JP2002270446A - Multilayer block and its producing method, electromagnetic actuator, stage unit and aligner comprising it, and method for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer block comprising a large number of thin magnetic sheets laid in layers in which the thin film is not stripped even if the multilayer block is polished obliquely to the layer direction and screws are prevented from loosening when the multilayer block is fixed to other apparatus. SOLUTION: The electromagnetic actuator 100 comprises an I core 20 and an E core 30. The multilayer block 22 employed in the I type core 20 comprises a plurality of thin magnetic sheets 21 laid in layers. The thin magnetic sheet 21 at one end of the multilayer block 22 is provided with a block fixing part 23 comprising a nonmagnetic body also serving as a securing part at the time of polishing. The multilayer plane 22A of the multilayer block 22 has an arcuate cross-section perpendicular to the layer direction. In the I core 20 employing the multilayer block 22, distance to the E core 30 is kept constant even if the I core 20 tilts against the E core 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated block and a method of manufacturing the same, an electromagnetic actuator, a stage device and an exposure apparatus using the same, and a method of manufacturing a semiconductor device. The present invention relates to a laminated block and the like configured as described above.

[0002]

2. Description of the Related Art For example, E-type cores and I-type cores used for transformers are known as laminated blocks in which a number of magnetic thin plates such as silicon steel plates and nickel steel plates are laminated and bonded.
The present inventors have invented an electromagnetic actuator 1 using an E-type laminated block (E-type core) and an I-type laminated block (I-type core) (FIG. 12).

In this electromagnetic actuator 1, an E-type core 3 around which a coil 4 is wound and an I-type core 2 are opposed to each other.
By controlling the current flowing through the coil 4 wound around the E-type core 3, a desired attractive force is generated between the I-type core 2 and the E-type core 3, and the I-type core 2 and the E-type core 3 Is to control the relative distance from. In the electromagnetic actuator 1, the attractive force is inversely proportional to the square of the relative distance between the lamination surface of the I-type core 2 and the lamination surface of the E-type core 3 (not shown). The surface to be laminated must be processed with high flatness (for example, 5 μm or less).

In particular, in the surface processing (grinding) of the lamination surface 2A of the I-shaped core 2, jigs 6 are applied to both sides of the I-shaped core 2 as shown in FIG. Done. The I-shaped core 2 whose surface has been ground is attached to another device (for example, a stage device) by inserting screws into screw notches 2c,... Formed at the ends in the layer direction.

[0005]

The I-type core 2
Grinding of the laminated surface 2A is performed by using a grindstone (not shown) and a jig 6.
In order to avoid interference with the jig, as shown in FIG.
Is set at a position lower than the laminating surface 2A, and in this state, the grindstone is pressed against the laminating surface 2A and its layer direction (X direction)
Grinding (polishing) is performed.

[0006] As described above, the grinding in the layer direction is performed in the direction perpendicular to the layer direction (Y direction) or in the oblique direction, as shown in FIG. This is because the magnetic thin plate 2b close to the jig 6 among the magnetic thin plates 2b constituting the I-shaped core 2 is easily peeled off. Thus, the grinding direction of the I-shaped core 2 is limited to the layer direction,
The degree of freedom in surface processing work is reduced.

[0007] Further, since the screw notch 2c provided in the I-shaped core 2 is formed at the end of the thin magnetic thin plate 2b, it is easily collapsed by tightening. For this reason, when the I-shaped core 2 is screwed to another device, the tightening torque must be reduced, which has been a factor of loosening of the screw. The present invention
In view of such circumstances, even if grinding processing is performed in a direction perpendicular or oblique to the layer direction, the magnetic thin plate does not peel off, and the screws are loose when mounting to another device. And a method for manufacturing the same.

Another object of the present invention is to provide a highly accurate electromagnetic actuator for position control using the laminated block.
And a stage device and the like using the same.

[0009]

According to a first aspect of the present invention, there is provided a laminated block in which a plurality of magnetic thin plates are laminated and bonded, and a block mounting portion made of a non-magnetic material also serving as a fixing portion during surface processing. , At least so as to be joined to a magnetic thin plate at one end of the laminated block.

According to a second aspect of the present invention, at least one laminating surface has an arc-shaped cross section perpendicular to the layer direction. Further, the laminated block according to claim 3 is a laminated block in which a plurality of magnetic thin plates are laminated,
A block mounting portion made of a non-magnetic material joined to a magnetic thin plate at at least one end of the laminated block, wherein at least one laminated surface of the laminated block has a predetermined cross-sectional shape substantially orthogonal to a layer direction thereof. The block mounting portion is formed such that at least a part of a cross-sectional shape of the laminated block in a direction substantially the same as the cross-sectional direction of the laminated block is curved in the predetermined arch shape. Things.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a laminated block, comprising: a first step of forming a laminated block by laminating and adhering magnetic thin plates; A second step of joining a block attaching portion, and a third step of fixing the laminated block to a grinding device using the block attaching portion;
Grinding the at least one lamination surface of the lamination block.

According to a fifth aspect of the present invention, there is provided a laminated block manufacturing method according to the fourth aspect, wherein the laminating surface is formed in an arch-like cross section perpendicular to the layer direction in the fourth step. The grinding is performed so that According to a sixth aspect of the present invention, in the fourth step of the method of manufacturing a laminated block according to the fourth or fifth aspect, the at least one laminated surface and the block mounting portion are simultaneously formed. It is to grind.

According to a seventh aspect of the present invention, there is provided an electromagnetic actuator comprising: the laminated block according to any one of the first to third aspects;
And a laminated block in which a coil is suspended to generate a magnetic field. According to an eighth aspect of the present invention, there is provided the stage device, wherein the electromagnetic actuator according to the seventh aspect is used as a driving unit of the stage unit.

According to a ninth aspect of the present invention, there is provided an exposure apparatus for forming a predetermined pattern on a substrate by using an optical system for exposure, comprising the stage device according to the eighth aspect. . According to a tenth aspect of the present invention, in manufacturing a device having a predetermined pattern formed thereon, a wafer having a reticle circuit pattern coated with a photosensitive agent using the exposure apparatus according to the ninth aspect. Transfer step to

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows an electromagnetic actuator 100 (FIG. 4).
FIG. 2 is a perspective view of an I-shaped core 20 used for the first embodiment.

As shown in FIG. 1, the I-shaped core 20 includes a laminated block 22 on which magnetic thin plates 21 are laminated, and block mounting portions 23, 23 joined to the magnetic thin plates 21 at both ends of the laminated block 22. It is constituted by. Here, the magnetic thin plate 21 is, for example, a silicon magnetic thin plate, a nickel magnetic thin plate (for example, Permalloy (trade name)) or the like, which is press-cut.

In this embodiment, the thickness of the magnetic thin plate 21 is 0.2 mm, and about 100 sheets are laminated.
When a silicon steel plate is used as the magnetic thin plate 21, a resin (such as acrylic) is applied to each magnetic thin plate 21 by baking to prevent rust and protect the surface. When the I-type core 20 is used for the electromagnetic actuator 100, the surface protection is performed at the initial stage of operation (at the time of initialization).
This is because the 0 and the E-shaped core 30 are temporarily in contact with each other.

In the laminated block 22 in which a number of magnetic thin plates 21 are laminated and bonded, one laminating surface 22A has a cross section perpendicular to the layer direction curved in an arch shape. The I-shaped core 20 constituted by the laminated block 22 is used for the electromagnetic actuator 100 (FIG. 4). In the electromagnetic actuator 100, the lamination surface 22A on the I-type core 20 side
And the interval between the laminated surface 30A of the E-shaped core 30 and the
The relative movable range is about 200 μm.

The arched curved surface 22A of the laminated block 22 is finished to a cylindricity of 5 μm by surface processing (grinding). On the other hand, the lamination surface 30A of the E-shaped core 30 is finished to have a flatness of 5 μm.

The block mounting portions 23 provided on both side ends of the laminated block 22 are made of a non-magnetic material such as stainless steel, and are fixed by a resin adhesive or the like. Block mounting portions 23, 2 made of non-magnetic material
3 is not affected by the magnetic field from the E-shaped core 30 around which the coil 40 is wound when the laminated block 22 is used as the I-shaped core 20. In addition, the block mounting part 23,
Reference numeral 23 denotes a hardness at which the grinding speed substantially matches that of the magnetic thin plate 21.

The block mounting portions 23 are provided with screw holes 23a by drilling. The screw holes 23a are used for fixing the I-shaped core 20 to another device (for example, the wafer table 604 shown in FIG. 5). In addition, as described below, the block mounting portion 23 is used to connect the laminated block 22 to a grinding device (grinding table 50).
Also used for fixing to.

Here, a method of manufacturing the laminated block 22 will be described. In manufacturing the laminated block 22 in which the laminated surface 22A is curved in an arch shape, first, a pressed rectangular magnetic thin plate 21 is laminated and bonded to form a rectangular parallelepiped laminated block 22 (FIG. 2A )).
At this point, the lamination surface 22A is flat. At both ends (magnetic thin plates 21 at both ends) of this rectangular parallelepiped laminated block 22,
The block mounting portions 23 are joined using a resin adhesive or the like.

The screw holes 23 of the block mounting portion 23
are aligned with the screw holes 51 on the grinding table 50 side, and the laminated blocks 22 are fixed to the grinding table 50 by the screws 61,... (FIG. 2B). The lamination surface 22A of the lamination block 22 fixed to the grinding table 50 is ground by a grindstone 55. This grinding is performed in a direction perpendicular to the layer direction (Y direction) or in an oblique direction so that the laminated surface 22A is curved in an arch shape as shown in FIG. By this grinding, the arched laminated surface 22A has a predetermined cylindricity (5 μm).

In this case, as described above, the block mounting portion 2
The hardness of the magnetic thin plate 21 constituting the laminated block 22
Since the hardness is such that the grinding speed is substantially constant, the laminated block 22 and the block mounting portion 23 can be ground at the same time, and there is no need to provide a step (height difference) between them to prevent interference. As described above, according to the method for manufacturing a laminated block according to the present invention, since the laminated block and the block mounting portion are ground at once, the laminated block and the block mounting portion are manufactured after the production.
Each cross section of (part of) is formed into a continuous surface that is curved in an arch shape with a predetermined cylindricity.

The laminated block 22 having the laminated surface 22A ground as described above is used as an I-type core 20, and as shown in FIG. 4, the electromagnetic actuator 100 is opposed to the E-type core 30 around which the coil 40 is wound. Constitute. As shown in FIGS. 5 and 6, the electromagnetic actuator 100 in which the laminated block 22 is used as the I-type core 20 has a screw screwed into a screw hole 23 a of the block mounting portion 23 of the I-type core 20, and It is fixed to the 604 side.

The E-shaped cores 30, 30 are also fixed to the Y stage 600Y by screwing screws (not shown) into screw holes (not shown) formed in the mounting portions. A wafer table 604 on which the I-type core 20 and the E-type core 30 of the electromagnetic actuator 100 are respectively arranged and the Y stage 600Y
As shown in FIGS. 6A and 6B, the Y stage 60
Even when the wafer table 604 is tilted with respect to 0Y, since the cross section of the lamination surface 22A on the I-type core 20 side is curved in an arch shape, regardless of the relative inclination,
The distance between the laminated surface 22A of the I-shaped core 20 and the laminated surface 30A of the E-shaped core 30 is kept substantially constant.

In particular, since both the cylindricity of the lamination surface 22A on the I-type core 20 side and the flatness of the lamination surface 30A of the E-type core 30 are high (5 μm), the I-type core 2 on the wafer table 604 side is high.
The distance between 0 and the E-shaped core 30 on the Y stage 600Y side is maintained substantially constant over the entire surface of the lamination surface 22A and the lamination surface 30A.

As a result, the accuracy of the position control of the electromagnetic actuator 100 is improved, and by controlling the energization of the coil 40, a highly accurate stage control (wafer table 604) is performed.
In the shift direction (Z). In the above-described embodiment, an example has been described in which the block mounting portions 23 are provided on both side ends of the laminated block 22. However, as shown in FIGS. The mounting part 70 and the square block mounting part 80 may be used as a fixing part at the time of surface processing.

Further, in this embodiment, the laminated block having a flat surface is subjected to high-precision grinding along a direction perpendicular to the layer direction, so that the laminated surface is arched with high cylindricity. Before applying this high-precision grinding, the lamination surface is previously formed in an arch shape by rough grinding, etc., and then high cylindricity is realized by high-precision grinding Is also good.

(Second Embodiment) Next, a second embodiment of the present invention will be described.
The embodiment will be described with reference to FIG. In the second embodiment, a Y stage 600Y of a stage device 600 used for manufacturing a semiconductor and a wafer table 6
04, the electromagnetic actuator 100 of the first embodiment described above is arranged.

The stage device 600 in which the electromagnetic actuator 100 is used to adjust the position (adjustment of the amount of shift) between the Y stage 600Y and the wafer table 604 is not limited in its use, but in this embodiment, a wafer (substrate) is used. It is used as a means for moving the wafer W in an exposure apparatus that transfers a pattern formed on a mask (not shown) onto the wafer W.

That is, the stage device 600 is a two-axis XY stage device of an X axis and a Y axis.
02, an X stage 600X driven in the X direction (direction indicated by arrow X in the figure), a Y stage 600Y driven in the Y direction (direction indicated by arrow Y), a wafer table (sample stage) 604, and a Y stage 600Y and wafer table 6
The main component is an electromagnetic actuator 100 (not shown in FIG. 8) for adjusting the shift amount with respect to the electromagnetic actuator 04.

Here, the wafer table 604 is arranged on the Y stage 600Y.
4. Wafer (substrate) via wafer holder (not shown)
W is mounted. An irradiation unit (not shown) is arranged above the wafer W, and a resist (not shown) applied to the wafer W in advance by exposure light irradiated from the irradiation unit via a mask (both not shown). (Omitted), the circuit pattern on the mask is transferred.

X stage 6 in stage device 600
The amounts of movement of the 00X and Y stages 600Y are respectively set to the moving mirrors 605X and 605Y fixed to the X-direction end and the Y-direction end of the wafer table 604, and to the base unit 602 so as to face the mirrors. Fixed laser interferometer 6
06X and 606Y. A main controller (not shown) controls the movement of the wafer table 604 to a desired position on the base 602 based on the measurement result.

The X stage 60 of the stage device 600
The 0X, Y stage 600Y is driven by linear motors 610, 610, 620, 620 using a stator 611.
Each is driven on the base 602 in the X direction and the Y direction. Here, the stators 611 and 611 of the two linear motors 610 and 610 are both mounted on the mounting portion 61 on the base 602.
6 and 616, and the movers 612 and 612 are respectively fixed to the X stage 600X via fixed plates 607 and 607.
Fixed to.

The stators 621 and 621 of the linear motors 620 and 620 are both fixed to the X stage 600X, and the movers 622 and 622 (only one is shown) are fixed to the Y stage 600Y.

Each stator 611, 611, 621, 621
Is cooled by a cooling medium for temperature adjustment flowing in a flow path in the inside thereof.
The temperature is adjusted at 1. The stators 611, 611, 6
21, 621 and the temperature controller 631
2, connected by a pipe 633 or the like. The stage device 600 is provided with an air guide 640 and a static pressure gas bearing (not shown).
The air suction port 642 forms a static pressure air bearing type stage.

(Third Embodiment) Next, a third embodiment of the present invention will be described.
The embodiment will be described with reference to FIG. In the third embodiment, the electromagnetic actuator 100 of the first embodiment is used as a driving unit of a reticle (mask) stage 750 of an exposure apparatus 700. That is, in the third embodiment, the electromagnetic actuator 100 of the first embodiment is incorporated in a reticle stage 750 (FIG.
00 is not shown), for example, reticle stage 75
Driving in the 0 tilt direction and the like are performed.

The exposure apparatus 700 is a so-called step-and-scan exposure type scanning exposure apparatus. As shown in FIG. 9, the exposure apparatus 700 includes an illumination system 710, a stage movable unit 751 for holding a reticle (photomask) R, a projection optical system PL, and a wafer (substrate) W in an XY plane. , A stage device 800 for driving in a two-dimensional direction of the X direction and the Y direction, and a main control device 720 for controlling these.

The illumination system 710 irradiates the exposure light emitted from the light source unit to the rectangular (or arc-shaped) illumination area IAR on the reticle R with uniform illuminance. In the reticle stage 750, the stage movable section 751 is moved on a reticle base (not shown) at a predetermined scanning speed along a guide rail (not shown).
A reticle R is fixed on the upper surface of the stage movable section 751, for example, by vacuum suction. Also, the stage movable part 7
An exposure light passage hole (not shown) is formed below the reticle R of 51.

The moving position of the stage movable section 751 is as follows.
The stage control system 719 is detected by the reflecting mirror 715 and the reticle laser interferometer 716, and the main controller 720 based on the detected moving position of the stage movable section 751 is used.
The stage movable section 751 is driven in accordance with the instruction from. The projection optical system PL is a reduction optical system, and is disposed below the reticle stage 750, and the direction of its optical axis AX (coincident with the optical axis IX of the illumination optical system) is defined as the Z-axis direction.
Here, a refraction optical system including a plurality of lens elements arranged at predetermined intervals along the optical axis AX direction so as to have a telecentric optical arrangement is used. Therefore, the illumination area IA of the reticle R by the illumination system 710
When R is illuminated, a reduced image (partially inverted image) of the circuit pattern in the illumination area IAR of the reticle R is formed in the exposure area IA conjugate to the illumination area IAR on the wafer W.

The stage device 800 includes a flat motor 8
The table 818 is driven in a two-dimensional direction in the XY plane by using 70 as a driving unit. That is, the stage device 800 includes a base 821 and the base 821.
And a flat motor 870 for moving the table 818, with the table 818 floating above the upper surface through a clearance of about several μm. The table 818 has a wafer (substrate) W on its upper surface during the exposure processing.
Is fixed, for example, by vacuum suction.

A moving mirror 827 is fixed to the table 818, and a laser beam is irradiated from the wafer interferometer 831 to detect the moving position of the table 818 in the XY plane. . Information on the movement position obtained at this time is sent to main controller 720 via stage control system 719. Then, the stage control system 719
In accordance with an instruction from main controller 720 based on this information, planar motor 870 is operated and table 818 is set to X
-Move to a desired position in the Y plane.

The table 818 is supported at three different points by a support mechanism (not shown) on the upper surface of a mover (not shown) constituting the flat motor 870. The table 818 is moved in the X and Y directions by the flat motor 870. Not only can it be driven, but also it can be tilted with respect to the XY plane or driven in the Z-axis direction (upward). Note that the planar motor 870 has a known configuration, and other descriptions of the planar motor 870 are omitted.

In the figure, reference numeral 821 is a base portion,
The cooling medium for preventing the temperature rise due to the heat generated from the inside thereof includes the supply pipe 792, the discharge pipe 793, and the temperature control device 7.
By the action of 79, and is circulated. Exposure apparatus 70 including reticle stage 750 having such a configuration
At 0, the exposure process is generally performed in the following procedure.

First, reticle R and wafer W are loaded, and then reticle alignment, baseline measurement, alignment measurement and the like are executed. After the completion of the alignment measurement, an exposure operation of a step-and-scan method is performed. In the exposure operation, main controller 720 issues a command to stage control system 719 based on position information of reticle R by reticle interferometer 716 and position information of wafer W by wafer interferometer 831, and controls electromagnetic actuator 100 of reticle stage 750. The reticle R and the wafer W are moved synchronously by a linear motor (not shown) and a plane motor 870, so that a desired scanning exposure is performed.

When the transfer of the reticle pattern to one shot area is completed, the table 8
18 is stepped by one shot area, and scanning exposure is performed on the next shot area. This stepping and scanning exposure are sequentially repeated, and the required number of shot patterns are transferred onto the wafer W.

The manufacture of a semiconductor device using the stage apparatus 600 or the exposure apparatus 700 according to the second and third embodiments of the present invention is generally performed according to the procedures shown in FIGS. Will be That is, the semiconductor device has a step of designing the function and performance of the device, a step of manufacturing a reticle based on this design step, a step of manufacturing a wafer from a silicon material, and a step of forming a reticle pattern by the exposure apparatus of the above-described embodiment. It is manufactured through a step of transferring to a wafer, a step of assembling a device (including a dicing step, a bonding step, and a package step), an inspection step, and the like.

Hereinafter, the device manufacturing method will be described in more detail. FIG. 10 shows a flowchart of an example of manufacturing devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). As shown in this figure, first, in step 1001 (design step), a function / performance design of a device (for example, a circuit design of a semiconductor device) is performed, and a pattern design for realizing the function is performed.
Subsequently, in step 1002 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step 1003 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

Next, in step 1004 (wafer processing step), steps 1001 to 1003
Using the mask (reticle) and the wafer prepared in the above, an actual circuit or the like is formed on the wafer by lithography technology or the like as described later. Next, step 1005
In (device assembling step), step 1004
Device assembly is performed using the wafer processed in the above. Step 1005 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.

Finally, in step 1006 (inspection step), inspections such as an operation confirmation test and a durability test of the device manufactured in step 1005 are performed. After these steps, the device is completed and shipped. FIG. 11 shows a detailed flow example of step 1004 in the case of a semiconductor device. In FIG. 11, in step 1011 (oxidation step), the surface of the wafer is oxidized. Step 1012
In the (CVD step), an oxide insulating film is formed on the wafer surface. In step 1013 (electrode forming step), electrodes are formed on the wafer by vapor deposition. In step 1014 (ion implantation step), ions are implanted into the wafer.

The above steps 1011 to 101
Each of the components 4 constitutes a pre-processing step in each stage of the wafer processing, and is selected and executed according to a necessary process in each stage. In each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step 1015 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step 1016 (exposure step), the circuit pattern of the mask is transferred onto the wafer by using the above-described exposure apparatus. Next, in step 1017 (development step), the exposed wafer is developed, and in step 1018 (etching step)
In, the exposed member other than the portion where the resist remains is removed by etching. Then, in step 1019 (resist removing step), unnecessary resist after etching is removed.

By repeating these pre-processing and post-processing steps, multiple circuit patterns are formed on the wafer. Also, the stage device 600 according to the present invention
The present invention can also be applied as a stage device of a step-and-repeat type exposure apparatus that exposes a pattern of a mask while the mask and the substrate are stationary and sequentially moves the substrate in steps.

[0054] Further, the present invention can be brought into close contact with the mask and the substrate without using a projection optical system is also applicable as a drive device for a proximity exposure apparatus that exposes a pattern of a mask. Further, the exposure apparatus 700 according to the present invention
The present invention is not limited to an exposure apparatus for manufacturing a semiconductor, and can be applied to, for example, an exposure apparatus for a liquid crystal for exposing a liquid crystal display element pattern to a square glass plate and an exposure apparatus for manufacturing a thin film magnetic head.

The light source of the exposure apparatus according to the third embodiment includes g-line (436 nm), i-line (365 nm), KrF
Not only an excimer laser (248 nm), an ArF excimer laser (193 nm), and an F ₂ laser (157 nm) but also a charged particle beam such as an X-ray or an electron beam can be used. For example, when an electron beam is used, a thermionic emission type lanthanum hexaboride (LaB ₆ ) or tantalum (Ta) can be used as the electron gun. Furthermore, when using an electron beam, a configuration using a mask may be used,
A structure in which a pattern is directly formed on a substrate without using a mask may be adopted.

In this case, when far ultraviolet rays such as an excimer laser are used as the projection optical system, a material that transmits far ultraviolet rays such as quartz or fluorite is used as the glass material, and when an F ₂ laser or X-ray is used. catadioptric system or the refractive based optical system (reticle also used as a reflective type), or may be used an electron optical system comprising an electron lens and a deflector as an optical system in the case of using an electron beam. In addition,
It goes without saying that the optical path through which the electron beam passes is in a vacuum state.

The magnification of the projection optical system of the exposure apparatus 700 according to the present invention may be not only a reduction system but also an equal magnification and an enlargement system. Further, as the wafer stage or reticle stage according to the present invention, any of an air floating type using an air bearing and a magnetic floating type using a Lorentz force or a reactance force may be used.

The stage according to the present invention is not limited to a type that moves along a guide, but may be a guideless type that does not require a guide. The reaction force generated by the movement of the wafer stage is described in
Utilizing the invention proposed in 166475, a frame member may be used to mechanically escape to the floor side (ground).

Regarding the reaction force generated by the movement of the reticle stage, utilizing the invention proposed in Japanese Patent Application Laid-Open No. 8-330224, a frame member is used to mechanically move the floor side (ground). You may make it escape to.
The exposure apparatus to which the linear motor according to the present invention described above is applied is designed to maintain various mechanical subsystems including the respective constituent elements recited in the claims with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. And manufactured by assembling.

In order to ensure these various precisions, before and after this assembly, adjustments to achieve optical precision for various optical systems, adjustments to achieve mechanical precision for various mechanical systems, various Adjustments are made to the electrical system to achieve electrical accuracy. In addition, the process of assembling the exposure apparatus from the various subsystems includes mechanical connection, wiring connection of an electric circuit, and piping connection of a pneumatic circuit between the various subsystems.

It goes without saying that there is an assembling step for each subsystem before the assembling step from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

[0062]

As described above, according to the first, third, fourth, and sixth aspects of the present invention, the magnetic thin plate at one end of the laminated block serves as a fixing part also serving as a fixing part at the time of surface processing. Since the block mounting portion made of a magnetic material is joined, even if grinding is performed in an oblique direction to the layer direction (for example, a superimposing direction perpendicular to the layer), the lamination block can be formed without causing peeling of the magnetic thin plate. Screws are less likely to be loosened when attached to other devices.

Further, according to the second, fifth and sixth aspects of the present invention, when the laminated surface of the laminated block is curved in an arch shape, even if the grinding is performed along the curved surface, the magnetic properties can be improved. Does not cause peeling of thin plates. According to the seventh aspect of the present invention, in the electromagnetic actuator, the laminated surface of the laminated block constituting one core (I-type core) can be ground with high flatness and cylindricity, so that the laminated surface and the other surface can be ground. The distance between the core (E-shaped core) and the laminated surface can be adjusted with high accuracy, and the control accuracy of the electromagnetic actuator is improved.
Further, the one core of the electromagnetic actuator can be firmly fixed to a driven portion (for example, a stage device).

Further, according to the stage device of the present invention, since the electromagnetic actuator having high position control accuracy is used as the moving means, fine operation control of the stage device can be performed. According to the ninth aspect of the present invention, since the object to be exposed by the exposure apparatus is moved by the stage device capable of finely controlling the operation, the accuracy in manufacturing semiconductor elements, liquid crystal display elements, and the like is improved. I do.

According to the tenth aspect of the present invention, since a predetermined pattern of a semiconductor device is formed by the exposure apparatus, a fine pattern can be manufactured with high accuracy, and its high integration can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an I-shaped core 20 used for an electromagnetic actuator 100. FIG.

FIG. 2 is a perspective view showing a state in which a block attaching portion 23 is attached to a laminated magnetic thin plate block main body 22.

FIG. 3 is a perspective view showing how the I-shaped core 20 is ground.

FIG. 4 is a perspective view showing an electromagnetic actuator 100 to which the I-shaped core 20 is applied.

5 shows an I-shaped core 20, E of an electromagnetic actuator 100. FIG.
FIG. 9 is a perspective view showing a state where the mold core 30 is attached to a stage device 600.

FIG. 6 shows an electromagnetic actuator 100 and a stage device 6
It is a figure showing the relation with 00.

FIG. 7 is a perspective view showing a square-shaped block mounting portion 70 and a square-shaped block mounting portion 80 that can be used in place of the block mounting portion 23 of the present embodiment.

FIG. 8 is a perspective view showing a stage device 600 to which the electromagnetic actuator 100 is applied.

FIG. 9 is a diagram showing an overall configuration of an exposure apparatus 700 in which an electromagnetic actuator 100 is used for a reticle stage 750.

FIG. 10 is a diagram showing a semiconductor device manufacturing process using the exposure apparatus according to the present invention.

FIG. 11 is a diagram showing a more specific manufacturing process of a semiconductor device using the exposure apparatus according to the present invention.

FIG. 12 is a perspective view showing a conventional electromagnetic actuator 1.

FIG. 13 is a perspective view showing an I-shaped core 2 of the electromagnetic actuator 1.

FIG. 14 shows a magnetic thin plate 2 at an end of an I-shaped core 2 during grinding.
It is a figure which shows the mode of peeling of b.

[Explanation of symbols]

 Reference Signs List 20 I-shaped core 22 Laminated block 22A Laminated surface 23 Block mounting part 30 E-shaped core 40 Coil 50 Grinding table (grinding device) 55 Grinding wheel 100 Electromagnetic actuator 600 Stage device 700 Exposure device 750 Reticle stage

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E048 AD07 CA01 5F031 LA04 LA06 LA08 MA27 5F046 BA05 CC01 CC02 CC03 CC18 DA26

Claims (10)

[Claims] In a laminated block in which a plurality of magnetic thin plates are laminated and adhered, a block mounting portion made of a non-magnetic material also serving as a fixing portion during surface processing is bonded at least to a magnetic thin plate at one end of the laminated block. The laminated block characterized by being provided in. 2. The laminated block according to claim 1, wherein at least one laminated surface of the laminated block has an arc-shaped cross section perpendicular to the layer direction. 3. A laminated block in which a plurality of magnetic thin plates are laminated, and a block attaching portion made of a non-magnetic material joined to a magnetic thin plate at at least one end of the laminated block, wherein at least one of the laminated blocks is provided. The two stacking surfaces are formed such that the cross-sectional shape substantially orthogonal to the layer direction is curved in a predetermined arch shape, and the block mounting portion has a cross-section in a direction substantially the same as the cross-sectional direction of the stacked block. A laminated block, wherein at least a part of the shape is curved in the predetermined arch shape. 4. A method of manufacturing a laminated block in which a plurality of magnetic thin plates are laminated, a first step of forming a laminated block by laminating and adhering the magnetic thin plates, and at least a magnetic step at one end of the laminated block. A second step of joining a non-magnetic block mounting portion to the thin plate; a third step of fixing the laminated block to a grinding device using the block mounting portion; and at least one lamination of the laminated block And a fourth step of grinding the surface. 5. The method of manufacturing a laminated block according to claim 4, wherein, in the fourth step, the laminated surface is ground so that a cross section perpendicular to a layer direction has an arch shape. Manufacturing method of a laminated block. 6. The method for manufacturing a laminated block according to claim 4, wherein in the fourth step, the at least one laminated surface and the block mounting portion are simultaneously ground. A method for manufacturing a laminated block. 7. An electromagnetic actuator comprising: the multilayer block according to claim 1, and a multilayer block in which a coil is suspended to generate a magnetic field. 8. A stage device, wherein the electromagnetic actuator according to claim 7 is used as driving means for a stage unit. 9. An exposure apparatus for forming a predetermined pattern on a substrate using an exposure optical system, comprising: the stage apparatus according to claim 8. 10. A method of manufacturing a device having a predetermined pattern, comprising the step of transferring a circuit pattern of a reticle onto a wafer coated with a photosensitive agent using the exposure apparatus according to claim 9. A method for manufacturing a semiconductor device.