 1 is a mold transfer chamber. The front of the transfer chamber 1 is connected to the first transfer chamber via gate valves G1 and G2.
And the second cassette chamber 2B are connected to each other. These cassette chambers 2A and 2B are formed as chambers for accommodating a cassette 3 as a container accommodating a plurality of (eg, 25) objects to be processed, for example, semiconductor wafers W at predetermined intervals (eg, 5 mm intervals).

For example, a cassette for unprocessed wafers is accommodated in the first cassette chamber 2A, and a cassette for processed wafers is accommodated in the second cassette chamber 2B. Gate valves G3 and G4 for opening and closing between the cassette chambers 2A and 2B are provided in the cassette chambers 2A and 2B.
A and 2B have an arm for supporting the cassette 3 in a state where the wafer W is horizontal, and a cassette loading / unloading mechanism (for loading / unloading the cassette 3 from / to the outside via the gate valves G3 and G4). (Not shown), and a cassette stage 4 that can be moved up and down to receive the loaded cassette 3 from the arm and support it in a height-adjustable manner.

In the transfer chamber 1, a transfer mechanism 5 and a rotary stage 6 for aligning the center of the wafer W and an orientation flat (also referred to as an orientation flat) are provided. The rotary stage 6 constitutes an alignment mechanism for the wafer W together with an optical sensor (not shown) for detecting the peripheral position of the wafer W and the transfer mechanism 5. For example, when it is detected that the center of the wafer W is deviated from the center of the rotating stage 6, the transfer mechanism 5 corrects the position of the wafer W.

The transfer mechanism 5 is composed of an arm which can rotate and expand and contract in the horizontal direction, for example, an articulated arm, and has a suction hole 7 at its tip for holding the supported wafer W by vacuum suction. preferable. The transfer mechanism 5 controls the cassettes 3 in the first and second cassette chambers 2A and 2B.
And the rotary stage 6 and processing chambers 10A and 10
It is configured to transfer the wafer W between B and 10C.

Around the transfer chamber 7 excluding the front part, the first to third processing chambers 10 are connected via gate valves G9 to G11.
The processing chambers 10A to 10C are connected to a predetermined pressure, for example, 10 ^-3 to 10 ^-8 To by a pressure reducing pump.
The pressure is reduced to rr. Processing chamber 10A
-10C may be configured to perform the same processing, or may be configured to perform different processing.

The transfer chamber 1 includes gate valves G1 and G2.
Is opened to communicate with the cassette chambers 2A and 2B, the same pressure as in the cassette chambers 2A and 2B, for example, the atmospheric pressure,
Gate valves G1 and G2 are closed and gate valves G5 and G
6, G7 is opened and any of the first to third processing chambers 10A to 10A
When communicating with 10C, it is comprised so that pressure may be controlled so that it may become substantially the same pressure as in processing chamber 10A-10C. When the cassette chambers 2A, 2B and the transfer chamber 1 are communicated with each other, an inert gas such as a nitrogen gas may be introduced into the cassette chambers 2A, 2B and the transfer chamber 1 to make the atmosphere inert gas atmosphere. preferable.

At least one of the processing chambers 10A to 10C is configured as a processing chamber 10 of a lamp heating type heat treatment apparatus, for example, a lamp heating type single wafer decompression CVD apparatus. The processing chamber 10 is formed in a cylindrical shape from, for example, an aluminum alloy as shown in FIG.
A susceptor 11 as a support for supporting the wafer W is provided therein.
Are provided horizontally so as to close the bottom opening of the processing chamber 10 from the inside.

The susceptor 11 places a wafer W thereon,
In order to absorb light energy (heat rays) from the heating unit 12 to be described later and heat it to a predetermined temperature, for example, 500 to 700 ° C. by heat conduction, it is formed in a disk shape using, for example, carbon (C) or silicon carbide (SiC). It is preferred that Further, it is preferable that the susceptor 11 is provided with a temperature sensor on a bottom portion or the like in order to manage the temperature.

The upper portion of the processing chamber 10 is air-tightly closed by a lid 13, and a processing gas, a cleaning gas,
Gas supply ports 14a and 14b leading to a gas source for introducing an inert gas or the like into the processing chamber are provided. Also,
On the lid 13, a shower head 15 having a porous structure is provided facing the susceptor 11 as a gas supply unit for uniformly supplying a processing gas to the surface to be processed of the wafer W in a shower shape. In order to further uniformly supply the processing gas, the gas supply ports 14a, 14b and the shower head 1
It is preferable that the number of perforated plates 16a and 16b is appropriately arranged between the five plates.

On the side of the processing chamber 10, there are provided an entrance 17 for carrying in and out the wafer W and a gate valve G for opening and closing the entrance 17. In addition, an exhaust port 18 communicating with a decompression pump or the like is provided on a side portion of the processing chamber 10.

At the bottom of the processing chamber 10, a transmission window 19 is provided in an airtight manner via an unillustrated airtight material such as an O-ring so as to close the bottom opening from the outside. The above transmission window 1
Reference numeral 9 denotes a material that efficiently transmits light energy from the heating unit 12, for example, quartz glass. Further, it is preferable that the transmission window 19 is formed in a curved shape bulging outward in order to achieve pressure resistance and thinning.

In order to prevent the processing gas from flowing to the back side of the susceptor 11 and adhering to the transmission window 19 and the like to cause temperature unevenness, an inert gas ( A gas supply port 20 is provided for supplying, for example, nitrogen gas) or air to the space between the susceptor 11 and the transmission window 19. Further, between the susceptor 11 and the transmission window 19, there is provided a quartz buffer plate 21 having a porosity for uniformly supplying the inert gas so as not to cause temperature unevenness on the back surface of the susceptor 11. ing. The inert gas supplied to the back surface of the susceptor 11 flows through the gap between the susceptor 11 and the processing chamber 10 into the processing chamber 11 on the reduced pressure side, so that the processing gas flows to the back side of the susceptor 11. Wrap around is prevented.

A heating chamber 22 is connected to the outside of the bottom of the processing chamber 10 through the transmission window 19.
The heating unit 12 is rotatably accommodated in 2. The heating unit 12 has a base 23 constituting a turntable, and a plurality of heating lamps 24 and a reflector 25 as heat sources are arranged on the base 23.

The base 23 is formed in a disk shape by, for example, an aluminum alloy and has a cooling structure having a coolant passage 26 therein, for example, a water cooling structure using room temperature cooling water as a coolant. As shown in FIG. 3, the reflector 25 is formed in a shape that is expanded upward around the lamp body 24a of each heating lamp 24, and is formed by applying gold plating to a surface of a base material made of, for example, an aluminum alloy. It becomes.

The heating chamber 22 is formed in a cylindrical shape, and the inside thereof is vertically divided by the base 23. On the side of the heating chamber 2, the base 2
An air supply port 27 for supplying a cooling gas, for example, air at a normal temperature (also referred to as cooling air), is provided on the back side (lower side) of 3, and an exhaust port 28 is provided on the opposite side (upper side). A blower (not shown) for supplying cooling air is connected.

The heating lamp 24 is, for example, a halogen lamp, and has a quartz glass lamp body (bulb) 24a as shown in FIG. This lamp body 2
4a is sealed by inserting a tungsten filament 30 having a conductive material 29 made of molybdenum foil at both ends, sealing a halogen gas, and bringing quartz glass into close contact with the conductive material 29. A substantially rectangular parallelepiped sealing portion 24b made of, for example, alumina (Al ₂ O ₃ ) having a terminal 31 electrically connected to the conductive portion 29 is provided in a sealing portion of the lamp body 24a.

As shown in FIGS. 3 and 4, the base 23 is provided with an insertion opening 32 into which the sealing portion 24b of the heating lamp 24 is inserted. Terminal 3 of sealing portion 24b is located at a position corresponding to 24b.
A socket 33 for inserting the socket 1 is attached. The socket 33 is attached to the base 23 by screws (not shown) via brackets (not shown) provided at both ends in the longitudinal direction.

The base 23 is provided with a ventilation port 34 for passing cooling air as a cooling gas from the sealing portion 24b side of the heating lamp 24 to the lamp body 24a side. Is provided. The ventilation holes 34 in the illustrated example are provided on both long sides of the sealing portion 24b, and are formed continuously with the insertion ports 32 of the sealing portion 24b.

The rectifying body 35 is formed so as to expand toward the outlet side of the ventilation hole 34 from the sealing portion 24b of the heating lamp 24, and the sealing portion of the heating lamp 24 extends from the base 23 side. It consists of a leaf spring pressed against the side of 24b. As a material of the leaf spring, for example, phosphor bronze which is excellent in thermal conductivity or the like is preferable.

The leaf spring is formed in a rectangular shape, and one end thereof is fixed to the upper surface of the base 23 so as to be sandwiched between the reflector 25 and the other end thereof is bent downward in the ventilation port 34 and sealed. The stop portion 24b is pressed against the long side surface of the stop portion 24b by surface contact, and is symmetrically disposed on both sides of the sealing portion 24b. Further, a vent hole 36 is formed in the leaf spring so as to be located outside the side surface of the lamp body 24a. It is preferable that the flow rate of the cooling air flowing from the sealing portion 24b side to the lamp body 24a side be controlled to about 1 to 3 m / s by the rectifier 35.

When the cooling air passes through the ventilation port 34, it first cools the cooling air through the side of the sealing portion 24 b, and is then guided radially outward by the rectifier 35 through the ventilation hole 36. Space between annular member 24a and reflector 25 (annular space)
37, and cools the lamp body 24a. Further, since the rectifier 35 is formed of a plate spring having thermal conductivity and is press-fitted from the base 23 of the cooling structure (water-cooled structure) to the side surface of the sealing portion 24b, poor contact occurs. It is configured such that the sealing portion 24b can be reliably cooled by heat conduction and the cooling efficiency can be improved.

With such a cooling structure, the lamp body 24a is cooled to a predetermined temperature at which the halogen cycle can be smoothly continued without overheating, for example, 250 to 800 ° C., preferably 500 to 600 ° C. ing.
Further, the sealing portion 24b is formed at a predetermined temperature at which a minute leak does not occur due to a difference in thermal expansion between the conductive portion 29 and the quartz glass, for example, 350 ° C. or less, preferably 200 to 300 ° C.
It is designed to cool down.

The rectifier 35 is preferably provided with a temperature sensor 38 composed of, for example, a thermocouple in order to control the temperature of the sealing portion 24b. In this case, the feedback control based on the temperature detection of the temperature sensor 38 may control, for example, the flow rate of the cooling water supplied to the base 23 to manage the temperature of the sealing portion 24b.

As shown in FIG. 1, the base 23 has a plurality of support arms 4 at the upper end of a rotating body 40 rotatably supported via bearings 39 so as to penetrate the bottom of the heating chamber 22.
0a, the periphery of which is supported by the rotating body 40a.
Is provided with an electric motor 41 as a rotation drive unit, a pulley 42a,
42b and the belt 43. The rotating body 40 is provided with a slip ring 45 for supplying power from the power supply terminal 44 on the power supply side to the socket 33 of the heating lamp 24.
A coolant supply / discharge header 46 for supplying / discharging a coolant, for example, cooling water, to / from the coolant passage 26 of the base 23 through the shaft core portion is provided.

Next, the operation of the lamp heating type heat treatment apparatus configured as described above will be described. First, the power supply terminal 4
4 supplies power to the heating lamp 24 of the heating unit 12 via the slip ring 45 to turn on the heating lamp 24 and to rotate the heating unit 12 by driving the electric motor 41.
In addition, for example, coolant, which is a coolant, is supplied and circulated from the coolant supply / discharge header 46 to the coolant passage 26 of the base 23 of the heating unit 12 to cool the base 23 and the reflector 25 and to be supplied into the heating chamber 22. The heating unit 12 is cooled (air cooled) by supplying a cooling gas, for example, cooling air from the air port 27 as described later.

When the heating lamp 24 is turned on, light energy is applied to the back surface of the susceptor 11 through the transmission window 19 and the buffer plate 21, and the light energy is absorbed to raise the temperature of the susceptor 11. The wafer W placed on the upper surface of the susceptor 11 is uniformly heated to a predetermined processing temperature. Processing chamber 1 containing wafer W
The inside of 0 is maintained at a predetermined reduced pressure state by the reduced pressure exhaust from the exhaust port 18, and in this state, the processing gas is supplied from the processing gas supply port 14a via the shower head 15 to the surface to be processed of the wafer W in the heated state. Thus, the surface to be processed of the wafer W is uniformly subjected to the film forming process by the CVD method.

In the heating section 12, the cooling air supplied below the base 23 passes through a ventilation hole 34 provided in the base 23, and the sealing section 24 b side of each heating lamp 24 to the lamp body 24 a side. To cool (air cooling) the sealing portion 24b and the lamp body 24a, respectively. In this case, the cooling air is rectified by the rectifier 35 provided in the ventilation port 34 and supplied to the space (annular space) 37 between the lamp body 24a and the reflector 25, so that the lamp body 24a
It is possible to cool the lamp body 24a uniformly without directly or directly cooling the lower surface portion d or the like. The cooling air is supplied to the ventilation holes 36 of the rectifiers 35 on both sides.
Is blown into the space 37 between the lamp body 24a and the reflector 25, and at that time, it flows around to the area of the space (annular space) 37 where the ventilation hole 36 is not provided. No cooling unevenness occurs in 24a.

As described above, according to the lamp heating type heat treatment apparatus, the sealing portion 24b of each heating lamp 24 of the heating portion 12 is provided.
Further, since the lamp body 24a is configured to be cooled to a predetermined temperature, it is possible to prevent troubles caused by overheating and uneven cooling of the heating lamp 24, and to improve the durability of the heating lamp 24. In particular, a lamp body 24a is placed on a base 23 on which a plurality of heating lamps 24 and a reflector 25 are disposed, from a sealing portion 24b side of each heating lamp 24.
Ventilation holes 34 for venting the cooling air to the side,
Since the rectifier 35 for rectifying the cooling air is provided in the ventilation port 34, the sealing portion 24b and the lamp body 24a of each heating lamp 24 can be cooled to a predetermined appropriate temperature.

A heating chamber 22 for accommodating the heating section 12 is connected to the processing chamber 10, and an air supply port for supplying cooling air to the back side of the heating chamber 22 with the base 23 as a boundary. 27 and an exhaust port 28 for exhausting air from the opposite side, the ventilation holes 34 provided on the base 23 are provided.
From the sealing portion 24b side of the heating lamp 24,
Cooling air can be passed smoothly to the a side,
The sealing portion 24b and the lamp body 24a can be efficiently cooled. Further, the base 23 has a cooling structure, and the rectifier 35 has a sealing portion 24 b of the heating lamp 24.
From the base 23 to the outlet side of the ventilation port 34, and the sealing portion 24b of the heating lamp 24 from the base 23 side.
Is made of a plate spring having thermal conductivity pressed against the side of the sealing member 24b, so that the sealing portion 24b can be reliably cooled by heat conduction from the base 23 side without causing a contact failure. The efficiency can be further improved.

Further, since the rectifier 35 is provided with a temperature sensor 38 for controlling the temperature of the sealing portion 24b, for example, the flow rate of the cooling water supplied to the base 23 is controlled by feedback control. The sealing part 24
The temperature b can be easily managed, and the durability of the heating lamp 24 can be further improved.

The embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to the above embodiments, and various design changes and the like can be made without departing from the gist of the present invention. Is possible. For example, as shown in FIG. 6, a guide 47 for improving the rectification effect may be provided near the ventilation hole 36 in the rectifier 35. In addition, as shown in FIG. 7, the flow regulating body 35 may be provided with an auxiliary ventilation port 36a for supplying minute cooling air without causing local cooling on the lower surface d of the lamp body 24a. As shown in FIG. 8, a fin 48 made of, for example, quartz may be provided on the lamp body 24a so as to cover the lower surface portion d.

The ventilation port 34 provided on the substrate 23 may be provided continuously or intermittently around the sealing portion 24b of the heating lamp 24, and the rectifier 35 is also formed in a bell mouth shape continuous in the circumferential direction. It may be. The cooling gas may be an inert gas, such as nitrogen gas, in addition to the cooling air. The lamp heating type heat treatment apparatus to which the present invention is applied may be one which performs, for example, oxidation, diffusion, annealing or the like in addition to the CVD processing. Further, the lamp heating type heat treatment apparatus may be one which directly heats a semiconductor wafer by light energy of a heating lamp without passing through a susceptor. As the object to be processed, for example, an LCD substrate or the like can be applied other than the semiconductor wafer.

[0046]

In summary, according to the present invention, the following excellent effects can be obtained.

(1) According to the first aspect of the present invention, since the sealing portion of each heating lamp and the lamp body of the heating section in the lamp heating type heat treatment apparatus are configured to be cooled to predetermined temperatures, respectively. In addition, it is possible to prevent problems caused by overheating and uneven cooling of the heating lamp, and to improve the durability of the heating lamp.

(2) According to the second aspect of the present invention, ventilation through which a cooling gas is passed from the sealing portion side of each heating lamp to the lamp body side to the base on which the plurality of heating lamps and the reflector are disposed. In addition to the opening, a rectifier for rectifying the cooling gas is provided at the ventilation opening, so that the sealing portion of each heating lamp and the lamp body can be cooled to a predetermined appropriate temperature, respectively. Performance can be improved.

(3) According to the third aspect of the present invention, the processing chamber is provided with a heating chamber for accommodating a heating unit, and the heating chamber is provided with a cooling gas on the back side of the base with the base as a boundary. Since the supply air supply port and the exhaust port for exhausting air from the opposite side are provided, the cooling gas smoothly flows from the sealing portion side of the heating lamp to the lamp body side at each ventilation port provided on the base. The ventilation can be performed, and the sealing portion and the lamp body can be efficiently cooled.

(4) According to the fourth aspect of the present invention, the base has a cooling structure, and the rectifying body is formed so as to expand from the sealing portion of the heating lamp toward the outlet side of the ventilation port.
In addition, since it is made of a thermally conductive leaf spring pressed against the side of the sealing portion of the heating lamp from the base side, the sealing portion can be securely secured by heat conduction from the base side without causing contact failure. The cooling efficiency can be improved, and the cooling efficiency can be improved.

(5) According to the fifth aspect of the present invention, since the rectifier is provided with the temperature sensor for controlling the temperature of the sealing portion, the temperature of the sealing portion can be easily controlled. And the durability of the heating lamp can be further improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a lamp heating type heat treatment apparatus showing an embodiment of the present invention.

FIG. 2 is a schematic plan view showing a multi-chamber type processing apparatus provided with the apparatus of FIG.

FIG. 3 is an enlarged sectional view of a main part of a heating unit in the apparatus of FIG.

FIG. 4 is a schematic plan view showing the configuration of a rectifier.

FIG. 5 is a side view of a heating lamp.

FIG. 6 is a cross-sectional view showing another example of the heating unit.

FIG. 7 is a cross-sectional view illustrating another example of the heating unit.

FIG. 8 is a sectional view showing another example of the heating unit.

[Explanation of symbols]

 W Semiconductor wafer (object to be processed) 10 Processing chamber 11 Susceptor 12 Heating section 19 Transmission window 22 Heating chamber 23 Base 24 Heating lamp 24a Lamp body 24b Sealing section 25 Reflector 27 Air supply port 28 Exhaust port 34 Ventilation port 35 Adjustment Fluid 38 Temperature sensor

Claims (5)

[Claims] In a lamp heating type heat treatment apparatus for providing a heating unit having a plurality of heating lamps through a transmission window in a processing chamber and for heating an object to be processed in the processing chamber by the heating unit, A lamp heating type heat treatment apparatus, wherein a sealing portion of a heating lamp and a lamp body are each cooled to a predetermined temperature. 2. A heating unit having a plurality of heating lamps and a reflector disposed on a base through a transmission window in a processing chamber, and the heating unit heats an object to be processed in the processing chamber by the heating unit. In the mold heat treatment apparatus, the base of the heating unit is provided with a ventilation port through which the cooling gas flows from the sealing portion side of each heating lamp to the lamp body side, and a rectifying body that rectifies the cooling gas is provided in the ventilation port. A lamp heating type heat treatment apparatus characterized by the above-mentioned. 3. A heating chamber accommodating the heating section is connected to the processing chamber, and an air supply port for supplying a cooling gas to a back side of the heating chamber with a base of the heating section as a boundary. 3. The lamp heating type heat treatment apparatus according to claim 2, further comprising an exhaust port for exhausting air from an opposite side. 4. The base has a cooling structure, and the rectifier is formed so as to expand from a sealing portion of the heating lamp toward an outlet side of the ventilation port, and the rectifier is formed from the base side. 3. The lamp heating type heat treatment apparatus according to claim 2, comprising a leaf spring having thermal conductivity pressed against a side of the sealing portion of the heating lamp. 5. The lamp heating type heat treatment apparatus according to claim 2, wherein the rectifier is provided with a temperature sensor for controlling the temperature of the sealing portion.