JP2002261136A - 異物検査方法 - Google Patents

異物検査方法

Info

Publication number
JP2002261136A
JP2002261136A JP2001054671A JP2001054671A JP2002261136A JP 2002261136 A JP2002261136 A JP 2002261136A JP 2001054671 A JP2001054671 A JP 2001054671A JP 2001054671 A JP2001054671 A JP 2001054671A JP 2002261136 A JP2002261136 A JP 2002261136A
Authority
JP
Japan
Prior art keywords
foreign matter
pattern
secondary electron
profile
electron profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001054671A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002261136A5 (enExample
Inventor
Yayoi Hosoya
弥生 細谷
Shunsuke Koshihara
俊介 腰原
Yoshinori Nakada
佳範 中田
Kazuo Aoki
一雄 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Science Systems Ltd
Original Assignee
Hitachi Ltd
Hitachi Science Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Science Systems Ltd filed Critical Hitachi Ltd
Priority to JP2001054671A priority Critical patent/JP2002261136A/ja
Publication of JP2002261136A publication Critical patent/JP2002261136A/ja
Publication of JP2002261136A5 publication Critical patent/JP2002261136A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
JP2001054671A 2001-02-28 2001-02-28 異物検査方法 Pending JP2002261136A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001054671A JP2002261136A (ja) 2001-02-28 2001-02-28 異物検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001054671A JP2002261136A (ja) 2001-02-28 2001-02-28 異物検査方法

Publications (2)

Publication Number Publication Date
JP2002261136A true JP2002261136A (ja) 2002-09-13
JP2002261136A5 JP2002261136A5 (enExample) 2005-01-20

Family

ID=18914969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001054671A Pending JP2002261136A (ja) 2001-02-28 2001-02-28 異物検査方法

Country Status (1)

Country Link
JP (1) JP2002261136A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005174929A (ja) * 2003-12-11 2005-06-30 Samsung Electronics Co Ltd 微細パターン線幅測定方法およびそのシステム
JP2007184565A (ja) * 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2007273581A (ja) * 2006-03-30 2007-10-18 Toray Eng Co Ltd 半導体ウエーハ検査方法およびその装置
JP2009520952A (ja) * 2005-12-14 2009-05-28 ケーエルエー−テンカー テクノロジィース コーポレイション 検査サンプル上で検出された欠陥分類のための方法とシステム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005174929A (ja) * 2003-12-11 2005-06-30 Samsung Electronics Co Ltd 微細パターン線幅測定方法およびそのシステム
JP2007184565A (ja) * 2005-12-07 2007-07-19 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
JP2009520952A (ja) * 2005-12-14 2009-05-28 ケーエルエー−テンカー テクノロジィース コーポレイション 検査サンプル上で検出された欠陥分類のための方法とシステム
JP2007273581A (ja) * 2006-03-30 2007-10-18 Toray Eng Co Ltd 半導体ウエーハ検査方法およびその装置

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