JP3921379B2 - Head support mechanism and magnetic disk apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a head support mechanism used in an external storage device of a computer and a magnetic disk device using the head support mechanism.
[0002]
[Prior art]
Japanese Patent Laid-Open No. 6155513/1990 discloses a method of forming an insulating layer by a photolithography technique and a thin film wiring pattern by plating or the like on a metal beam load beam and a gimbal integrated with the load beam in a head support mechanism. It is described in. Japanese Patent Laid-Open No. 2001-256627 discloses a head support mechanism body in which a metal body under a thin film wiring pattern of a flexure and a part of a load beam are removed in order to reduce a parasitic capacitance between the thin film wiring pattern and a ground. Are listed.
[0003]
[Problems to be solved by the invention]
In order to realize large capacity and high speed transfer of the magnetic disk device, it is necessary to sufficiently separate the two pairs of wiring thin film patterns for reading and writing formed on the flexure of the head support mechanism body. Since the width of the body also widens, the bending rigidity tends to increase as a whole. However, unless the flexural rigidity of the flexure is partially suppressed, the original function of the head support mechanism may be hindered.
[0004]
The example will be described below. FIG. 5A shows a partially enlarged plane of HSA (Head Stack Assembly) when the flexure of the head support mechanism is electrically connected to the main FPC equipped with the preamplifier using relay FPC (Relay Flexible Printed Circuits). FIG. 5B is a cross-sectional view of the flexure 12 taken along the line BB, and FIG. 5C is a cross-sectional view of the flexure 12 taken along the line CC. As shown in FIGS. 5B and 5C, in the conventional example, the lower part of the thin film wiring pattern 9 is perforated by etching so that two metal bodies 11 are translated and formed sideways of the two pairs of thin film wiring patterns 9. Remove in the shape of
[0005]
Since the relay FPC is generally attached along the carriage arm 3, the flexure 12 is pulled out to the side of the base plate 8 before or after the load bending portion 14a formed on the hinge 14 or the load beam 13 to form a step. The hinge 14 is fixed by laser welding or the like. The reason why the hinge 14 is stepped is to ensure a sufficient gap so that the relay FPC 5 joined to the terminal of the flexure 12 and the magnetic recording medium 7 do not come into contact with each other.
[0006]
However, in the process of laser welding the routing portion of the flexure 12 and the hinge 14, if the bending rigidity of the routing portion 12a of the flexure 12 is high, the adhesion strength becomes weak and the welding joint strength decreases, or the thin film wiring pattern 9 and the insulating layer 10 are subjected to large stresses and strains. Further, the tension of the lead portion 12 a causes a slight twist in the head support mechanism 1 to deteriorate the vibration characteristics of the head support mechanism 1, thereby positioning the magnetic head slider 6 on a predetermined track of the magnetic recording medium 7 at a high speed. May be an obstacle.
[0007]
On the other hand, if the bending rigidity is too low, the routing portion 12a is vibrated by the air flow generated by the rotation of the magnetic recording medium 7 and causes vibration.
[0008]
In addition, if the flexure 12 between the hinge load bending portions 14a that applies a predetermined load to the magnetic head slider 6 has a high rigidity, it causes a load variation. There are cases where the read / write characteristics of the head slider 6 are hindered.
[0009]
[Means for Solving the Problems]
In order to solve this problem, the present invention provides two pairs of thin film wiring patterns for electrically reading and writing by electrically connecting signals to the terminal portion of the head slider, and an insulating layer below the thin film wiring pattern. In the head support mechanism having a flexure having a structure with a metal body, the metal body is provided in translation between the two pairs of thin film wiring patterns in at least one of the flexures.
[0010]
As a result, by setting the width of the metal body provided between the thin-film wiring patterns so as to have a desired bending rigidity, it is possible to improve the assemblability by providing flexibility and to achieve both vibration resistance. Can do.
[0011]
In addition, a metal body that translates between the two pairs of thin film wiring patterns, and a metal body that intersects the two pairs of thin film wiring patterns and passes under the two pairs of thin film wiring patterns. Further, it is possible to prevent cracks in the thin film wiring pattern and the insulating layer that may be generated by cavitation in the ultrasonic cleaning process of the head support structure.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
[0013]
FIG. 1 is a perspective view of a magnetic disk drive equipped with a head support mechanism 1 of the present invention. The base of the head support mechanism 1 is fixed to a motor 2 for positioning and driving the head support mechanism 1 via a carriage 3. A relay FPC 5 that electrically connects the head support mechanism 1 and the main FPC 4 on which a preamplifier (not shown) is mounted is joined to a terminal portion (not shown) of the head support mechanism 1 with solder or the like. Yes. On the other hand, a magnetic head slider 6 for recording / reproducing magnetic information is provided on the front end side of the head support mechanism 1 and floats on the rotating magnetic recording medium 7 with a small gap. Here, the head support mechanism 1 and the magnetic head slider 6 are collectively referred to as a head assembly, and the head assembly, the carriage 3, the main FPC 4, and the relay FPC 5 are collectively referred to as HSA (Head Stack Assembly).
[0014]
FIG. 2 is a partially enlarged plan view of the HSA and a sectional view taken along the line BB of the flexure 12 showing an embodiment of the present invention. The figure shows the magnetic recording medium surface facing side of the head support mechanism 1 shown in FIG.
[0015]
The head support mechanism 1 grips a base plate 8 and a magnetic head slider 6 that engage the head support mechanism 1 with a carriage, and electrically connects a signal to a terminal portion (not shown) of the magnetic head slider 6. A flexure 12 in which two pairs of thin-film wiring patterns 9, an insulating layer 10, and a metal body 11 are integrated, a load beam 13 that supports the flexure 12 by joining it by laser spot welding, and a load that applies a load to the magnetic head slider 6. The bending part 14a and the holding part 14b which hold | maintains the routing part 12a of the flexure 12 have the hinge 14 integrated.
[0016]
The metal body 11 of the flexure routing portion 12a is provided on the lower surface between the thin film wiring patterns 9 via the insulating layer 10 as shown in FIG. The metal body 11 is formed by forming the insulating layer 10 and the thin film wiring pattern 9 on the metal body 11 by photolithography technique or plating, and then removing it into a desired shape by etching.
[0017]
In the embodiment of the present invention, the number of the metal bodies 11 formed by translation to the side of the two pairs of thin film wiring patterns 9 is one, so that the bending rigidity can be made lower than that of the conventional example, and the width thereof can be reduced. By setting the desired width, it is possible to cope with a case where the level difference of the hinge holding portion 14b is high.
[0018]
3 includes a second metal body 11a that crosses the metal body 11 that translates between the two pairs of thin film wiring patterns in FIG.
[0019]
FIG. 4 shows another embodiment of FIG. 3, which crosses in a T shape so as to alternate with the metal body 11 that translates with the two pairs of thin film wiring patterns 9 of FIG. The second metal body 11b passes under each thin film wiring pattern 9.
[0020]
As a result, cracks in the thin film wiring pattern 9 and the insulating layer 10 that may occur due to cavitation in the ultrasonic cleaning process of the head support structure 1 can be prevented.
[0021]
Here, in this embodiment, the end face of the second metal body 11a intersecting with the metal body 11 that translates with the two pairs of thin film wiring patterns 9 has a shape that is open. The shape connected with the metal body 11a may be sufficient.
[0022]
In the present embodiment, the method of electrically connecting the flexure 12 and the main FPC 4 by the relay FPC 5 is shown. However, the present invention is also effective in a system in which the flexure 12 and the main FPC 4 are directly connected, so-called long tail system. is there. In particular, it is effective in a so-called chip-on-base system in which a long tail system and a preamplifier are mounted in the vicinity of the hinge holding portion 14b of the flexure 12 in order to cope with large capacity and high speed transfer.
【The invention's effect】
By providing the metal body under the thin film wiring pattern between the thin film wiring patterns and setting the width so as to have the desired bending rigidity, it is possible to improve the assembling property and improve the vibration resistance. Can be achieved.
It is also possible to prevent cracks in the thin film wiring pattern and the insulating layer that may be generated by cavitation in the ultrasonic cleaning process of the head support structure.
[Brief description of the drawings]
FIG. 1 is a perspective view of a magnetic disk device on which a head support mechanism is mounted.
FIG. 2 is an HSA partial enlarged plan view and a flexure sectional view of the first embodiment.
FIGS. 3A and 3B are an HSA partial enlarged plan view and a flexure sectional view of another embodiment. FIGS.
FIG. 4 is a partially enlarged HSA plan view and a flexure cross-sectional view of another embodiment.
FIG. 5 is a conventional HSA partial enlarged plan view and flexure cross-sectional view.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Head support mechanism body, 2 ... Motor, 3 ... Carriage, 4 ... Main FPC, 5 ... Relay FPC, 6 ... Magnetic head slider, 7 ... Magnetic recording medium, 8 ... Base plate, 9 ... Thin film wiring pattern, 10 ... Insulation Layer 11, metal body, 11 a, second metal body, 12, flexure, 12 a, routing portion, 13, load beam, 14, hinge, 14 a, load bending portion, 14 b, holding portion.

Claims (4)

A thin film wiring pattern of the two pairs of connecting electrically the signal to the terminal portion of the magnetic head slider, an insulating layer formed on the thin film wiring patterns, the thin-film wiring between thin film wiring pattern of the two pairs via the insulating layer head support mechanism having a Furekushi multichemistry structure having a metal body to translate the pattern. 2. The head support mechanism according to claim 1, further comprising a second metal body that passes under the thin film wiring pattern and intersects the metal body in a cross shape. The head support mechanism according to claim 1, further comprising a second metal body that passes under the thin film wiring pattern and intersects the metal body in a T-shape. A magnetic disk device comprising a magnetic head slider for recording / reproducing magnetic information on a recording medium, a head support mechanism for supporting the magnetic head slider, and a motor for positioning and driving the head support mechanism via a carriage. There,
The head support mechanism body and the thin film wiring pattern of two pairs of connecting electrically the signal to the terminal portion of the magnetic head slider, an insulating layer formed on the thin film wiring patterns, the thin film wiring of the two pairs via the insulating layer A magnetic disk drive comprising: a metal body that translates between the thin film wiring patterns between the patterns ; and a flexure having a structure in which a second metal body that passes under the thin film wiring pattern and intersects the metal body in a cross shape is provided.

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