JP2003151114A - Head support mechanism body and magnetic disk device - Google Patents
Head support mechanism body and magnetic disk deviceInfo
- Publication number
- JP2003151114A JP2003151114A JP2001344019A JP2001344019A JP2003151114A JP 2003151114 A JP2003151114 A JP 2003151114A JP 2001344019 A JP2001344019 A JP 2001344019A JP 2001344019 A JP2001344019 A JP 2001344019A JP 2003151114 A JP2003151114 A JP 2003151114A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- metal body
- film wiring
- flexure
- support mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はコンピュータの外部
記憶装置に用いられるヘッド支持機構体及びこのヘッド
支持機構体を用いた磁気ディスク装置に関わる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a head supporting mechanism used for an external storage device of a computer and a magnetic disk device using the head supporting mechanism.
【０００２】[0002]
【従来の技術】ヘッド支持機構体において、金属体であ
るロードビームとロードビームと一体となったジンバル
上に、フォトリソグラフィ技術により絶縁層を、メッキ
等により薄膜配線パターンを形成する方法が特開平6-21
5513号公報に記載されている。また特開2001-256627号
公報には薄膜配線パターンとグランドとの間の寄生容量
を低減するために、フレクシャの薄膜配線パターン下方
の金属体及びロードビームの一部を除去したヘッド支持
機構体が記載されている。2. Description of the Related Art In a head support mechanism, a method of forming an insulating layer by a photolithography technique and a thin film wiring pattern by plating etc. on a load beam which is a metal body and a gimbal integrated with the load beam is disclosed. 6-21
It is described in Japanese Patent No. 5513. Further, JP-A-2001-256627 discloses a head support mechanism body in which a metal body under a thin film wiring pattern of a flexure and a part of a load beam are removed in order to reduce a parasitic capacitance between a thin film wiring pattern and a ground. Have been described.
【０００３】[0003]
【発明が解決しようとする課題】磁気ディスク装置の大
容量高速転送化を実現するためには、ヘッド支持機構体
のフレクシャ上に形成された読み書き用の２対の配線薄
膜パターン間を十分に分離する必要があるが、それに伴
い金属体の幅も広がるため全体的に曲げ剛性が高くなる
傾向にある。しかし部分的にフレクシャの曲げ剛性を低
く抑えなければ、ヘッド支持機構体本来の機能に支障を
きたす場合がある。In order to realize high-capacity and high-speed transfer of a magnetic disk device, two pairs of read / write wiring thin film patterns formed on the flexure of the head support mechanism are sufficiently separated. However, since the width of the metal body also increases, the bending rigidity tends to increase as a whole. However, unless the flexural rigidity of the flexure is suppressed to be low, the original function of the head support mechanism may be impaired.
【０００４】以下、その例について説明を行う。図５
（ａ）は、中継ＦＰＣ(Relay Flexible Printed Circui
ts)を用いてヘッド支持機構体のフレクシャとプリアン
プを搭載したメインＦＰＣとを電気的に接続する場合の
ＨＳＡ(Head Stack Assembly)の部分拡大平面図であ
る。図５（ｂ）はフレクシャ１２のＢ−Ｂ断面図を、図
５（ｃ）はフレクシャ１２のＣ−Ｃ断面図を示す。図５
（ｂ）及び（ｃ）に示す様に従来例では、金属体１１が
２対の薄膜配線パターン９の側方に並進して２本形成す
る様に薄膜配線パターン９下部をエッチングで穴状に除
去する。An example will be described below. Figure 5
(A) is a relay FPC (Relay Flexible Printed Circui
FIG. 7 is a partially enlarged plan view of an HSA (Head Stack Assembly) when electrically connecting the flexure of the head support mechanism and the main FPC equipped with a preamplifier by using (ts). 5B is a sectional view taken along the line BB of the flexure 12, and FIG. 5C is a sectional view taken along the line CC of the flexure 12. Figure 5
As shown in (b) and (c), in the conventional example, the lower portion of the thin film wiring pattern 9 is formed into a hole shape by etching so that two metal bodies 11 are translated laterally to form two thin film wiring patterns 9. Remove.
【０００５】一般的に中継ＦＰＣはキャリッジアーム３
に沿って取り付けられるため、フレクシャ１２を、ヒン
ジ１４またはロードビーム１３に形成された荷重曲げ部
１４ａの前、または後からベースプレート８の側方に引
き出し、段差加工されたヒンジ１４にレーザ溶接等によ
って固定する。ヒンジ１４に段差加工する理由は、フレ
クシャ１２の端子に接合された中継ＦＰＣ５と磁気記録
媒体７が接触しないよう十分な隙間を確保するためであ
る。Generally, a relay FPC has a carriage arm 3
Since the flexure 12 is attached along the base plate 8, the flexure 12 is pulled out to the side of the base plate 8 from before or after the load bending portion 14a formed on the hinge 14 or the load beam 13 and is laser-welded to the stepped hinge 14 by laser welding or the like. Fix it. The reason for forming the step on the hinge 14 is to secure a sufficient gap so that the relay FPC 5 joined to the terminal of the flexure 12 and the magnetic recording medium 7 do not come into contact with each other.
【０００６】しかしながらフレクシャ１２の引回し部と
ヒンジ１４とをレーザ溶接する工程において、このフレ
クシャ１２の引回し部１２ａの曲げ剛性が高いと密着力
が弱くなって溶接の接合強度が低下したり、薄膜配線パ
ターン９や絶縁層１０に大きな応力やひずみが生じて、
その結果、クラックの発生により破断する要因となる。
また引回し部１２ａの張力によって、ヘッド支持機構体
１に微小なねじれが生じてヘッド支持機構体１の振動特
性が悪化し、磁気記録媒体７の所定トラック上に磁気ヘ
ッドスライダ６を高速位置決めする際の障害となる場合
がある。However, in the process of laser welding the lead-out portion of the flexure 12 and the hinge 14, if the lead portion 12a of the flexure 12 has a high bending rigidity, the adhesion is weakened and the welding joint strength is lowered. Large stress or strain is generated in the thin film wiring pattern 9 or the insulating layer 10,
As a result, it becomes a factor of fracture due to occurrence of cracks.
Further, the tension of the lead-out portion 12a causes a slight twist in the head support mechanism 1 to deteriorate the vibration characteristics of the head support mechanism 1, and positions the magnetic head slider 6 on a predetermined track of the magnetic recording medium 7 at high speed. It may become an obstacle.
【０００７】逆に曲げ剛性低すぎると、磁気記録媒体７
の回転よって生ずる空気流によって引回し部１２ａが加
振されて振動の要因となる。On the contrary, if the bending rigidity is too low, the magnetic recording medium 7
The routing portion 12a is vibrated by the air flow generated by the rotation of the, and causes a vibration.
【０００８】また、磁気ヘッドスライダ６に所定荷重を
負加するヒンジ荷重曲げ部１４ａ間のフレクシャ１２の
剛性が高いと荷重ばらつきの要因となり、その結果、磁
気記録媒体７上に微小隙間を保って浮上する磁気ヘッド
スライダ６の読み書き特性に支障を来たす場合がある。Further, if the flexure 12 between the hinge load bending portions 14a for applying a predetermined load to the magnetic head slider 6 has a high rigidity, it causes a load variation, and as a result, a minute gap is maintained on the magnetic recording medium 7. In some cases, the read / write characteristics of the flying magnetic head slider 6 may be affected.
【０００９】[0009]
【課題を解決するための手段】本発明はこの問題点を解
決するために、ヘッドスライダの端子部に電気的に信号
を接続して読み書きを行うための２対の薄膜配線パター
ンと、その薄膜配線パターンの下部に絶縁層を介して金
属体がある構造のフレクシャを備えたヘッド支持機構体
において、前記フレクシャの少なくとも一ヶ所に、前記
金属体を前記２対の薄膜配線パターン間に並進して設け
たものである。In order to solve this problem, the present invention solves this problem by providing two pairs of thin film wiring patterns for electrically connecting and reading signals to and from the terminals of the head slider, and the thin films thereof. In a head support mechanism including a flexure having a structure in which a metal body is provided below a wiring pattern via an insulating layer, the metal body is translated between the two pairs of thin film wiring patterns at at least one position of the flexure. It is provided.
【００１０】これにより、薄膜配線パターン間に設けた
金属体の幅を所望の曲げ剛性になるように設定すること
により、柔軟性を持たせることで組立性向上を図ると共
に耐振動性との両立を図ることができる。Thus, by setting the width of the metal body provided between the thin film wiring patterns so as to have a desired bending rigidity, it is possible to improve flexibility in assembling and to improve the vibration resistance. Can be achieved.
【００１１】また２対の薄膜配線パターン間に並進する
金属体と、更に前記２対の薄膜配線パターン間に並進す
る金属体と交差し、かつ２対の薄膜配線パターン下を通
る金属体で構成することにより、ヘッド支持構造体の超
音波洗浄工程でキャビテーションによって生ずる可能性
の有る薄膜配線パターンや絶縁層のクラックを防止する
ことができる。Further, it is composed of a metal body that translates between two pairs of thin film wiring patterns, and a metal body that intersects the metal body that translates between the two pairs of thin film wiring patterns and that passes under the two pairs of thin film wiring patterns. By doing so, it is possible to prevent cracks in the thin film wiring pattern or the insulating layer that may occur due to cavitation in the ultrasonic cleaning process of the head support structure.
【００１２】[0012]
【発明の実施の形態】本発明の実施例を図面を用いて説
明する。Embodiments of the present invention will be described with reference to the drawings.
【００１３】図１は本発明のヘッド支持機構体１を搭載
した磁気ディスク装置の斜視図を示す。ヘッド支持機構
体１の根元は、ヘッド支持機構体１を位置決め駆動する
モータ２にキャリッジ３を介して固定されている。そし
てヘッド支持機構体１の端子部(図示せず)には、ヘッド
支持機構体１とプリアンプ(図示せず)を搭載したメイン
ＦＰＣ４とを電気的に接続する中継ＦＰＣ５が半田等で
接合されている。一方、ヘッド支持機構体１の先端側に
は磁気情報を記録・再生する磁気ヘッドスライダ６が設
けられており、回転する磁気記録媒体７上に微小隙間を
保って浮上する。ここで、このヘッド支持機構体１と磁
気ヘッドスライダ６を総称してヘッド組立体といい、ま
たヘッド組立体、キャリッジ３、メインＦＰＣ４、中継
ＦＰＣ５を総称してＨＳＡ(Head Stack Assembly)とい
う。FIG. 1 is a perspective view of a magnetic disk device equipped with a head support mechanism 1 of the present invention. The root of the head support mechanism 1 is fixed to a motor 2 for positioning and driving the head support mechanism 1 via a carriage 3. A relay FPC 5 for electrically connecting the head support mechanism 1 and the main FPC 4 having a preamplifier (not shown) is joined to the terminal portion (not shown) of the head support mechanism 1 by soldering or the like. There is. On the other hand, a magnetic head slider 6 for recording / reproducing magnetic information is provided on the front end side of the head support mechanism 1 and floats above a rotating magnetic recording medium 7 with a minute gap. Here, the head support mechanism 1 and the magnetic head slider 6 are collectively referred to as a head assembly, and the head assembly, the carriage 3, the main FPC 4, and the relay FPC 5 are collectively referred to as an HSA (Head Stack Assembly).
【００１４】図２は本発明の一実施例を示すＨＳＡの部
分拡大平面図及びフレクシャ１２のＢ−Ｂ断面図であ
る。図は、図１に示すヘッド支持機構体１の磁気記録媒
体面対向側を示す。FIG. 2 is a partially enlarged plan view of the HSA showing the embodiment of the present invention and a cross-sectional view of the flexure 12 taken along the line BB. The figure shows the side of the head support mechanism 1 shown in FIG. 1 facing the magnetic recording medium surface.
【００１５】ヘッド支持機構体１は、ヘッド支持機構体
１をキャリッジに勘合するベースプレート８と磁気ヘッ
ドスライダ６を把持し、磁気ヘッドスライダ６の端子部
（図示せず）に電気的に信号を接続するための２対の薄
膜配線パターン９、絶縁層１０、金属体１１が一体にな
ったフレクシャ１２、そのフレクシャ１２をレーザスポ
ット溶接等で接合して支えるロードビーム１３、磁気ヘ
ッドスライダ６に荷重を負荷する荷重曲げ部１４ａとフ
レクシャ１２の引回し部１２ａを保持する保持部１４ｂ
が一体となったヒンジ１４を有している。The head supporting mechanism 1 holds the magnetic head slider 6 and the base plate 8 that fits the head supporting mechanism 1 into the carriage, and electrically connects a signal to a terminal portion (not shown) of the magnetic head slider 6. A flexure 12 in which two pairs of thin film wiring patterns 9, an insulating layer 10 and a metal body 11 are integrated, a load beam 13 for supporting the flexure 12 by laser spot welding or the like, and a load on the magnetic head slider 6. A holding portion 14b that holds the load bending portion 14a to be applied and the lead-out portion 12a of the flexure 12.
Has an integrated hinge 14.
【００１６】フレクシャ引回し部１２ａの金属体１１
は、図２（ｂ）に示すように絶縁層１０を介して薄膜配
線パターン９間下面に設けられている。この金属体１１
は、金属体１１上にフォトリソグラフィ技術やメッキで
絶縁層１０、薄膜配線パターン９を形成した後、エッチ
ングにより所望の形状に除去して形成される。The metal body 11 of the flexure routing portion 12a
Is provided on the lower surface between the thin film wiring patterns 9 via the insulating layer 10 as shown in FIG. This metal body 11
Is formed by forming the insulating layer 10 and the thin film wiring pattern 9 on the metal body 11 by photolithography or plating, and then removing the insulating layer 10 and the thin film wiring pattern 9 into a desired shape by etching.
【００１７】本発明の実施例では、２対の薄膜配線パタ
ーン９の側方に並進して形成される金属体１１が１本で
あるため、従来例より曲げ剛性を低くすることができ、
またその幅を所望の幅に設定することによってヒンジ保
持部１４ｂの段差量が高い場合でも対応することができ
る。In the embodiment of the present invention, the bending rigidity can be made lower than that of the conventional example because the number of the metal bodies 11 formed by translating the two thin film wiring patterns 9 laterally is one.
Further, by setting the width to a desired width, it is possible to deal with the case where the step amount of the hinge holding portion 14b is high.
【００１８】図３の、図１の２対の薄膜配線パターン間
に並進する金属体１１と十字状に交差し、薄膜配線パタ
ーン９下を通る第２の金属体１１ａで構成されている。The second metal body 11a shown in FIG. 3 intersects with the metal body 11 that translates between the two pairs of thin film wiring patterns of FIG. 1 in a cross shape and passes below the thin film wiring pattern 9.
【００１９】図４は図３の他の実施例で、図２の２対の
薄膜配線パターン９と並進する金属体１１と、薄膜配線
パターン９間の金属体１１と互い違いになるようＴ字状
に交差し、かつそれぞれの薄膜配線パターン９下を通る
第２の金属体１１ｂで構成されている。FIG. 4 shows another embodiment of FIG. 3, in which the metal body 11 that translates with the two pairs of thin film wiring patterns 9 of FIG. And a second metal body 11b that intersects with each other and passes under each thin film wiring pattern 9.
【００２０】これにより、ヘッド支持構造体1の超音波
洗浄工程でキャビテーションによって生ずる可能性の有
る薄膜配線パターン９や絶縁層１０のクラックを防止す
ることができる。This makes it possible to prevent cracks in the thin film wiring pattern 9 and the insulating layer 10 which may be caused by cavitation in the ultrasonic cleaning process of the head support structure 1.
【００２１】ここで本実施例では、２対の薄膜配線パタ
ーン９と並進する金属体１１と交差する第２の金属体１
１ａの端面が開放された形状となっているが、部分的に
隣の第２の金属体１１ａと繋がった形状でもよい。In this embodiment, the second metal body 1 intersects with the pair of thin film wiring patterns 9 and the translating metal body 11.
Although the end surface of 1a is open, it may be partially connected to the adjacent second metal body 11a.
【００２２】また本実施例では中継ＦＰＣ５にてフレク
シャ１２とメインＦＰＣ４とを電気的に接続する方法を
示したが、本発明はフレクシャ１２とメインＦＰＣ４と
を直接接続する方式、いわゆるロングテイル方式におい
ても有効である。特に大容量高速転送化に対応するため
にロングテイル方式で、かつフレクシャ１２のヒンジ保
持部１４ｂ付近にプリアンプを搭載する、いわゆるチッ
プオンベース方式において有効である。In this embodiment, the method of electrically connecting the flexure 12 and the main FPC 4 with the relay FPC 5 is shown. However, the present invention is a method of directly connecting the flexure 12 and the main FPC 4, that is, a so-called long tail method. Is also effective. Particularly, it is effective in a so-called chip-on-base system in which a long-tail system is adopted to cope with large-capacity and high-speed transfer and a preamplifier is mounted near the hinge holding portion 14b of the flexure 12.
【発明の効果】薄膜配線パターンの下の金属体を薄膜配
線パターンの間に設け、その幅を所望の曲げ剛性になる
ように設定することにより、柔軟性を持たせることで組
立性向上を図ると共に耐振動性との両立を図ることがで
きる。また、ヘッド支持構造体の超音波洗浄工程でキャ
ビテーションによって生ずる可能性の有る薄膜配線パタ
ーンや絶縁層のクラックを防止することもできる。The metal body under the thin film wiring pattern is provided between the thin film wiring patterns, and the width thereof is set so as to have a desired bending rigidity, so that flexibility is provided to improve the assembling property. At the same time, it is possible to achieve compatibility with vibration resistance. Further, it is possible to prevent cracks in the thin film wiring pattern and the insulating layer which may be caused by cavitation in the ultrasonic cleaning process of the head support structure.
【図１】ヘッド支持機構体を搭載した磁気ディスク装置
の斜視図である。FIG. 1 is a perspective view of a magnetic disk device equipped with a head support mechanism.
【図２】第１の実施例のＨＳＡ部分拡大平面図及びフレ
クシャ断面図である。FIG. 2 is a partially enlarged plan view and a flexure sectional view of a HSA of the first embodiment.
【図３】他の実施例のＨＳＡ部分拡大平面図及びフレク
シャ断面図である。FIG. 3 is a partially enlarged plan view and a flexure sectional view of an HSA of another embodiment.
【図４】他の実施例の部分拡大ＨＳＡ平面図及びフレク
シャ断面図である。FIG. 4 is a partially enlarged HSA plan view and flexure sectional view of another embodiment.
【図５】従来のＨＳＡ部分拡大平面図及びフレクシャ断
面図である。FIG. 5 is a partially enlarged plan view of a conventional HSA and a flexure sectional view.
１…ヘッド支持機構体、２…モータ、３…キャリッジ、
４…メインＦＰＣ、５…中継ＦＰＣ、６…磁気ヘッドス
ライダ、７…磁気記録媒体、８…ベースプレート、９…
薄膜配線パターン、１０…絶縁層、１１…金属体、１１
ａ…第２の金属体、１２…フレクシャ、１２ａ…引回し
部、１３…ロードビーム、１４…ヒンジ、１４ａ…荷重
曲げ部、１４ｂ…保持部。1 ... Head support mechanism, 2 ... Motor, 3 ... Carriage,
4 ... Main FPC, 5 ... Relay FPC, 6 ... Magnetic head slider, 7 ... Magnetic recording medium, 8 ... Base plate, 9 ...
Thin film wiring pattern, 10 ... Insulating layer, 11 ... Metal body, 11
a ... second metal body, 12 ... flexure, 12a ... routing section, 13 ... load beam, 14 ... hinge, 14a ... load bending section, 14b ... holding section.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 前田 直起 神奈川県小田原市国府津2880番地 株式会 社日立製作所ストレージ事業部内 (72)発明者 萩谷 忍 神奈川県小田原市国府津2880番地 株式会 社日立製作所ストレージ事業部内 (72)発明者 津吉 敏明 神奈川県小田原市国府津2880番地 株式会 社日立製作所ストレージ事業部内 (72)発明者 西山 延昌 神奈川県小田原市国府津2880番地 株式会 社日立製作所ストレージ事業部内 Ｆターム(参考） 5D042 NA02 PA10 TA07 5D059 AA01 BA01 CA30 DA26 DA36 EA20 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Naoki Maeda 2880 Kozu, Odawara City, Kanagawa Stock Association Company Hitachi Ltd. Storage Division (72) Inventor Shinobu Hagiya 2880 Kozu, Odawara City, Kanagawa Stock Association Company Hitachi Ltd. Storage Division (72) Inventor Toshiaki Tsuyoshi 2880 Kozu, Odawara City, Kanagawa Stock Association Company Hitachi Ltd. Storage Division (72) Inventor Enchan Nishiyama 2880 Kozu, Odawara City, Kanagawa Stock Association Company Hitachi Ltd. Storage Division F-term (reference) 5D042 NA02 PA10 TA07 5D059 AA01 BA01 CA30 DA26 DA36 EA20
Claims (4)
号を接続して読み書きを行うための２対の薄膜配線パタ
ーンと、この薄膜配線パターンの下部に絶縁層を介し前
記２対の薄膜配線パターン間に金属体がある構造のフレ
クシャとを備えたヘッド支持機構体。1. A pair of thin film wiring patterns for electrically reading and writing by electrically connecting a signal to a terminal portion of a magnetic head slider, and two pairs of thin film wirings below the thin film wiring pattern via an insulating layer. A head support mechanism including a flexure having a structure in which there is a metal body between patterns.
体を備えた請求項１記載のヘッド支持機構体。2. The head support mechanism according to claim 1, further comprising a second metal body that intersects the metal body in a cross shape.
体を備えた請求項１記載のヘッド支持機構体。3. The head support mechanism according to claim 1, further comprising a second metal body that intersects the metal body in a T shape.
ヘッドスライダと、この磁気ヘッドスライダを支持する
ヘッド支持機構体と、キャリッジを介してこのヘッド支
持機構体を位置決め駆動するモータとを備えた磁気ディ
スク装置であって、 前記ヘッド支持機構体は磁気ヘッドスライダの端子部に
電気的に信号を接続して読み書きを行うための２対の薄
膜配線パターンと、この薄膜配線パターンの下部に絶縁
層を介し前記２対の薄膜配線パターン間に金属体がある
構造のフレクシャとを備えた磁気ディスク装置。4. A magnetic head slider for recording / reproducing magnetic information on / from a recording medium, a head supporting mechanism for supporting the magnetic head slider, and a motor for positioning and driving the head supporting mechanism via a carriage. In the magnetic disk device, the head support mechanism includes two pairs of thin film wiring patterns for electrically connecting and reading signals to and from the terminals of the magnetic head slider, and an insulating layer under the thin film wiring pattern. And a flexure having a structure in which a metal body is provided between the two pairs of thin film wiring patterns via a layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001344019A JP3921379B2 (en) | 2001-11-09 | 2001-11-09 | Head support mechanism and magnetic disk apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001344019A JP3921379B2 (en) | 2001-11-09 | 2001-11-09 | Head support mechanism and magnetic disk apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003151114A true JP2003151114A (en) | 2003-05-23 |
| JP2003151114A5 JP2003151114A5 (en) | 2005-07-14 |
| JP3921379B2 JP3921379B2 (en) | 2007-05-30 |
Family
ID=19157603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001344019A Expired - Fee Related JP3921379B2 (en) | 2001-11-09 | 2001-11-09 | Head support mechanism and magnetic disk apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3921379B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7224555B2 (en) | 2003-08-05 | 2007-05-29 | Nhk Spring Co., Ltd. | Disc drive suspension |
| JP2007272984A (en) * | 2006-03-31 | 2007-10-18 | Hitachi Global Storage Technologies Netherlands Bv | Disk drive device, and head assembly used for the device |
| US7359158B2 (en) | 2003-06-02 | 2008-04-15 | Nhk Spring Co., Ltd. | Suspension of disc drive |
| JP2008103745A (en) * | 2007-11-12 | 2008-05-01 | Nitto Denko Corp | Method for manufacturing wired circuit substrate |
| JP2008109147A (en) * | 2007-11-12 | 2008-05-08 | Nitto Denko Corp | Wiring circuit substrate |
| US7675713B2 (en) | 2005-05-27 | 2010-03-09 | Nhk Spring Co., Ltd. | Head suspension with flexure vibration clearance |
| US8134080B2 (en) | 2005-07-07 | 2012-03-13 | Nitto Denko Corporation | Wired circuit board |
| US8266794B2 (en) | 2006-08-30 | 2012-09-18 | Nitto Denko Corporation | Method of producing a wired circuit board |
| US8758910B2 (en) | 2010-06-29 | 2014-06-24 | Dai Nippon Printing Co., Ltd. | Substrate for suspension, and production process thereof |
| US8760815B2 (en) | 2007-05-10 | 2014-06-24 | Nitto Denko Corporation | Wired circuit board |
| US8988813B2 (en) | 2013-05-20 | 2015-03-24 | Tdk Corporation | Microwave-assisted magnetic recording and reproducing device |
-
2001
- 2001-11-09 JP JP2001344019A patent/JP3921379B2/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7359158B2 (en) | 2003-06-02 | 2008-04-15 | Nhk Spring Co., Ltd. | Suspension of disc drive |
| US7224555B2 (en) | 2003-08-05 | 2007-05-29 | Nhk Spring Co., Ltd. | Disc drive suspension |
| US7675713B2 (en) | 2005-05-27 | 2010-03-09 | Nhk Spring Co., Ltd. | Head suspension with flexure vibration clearance |
| US8134080B2 (en) | 2005-07-07 | 2012-03-13 | Nitto Denko Corporation | Wired circuit board |
| US8102628B2 (en) | 2006-03-31 | 2012-01-24 | Hitachi Global Storage Technologies Netherlands B.V. | Disk drive and head assembly having hole sequences |
| JP2007272984A (en) * | 2006-03-31 | 2007-10-18 | Hitachi Global Storage Technologies Netherlands Bv | Disk drive device, and head assembly used for the device |
| US8266794B2 (en) | 2006-08-30 | 2012-09-18 | Nitto Denko Corporation | Method of producing a wired circuit board |
| US8760815B2 (en) | 2007-05-10 | 2014-06-24 | Nitto Denko Corporation | Wired circuit board |
| JP2008103745A (en) * | 2007-11-12 | 2008-05-01 | Nitto Denko Corp | Method for manufacturing wired circuit substrate |
| JP4640852B2 (en) * | 2007-11-12 | 2011-03-02 | 日東電工株式会社 | Method for manufacturing printed circuit board |
| JP4640853B2 (en) * | 2007-11-12 | 2011-03-02 | 日東電工株式会社 | Printed circuit board |
| JP2008109147A (en) * | 2007-11-12 | 2008-05-08 | Nitto Denko Corp | Wiring circuit substrate |
| US8758910B2 (en) | 2010-06-29 | 2014-06-24 | Dai Nippon Printing Co., Ltd. | Substrate for suspension, and production process thereof |
| US9516747B2 (en) | 2010-06-29 | 2016-12-06 | Dai Nippon Printing Co., Ltd. | Substrate for suspension, and production process thereof |
| US8988813B2 (en) | 2013-05-20 | 2015-03-24 | Tdk Corporation | Microwave-assisted magnetic recording and reproducing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3921379B2 (en) | 2007-05-30 |
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