JP2002269712A - Magnetic head suspension and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic head suspension by which floating characteristic of a magnetic head can be stabilized by satisfactorily reducing the rigidity of a FPC and which can be easily produced, and to provide a manufacturing method therefor. SOLUTION: The magnetic head suspension is formed by joining the FPC having at least an insulating base film and a wiring conductive body disposed on the base film to a suspension base body having a load beam and a flexure joined to each other along a longitudinal direction. The FPC is joined to the disk facing the surface side of the suspension base body and has an aerial wiring part consisting of only the wiring conductive body on at least a part thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head suspension used for a hard disk drive (HDD), and more particularly, to a magnetic head suspension constituting a magnetic head wiring.
The present invention relates to a magnetic head suspension in which PCs (Flexible Printed Circuits) are adhered to a suspension base.

[0002]

2. Description of the Related Art Wires have conventionally been used as magnetic head wiring for connecting a magnetic head supported by a magnetic head suspension to a preamplifier substrate. However, with the miniaturization of the magnetic head, the rigidity of the wire has been an obstacle to stabilization of the flying characteristics of the magnetic head. Body wiring,
An FPC bonded to a suspension base is used.

[0003] The integrated wiring has a PI (polyimide) film insulating layer integrally laminated on the suspension base, and a conductor layer laminated on the PI insulating layer. On the other hand, the FPC has a base film made of a PI film and a conductor layer laminated on the base film, and the base film is bonded to a suspension base.

Incidentally, the PI base film in the FPC generally has a thickness of 25 to 50 μm, and is 3 to 5 times as thick as the PI film layer in the integrated wiring. Therefore, in order to stabilize the flying characteristics of the magnetic head, it is necessary to reduce the rigidity of the FPC itself having the thick PI base film.

To meet such a demand, Japanese Patent Application Laid-Open No. 52-12815
No. 4,616,279, an FPC is adhered to a back surface (hereinafter referred to as a back surface) of a suspension base opposite to a disk facing surface, and only a wiring conductor is provided at a position near the magnetic head in the FPC. A magnetic head suspension having an aerial wiring portion is disclosed.

[0006]

However, in the magnetic head suspensions described in the above-mentioned publications and U.S. Patents, after the FPC is bonded to the lower surface of the suspension base, the head-side terminal of the FPC is placed on the magnetic head side. Since it is necessary to bend, there is a problem that the rigidity of the FPC cannot be sufficiently reduced and the assembly process from the FPC bonding process to the magnetic head bonding process becomes complicated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a magnetic head suspension which can be manufactured easily and which can sufficiently reduce the rigidity of the FPC to stabilize the flying characteristics of the magnetic head. One purpose is to provide.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a suspension base having a load beam and a flexure joined in a longitudinal direction, at least an insulating base film and a suspension base on the base film. A magnetic head suspension including an FPC having a wiring conductor disposed thereon, wherein the FPC is bonded to a disk-facing surface of the suspension base, and the FPC is at least partially connected to the FPC. Provided is a magnetic head suspension having an aerial wiring portion composed of only a wiring conductor.

Preferably, the aerial wiring portion is disposed so as to intersect a central axis in a width direction of the suspension base passing through a dimple formed in the load beam. Further, the FPC may be symmetrical with respect to a longitudinal central axis of the suspension base in a region including the aerial wiring portion. More preferably, the FPC has a hole formed in a portion of the base film that is not bonded to the suspension base.

[0010] Further, the present invention provides
F having at least an insulating base film on a suspension base and wiring conductors disposed on the base film
A method of manufacturing a magnetic head suspension, wherein a PC is joined, and said FPC has an aerial wiring portion at least partially including only said wiring conductor, wherein said polyimide film constituting said insulating base film A first step of preparing a polyimide film having an adhesive layer provided on one surface side, and a magnetic head side region and a preamplifier side region separated from each other by a gap for forming the aerial wiring portion And, having a connection portion connecting the two regions in the width direction outside of the gap,
A second step of forming the polyimide film, a third step of joining a conductor layer constituting the wiring conductor to the entire surface of the adhesive layer, and a step of leaving a region of the conductor layer to be left as a wiring conductor. A fourth step of forming a resist pattern, a fifth step of forming an etching protection layer on the other surface side of the polyimide film, and etching the conductor layer using the resist pattern and the etching protection layer as a mask to form a wiring conductor. A sixth step of forming the same; a seventh step of removing the resist pattern and the etching protection layer; an eighth step of joining the other surface of the polyimide film to a disk-facing surface of the suspension base; And a ninth step of cutting a connection portion of the film.

Preferably, after the sixth step, a step of forming a cover coat layer surrounding a desired portion of the wiring conductor can be further provided. Preferably, a step of plating the exposed surface of the wiring conductor after the seventh step can be further provided.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a preferred embodiment of a magnetic head suspension according to the present invention will be described with reference to the accompanying drawings. 1 and 2
3A and 3B are a top view and a bottom view, respectively, of the magnetic head suspension 1 according to the present embodiment. FIG. 3 is an enlarged top view of the suspension base portion of the magnetic head suspension 1, and FIGS. 4 and 5 are a top view and a bottom view of the FPC alone in the magnetic head suspension 1, respectively. 6 and 7 show the suspension base 10 of the magnetic head suspension.
3A and 3B are a top view and a bottom view. The upper surface and the lower surface mean a magnetic disk suspension surface and a back surface opposite to the disk surface in the magnetic head suspension, respectively.

The magnetic head suspension 1 includes a suspension base 10 and an FPC 50 bonded to the surface of the suspension base facing the magnetic disk.
The suspension base 10 includes a base plate 20 having a base end fixed to an arm (not shown), a load beam 30 connected to the base plate 20 in the longitudinal direction, and a load beam 30 connected to the load beam 30 in the longitudinal direction. And a flexure 40 to be connected.

The base plate 20 and the load beam 3
0 and the flexure 40 each have a thickness of, for example, 0.2
mm ~ 0.3mm, thickness 30μm ~ 70μm and thickness 20μm ~ 3
It is formed using 0 μm stainless steel.
The three members 30, 40, 50 are preferably joined by welding.

The base plate 20 is formed with a cylindrical boss 21 protruding on the back side. The boss 21
Is provided for connection with the arm (not shown). That is, while the boss 21 is inserted into a boss hole formed in the arm (not shown), a ball having a diameter slightly larger than the inner diameter of the through hole is inserted into the through hole 22 in the boss 21. Thereby, the base plate 20 is caulked and fixed to the arm.

The load beam 30 has a load bending portion 31 formed on the base end side and a dimple 32 formed on the tip end side. The load bending portion 31 generates a load for pressing the magnetic head supported by the tip portion of the flexure 40 toward the magnetic disk. In the present embodiment, the load beam tip portion has a magnetic force. Bending process is performed in the direction approaching the disk. The dimple 32 is formed on the magnetic disk facing surface on the load beam tip side. The dimple 3
2 is a magnetic head mounting portion 42 of a flexure 40 described later.
The load generated at the load bending portion 31 of the load beam 30 can be effectively applied to the magnetic head. In the drawings, reference numeral 33 denotes a flange bending portion provided as necessary to increase the rigidity of the load beam.

The flexure 40 connects a base end 41 joined to the load beam 30, a magnetic head mounting part 42 for supporting the magnetic head, and connects the base end 41 and the magnetic head mounting part 42. And a connecting portion 43.

The flexure 40 is provided in the width direction (lateral direction) of the magnetic head mounting portion 42 to stably support the magnetic head.
It is desired that the rigidity of the magnetic head mounting portion 42 be reduced in the pitch direction and the roll direction while maintaining high rigidity and improving the followability of the magnetic head against the undulation of the magnetic disk.

For this reason, in this embodiment, as shown in FIGS. 6 and 7, the connecting portion 43 is connected to the base end portion 4.
A pair of arm portions 43 extending forward from both end portions in the width direction.
a bridge portion 43b connecting the distal ends of the pair of arm portions; and a support portion 43 extending rearward from a substantially central portion of the bridge portion 43b and connected to the magnetic head mounting portion 42.
c.

As described above, the dimples 32 of the load beam 30 are in contact with the back surface of the magnetic head mounting portion 42 of the flexure 40. Therefore, the magnetic head is in contact with the dimple 32 and the magnetic head mounting portion 42. It swings in the pitch direction and the roll direction around the contact point.

The FPC 50 includes a base film 51
And a wiring conductor 52 laminated on the base film 51.
And a cover coat 53 surrounding the wiring conductor. Each of the base film 51, the wiring conductor 52, and the cover coat 53 has a thickness of, for example, 25 μm to 50 μm.
It is formed of an electrolytic copper foil or a rolled copper foil having a thickness of 12 μm to 18 μm and a resin having a thickness of 5 μm to 30 μm. The reference numeral 51c in FIG. 4 and FIG.
1 is an opening for grounding the magnetic head.

The cover coat 53 is provided at a desired position to protect the wiring conductor 52. In the present embodiment, the cover coat 53 is formed only on the base end side in the longitudinal direction of the FPC 50 (see FIGS. 1 and 4).

The wiring conductor 52 preferably has a minimum width / minimum interval of 25 μm / 25 μm to 50 μm / 50 μm, and more preferably, Ni / Au (1 μm / 1 μm)
m) Plating is applied. The base film 51
An adhesive layer having a thickness of about 10 μm to 20 μm may be interposed between the wiring conductor 52 and the wiring conductor 52. The wiring conductor 52
Are exposed to the outside at least at the distal end and the proximal end, and form a head-side terminal 52a and a preamplifier substrate-side terminal 52b, respectively. In the present embodiment, no cover coat is formed on the distal end side of the wiring conductor 52, and therefore, the head-side terminal 52a of the wiring conductor 52 is not provided.
Is exposed to the outside. On the other hand, the preamplifier substrate side terminal 52b of the wiring conductor 52 is exposed to the outside via an opening 51a formed on the base end side of the base film 51.

In the FPC 50 having such a structure, the base film 51 is adhered to the surface of the suspension base 10 facing the magnetic head using an adhesive. FIG. 8 is a top view showing an adhesion region between the FPC 50 and the suspension base 10. In the present embodiment, as shown in FIG. 8, the load beam 30 is located at the center in the width direction, and has a main body 30a in which the load bending portion 31 and the dimple 32 are formed. And an FPC support plate 30b protruding outward in the width direction from the FPC.
The FPC 50 is adhered to the surface of the support plate 30b facing the magnetic head. In FIG. 8, the bonding area is indicated by a chain line. Reference numeral 100 in FIG. 8 denotes a magnetic head. The positioning of the FPC 50 with respect to the suspension base 10 is performed by positioning holes 50a, 10a formed in the FPC 50 and the suspension base 10, respectively.
a.

The head-side terminals 52a are connected to corresponding terminals of the magnetic head by Au bolding or the like. On the other hand, the preamplifier substrate side terminal 52b is connected to a corresponding terminal of the preamplifier substrate fixed to the arm by soldering or ultrasonic bonding. That is, a preamplifier IC board for amplifying a signal from a read element of a magnetic head and / or supplying a signal to a write element is fixed to the base of the arm. Are connected to the corresponding terminals.

As shown in FIG. 4 and FIG.
Prior to commercialization, the PC 50 has an inspection pad portion 55 and a shunting tab portion 56 in order from the base end side of the preamplifier substrate side terminal 52b.

In the shunting tab 56 located closest to the base end, four wiring conductors are short-circuited to each other, and when the magnetic head and the FPC are connected, the read element and the write element of the magnetic head are connected. The reading element (in particular, a reading element such as an MR element or a GMR element) is prevented from being electrostatically damaged. The shunting tab 56 is cut after the adhesion of the magnetic head and the connection between the terminal of the magnetic head and the head-side terminal 52a of the FPC 50 are completed.

The inspection pad portion 55 located between the shunting tab portion 56 and the preamplifier substrate side terminal 52b is exposed to the outside through an opening 51b formed in the base film 51. After the shunting tab portion 56 is cut, a probe is brought into contact with the inspection pad 55 portion, and an electrical characteristic test of the magnetic head is performed. After such an inspection, the inspection pad portion 55 is also cut off, and then the preamplifier substrate side terminal 52b of the FPC is
And the preamplifier substrate are connected.

As shown in FIG. 1 to FIG.
Further has an aerial wiring portion 54 composed of only the wiring conductor 52 in a region not supported by the suspension base 10, thereby reducing the pitch direction rigidity and the roll direction rigidity of the FPC 50.

In particular, in the present embodiment, as described above, since the FPC 50 is located on the disk-facing surface side of the suspension base 10, when connecting the head-side terminal 52a of the FPC 50 to the magnetic head, the aerial wiring is used. Without bending the portion 54, the pitch direction rigidity and the roll direction rigidity of the aerial wiring portion 54 can be reduced,
Thereby, the flying characteristics of the magnetic head can be stabilized.

More preferably, as shown in FIGS. 1 to 3, the aerial wiring portion 54 is formed by a width axis orthogonal to a longitudinal axis of the flexure base 10 and the dimple 32.
On the widthwise central axis Y passing through the FPC 5 so that the FPC 5
The effect of the rigidity of 0 can be further reduced.

That is, as described above, the magnetic head operates (oscillates) about the dimple 32 in the pitch direction and the roll direction. In other words, the magnetic head operates in the pitch direction with the central axis Y in the width direction as the central axis, and performs the roll direction operation with the central axis in the longitudinal direction X of the flexure base 10 passing through the dimple 32 as the central axis.

Therefore, as described above, by positioning the aerial wiring portion 54 on the central axis Y in the width direction,
The adverse effect of the FPC rigidity on the pitch operation of the magnetic head can be further reduced.

Further, in the present embodiment, the FPC
Since there is no need to bend the FPC 50, the FPC 50 can be bonded to the suspension base 10, and then the magnetic head can be bonded as it is, and terminal bonding between the magnetic head and the FPC 50 can be performed. Therefore, it can be manufactured very easily.

Embodiment 2 Hereinafter, other embodiments of the magnetic head suspension according to the present invention will be described with reference to the accompanying drawings. 9 and 10 show a magnetic head suspension 1 ′ according to the present embodiment, respectively.
3A and 3B are a top view and a bottom view, respectively. FIG. 11 is an enlarged top view near the suspension base of the magnetic head suspension 1 ', and FIGS. 12 and 13 are a top view and a bottom view of the FPC 50' alone in the magnetic head suspension 1 '. Further, FIG.
FIG. 4 is a top view showing an adhesion region between the suspension base 50 and 50 ′. In the present embodiment, the same or corresponding members as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In this embodiment, the FPC 50 '
Are symmetrical with respect to a longitudinal center line X of the suspension base 10 in a region including the aerial wiring portion 54. Specifically, FPC5 in the present embodiment
0 ′ is the FPC support plate 30 of the load beam 30 on the base end side.
b, and is located on the lateral side of the suspension base 10 in the width direction, and the tip side is the main body 30 of the load beam 30.
a and is located at the center in the width direction of the suspension base 10.

Of the base film 51 ', the FPC
The portion located on the distal end side of 50 ′ is a base portion 51A ′ located at the center in the width direction of the suspension base 10, a pair of arm portions 51B ′ extending forward from both side edges of the base portion 51A ′, And a separation portion 51C ′ separated from the arm portion 51B ′.
B ′ is configured symmetrically with respect to the longitudinal center line X of the suspension base 10.

Further, of the wiring conductor 52 ', the FPC 5
The portion located on the tip side of 0 ′ is the suspension base 1
Two paths 5 symmetrical to each other with respect to the longitudinal centerline X of 0
It is branched into 2A 'and 52B'. That is, the wiring conductor 52A 'of one path passes on one side edge in the width direction of the base portion 51A' and on one arm portion 51B ', passes through the aerial wiring portion 54, and is on the separation portion 51C'. It is located at. Then, the wiring conductor 52B 'of the other system path
Passes over the other side edge in the width direction of the base portion 51A ′ and the other arm portion 51B ′, passes through the aerial wiring portion 54,
It is located on the separating portion 51C '.

In the magnetic head suspension 1 'having such a structure, the following effects can be obtained in addition to the effects of the first embodiment. That is, in the present embodiment, the FPC 50 ′ is configured to be symmetric with respect to the longitudinal center line X of the suspension base 10 in the region including the aerial wiring portion 54. It can be equal on both sides in the direction. Therefore, the operation of the magnetic head in the roll direction can be made uniform on both sides in the roll direction.

Further, preferably, a hole H can be formed in a portion of the base film 51 ′ that is not bonded to the suspension base 10.
The stiffness caused by the base film 51 'can be further reduced, and the flying characteristics of the magnetic head can be further stabilized. In the present embodiment, holes are formed in the pair of arm portions 51B 'of the base film 51'.

In this embodiment, the FPC 5
Since the front end side of 0 ′ is located on the main body 30a of the load beam 30, the disk facing area of the entire suspension including the FPC can be reduced.
It is possible to reduce the vibration of the suspension due to the airflow caused by the rotation of the disk in the DD.

Hereinafter, a method of manufacturing a magnetic head suspension according to the present invention will be described using a magnetic head suspension 1 'according to the second embodiment. The magnetic head suspension can be manufactured using TAB (Tape Automated Bonding) technology.

That is, first, a tape-shaped polyimide film having an adhesive layer provided on one surface is subjected to press punching to obtain a predetermined shape. The polyimide film is F
The base film 51 'is formed in the PC 50'. The predetermined shape includes an outer shape of the base film 51 ', a gap h2 for forming the aerial wiring portion 54, an opening 50a for positioning, and an opening for reducing rigidity. h1 is included.

However, at the time of the punching process, as shown in FIGS. 15 and 16, a region of the base film 51 'located on the magnetic head side with the gap h2 for forming the aerial wiring interposed between the base film 51' and the preamplifier substrate. Punching is performed so as to leave a connection portion 58 connecting the region located on the side with the region located outward in the width direction from the gap h2. Preferably, a plurality of FPCs 50 'are formed on one tape-like polyimide film. The plurality of FPCs
50 'are connected to each other by a bridge portion (not shown).

Next, a copper foil is thermocompression-bonded to the entire surface of the adhesive layer provided on one side of the polyimide film. After this,
A photosensitive resist is applied on the copper foil, and only a region corresponding to the wiring conductor is exposed, and then developed to form a resist pattern.

Then, a protective layer made of a resist or a resin film is formed on the entire other surface of the polyimide film. In the protective layer, in a subsequent etching step, an etching solution enters through an opening such as a space for aerial wiring or a positioning opening formed in the polyimide film, and a necessary portion of the copper foil to be left as a wiring conductor is formed. This is for preventing etching removal.

After the formation of the protective layer, unnecessary portions of the copper foil are removed by etching using the resist pattern as a mask. Thereafter, a cover coat 53 made of a solder resist is formed at a desired position of the wiring conductor. Preferably, the cover coat 53 is formed of the FPC 50 ′.
It can be formed in a region not supported by the FPC support plate. The cover coat 53 can be formed by, for example, screen printing.

After removing the resist pattern and the protective layer, the exposed surface of the wiring conductor is plated with Ni / Au. Thereafter, by cutting the connecting portion, a plurality of FPC intermediates formed on the tape-like polyimide film are individually cut out. Note that the FPC intermediate has the above-described connecting portion 58 (see FIGS. A and B).

Next, the cut out FPC intermediate body is bonded to the disk-facing surface of the suspension base 10.
For such bonding, for example, an epoxy adhesive or an acrylic adhesive can be used.

The above-mentioned FPC intermediate is used as a suspension base 1
After bonding to the connecting portion 5 of the base film 51 ',
8 is cut along the cutting line L to form an aerial wiring portion 54 including only the wiring conductor 52 '(see FIG. 17). This cutting can be performed using a mold or a laser beam.

According to such a manufacturing method, the FPC can be easily manufactured by using the TAB technique, and when the FPC is bonded to the suspension base, the FPC has a connection portion. It is possible to effectively prevent the air wiring portion from being deformed and / or damaged in the bonding step with the air wiring portion.

[0052]

According to the magnetic head suspension of the present invention, the FPC is joined to the disk-facing surface of the suspension base, and at least a portion of the FPC is provided with an aerial wiring portion consisting of only a wiring conductor. The rigidity of the FPC can be sufficiently reduced, and the manufacturing efficiency can be improved.

Further, according to the method of manufacturing a magnetic head suspension according to the present invention, a magnetic head comprising an FPC having at least a portion of an aerial wiring portion consisting of only a wiring conductor is joined to a disk-facing surface of a suspension base. The suspension can be manufactured with high yield.

[Brief description of the drawings]

FIG. 1 is a top view of one embodiment of a magnetic head suspension according to the present invention.

FIG. 2 is a bottom view of the magnetic head suspension shown in FIG. 1;

FIG. 3 is an enlarged top view of a suspension base part in the magnetic head suspension shown in FIG. 1;

FIG. 4 is a top view of a single FPC in the magnetic head suspension shown in FIGS. 1 to 3;

FIG. 5 is a bottom view of the FPC shown in FIG. 4 alone.

FIG. 6 is a top view of a suspension base in the magnetic head suspension shown in FIGS. 1 to 3;

FIG. 7 is a bottom view of the suspension base shown in FIG. 6;

FIG. 8 is a top view showing a joint region between the FPC and the suspension base in the magnetic head suspension shown in FIGS. 1 to 3;

FIG. 9 is a top view of another embodiment of the magnetic head suspension according to the present invention.

FIG. 10 is a bottom view of the magnetic head suspension shown in FIG. 9;

FIG. 11 is an enlarged top view of the vicinity of a suspension base of the magnetic head suspension shown in FIG. 9;

FIG. 12 is a top view of the FPC alone in the magnetic head suspension shown in FIGS. 9 to 11;

FIG. 13 is a bottom view of the FPC shown in FIG. 12 alone.

FIG. 14 is a top view showing a joint region between an FPC and a suspension base in the magnetic head suspension shown in FIGS. 9 to 11;

FIG. 15 is a top view showing the FPC manufacturing process of the magnetic head suspension shown in FIGS. 9 to 11.

FIG. 16 is a bottom view showing the FPC manufacturing process of the magnetic head suspension shown in FIGS. 9 to 11;

FIG. 17 is an enlarged top view of the vicinity of the aerial wiring portion of the FPC shown in FIGS. 15 and 16;

[Explanation of symbols]

 1, 1 'Magnetic head suspension 10 Suspension base 30 Load beam 32 Dimple 40 Flexure 50 FPC 51, 51' Base film 52, 52 'Wiring conductor 54 Aerial wiring part X Suspension base longitudinal center axis Y Suspension base width direction center axis h1 hole

Claims (7)

[Claims] 1. A magnetic head in which an FPC having at least an insulating base film and a wiring conductor disposed on the base film is joined to a suspension base having a load beam and a flexure joined in a longitudinal direction. A suspension, wherein the FPC is bonded to a disk-facing surface side of the suspension base, and the FPC has at least a part of an aerial wiring portion including only the wiring conductor. And magnetic head suspension. 2. The magnetic head suspension according to claim 1, wherein the aerial wiring section is disposed so as to intersect a central axis in a width direction passing through a dimple formed in the load beam. 3. The magnetic head suspension according to claim 1, wherein the FPC is symmetric with respect to a central axis in a longitudinal direction of the suspension base in a region including the aerial wiring portion. . 4. The magnetic device according to claim 1, wherein the FPC has a hole formed in a portion of the base film that is not bonded to the suspension base. Head suspension. 5. An FPC having at least an insulating base film and a wiring conductor disposed on the base film is joined to a suspension base, and the FPC is connected to the suspension base.
Is a method of manufacturing a magnetic head suspension having an aerial wiring portion composed of only the wiring conductor at least partially, wherein the polyimide film constituting the insulating base film, and an adhesive layer on one surface side A first step of preparing a polyimide film provided with: a magnetic head side region and a preamplifier side region separated from each other by a gap for forming the aerial wiring portion; A second step of molding the polyimide film so as to have a connection portion connecting the two regions; a third step of joining a conductor layer constituting the wiring conductor to the entire surface of the adhesive layer; A fourth step of forming a resist pattern on a region of the conductor layer to be left as a wiring conductor, and etching the other side of the polyimide film with an etchant. A fifth step of forming a protection layer, a sixth step of etching the conductor layer using the resist pattern and the etching protection layer as a mask to form a wiring conductor, and a sixth step of removing the resist pattern and the etching protection layer. 7, a eighth step of joining the other surface of the polyimide film to a disk-facing surface of the suspension base, and a ninth step of cutting a connection portion of the polyimide film. Of manufacturing a magnetic head suspension. 6. A step of forming a cover coat layer surrounding a desired portion of the wiring conductor after the sixth step,
The method for manufacturing a magnetic head suspension according to claim 5, further comprising: 7. The method of manufacturing a magnetic head suspension according to claim 5, further comprising, after the seventh step, plating an exposed surface of the wiring conductor.