JP2002261374A - Package for storing optical semiconductor element and optical semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance airtightness of an optical semiconductor element, optical coupling efficiency of the optical semiconductor element and an optical fiber, high frequency transmission characteristics of the optical semiconductor element and an I/O terminal, and heat dissipation properties of the optical semiconductor element during operation. SOLUTION: In a substantially rectangular prism basic body 2 having a part 2a for mounting an optical semiconductor element 1 on the bottom face of a recess made in the upper surface, an optical fiber securing member fixing part in the form of a through hole 2c made in the recess from one side part, and an I/O terminal fixing part 2d in the form of a through opening or a cut made in the recess from the other side part, and provided with screw fixing parts 2b in the form of a through hole or a cut at the parts stretching outward from the outer surface at the lower end of opposite side parts, a basic material m composed of a metal carbon complex A where an aggregate of unilateral carbon fibers 1 is dispersed into a carbonaceous parent material impregnated with copper and/or silver n is coated with a copper plating layer B on the surface thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor laser (L).
D), an optical semiconductor element housing package for housing an optical semiconductor element such as a photodiode (PD), and an optical semiconductor device using the optical semiconductor element housing package.

[0002]

2. Description of the Related Art A conventional optical semiconductor element housing package (hereinafter referred to as an optical semiconductor package) is shown in FIGS. 3 to 5 in plan view, sectional view and partially enlarged sectional view, respectively (see Japanese Patent Application Laid-Open No. 2000-150746). ).

This optical semiconductor package has a mounting portion 102a on the upper surface on which an optical semiconductor device 101 is mounted via a thermoelectric cooling element 105 such as a Peltier device, and a through hole or a cutout at an end of the opposing surface. It has a base 102 having a screw mounting portion 102b composed of a notch. Also, the base 1
02, the through-hole 103a which is formed on one side and serves as an optical signal path, and which is formed on the other side. Frame 103 provided with an input / output terminal mounting portion 103b formed of a through opening or a notch. Further, it has an input / output terminal 106 fitted to the input / output terminal mounting portion 103b. Further, a translucent member 108 functioning as a condensing lens is brazed to the inner peripheral surface of the through hole 103a, and an optical fiber (not shown) for transmitting an optical signal into and out of the optical semiconductor package is fixed. A cylindrical optical fiber fixing member 107 is fitted.

A metallization layer 106a is formed in the input / output terminal 106 so as to pass through the frame 103, and a lead terminal 107 to be connected to an external electric circuit (not shown) is provided on the outside of the frame 103. It is joined to the metallization layer 106a via a brazing material such as silver brazing.

[0005] The seal ring 104 is joined to the upper surface of the frame 103 and the upper surface of the input / output terminal 106, which are substantially flush with each other, with a brazing material such as silver brazing, and a cover (not shown) is seamed to the optical semiconductor package. It functions as a joining medium when welding or brazing.

The base 102 is made of a unidirectional carbon composite material in which unidirectional carbon fibers arranged in one direction from the upper surface side to the lower surface side are bonded with carbon. The unidirectional carbon composite has a very low modulus of elasticity in the transverse direction (perpendicular to the direction of the unidirectional carbon fibers) and a coefficient of thermal expansion of about 7 ppm / ° C. (× 10 ⁻⁶ / ° C.). And a three-layer structure of a first layer made of chromium (Cr) -Fe alloy, a second layer made of copper (Cu), and a third layer made of Fe-Ni-Co alloy on the upper and lower surfaces. A metal layer has been applied. Thereby, the coefficient of thermal expansion in the lateral direction is 10 to 13 pp.
m / ° C.

The thermal expansion coefficient of the substrate 102 in the longitudinal direction (the direction parallel to the direction of the unidirectional carbon fiber) is very high because the elastic modulus in the longitudinal direction of the unidirectional carbon fiber is very high. It is close to the coefficient of thermal expansion in the longitudinal direction of the fiber (almost about 0 ppm / ° C.).

The base 102 has a very high thermal conductivity of about 300 W / m · K or more in the vertical direction, while the thermal conductivity in the horizontal direction is between the unidirectional carbon fibers. Since it has a very large number of pores, it is extremely low at about 30 W / m · K or less, and the thermal conductivity is largely different between the vertical direction and the horizontal direction.

[0009] Such a base 102 is provided with the screw mounting portion 10.
The optical semiconductor element 101 is screwed to a heat sink portion of an external electric circuit via the second semiconductor chip 2b and fixed in close contact therewith.
Has a function as a so-called heat sink that efficiently transmits heat generated during operation to the heat sink.

After the optical semiconductor element 101 is mounted and fixed on the optical semiconductor package having such a base 102, the optical semiconductor element 101 and the metallized layer 106a are electrically connected by a bonding wire (not shown), and a cover is formed. By optically sealing the optical semiconductor element 101 with a body, an optical semiconductor device as a product is obtained. The optical semiconductor element 101
Is operated by a high-frequency signal input from an external electric circuit or an optical signal input from an optical fiber.

[0011]

However, the substrate 1
02 is not at a predetermined position on the upper surface of the base 102, that is, when the bonding position of the frame 103 is shifted, a gap is formed between the base 102 and the frame 103. As a result, there is a problem that the airtightness of the optical semiconductor element 101 is impaired.

When the optical semiconductor element 101 is mounted and fixed on the mounting portion 102a so as to be parallel to the end face of the base 102, the optical semiconductor element 101 and one side of the frame 103 are substantially perpendicular to the optical semiconductor element 101. Optical fiber fixing member 10
It becomes very difficult to adjust the optical axis with the optical fiber fixed to 7. That is, the optical coupling efficiency between the optical semiconductor element 101 and the optical fiber is reduced, and thus the optical semiconductor element 101 has a problem such as malfunction.

Further, in such a conventional configuration, since the electrode of the optical semiconductor element 101 and the metallized layer 106a of the input / output terminal 106 are displaced from a predetermined position to be connected by a bonding wire, the input / output of the optical semiconductor element 101 There is a portion where the length of a bonding wire (not shown) for making an electrical connection with the terminal 106 becomes extremely long.
Therefore, the impedance at this portion increases. As a result, the optical semiconductor element 101 and the input / output terminal 106
However, there is a problem that the transmission characteristics of the high-frequency signal are deteriorated.

As a means for solving such a problem, an end face (side face) of the frame 103 is attached to the optical semiconductor element 101.
Of the optical semiconductor element 101 so as to be parallel to the end face of the frame 103 as an alignment surface for
02a may be fixed.
Since it is difficult to accurately set the optical fiber perpendicular to the upper surface of the base 102, it is difficult for the optical fiber to be exactly parallel to the upper surface of the base 102. In addition, when there are a large number of optical semiconductor devices having optical fibers with such shifted optical axes, if the optical axes of the optical fibers are individually adjusted on an external electric circuit, the adjustment work becomes very complicated. .

When the amount of heat generated by the optical semiconductor element 101 during operation is very large, the heat is transferred only almost immediately below the junction (mounting part 102a) of the upper surface of the base 102 where the thermoelectric cooling element 105 is joined. That it can only be transmitted
Since the thermal conductivity of the frame 103 made of an Fe—Ni—Co alloy or the like is about 17 W / m · K, which is much lower than that of the base 102, the heat is generated by the space formed by the base 102 and the frame 103. Heat is stored in a place (internal space), and as a result, the optical semiconductor element 1
There are problems such as impairing the operability of No. 01 and heat destruction.

As means for solving such a problem,
It is conceivable to increase the size of the thermoelectric cooling element 105 to improve the efficiency of heat transfer. However, in this case, the size of the optical semiconductor package is increased, which is out of the trend of recent miniaturization and weight reduction.

Further, in order to strengthen the close contact between the optical semiconductor package and the heat sink portion of the external electric circuit, and to increase the efficiency of heat transfer to the heat sink portion, the screw mounting portion 102b is screwed to the heat sink portion with a high torque. When tightened, the screw mounting portion 102b, whose compressive strength is significantly smaller than that of metal, is crushed in the thickness direction, and it becomes impossible to tightly fix the optical semiconductor package and the heat sink.
For this reason, the heat generated by the optical semiconductor element 101 cannot be transmitted to the heat sink portion satisfactorily, and there is a problem that the operability of the optical semiconductor element 101 is impaired, or the optical semiconductor element 101 is destroyed by heat.

Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to ensure the airtightness of an optical semiconductor device such as an LD and a PD, and to establish a connection between the optical semiconductor device and an optical fiber. It is an object to improve the light coupling efficiency and to improve the high-frequency transmission characteristics between the optical semiconductor element and the input / output terminal. It is another object of the present invention to operate the optical semiconductor element normally and stably for a long period of time by efficiently transmitting the heat generated during the operation of the optical semiconductor element to the atmosphere or a heat sink.

[0019]

An optical semiconductor package according to the present invention has a substantially rectangular parallelepiped shape, and has a mounting portion for mounting an optical semiconductor element on a bottom surface of a concave portion formed on an upper surface and a side portion from above. An optical fiber fixing member mounting portion comprising a through hole formed over the concave portion, and an input / output terminal mounting portion comprising a through opening or a notch portion formed from the other side portion to the concave portion, and the outer surface of the side portion facing the side portion A base provided with a screw mounting portion comprising a through hole or a notch in an overhang portion formed so as to protrude outward at a lower end of the base;
In a package for housing an optical semiconductor element comprising a cylindrical optical fiber fixing member fitted to the optical fiber fixing member mounting portion and an input / output terminal fitted to the input / output terminal mounting portion, the base is A copper-plated layer is applied to the surface of a base material made of a metal-carbon composite in which an aggregate of unidirectional carbon fibers is dispersed in a carbonaceous base material impregnated with copper and / or silver It is characterized by.

According to the present invention, the airtightness of the optical semiconductor device, the coupling efficiency of light between the optical semiconductor device and the optical fiber, the high-frequency transmission characteristics between the optical semiconductor device and the input / output terminal, the operation of the optical semiconductor device, It is possible to improve the transmission of the heat generated sometimes and the rigidity of the substrate. As a result, the optical semiconductor element can be normally and stably operated for a long time.

An optical semiconductor device according to the present invention comprises: an optical semiconductor element storage package according to the present invention; an optical semiconductor element mounted and fixed on the mounting portion and electrically connected to the input / output terminal;
A lid joined to the upper surface of the base.

The present invention can provide a highly reliable optical semiconductor device using the above optical semiconductor package.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor package of the present invention will be described in detail below. 1 and 2 show an example of an embodiment of an optical semiconductor package of the present invention. FIG. 1 is a sectional view of the optical semiconductor package, and FIG. 2 is a partially enlarged sectional view of a base of the optical semiconductor package. .

In FIG. 1, 1 is an optical semiconductor element, 2 is a base having a copper-plated layer B formed on the surface of a base made of a metal-carbon composite A, 3 is a seal ring bonded to the upper surface of the base 2, Reference numeral 4 denotes an input / output terminal fitted to the mounting portion 2b of the base 2, and 6 denotes a cylindrical optical fiber fixing member (hereinafter, fixing member) fitted to the optical fiber fixing member mounting portion formed of the through hole 2c of the base 2. The substrate 2, the seal ring 3, the input / output terminal 4, and the fixing member 6
Is mainly configured.

Further, in FIG. 2, B is a copper plating layer, l
Is a unidirectional carbon fiber, m is a carbonaceous matrix, n is copper and / or
Alternatively, silver and A are metal-carbon composites composed of unidirectional carbon fiber l, carbonaceous matrix m, copper and / or silver n, and base 2 is made of copper plating on the surface of a base made of metal-carbon composite A Layer B is applied.

As shown in FIG. 2, the metal-carbon composite A is
An aggregate of unidirectional carbon fibers 1 is dispersed in a carbonaceous base material m impregnated with copper and / or silver n. Such a metal-carbon composite A is prepared, for example, by the following step [1]:
To [6].

[1] A block in which unidirectional bundles of carbon fibers are bonded with carbon is crushed into small carbon fiber aggregates, and the crushed carbon fiber aggregates are collected to obtain solid pitch or fine coke or the like. The powder is immersed in a solution of a thermosetting resin such as a phenol resin in which the powder is dispersed. In addition, the size of the small block obtained by crushing the block is approximately 0.1 to 1 mm on one side when converted to a rectangular one.

[2] This is dried, heated at a predetermined pressure and heated to cure the thermosetting resin portion.

[3] By firing at a high temperature in an inert atmosphere, the phenol resin and the fine powder of pitch or coke are carbonized to obtain a carbonaceous base material m. The carbonaceous preform m itself has a large thermal conductivity of 200 to 300 W / m · K, and also functions as a heat transfer path for the heat generated by the optical semiconductor element 1.

[4] A block in which copper and / or silver n is melted and impregnated in a carbonaceous base material m under high temperature and high pressure. The impregnated copper and / or silver n is in the form of a lump or a thin plate and is dispersed in the carbonaceous matrix m. This block is cut out into a plate shape and the metal-carbon composite A
The dimensions of the plate are, for example, about 0.5 to 2 mm in thickness, and 1 × length × width in plan view.
It is about 00 mm square.

[5] This plate is processed into a desired shape to prepare a substrate made of the metal-carbon composite A.

[6] A copper plating layer B is applied to the upper and lower surfaces of the substrate.

The metal-carbon composite A of the present invention has a thermal expansion coefficient of 8 to 10 ppm / ° C. due to impregnation with copper and / or silver n. In addition, the impregnation with copper and / or silver n increases the rigidity of the metal-carbon composite A, and when the optical semiconductor package is fixed to an external electric circuit via the screw mounting portion 2b by screwing, the metal The carbon composite A can be firmly fixed without being crushed. Therefore, heat generated when the optical semiconductor element 1 operates can be reliably transmitted to the heat sink of the external electric circuit.

The copper and / or silver n has a coefficient of thermal expansion of 17 to 20 ppm / ° C. and a thermal conductivity of 390 W /
m · K or more, elastic modulus 80 GPa or more, melting point 900 ° C
The above and their characteristics are used from the viewpoint that they are preferable from the viewpoint of manufacturing and characteristics of the optical semiconductor package.

More specifically, when copper and / or silver n are dispersed at an appropriate content in the carbonaceous base material m, the thermal expansion coefficient of the metal-carbon composite A can be reduced by the optical semiconductor. It does not rise to a degree that is significantly different from element 1.
Further, since the thermal conductivity is very high, it is advantageous for transmitting heat generated when the optical semiconductor element 1 is operated. Further, with respect to the elastic modulus, copper and / or silver n function as a cushioning material when the screw is tightened as compared with the prior art, so that damage to the base 2 is effectively prevented.

Further, since the melting point of the optical semiconductor package is very high, even if the optical semiconductor package is assembled with a brazing material such as a silver brazing material having a melting point of about 780 ° C. or more, it is not melted, and the inside of the carbonaceous matrix m is always stabilized. Can be kept. In the case of a metal that can be melted, it may melt out from the end face of the base 2 and is not suitable for an optical semiconductor package.

As shown in FIG. 2, a copper plating layer B is applied to the surface of a substrate made of a metal-carbon composite A. The copper plating layer B completely covers the pores of the unidirectional carbon fiber 1 exposed on the surface of the base material, has a function of maintaining the airtightness inside the optical semiconductor package, and It also functions as a so-called heat transfer medium that transfers the heat generated during operation in the lateral direction. Further, when the optical semiconductor element 1, the seal ring 3, the input / output terminal 4 and the like to be joined to the base 2 are joined with a brazing material such as gold (Au) -tin (Sn) brazing or silver (Ag) brazing, It also functions as improving the wettability of the material.

In the copper plating layer B, when the airtightness inside the optical semiconductor package is inspected using helium (He), part of He is trapped in the pores of the unidirectional carbon fiber l. Can be effectively prevented, and as a result, an optical semiconductor package suitable for inspection can be obtained. Furthermore, copper plating layer B
In the optical semiconductor package, the heat generated during the operation of the optical semiconductor element 1 is transmitted along the copper plating layer B from the joint (mounting part 2a) where the optical semiconductor element 1 is joined (placed). Heat can be efficiently dissipated from the entire area to the entire area outside the optical semiconductor package (the heat sink portion and the air). In addition, when the optical semiconductor element 1, the seal ring 3, the input / output terminal 4, and the like are brazed to the base 2, by making the wettability of the brazing material good, the heat generated by the operation of the optical semiconductor element 1 can be efficiently removed. The input / output terminal 4, which has a function of transmitting air to the base 2 and also maintaining airtightness inside the optical semiconductor package, can be satisfactorily joined.

This copper plating layer B has a thickness of 0.5 to 5 μm.
m is good. When the thickness is less than 0.5 μm, when the optical semiconductor element 1 and the input / output terminal 4 are joined with a brazing material such as Au—Sn brazing or Ag brazing, the wettability of the brazing brazing material is likely to be impaired.
In addition, the function as a heat transfer medium is impaired, and the airtightness inside the optical semiconductor package is unsuitable for inspection. On the other hand, if it exceeds 5 μm, the strain due to the thermal stress generated between the metal-carbon composite A and the copper plating layer B becomes large, and the copper plating layer B is easily peeled.

Further, in the present invention, in the conventional configuration, the portion that becomes the frame surrounding the mounting portion 2a is made of exactly the same material as the portion having the mounting portion 2a. Is transmitted from the periphery of the mounting portion 2a to a portion surrounding the mounting portion 2a, the heat is efficiently radiated to the outside (in the atmosphere) from this portion. That is, the optical semiconductor element 1
Even if the amount of heat generated during operation is very large,
Efficient radiation can be achieved by two paths: a path transmitted from the portion having the mounting portion 2a to the atmosphere via the portion surrounding the mounting portion 2a, and a path transmitted from the portion having the mounting portion 2a to the heat sink.

Specifically, the base 2 has a thickness of 350 to 400 W / m in a direction perpendicular to the mounting portion 2a of the optical semiconductor element 1.
A thermal conductivity of about K is obtained, and 200 to 250 W / m in a direction parallel to the surface of the mounting portion 2a of the optical semiconductor element 1
-A thermal conductivity of about K is obtained. As a result, even when the amount of heat generated during the operation of the optical semiconductor element 1 is very large, the heat is transmitted efficiently and randomly from the portion having the mounting portion 2a to the portion surrounding the mounting portion 2a. Two paths: a path transmitted to the atmosphere in the air and a path transmitted randomly from the portion having the mounting portion 2a to the heat sink portion.
It can be efficiently dissipated.

The portion having the mounting portion 2a and the mounting portion 2
a is formed integrally with the optical semiconductor element 1 as in the related art.
There is no concern at all that the airtightness will be impaired.

Also, since the optical input / output end face of the optical semiconductor element 1 is formed integrally as described above, the optical input / output end face is parallel to one side (one side wall) of the portion surrounding the mounting portion 2a. The optical axis of the optical semiconductor element 1 and the optical fiber 7 fixed to the fixing member 6 so as to extend substantially perpendicularly to one side (side wall) surrounding the mounting portion 2a when the mounting is fixed to the mounting portion 2a. Adjustment becomes very easy. That is, since the light input / output end face of the optical semiconductor element 1 and one side of the portion surrounding the mounting section 2a are always parallel, the light coupling efficiency between the optical semiconductor element 1 and the optical fiber 7 is always improved. obtain.

Further, in the configuration of the present invention, since the electrodes of the optical semiconductor element 1 are at predetermined positions to be always connected to the metallized layer 4a of the input / output terminal 4, bonding for electrically connecting them is performed. There is no need to create a site where the length of the wire must be extremely long. Therefore, since the length of the wire bonding can be always constant at any part, the optical semiconductor device 1 having the constant impedance is obtained. Therefore, the transmission characteristics of the high-frequency signal between the optical semiconductor element 1 and the input / output terminal 4 are always improved.

On one side of the base 2 (one side surrounding the mounting portion 2a), there is formed a through hole 2c serving as a path for an optical signal, and the other side (mounting). On the other side of the portion surrounding the mounting portion 2a), an input / output formed of a through opening or a cutout for fitting an input / output terminal 4 having a function of inputting / outputting a high-frequency signal to / from an external electric circuit. A terminal mounting portion 2d is formed.

A fixing member 6 for inserting an optical fiber 7 and fixing a holder 8 bonded with a resin adhesive or the like to the inner peripheral surface of the through hole 2c or the peripheral portion of the opening on the outer surface side of the base 2.
Are joined with a brazing material such as a silver brazing material. This fixing member 6
Is made of a metal material such as an Fe-Ni-Co alloy or an Fe-Ni alloy. For example, in the case of an Fe-Ni-Co alloy, a predetermined process is performed by subjecting an ingot of this alloy to metal working such as rolling or pressing. It is manufactured in the shape of In order to effectively prevent oxidative corrosion on the surface,
A metal layer such as a 0.5 to 9 μm Ni layer or a 0.5 to 5 μm Au layer is preferably applied by plating.

A translucent member 9 made of amorphous glass or the like which functions as a condenser lens and closes the inside of the optical semiconductor package is formed on the inner peripheral surface of the fixing member 6 on the surface of the joint. 200- through the metallized layer
It is joined with a low melting point brazing material such as an Au-Sn alloy having a melting point of 400 ° C.

The translucent member 9 has a coefficient of thermal expansion of 4 to 12 p.
It is made of sapphire (single crystal alumina) or amorphous glass at pm / ° C. (room temperature to 400 ° C.), and has a spherical, hemispherical, convex lens, rod lens, or other shape. Then, a light such as an external laser beam transmitted through the optical fiber 7 is input to the optical semiconductor element 1, or a condensing light for inputting the laser light or the like output from the optical semiconductor element 1 to the optical fiber 7. Used as a member. When the translucent member 9 is, for example, amorphous glass having no crystal axis, silicon oxide (S
iO ₂ ), a lead-based material mainly containing lead oxide (PbO), or a borosilicate-based material mainly containing boric acid or silica sand is used.

Even if the translucent member 9 has a different coefficient of thermal expansion from that of the base 2, the fixing member 6 absorbs and relaxes the stress due to the difference in thermal expansion, so that the crystal axis is due to the stress. It is unlikely that a change in the refractive index of light due to the alignment in the direction will occur. Therefore, by using such a translucent member 9, the light coupling efficiency between the optical semiconductor element 1 and the optical fiber 7 can be increased.

The holder 8 is provided with a YAG
Since it is joined by laser welding or the like, it is better to be made of a metal material like the fixing member 6. Further, the thermal expansion coefficient of the holder 8 is preferably made of the same material as that of the fixing member 6 so that the optical axis of the optical semiconductor element 1 and the optical fiber 7 do not shift. Accordingly, the material of the holder 8 is preferably an Fe—Ni—Co alloy when the fixing member 6 is an Fe—Ni—Co alloy, while an Fe—Ni—Co alloy is preferable when the fixing member 6 is an Fe—Ni alloy.
A Ni alloy is preferred.

The input / output terminal mounting portion 2d has an input / output terminal 4 fitted on the inner peripheral surface thereof with a brazing material such as Ag brazing via a copper plating layer B. The input / output terminal 4 is formed by attaching a conductive metallized layer 4a to an insulating ceramic substrate, has a function of maintaining the airtightness inside the optical semiconductor package, and has a function of maintaining the optical semiconductor package and an external electric circuit. And a function of inputting and outputting a high-frequency signal to and from the device. In addition, as the material of the ceramic substrate, a ceramic material such as alumina (Al ₂ O ₃ ) ceramic or aluminum nitride (AlN) ceramic is appropriately selected according to characteristics such as a dielectric constant and a thermal expansion coefficient.

The input / output terminal 4 is formed by adding a metal paste obtained by adding an organic solvent and a solvent to a powder of tungsten (W), molybdenum (Mo), manganese (Mn) or the like to be a metallized layer 4a. A suitable organic binder, a solvent, etc. are added to and mixed with the raw material powder to form a paste, and the paste is formed into a ceramic green sheet formed by a doctor blade method or a calender roll method in advance by a conventionally well-known screen printing method. It is produced by printing and applying to a shape and sintering at a high temperature of about 1600 ° C.

On the upper surface of the metallized layer 4a, lead terminals (shown in the drawing) made of a member having a coefficient of thermal expansion close to that of the ceramic substrate of the input / output terminals 4 are formed in order to strengthen the bonding with the input / output terminals 4. ) Are joined with a brazing material such as silver brazing. For example, the ceramic substrate of the input / output terminal 4 is made of Al ₂ O ₃
When made of ceramics, the lead terminals are Fe-Ni
-Co alloy or Fe-Ni alloy.

On the upper surface of the base 2 to which the input / output terminal 4 and the fixing member 6 are joined, the lid 5 is seam-welded or Au-coated.
-Function as a joining medium for joining with Sn solder;
A seal ring 3 made of a metal such as an Fe-Ni-Co alloy or an Fe-Ni alloy is joined with a brazing material such as Ag brazing. When the seal ring 3 is made of, for example, an Fe-Ni-Co alloy, the seal ring 3 is manufactured into a predetermined shape by subjecting an ingot of this alloy to metal working such as rolling or pressing. In order to effectively prevent oxidative corrosion, a 0.5-9 μm Ni layer or a 0.5-5 μm A
It is preferable that a metal layer such as a u layer is applied by a plating method.

Further, on the upper surface of the seal ring 3, Fe-
Ni-Co alloy, Fe-Ni metal lid body 5 made of an alloy or the like or Al ₂ O ₃ ceramics, and ceramic lid 5 made of AlN ceramics is bonded, the optical semiconductor element 1 by the lid 5 Is hermetically sealed inside the optical semiconductor package.

As described above, the optical semiconductor package of the present invention has a substantially rectangular parallelepiped shape, and is formed on the mounting portion 2a of the optical semiconductor element 1 and the through hole 2c formed from one side to the concave portion on the bottom surface of the concave portion on the upper surface. An optical fiber fixing member mounting portion and an input / output terminal mounting portion 2d formed of a through opening or a cut-out portion formed from the other side portion to the concave portion, and are formed to protrude outward at the lower end of the opposed side outer surface. A base 2 provided with a screw mounting portion 2b formed of a through hole or a notch in the extended portion, a cylindrical optical fiber fixing member 6 fitted to the optical fiber fixing member mounting portion, and an input / output terminal mounting portion 2d
And an input / output terminal 4 fitted in the base material 2. The base 2 is made of a metal carbon in which an aggregate of unidirectional carbon fibers 1 is dispersed in a carbonaceous matrix m impregnated with copper and / or silver n. A copper plating layer B is adhered to the surface of a substrate made of the composite A.

The optical semiconductor package of the present invention, the optical semiconductor element 1 mounted and fixed on the mounting portion 2a and electrically connected to the input / output terminal 4, and the lid joined to the upper surface of the base 2 By providing 5, the optical semiconductor device as a product is obtained. The optical fiber 7 whose end is inserted into the fixing member 6 is generally provided when the optical semiconductor device is used. However, the optical fiber 7 may be added to the optical semiconductor device as a single item, or the optical semiconductor device may be connected to an external electrical device. It may be attached when it is used by being fixed to a circuit board or the like.

Specifically, the optical semiconductor element 1 is bonded and fixed to the upper surface of the mounting portion 2a on which the optical semiconductor element 1 is mounted via an adhesive such as glass, resin, brazing material or the like. The first electrode is electrically connected to a predetermined metallized layer 4a via a bonding wire, and then the lid 5 is joined to the upper surface of the seal ring 3 by glass, resin, brazing material, seam welding, or the like, so that the base 2, an optical semiconductor device as a product in which the optical semiconductor element 1 is housed in an optical semiconductor package including the seal ring 3, the input / output terminal 4, the fixing member 6, and the translucent member 9.

Such an optical semiconductor device can be used, for example, by using a high-frequency signal supplied from an external electric circuit.
Is light-excited, and the excited light such as laser light
Is transmitted and received through the optical fiber 7 and transmitted through the optical fiber 7, thereby functioning as a photoelectric conversion device capable of transmitting a large amount of information at a high speed, and can be widely used in the field of optical communication and the like.

The present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention. For example, the optical semiconductor device may be provided with an optical isolator for preventing return light inside or outside, for example, inside or outside the base 2 of the fixing member 6 or in the middle of the optical fiber 7 outside the base 2.
In this case, the light coupling efficiency between the optical semiconductor element 1 and the optical fiber 7 is further improved.

[0061]

The present invention has a substantially rectangular parallelepiped shape and comprises a mounting portion for mounting an optical semiconductor element on the bottom surface of a concave portion formed on the upper surface and a through hole formed from one side to the concave portion. It has an input / output terminal mounting portion comprising an optical fiber fixing member mounting portion and a through opening or notch formed from the other side to the concave portion, and is formed so as to protrude outward at the lower end of the opposing side outer surface. A base provided with a screw mounting portion formed of a through hole or a notch in the extended portion, a cylindrical optical fiber fixing member fitted to the optical fiber fixing member mounting portion, and a fitting to the input / output terminal mounting portion. The input / output terminal is provided with a base, and the base is formed of a metal-carbon composite in which an aggregate of unidirectional carbon fibers is dispersed in a carbonaceous base material impregnated with copper and / or silver. To the copper plating layer Since, airtightness of the optical semiconductor element,
It has the effect that the coupling efficiency of light between the optical semiconductor element and the optical fiber, the high-frequency transmission characteristics between the optical semiconductor element and the input / output terminal, and the heat dissipation during operation of the optical semiconductor element can be made very good. As a result, the optical semiconductor element can be normally and stably operated for a long time.

Further, an optical semiconductor device of the present invention includes an optical semiconductor package of the present invention, an optical semiconductor element mounted and fixed on a mounting portion and electrically connected to input / output terminals, and joined to an upper surface of a base. With such a lid, it is possible to provide a highly reliable optical semiconductor device using the optical semiconductor package having the above-described functions and effects.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an embodiment of an optical semiconductor package of the present invention.

FIG. 2 is a partially enlarged sectional view of a base in the optical semiconductor package of FIG. 1;

FIG. 3 is a plan view of a conventional optical semiconductor package.

FIG. 4 is a sectional view of the optical semiconductor package of FIG. 3;

FIG. 5 is a partially enlarged sectional view of a base in the optical semiconductor package of FIG. 3;

[Explanation of symbols]

 1: optical semiconductor element 2: base 2a: mounting portion 2b: screw mounting portion 2c: through hole 2d: input / output terminal mounting portion 4: input / output terminal 5: lid 6: optical fiber fixing member 7: optical fiber l: Unidirectional carbon fiber m: carbonaceous matrix n: copper and / or silver A: metal-carbon composite B: copper plating layer

Claims (2)

[Claims] 1. An optical fiber fixing device having a substantially rectangular parallelepiped shape and comprising a mounting portion for mounting an optical semiconductor element on a bottom surface of a concave portion formed on an upper surface and a through hole formed from one side to the concave portion. It has an input / output terminal mounting portion comprising a member mounting portion and a through-opening or notch formed from the other side portion to the concave portion, and is formed so as to protrude outward at a lower end of the opposed side outer surface. A base provided with a screw attachment portion formed of a through hole or a notch in the overhang portion, a cylindrical optical fiber fixing member fitted to the optical fiber fixing member attaching portion, and a fitting to the input / output terminal attaching portion; In the package for housing an optical semiconductor element having input / output terminals attached thereto, the base is made of a metal in which an aggregate of unidirectional carbon fibers is dispersed in a carbonaceous matrix impregnated with copper and / or silver. Carbon compound A package for containing an optical semiconductor element, wherein a copper plating layer is applied to a surface of a base material made of a united product. 2. An optical semiconductor element storage package according to claim 1, wherein the optical semiconductor element is mounted on and fixed to the mounting portion and electrically connected to the input / output terminal, and is bonded to an upper surface of the base. An optical semiconductor device, comprising: a lid;