JP2002044929A - Coil unit for armature and manufacturing method for the unit, armature unit, linear motor, stage device and exposure device and manufacturing method for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inhibit temperature rise in a linear motor and the like caused by heat generation of a coil, without spreading a passage area of a coolant or without raising pressure, but enhancing the cooling efficiency. SOLUTION: A coil unit 150 built in a stator 110 of a linear motor 100 and the like comprises a coil 151, composed of plate-shaped coil members 151a, 151b, 151c and 151d. Cooling sections 160A, 160B, having a number of dimples 161, 161 and so on are mounted on the surface of the coil 151. When a coolant is lubricated in a pass 115, formed between a can 113 of the stator 110 and the coil unit 150, cooling efficiency is improved by the amount that a surface area of the coil unit is enlarged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an armature coil unit and a method of manufacturing the same, an armature unit and a linear motor using the same, a stage apparatus, an exposure apparatus, and a method of manufacturing a device. The present invention relates to an armature coil unit, an armature unit, a linear motor, a stage device, and the like that are suitable for use in an environment where temperature control is severe such as a machine tool.

[0002]

2. Description of the Related Art In recent years, in an exposure apparatus used for manufacturing a semiconductor device, a liquid crystal display element, or the like, a reticle stage on which a mask (reticle, etc.) is placed and a photosensitive substrate (wafer, glass plate, etc.) are placed. A linear motor is used as a driving device (stage device) for a mounted wafer stage or the like.

A linear motor includes a stator and a mover that moves relative to the stator. In a stage device, one of the stator and the mover is on a specific stage, and the other is on another stage. And the particular stage is moved relative to the other stages. By the way, in the stage device, since precision instruments affected by heat, such as an interferometer used for detecting the stage position, are used, the temperature of the entire device must be strictly controlled. Therefore, it is necessary to control the temperature of the linear motor used in the stage device so as to keep the temperature within a predetermined temperature by suppressing heat generation (temperature rise) during operation.

[0004] Conventionally, in order to prevent heat generation (temperature rise) during operation of a linear motor, a flow path of a cooling medium is formed in a can accommodating a coil, and the temperature of the cooling medium flowing through the flow path is controlled. There is known a linear motor provided with a cooling mechanism that controls the temperature of a coil in a can by controlling the temperature of the coil using a temperature controller. In the linear motor having such a cooling mechanism, a flow path (gap) having a fixed area is secured between the can and the coil so that a fixed amount of the cooling medium flows around the coil per unit time.

[0005] An inlet and an outlet for a cooling medium are provided in the can, and a cooling device is connected to the inlet and the outlet so that a fixed amount of the cooling medium circulates in the can per unit time. Has become. The cooling medium in the can is pressurized to a constant pressure by a pressurizing pump so as to flow at a constant flow rate.

[0006]

By the way, in a stage device using a linear motor in recent years, the amount of movement is controlled with higher precision as the semiconductor devices and liquid crystal display elements to be manufactured are highly integrated. Therefore, it is necessary to detect the stage position with higher accuracy.

Here, the moving amount of the stage is detected by an interferometer or the like, but when the temperature of the linear motor rises,
"Fluctuation" is caused by the heat generation, and the accuracy of detecting the stage position by an interferometer or the like is reduced. Therefore,
There is a demand for a linear motor used in a stage device to further reduce the amount of heat generated. In the stage device, in order to increase the cooling efficiency of the cooling mechanism of the linear motor, it is conceivable to first increase the area of the flow path of the cooling medium in the can, and secondly, to increase the cooling medium supplied into the can. It is conceivable to increase the pressure to increase the flow velocity.

However, if the flow path of the cooling medium in the can is enlarged, the entire linear motor becomes large. Further, the coil in the can, which is the stator side, and the movable element, which is located outside the coil, are located outside the can. There is a problem that the distance from the magnet is increased and the motor constant is reduced. on the other hand,
If the pressure of the cooling medium supplied into the can is increased, the can itself expands and its outer wall comes into contact with the mover, so that the linear motor may not operate or the linear motor may be damaged or deformed.

The present invention has been made in view of such circumstances, and in a linear motor in which a coil is cooled by a cooling mechanism, the cooling efficiency is increased without increasing the flow area of the cooling medium or increasing the pressure of the cooling medium. It is therefore an object of the present invention to provide an armature coil unit, an armature unit, a linear motor, and the like, which are capable of reliably suppressing an increase in temperature of a linear motor due to heat generation of a coil.

[0010]

According to a first aspect of the present invention, there is provided an armature coil unit in which a cooling portion having a large number of irregularities is provided on the surface of the coil. Thereby, the surface area of the armature coil unit can be increased. According to a second aspect of the present invention, in the armature coil unit according to the first aspect, the cooling portion is formed of a sheet member having a large number of irregularities. Thereby, the surface area of the armature coil unit can be increased by a simple method.

According to a third aspect of the present invention, there is provided a method of manufacturing an armature coil unit according to the first aspect, wherein an adhesive is applied to the coil; And solidifying the adhesive by sandwiching the adhesive from both sides with a mold plate having a large number of irregularities. This makes it possible to form a cooling portion having a large number of irregularities by a simple manufacturing method, and to increase the surface area of the armature coil unit.

According to a fourth aspect of the present invention, there is provided an armature unit comprising the armature coil unit according to the first or second aspect and a can accommodating the armature coil unit therein. A flow path for circulating a cooling medium is formed between the armature coil unit and the armature coil unit. Thus, if the flow rate of the cooling medium flowing around the armature coil unit is the same, the cooling efficiency is improved by an increase in the surface area of the armature coil unit.

Further, the linear motor according to the fifth aspect is the fourth aspect of the present invention.
And a movable element including a yoke and a magnet. This allows
Temperature adjustment of the stator during operation of the linear motor is facilitated. According to a sixth aspect of the present invention, there is provided a linear motor including a movable element comprising the armature unit according to the fourth aspect and a stator comprising a yoke and a magnet. This facilitates temperature adjustment of the mover during operation of the linear motor.

The stage device according to claim 7 is the same as that in claim 5.
Alternatively, the linear motor according to claim 6 is used as a drive unit of a stage unit. This allows
Since the temperature adjustment of the stage device is reliably performed, the measurement accuracy of a device that requires temperature management, such as a measuring device (for example, an interferometer) that detects the stage position, is increased. According to a further aspect of the present invention, there is provided an exposure apparatus for forming a predetermined pattern on a substrate using an exposure optical system, the apparatus comprising the stage device according to the seventh aspect. Thereby, the movement amount of the stage device can be controlled with high accuracy, and the semiconductor device,
Accuracy at the time of manufacturing a liquid crystal display element or the like is also improved.

According to a ninth aspect of the present invention, there is provided a method of manufacturing a device on which a predetermined pattern is formed, wherein a photosensitive agent is applied to a reticle circuit pattern using the exposure apparatus according to the eighth aspect. It has a step of transferring to a wafer. Since the exposure apparatus uses a stage apparatus with high movement amount control, a fine pattern can be accurately formed on the device.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the present invention will be described below with reference to FIGS. The linear motor 100 according to the first embodiment
Is composed of a stator 110 and a mover 120, as shown in FIGS.

The mover 120 has a U-shaped cross section and is fitted to the stator 110.
When a current having a predetermined waveform is passed through 51,
Moves relative to the stator 110 in the direction indicated by the arrow X in FIG. Here, the stator 110 is constituted by an armature coil unit 150 and a can 113 for accommodating the armature coil unit, and a gap between the can 113 and the coil unit 150 serves as a cooling medium flow path 115. Construct an armature unit.

The can 113 has an inlet 1 for taking in a cooling medium whose temperature has been adjusted by a cooling device (not shown).
15A and an outlet 115B for discharging. Also, the coils 151 constituting the coil unit 150
Are a plurality of plate-shaped coil members 151a, 151b, 15
1c and 151d are bonded with, for example, an adhesive,
The connection part 155 is composed of a can 113 and a top member (heat insulating material).
It is fixed by 114.

The mover 120 is, as shown in FIG.
It comprises a yoke 121 and permanent magnets 122, 122 arranged on the inner wall surface of the yoke 121. still,
Permanent magnets 122, 12 used as magnetic flux generating means
Instead of 2, an electromagnet or the like may be used. Here, the coil unit 15 built in the can 113 of the stator 110
The configuration of No. 0 and the manufacturing method will be described with reference to FIGS.

As shown in FIG. 3, the coil unit 150 includes a plurality of plate-like coil members 151a, 151b, and 15a.
Coils 151a and 151b are bonded with a resin adhesive, and a large number of dimples (recesses) 161, 16
1 are formed by the cooling units 160A and 160B. Due to the dimples 161 of the cooling units 160A, 160B, a large number of irregularities are formed on the surface of the coil 151, and as a result, the surface area is increased.

When the surface area of the coil 151 is increased by the dimples 161, 161.
The cooling efficiency can be increased without increasing the amount of cooling medium (florinert) flowing around the periphery of the cooling medium 1. Suppose, cooling section 160A, the thickness of 160B is 2 mm, if the vertical and horizontal coils 151 are 60 mm × 800 mm, one side of the area is 48000Mm ^2, hemispherical dimple radius 2 mm 161, 161 ... are one-sided About 30 per
00 pieces can be formed. At this time, the hemispherical dimple 16
The total area of 1,161 ... is 2π × 3000 × 75400m
m ² . That is, the area of the coil 151 is about 1.57 times on both surfaces. The cooling efficiency increases in proportion to the increase in the surface area (the cooling efficiency also becomes about 1.57 times).

As described above, since the surface area of the coil 151 can be increased without increasing the size of the coil 151 itself, the gap between the coil unit 150 and the can 113 (the opening area of the flow path 115) is not increased, and cooling is performed. The cooling efficiency can be dramatically increased without increasing the pressure of the medium. Note that the cooling units 160A and 160B
(For example, about 2 cm)
m), even if the cooling units 160A and 160B are provided,
The opening area of the flow channel 115 does not significantly decrease.
In other words, the cooling units 160A and 160B are provided to improve the cooling efficiency by increasing the surface area of the coil unit 150, and the cooling units 160A and 160B are provided to reduce the opening area of the flow path 115 and thereby reduce the cooling efficiency. When compared with each other, the influence of the former is much greater.

FIG. 4 shows a cooling section 160A in which a large number of dimples 161, 161.
A method of forming 160B by solidifying the adhesive 160 will be described. As shown in this figure, first, a sufficient amount of adhesive 160 is applied to both surfaces of the coil 151, and in this state, the coil 151 is formed by the mold plates 170A, 170B having a number of convex portions 171, 171. As shown in FIG. 3, by sandwiching the cooling unit 160A from above and below with a constant pressure, a plurality of dimples 161, 161.
160B are formed on both upper and lower surfaces of the coil 151. As a material of the mold plates 170A and 170B, a resin such as Delrin or a metal is used.

Here, the adhesive 1 is applied to both sides of the coil 151.
Although the example in which the cooling units 160A and 160B are formed by applying 60 is described above, the coil members 151a, 151b,
When the coils 151c and 151d are bonded with an adhesive to form the coil 151, an extra adhesive is applied, and the adhesive is oozed on the surface of the coil 151, so that the cooling units 160A, 160
B may be formed.

In this embodiment, the cooling unit 160
A and 160B have been described with examples in which hemispherical dimples 161, 161... Are formed, but other shapes (for example,
Even in the case of a triangular pyramid, a quadrangular pyramid, or the like, the surface area of the coil 151 can be increased to increase the cooling efficiency. (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG.

The coil unit 25 of the second embodiment
0 denotes a cooling section (sheet member) 26 made of resin
0A and 260B are different from the coil unit 150 of the first embodiment described above. still,
The coil unit 250 is also used for the stator 110 of the linear motor 100. That is, the coil unit 25
In the case of 0, resin cooling sheets 260A and 260B are adhered to the upper and lower surfaces of the coil 151, respectively, with an adhesive.

A large number of dimples 261, 261... Are formed on the surface of the cooling sheets 260A, 260B, and the surface area of the coil unit 250 is increased. The dimples 261, 261 of the cooling sheets 260A, 260B
261 are the same as those in the first embodiment described above. Therefore, the operation effect (improvement in the cooling efficiency of the linear motor 100) when the coil unit 250 is used is also the same as that in the first embodiment. This is the same as the first embodiment.

In manufacturing the cooling sheets 260A and 260B, a mold plate similar to the mold plates 170A and 170B used in the first embodiment is used, and a large number of cooling plates are provided on the surfaces of the cooling sheets 260A and 260B. Are formed. Thus, the cooling sheet 260 is provided on the upper and lower surfaces of the coil 151.
By adhering A and 260B, the surface area can be increased without increasing the size of the coil 151 itself, without increasing the gap (opening area of the flow path) between the coil unit 250 and the can, and The cooling efficiency can be dramatically increased without increasing the pressure of the cooling medium.

The cooling sheet 260A,
Even if 260B is attached, cooling sheets 260A, 260B
Is sufficiently thin (about 2 mm) as compared with the thickness of the coil 151 (for example, about 2 cm), so that the opening area of the flow path of the cooling medium does not significantly decrease. In the first and second embodiments described above, the coil unit 15
0,160 is a moving magnet type linear motor 1
Although the case where it is provided in the stator 110 of 00 has been described,
For example, these coil units 150 and 160 may be provided on the mover side of a moving coil type linear motor.

(Third Embodiment) Next, a third embodiment of the present invention will be described.
The embodiment will be described with reference to FIG. In the third embodiment, a linear motor 1 in which the coil units 150 and 250 of the first and second embodiments described above are built in a stage device 600 used for manufacturing a semiconductor.
00 is used.

The linear motor 1 according to the first and second embodiments
00, the surface area of the coil units 150, 250 is enlarged by the dimples 161, 161, 261, 261, and the cooling efficiency is improved. Therefore, the temperature of the linear motor 100 can be adjusted with high accuracy. Yes,
The accuracy of the movement amount control is increased. In the third embodiment, the linear motor 100 having high temperature adjustment accuracy and high movement amount control accuracy is used for driving the X stage (movable stage) 600X of the stage device 600.

Here, when a cooling medium (for example, Fluorinert) for adjusting the temperature is passed through the cooling liquid flow path 115 between the can 113 of the stator 110 and the coil unit 150, heat generated from the stator 110 is generated. Is absorbed. Note that Y
The configuration of the two linear motors 620 (only one is shown in FIG. 6) used for driving the stage 600Y is the same as that of the linear motor 100, and a detailed description thereof will be omitted.

The use of the stage device 600 in which the linear motors 100 and 620 are used as driving means is not limited, but in this embodiment, a pattern formed on a wafer (substrate) W by a mask (not shown) is used. Is used as a moving means of the wafer W in the exposure apparatus for transferring the wafer. That is, the stage device 600 is a two-axis XY stage device of the X axis and the Y axis,
02, an X stage 600X driven in the X direction (direction indicated by arrow X in the figure), a Y stage 600Y driven in the Y direction (direction indicated by arrow Y), and a sample stage (movable body) 6
04 is a main component.

Here, the sample stage 604 is mounted on the Y stage 6
The wafer (substrate) W is mounted on the sample table 604 via a wafer holder (not shown).
An irradiation unit (not shown) is arranged above the wafer W, and a resist (not shown) applied to the wafer W in advance by exposure light irradiated from the irradiation unit via a mask (both not shown). (Omitted), the circuit pattern on the mask is transferred.

X stage 6 in stage device 600
The movement amounts of the 00X and Y stages 600Y are respectively set on moving mirrors 605X and 605Y fixed to the X-direction end and the Y-direction end of the sample table 604, and the base unit 602 so as to face the moving mirrors. Fixed laser interferometer 606X,
606Y. Then, a main controller (not shown) controls the movement of the sample table 604 to a desired position on the base 602 based on the measurement result.

The X stage 60 of the stage device 600
The 0X and Y stages 600Y are linear motors 100, 100, and 62 using the stator 110 having the coil units 150 and 250 of the first and second embodiments, respectively.
0 and 620 drives the base unit 602 in the X and Y directions, respectively. Here, the stators 110, 110 of the two linear motors 100, 100 are both fixed on mounting portions 116, 116 on the base 602, and the movers 120, 120 are respectively fixed via fixing plates 607, 607. Fixed to X stage 600X.

In the linear motors 620 and 620, the respective stators 621 and 621 are both fixed to the X stage 600X, and the movers 622 and 622 (only one is shown) are fixed to the Y stage 600Y. Each stator 110, 1
The cooling medium 10, 621, 621 is cooled by a cooling medium for temperature adjustment flowing in an internal flow path (for example, the flow path 115 in FIG. 2).
The temperature is adjusted at. The stators 110, 110, 62
1,621 and the temperature controller 631 are connected to a discharge pipe 632,
They are connected by a pipe 633 or the like.

The stage device 600 is provided with an air guide 640 and a static pressure gas bearing (not shown).
The air blowing port 641 and the air suction port 642 constitute a static pressure air bearing type stage. (Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG.

The fourth embodiment is similar to the first,
The linear motor 100 according to the second embodiment is
The reticle (mask) stage 750 is used as a driving means of the reticle (mask) stage 750. That is, in the fourth embodiment, the linear motors 100 of the first and second embodiments are incorporated in the reticle stage 750. Here, the exposure apparatus 700 is a so-called step-and-scan exposure type scanning exposure apparatus.

As shown in FIG. 7, the exposure apparatus 700 includes an illumination system 710, a stage movable section 751 for holding a reticle (photomask) R, a projection optical system PL, and a wafer (substrate) W. A stage device 800 that drives in a two-dimensional direction of the X direction and the Y direction in the Y plane, a main controller 720 that controls these, and the like are provided. The illumination system 71
Numeral 0 is for irradiating the exposure light emitted from the light source unit to the rectangular (or arc-shaped) illumination area IAR on the reticle R with uniform illuminance.

In the reticle stage 750, the stage movable portion 751 is moved on a reticle base (not shown) at a predetermined scanning speed along a guide rail (not shown). A reticle R is provided on the upper surface of the stage movable portion 751.
Is fixed, for example, by vacuum suction. An exposure light passage hole (not shown) is formed below the reticle R of the stage movable section 751.

The moving position of the stage movable portion 751 is as follows.
The stage control system 719 is detected by the reflecting mirror 715 and the reticle laser interferometer 716, and the main controller 720 based on the detected moving position of the stage movable section 751 is used.
The stage movable section 751 is driven in accordance with the instruction from.

The projection optical system PL is a reduction optical system.
The optical axis A is disposed below the reticle stage 750.
The direction of X (coincident with the optical axis IX of the illumination optical system) is defined as the Z-axis direction. Here, a refraction optical system including a plurality of lens elements arranged at predetermined intervals along the optical axis AX direction so as to have a telecentric optical arrangement is used. Therefore, when the illumination system 710 illuminates the illumination area IAR of the reticle R, the illumination area IA of the reticle R
A reduced image (partially inverted image) of the circuit pattern in R is formed in an exposure area IA conjugate to the illumination area IAR on the wafer W.

The stage device 800 drives the table 818 in a two-dimensional direction in the XY plane by using a planar motor 870 using the coil unit 150 as an armature as a driving means. That is, the stage device 800
It includes a base 821, a table 818 that floats above the upper surface of the base 821 with a clearance of about several μm, and a planar motor 870 that moves the table 818. At the time of exposure processing, a wafer (substrate) W is fixed to the upper surface of the table 818 by, for example, vacuum suction.

A moving mirror 827 is fixed to the table 818, and a laser beam is irradiated from the wafer interferometer 831 to detect the moving position of the table 818 in the XY plane. . Information on the movement position obtained at this time is sent to main controller 720 via stage control system 719. Then, the stage control system 719
In accordance with an instruction from main controller 720 based on this information, planar motor 870 is operated and table 818 is set to X
-Move to a desired position in the Y plane.

The table 818 is supported on the upper surface of a mover (not shown) constituting the flat motor 870 at three different points by a support mechanism (not shown), and is moved in the X and Y directions by the flat motor 870. Not only can it be driven, but also it can be tilted with respect to the XY plane or driven in the Z-axis direction (upward). Note that the planar motor 870 has a known configuration, and other descriptions of the planar motor 870 are omitted.

In the drawing, reference numeral 821 denotes a base portion,
A cooling medium for preventing a temperature rise due to heat generated from the inside thereof includes a supply pipe 792, a discharge pipe 793, and a temperature control device 7.
By the operation of 79, circulation is performed. Exposure apparatus 70 including reticle stage 750 having such a configuration
At 0, the exposure process is generally performed in the following procedure.

First, the reticle R and the wafer W are loaded, and then, reticle alignment, baseline measurement, alignment measurement, and the like are performed. After the completion of the alignment measurement, an exposure operation of a step-and-scan method is performed. In the exposure operation, main controller 720 issues a command to stage control system 719 based on position information of reticle R by reticle interferometer 716 and position information of wafer W by wafer interferometer 831, and controls linear motor 100 of reticle stage 750. , 100 and the plane motor 870, the reticle R and the wafer W move synchronously, thereby performing a desired scanning exposure.

When the transfer of the reticle pattern to one shot area is completed, the table 8
18 is stepped by one shot area, and scanning exposure is performed on the next shot area. This stepping and scanning exposure are sequentially repeated, and the required number of shot patterns are transferred onto the wafer W. Here, in the reticle stage 750, the linear motor 1
Coil member 15 of coil unit (coil unit 150 or 250) of stators 110, 110 of 00, 100
Three-phase currents are appropriately supplied to 1a, 151b, 151c, and 151d, respectively, and the amount of movement is controlled. The reticle stage 750 of the exposure apparatus 700 has a high cooling efficiency of the linear motor 100 and can precisely control the movement amount.

The manufacture of a semiconductor device using the stage apparatus 600 or the exposure apparatus 700 according to the third and fourth embodiments of the present invention is generally carried out according to the procedures shown in FIGS. Will be That is, the semiconductor device has a step of designing the function and performance of the device, a step of manufacturing a reticle based on this design step, a step of manufacturing a wafer from a silicon material, and a step of forming a reticle pattern by the exposure apparatus of the above-described embodiment. It is manufactured through a step of transferring to a wafer, a step of assembling a device (including a dicing step, a bonding step, and a package step), an inspection step, and the like.

Hereinafter, the device manufacturing method will be described in more detail. FIG. 8 shows devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin film magnetic heads,
The flowchart of the example of manufacture of a micromachine etc. is shown. As shown in this figure, first, step 1
In 001 (design step), a function / performance design of a device (for example, a circuit design of a semiconductor device) is performed, and a pattern design for realizing the function is performed. Subsequently, in step 1002 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step 1003 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

Next, in step 1004 (wafer processing step), steps 1001 to 1003
Using the mask (reticle) and the wafer prepared in the above, an actual circuit or the like is formed on the wafer by lithography technology or the like as described later. Next, step 1005
In (Tevaise assembly step), step 1004
Is assembled by using the wafer processed in the above step. Step 1005 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.

Finally, in step 1006 (inspection step), inspections such as an operation confirmation test and a durability test of the device manufactured in step 1005 are performed. After these steps, the device is completed and shipped. FIG. 9 shows a detailed flow example of step 1004 in the case of a semiconductor device. FIG.
In step 1011 (oxidation step), the surface of the wafer is oxidized. Step 1012 (CV
In step D), an oxide insulating film is formed on the wafer surface. In step 1013 (electrode forming step), electrodes are formed on the wafer by vapor deposition. Step 1
In step 014 (ion implantation step), ions are implanted into the wafer.

The above steps 1011 to 101
Each of the components 4 constitutes a pre-processing step in each stage of the wafer processing, and is selected and executed according to a necessary process in each stage. In each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step 1015 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step 1016 (exposure step), the circuit pattern of the mask is transferred to the wafer by using the above-described exposure apparatus. Next, in step 1017 (development step), the exposed wafer is developed, and in step 1018 (etching step)
In, the exposed member other than the portion where the resist remains is removed by etching. Then, in step 1019 (resist removing step), unnecessary resist after etching is removed.

By repeating these pre-processing and post-processing steps, multiple circuit patterns are formed on the wafer. It should be noted that the linear motor 100 of the present invention is not limited to the exposure apparatus described in the embodiment, and is a scanning type exposure apparatus that exposes a pattern of a mask by synchronously moving a mask and a substrate. , No. 410).

A stage apparatus using the linear motor 100 of the present invention is a step-and-repeat type exposure apparatus that exposes a mask pattern while the mask and the substrate are stationary and sequentially moves the substrate in steps. Can be applied as a stage device. Further, the linear motor 100 of the present invention can also be applied as a driving device of a proximity exposure apparatus that exposes a mask pattern by bringing a mask and a substrate into close contact without using a projection optical system.

The exposure apparatus using the linear motor 100 of the present invention is not limited to an exposure apparatus for manufacturing semiconductors. For example, an exposure apparatus for exposing a liquid crystal display element pattern on a square glass plate can be used. The linear motor 100 of the present invention can be applied to an exposure apparatus and an exposure apparatus for manufacturing a thin-film magnetic head. The light source of the exposure apparatus according to the fourth embodiment includes g-line (436 nm) and i-line (365n).
m), KrF excimer laser (248 nm), ArF excimer laser (193 nm), F2 laser (157 n)
Not only m) but also charged particle beams such as X-rays and electron beams can be used. For example, when an electron beam is used, a thermionic emission type lanthanum hexaboride (L
aB6) and tantalum (Ta) can be used. Further, when an electron beam is used, a structure using a mask may be used, or a pattern may be formed directly on a substrate without using a mask.

In this case, when far ultraviolet rays such as an excimer laser are used as the projection optical system, a material that transmits the far ultraviolet rays such as quartz or fluorite is used as the glass material, and when F2 laser or X-ray is used, the reflection is used. An optical system of a refraction system or a refraction system (a reticle of a reflection type is used). When an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. In addition,
It goes without saying that the optical path through which the electron beam passes is in a vacuum state.

The magnification of the projection optical system of the exposure apparatus to which the linear motor of the present invention is applied as a driving means may be not only a reduction system but also an equal magnification and an enlargement system. When the linear motor 100 of the present invention is used for a wafer stage or a reticle stage, any of an air floating type using an air bearing and a magnetic floating type using Lorentz force or reactance force may be used.

The stage to which the linear motor of the present invention is applied is not limited to a type that moves along a guide, but may be a guideless type that does not require a guide. The reaction force generated by the movement of the wafer stage may be mechanically released to the floor (ground) by using a frame member by using the invention proposed in Japanese Patent Application Laid-Open No. 8-166475. It may be.

Regarding the reaction force generated by the movement of the reticle stage, the invention proposed in Japanese Patent Application Laid-Open No. 8-330224 is utilized, and a frame member is used to mechanically move the floor side (ground). You may make it escape to.
The exposure apparatus to which the linear motor according to the present invention described above is applied is designed to maintain various mechanical subsystems including the respective constituent elements recited in the claims with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. And manufactured by assembling.

In order to secure these various precisions, before and after this assembly, adjustments to achieve optical precision for various optical systems, adjustments to achieve mechanical precision for various mechanical systems, various Adjustments are made to the electrical system to achieve electrical accuracy. In addition, the process of assembling the exposure apparatus from the various subsystems includes mechanical connection, wiring connection of an electric circuit, and piping connection of a pneumatic circuit between the various subsystems.

It goes without saying that there is an assembling step for each subsystem before the assembling step from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured. It is desirable that the exposure apparatus be manufactured in a clean room in which the temperature, cleanliness, and the like are controlled.

[0064]

According to the coil unit of the first aspect described above, since the surface area of the cooling unit is increased due to the large number of irregularities of the cooling unit, the cooling efficiency is improved when the coil unit is exposed to a cooling medium. Will be able to
Further, according to the coil unit of the second aspect, since the cooling unit is constituted by a sheet member having a large number of irregularities, the surface area of the coil unit can be increased by a simple method.

According to the method of manufacturing a coil unit of the third aspect, the adhesive is applied to the coil, and the coil is sandwiched from both sides by a mold plate having a large number of irregularities and solidified to form a large number of irregularities. , And the surface area of the coil unit can be increased.
According to the armature unit of the fourth aspect, when the cooling medium flows through the flow path formed between the can and the coil unit, if the flow rate is the same, the surface area of the coil unit increases. The minute cooling efficiency is improved.

According to the linear motor of the fifth or sixth aspect, the armature unit of the fourth aspect is used as a stator or a movable element. The adjustment is easy, and the accuracy of the movement amount control of the linear motor can be improved. According to the stage device of the present invention, since a linear motor capable of reliably performing temperature adjustment is used as the moving means, a temperature control device such as a measuring device (for example, an interferometer) for detecting the stage position is used. The precision of the measurement of the equipment which needs to be increased, and the fine operation control of the stage device becomes possible.

According to the eighth aspect of the present invention, the object to be exposed by the exposure apparatus is moved by the stage device capable of finely controlling the operation. The accuracy is improved. According to the ninth aspect of the present invention, since the predetermined pattern of the semiconductor device is formed by the exposure apparatus, a fine pattern can be produced with high accuracy and its integration can be increased.

[Brief description of the drawings]

FIG. 1 shows a linear motor 10 according to a first embodiment of the present invention.
FIG.

FIG. 2 shows a linear motor 10 according to the first embodiment of the present invention.
0 is a sectional view.

FIG. 3 is a perspective view showing a coil unit 150 according to the first embodiment.

FIG. 4 is a perspective view illustrating a method for manufacturing the coil unit 150 according to the first embodiment.

FIG. 5 is a perspective view illustrating a method of manufacturing a coil unit 250 according to the second embodiment.

FIG. 6 is a perspective view showing a stage device 600 to which the linear motor 100 is applied.

FIG. 7 shows a linear motor 100 mounted on a reticle stage 750.
FIG. 3 is a diagram showing an overall configuration of an exposure apparatus 700 in which is used.

FIG. 8 is a diagram showing a semiconductor device manufacturing process using the exposure apparatus according to the present invention.

FIG. 9 is a diagram showing a more specific manufacturing process of a semiconductor device using the exposure apparatus according to the present invention.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 linear motor 110 stator (armature unit) 120 mover 150, 250 coil unit (armature coil unit) 151 coil 160 adhesive 160A, 160B cooling unit 161, 261 dimple (unevenness) 260A, 260B cooling sheet (sheet) Member) 600 Stage device 700 Exposure device 750 Reticle stage

Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat II (Reference) H02K 41/03 H01L 21/30 503A F-term (Reference) 5F046 CC01 CC02 CC03 CC18 5H609 BB08 PP02 PP09 QQ05 QQ11 RR26 RR32 RR35 RR41 RR51 RR63 5H615 AA01 BB07 PP01 PP02 SS13 SS18 SS24 SS44 TT26 5H641 BB06 BB18 BB19 GG02 GG03 GG05 GG07 GG11 GG12 GG26 GG29 HH02 HH03 HH04 HH06 JA06 JB03 JB04 JB05 JB10

Claims (9)

[Claims] 1. A coil unit for an armature, wherein a cooling unit having a large number of irregularities is provided on a surface of a coil. 2. The coil unit for an armature according to claim 1, wherein the cooling unit comprises a sheet member having a large number of irregularities. 3. The method for manufacturing an armature coil unit according to claim 1, wherein: a step of applying an adhesive to the coil; and forming the coil coated with the adhesive with a plurality of irregularities. A step of sandwiching the adhesive with the mold plate from both sides to solidify the adhesive. 4. The armature coil unit according to claim 1 or 2, further comprising a can for accommodating the armature coil unit therein, and between the can and the armature coil unit. An armature unit, wherein a flow path for circulating a cooling medium is formed in the armature unit. 5. A linear motor, comprising: a stator comprising the armature unit according to claim 4; and a mover comprising a yoke and a magnet. 6. A linear motor, comprising: a mover comprising the armature unit according to claim 4; and a stator comprising a yoke and a magnet. 7. A stage device, wherein the linear motor according to claim 5 is used as driving means for a stage unit. 8. An exposure apparatus for forming a predetermined pattern on a substrate using an exposure optical system, comprising the stage apparatus according to claim 7. 9. A method for manufacturing a device having a predetermined pattern formed thereon, comprising the step of using the exposure apparatus according to claim 8 to transfer a circuit pattern of a reticle to a wafer coated with a photosensitive agent. Characteristic device manufacturing method.