JP2002263831A - Brazing method and brazing device for diamond tip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a brazing method and a brazing device for a diamond tip which enable the realization of the excellent stuck state of the diamond tip, consequently realization of a diamond tip saw keeping a stable sharpness over a long period of time and also an in expensive diamond tip saw of high quality with case. SOLUTION: In the brazing method for the diamond tip by which the diamond tip is stuck by brazing the diamond tip to the tip attaching part of a base metal, an abutting part between the diamond tip and the base metal is brazed by heating in a state that at least one surface of the diamond tip is brought into surface-contact with a temperature control member which does not perform self heat-generation. The diamond tip is brazed by being brought into surface- contact with at least one side of the upper and lower surfaces of a temperature control member in a state that the base metal is almost horizontally placed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for brazing a diamond tip in a diamond tip saw or the like in which a diamond tip is fixed to a base metal.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 5, for example, a diamond tip saw 100 used for cutting various steel materials and the like has a concave portion for attaching a tip formed on a blade portion 102 on an outer peripheral edge of a base metal 101. A diamond chip 104 having a substantially rectangular parallelepiped shape is soldered and fixed to 103. Then, the diamond chip 104 is brazed to the concave portion 103 of the base metal 101 in a state where the base metal 101 is vertical and the diamond chip 10
4 and set the diamond chip 10
While the abutting portion between 4 and concave portion 103 is heated by a gas burner, a brazing material is brought into contact with the heated portion to be melted, and diamond chip 104 is soldered and fixed to concave portion 103.

[0003]

However, in the method of brazing the diamond tip 104, the contact portion between the diamond tip 104 set in the recess 103 of the base metal 101 and the recess 103 is simply heated by a gas burner. Therefore, it is difficult to maintain the diamond chip 104 at a predetermined heating temperature, and there is a possibility that the composition of the diamond chip 104 formed mainly of a sintered body of carbon may be destroyed. There is a problem that it is difficult to maintain a predetermined hardness satisfactorily, and as a result, the sharpness of the diamond tip saw 100 is likely to be lowered early.

Further, as shown in FIG. 6, it is difficult to accurately and easily set a set length t formed on both sides of the diamond tip 104, and it is difficult to obtain a high quality and inexpensive diamond tip saw 100. It also has problems. In other words, in order to obtain a uniform set dimension t on both sides, it is necessary to position the diamond tip 104 in the recess 103 with high precision.
It is practically impossible to position the diamond tip 104 with high accuracy in (1).

[0005] Therefore, the width w of the diamond tip 104 is set to be large in advance in consideration of the dispersion at the time of setting,
After the brazing, the portions indicated by hatching in FIG. 6 are polished to make the set dimensions t on both sides uniform. Therefore, the shape of the diamond tip 104 itself becomes larger than the actually required size and shape, and the diamond tip 1
As the cost of the polishing process itself increases, the operation time of the polishing operation increases, and the work of setting the diamond chip 104 in the vertical recess 103 and the heating operation by the gas burner itself become troublesome, so that the workability of the brazing operation is increased. However, the cost is increased, and it is difficult to obtain an inexpensive diamond tip saw 100.

The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain a diamond chip saw having a stable sharpness over a long period of time by obtaining a good fixing state of diamond chips, and at a low cost. An object of the present invention is to provide a diamond chip brazing method and a brazing apparatus capable of easily obtaining a high quality diamond chip saw.

[0007]

In order to achieve the above object, an invention according to claim 1 of the present invention is a method for brazing a diamond chip to a diamond chip mounting portion of a base metal by brazing. Then, in a state where at least one surface of the diamond chip is brought into surface contact with a temperature control member that does not generate heat, a contact portion between the diamond chip and the base metal is heated and brazed. It is preferable that the diamond tip is brazed in a state in which at least one of the upper and lower surfaces of the temperature control member is in surface contact with the base metal being substantially horizontal, as in the second aspect of the invention.

According to a third aspect of the present invention, there is provided a diamond chip brazing apparatus for brazing a diamond chip to a chip mounting portion of a base metal, wherein the diamond chip is in surface contact with at least one surface of the diamond chip. It is characterized by comprising a temperature control member that does not generate heat and a heating unit that heats a contact portion between the diamond chip and the base metal.

Preferably, the temperature control member is formed of a ceramic material, as in the invention of claim 4, and the temperature control member is, as in the invention of claim 5, It is preferable to also serve as a diamond chip positioning function. Preferably, the heating means heats the contact portion between the diamond chip and the base metal by induction heating, as in the invention according to claim 6.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2 show an embodiment of a device for brazing a diamond tip according to the present invention. FIG. 1 is a basic configuration diagram thereof, and FIG. 2 is a plan view of a main portion thereof.

In FIG. 1, a brazing device 1 includes a ceramic plate 3 as a temperature control member set horizontally at a predetermined position on a base plate 2 in a horizontal state, and a heating plate disposed above the ceramic plate 3. It has a coil 4 and a transistor inverter 5 as a high-frequency oscillator for supplying a high-frequency current to the heating coil 4. Heating means is formed by the heating coil 4 and the transistor inverter 5.

The ceramic plate 3 has a predetermined thickness t1 and at least an upper surface 3a thereof is formed to have a predetermined smooth surface so that it can come into surface contact with one surface 6a of the diamond chip 6. The ceramic plate 3 is fixedly arranged in a notch 2a formed at the edge of the base plate 2 made of, for example, a TC board. At this time, the notch 2a
Is set so that t2 = t1 + t + α (where α is a polishing amount and includes 0). That is, the upper surface 3a of the ceramic plate 3 is
1 also has a vertical positioning function in FIG.

The size of the ceramic plate 3 only needs to have a size in contact with at least one diamond chip 6, as indicated by a two-dot chain line in FIG. 2, and is appropriately set. In addition, the ceramic plate 3 may be disposed in the cutout portion 2a of the base plate 2 instead of a fixed type so as to be movable and used while being moved to a predetermined position.

According to the brazing apparatus 1, first, the heating coil 4 is arranged at a predetermined distance above the ceramic plate 3 as a brazing position, and a concave portion 7a as a chip mounting portion of the base metal 7 is formed. The recess 7 is located on the ceramic plate 3.
For example, a flux (not shown) is applied to a and a diamond chip 6 is fitted and set. At this time, when the heating coil 4 becomes an obstacle when the diamond chip 6 is set in the concave portion 7a, the concave portion 7a is set at one end side where the heating coil 4 of the ceramic plate 3 is not located above, and set. Thereafter, the base metal 7 on which the diamond chips 6 are set is moved to a substantially central position in the longitudinal direction of the ceramic plate 3 within the cutout portion 2a of the base plate 2.

When the diamond chip 6 is set in the recess 7a, the transistor inverter 5 is operated by operating an operation panel (not shown) to supply a high-frequency current to the heating coil 4 to induce a contact portion between the diamond chip 6 and the recess 7a. Heat. During this heating, the diamond chip 6 and the base metal 7 are induction-heated to a predetermined temperature by the induced eddy current, but no eddy current is induced in the ceramic plate 3 in which the surface 6a of the diamond chip 6 is in surface contact. , Is maintained at a predetermined low temperature (approximately normal temperature).

Accordingly, the diamond chip 6 is cooled at the temperature of the ceramic plate 3, so that excessive heating of the diamond chip 6 is prevented, and the composition of the diamond chip 6 is not destroyed. Further, a part of the flux applied when the diamond chip 6 is set adheres to the ceramic plate 3, but this flux evaporates due to the heating temperature of the diamond chip 6 and the metal base 7, and adheres to the upper surface of the ceramic plate 3 (with sticking). ) Is prevented, the ceramic plate 3 is always kept in a clean state, and a decrease in the positioning accuracy of the diamond chip 6 is prevented.

At the same time as the induction heating, a brazing material (not shown) is brought into contact with the contact portion between the diamond chip 6 and the concave portion 7a, and this brazing material is melted at the heating temperature and becomes between the diamond chip 6 and the concave portion 7a. The diamond chip 6 enters the gap, and is fixed to the concave portion 7a by brazing. This allows
The work of brazing the diamond chip 6 to one concave portion 7a is completed, and in this brazed state of the diamond chip 6, the diamond chip 6 is accurately positioned on the upper surface 3a of the ceramic plate 3 in the concave portion 7a. Therefore, the set size t is maintained in a predetermined range.

Each of the recesses 7a connecting the above operations
The diamond chips 6 are brazed to all the recesses 7a of the base metal 7 by performing the above steps continuously. Next, by polishing both sides in the width direction of the diamond tip 6 of the base metal 7 to which the diamond tip 6 is brazed, a diamond tip saw having a predetermined set length t is manufactured. Since the positioning of the diamond chip 6 at the time of setting is accurately performed on the upper surface 3a of the ceramic plate 3 during the polishing, the polishing amount may be extremely small, and the polishing operation itself is simplified.

The above brazing operation can be performed manually, but the setting of the base metal 7 on the base plate 2, the fitting of the diamond chip 6 to the concave portion 7a, the application of flux, the induction heating, and the like. Of course, it is also possible to automate the brazing work (labor saving) by mechanically performing all or a part of each work such as the brazing material contact and the movement of the base metal 7.

As described above, the brazing apparatus 1 of the above embodiment is used.
According to the method, one surface 6a of the diamond chip 6 set in the concave portion 7a of the base metal 7 is brought into surface contact with the upper surface 3a of the ceramic plate 3 which does not generate heat by induction heating. Since the contact portion with the concave portion 7a is induction-heated, the diamond chip 6 at the time of induction heating can be cooled by the ceramic plate 3, and excessive heating of the diamond chip 6 can be prevented, and its composition can be maintained in a predetermined state. It is possible to obtain a diamond tip saw that can be maintained and has a sharp sharpness over a long period of time.

Further, the base metal 7 is set in a horizontal state, and a diamond chip 6 is placed in each concave portion 7 a of the ceramic plate 3.
a, the diamond chip 6 can be set in each recess 7a with high precision, and the size of the diamond chip 6 can be prevented from being enlarged due to set variation as in the prior art. The cost of parts can be reduced. In addition, since the diamond chip 6 can be set to the required minimum size and accurately positioned and brazed, the amount of polishing of the diamond chip 6 can be reduced, and the polishing operation time can be shortened. .

Further, as described above, since the diamond chip 6 can be set in the concave portion 7a simply by placing the diamond chip 6 on the ceramic plate 3 in a horizontal state, the setting operation can be easily performed, and the ceramic chip 3 is arranged above the ceramic plate 3. Since induction heating can be performed only by supplying a high-frequency current to the heating coil 4 by operating the operation panel, a conventional gas burner is not required.
The heating operation itself is simple and can be performed safely in a good atmosphere. From these facts, the workability of the brazing operation is greatly improved, the manufacturing cost is reduced, and in combination with the reduction in the cost of the diamond tip 6 itself, it is possible to easily obtain an inexpensive and high-quality diamond tip saw. Will be possible.

FIGS. 3 and 4 are cross-sectional views of essential parts showing another embodiment of the brazing apparatus according to the present invention.
Hereinafter, the same portions as those in the above-described embodiment will be described by assigning the same reference numerals. First, the embodiment shown in FIG. 3 is configured so that the base metal 7 is brazed in a vertical state instead of a horizontal state, and the base plate 2 and the ceramic plate 3 are also set in a vertical state. In this case, as shown by a two-dot chain line in the figure, the ceramic plate 3 is formed into a shape having a concave portion 3b on the bottom surface side, and if the concave portion 3b is covered from above the diamond chip 6, approximately 3 The two surfaces come into surface contact with the ceramic plate 3 so that the cooling effect can be further improved.

In the embodiment shown in FIG. 4A, the positioning projection 2b of the ceramic plate 3 is formed in the notch 2a of the base plate 2.
Is provided so that the ceramic plate 3 can be accurately and stably set on the base plate 2. Also,
In the embodiment shown in FIG. 4B, the ceramic plate 3 is formed in an L-shaped cross section, and a positioning function of the diamond chip 6 in the horizontal direction is added to the positioning protrusion 3c. In the case of FIG. 4B, a structure in which a concave portion 3b indicated by a two-dot chain line in FIG. 3 is formed in the ceramic plate 3 can be adopted.

Also in each of these embodiments, at least one surface of the diamond chip 6 is in surface contact with the ceramic plate 3, so that the diamond chip 6 can be cooled during induction heating. In addition to obtaining substantially the same operation and effect, the diamond protrusion 6 can be set at a predetermined position with high accuracy by the positioning projections 2b and 3c, and the size and the like of the diamond chip 6 itself can be further reduced. can get.

As described above, the present invention is not limited to each of the above-described embodiments, and the embodiments can be appropriately combined. For example, the base metal 7 is not horizontally or vertically inclined at a predetermined angle. In this state, the ceramic plate 3 may be brazed, or the air flow holes 9 may be formed in the ceramic plate 3 as shown by a two-dot chain line in FIG. 1 to further enhance the cooling effect of the ceramic plate 3.

In the above-described embodiment, the high-frequency induction heating including the heating coil 4 and the transistor inverter 5 has been described as an example of the heating means. However, other appropriate heating means such as laser heating can be adopted. The temperature control member which does not generate heat is not limited to the ceramic plate 3 but may be any other appropriate member. Further, the shape of the blade portion of the base metal 7, the shape of the concave portion 7a, and the shape of the diamond chip 6 itself in the above embodiment are also examples.
The present invention can be applied to all diamond tip saws to which the diamond tip 6 is brazed and fixed.

Further, according to the present invention, the heating coil 4 may be arranged on both sides of the base metal 7 in the plate thickness direction, and the contact area between the diamond chip 6 and the ceramic plate 3 is not limited to the above embodiment. The base plate 2 and the ceramic plate 3 may have an appropriate contact area enough to cool the base plate 6.

[0029]

As described in detail above, according to the first aspect of the present invention, at least one surface of the diamond chip is brought into surface contact with a temperature control member which does not generate heat.
Heating and brazing the contact portion between the diamond tip and the base metal, the diamond tip can be cooled by the temperature control member in a heating manner, and excessive heating of the diamond tip is prevented to maintain a predetermined composition. It is possible to easily obtain a high-quality and inexpensive diamond tip saw with good sharpness over a long period of time.

According to the second aspect of the present invention, in addition to the effect of the first aspect, the diamond chip is brought into surface contact with at least one of the upper and lower surfaces of the temperature control member in a state where the base metal is substantially horizontal. Since the diamond chips are brazed in a state, the set state of the diamond chips can be stabilized, and a better cooling effect and brazing state can be obtained.

According to the third aspect of the present invention, a temperature control member which does not generate self-heating and which is disposed in surface contact with at least one surface of the diamond chip, and heats a contact portion between the diamond chip and the base metal. Heating means, which can cool the diamond chip by the temperature control member in a heating manner, prevent excessive heating of the diamond chip, maintain a predetermined composition, and provide good sharpness over a long period of time. A high quality and inexpensive diamond tip saw can be easily obtained.

According to the fourth aspect of the present invention, in addition to the effects of the third aspect of the present invention, the temperature control member is formed of a ceramic material. Can be used to obtain a less expensive brazing device.

According to the fifth aspect of the present invention, in addition to the effects of the third or fourth aspect, the temperature control member also has a diamond chip positioning function, so that the diamond chip can be more precisely controlled by the temperature control member. Brazing can be performed with good positioning, and a good cooling effect and a stable brazing state can be easily obtained.

According to the sixth aspect of the present invention, in addition to the effects of the third to fifth aspects, the heating means heats the contact portion between the diamond chip and the concave portion by induction heating. The members can be easily selected, and the heating operation itself can be performed accurately, safely and more easily.

[Brief description of the drawings]

FIG. 1 is a basic configuration diagram showing an embodiment of a brazing apparatus according to the present invention.

FIG. 2 is a plan view of a main part of the same.

FIG. 3 is a sectional view of a main part showing another embodiment of the brazing apparatus according to the present invention.

FIG. 4 is a sectional view of a main part showing still another embodiment of the brazing apparatus according to the present invention.

FIG. 5 is a plan view of a main part of a general diamond tip saw.

FIG. 6 is a sectional view of a main part of the same.

[Explanation of symbols]

 Reference Signs List 1 brazing device 2 base plate 2a cutout portion 2b positioning protrusion 3 ceramic plate 3a upper surface 3b recess 3c positioning protrusion 4 heating coil 5 transistor inverter 6 diamond chip 6a surface 7 base metal 7a recess 9 air flow hole

Claims (6)

[Claims] 1. A method for brazing a diamond chip, wherein the diamond chip is brazed to a chip mounting portion of a base metal, wherein at least one surface of the diamond chip is brought into surface contact with a temperature control member which does not generate heat. A brazing method by heating a contact portion between the diamond chip and the base metal. 2. The diamond according to claim 1, wherein the diamond chip is brazed in a state of surface contact with at least one of the upper and lower surfaces of the temperature control member with the base metal being substantially horizontal. Chip brazing method. 3. A diamond chip brazing apparatus for brazing a diamond chip to a chip mounting portion of a base metal, wherein the temperature control is performed so as not to generate self-heating and is arranged in surface contact with at least one surface of the diamond chip. An apparatus for brazing a diamond tip, comprising: a member; and heating means for heating a contact portion between the diamond tip and the base metal. 4. The apparatus according to claim 3, wherein said temperature control member is formed of a ceramic material. 5. The diamond chip brazing apparatus according to claim 3, wherein said temperature control member also has a diamond chip positioning function. 6. The apparatus according to claim 3, wherein said heating means heats a contact portion between the diamond chip and the base metal by induction heating.