JP2002252262A - Method for detecting copper deposited substrate and substrate processing apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect deposition of copper on a substrate relatively simply based on the specificity of a spectral reflectance on the copper deposited substrate. SOLUTION: This method for detecting copper deposition on the processed surface of the substrate comprises a data measurement process (steps S2 to S4) for measuring the spectral reflectance data on the processed surface of the substrate and a discrimination process (step S5) for discriminating, based on the specificity of the spectral reflectance data, if copper is deposited or not. Since the spectral reflectance data of the substrate to which copper is deposited shows the specificity, it is possible to discriminate if copper is deposited on the substrate based on if the measured spectral reflectance data shows the specificity or not.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting the presence of copper for wiring or the like on a substrate (hereinafter simply referred to as a substrate) such as a semiconductor wafer or a glass substrate for a liquid crystal display device. The present invention relates to an attached substrate detection method and a substrate processing apparatus using the method.

[0002]

2. Description of the Related Art Conventionally, aluminum and tungsten have been used for wiring on a silicon substrate in a semiconductor process. Recently, with the high integration of semiconductors,
Copper is being used as a wiring material having more excellent conductivity, and products corresponding to processes using copper have been put to practical use also in semiconductor manufacturing equipment.

For example, in a substrate cleaning / etching apparatus, a copper-coated substrate coated with copper other than aluminum or tungsten is also used. If a copper-coated substrate is erroneously processed, the cleaning tank is contaminated with copper, and the apparatus is seriously damaged. Moreover, not only the substrate cleaning apparatus itself but also peripheral parts such as pipes provided in the apparatus are greatly damaged by contamination.
Normally, it is impossible for a copper-coated substrate to be mixed into a substrate processing apparatus corresponding to a substrate to which aluminum has been coated, but if it is mixed, extremely serious damage is caused.

Therefore, in order to prevent such damage beforehand, the substrate is checked inside the substrate processing apparatus before processing to detect the copper-coated substrate, and if detected, the substrate is processed. Need to be eliminated without having to. At present, as a method for detecting such a copper-coated substrate, it is conceivable to use various elemental analyzers.

[0005]

However, the prior art having such a structure has the following problems. In other words, various elemental analyzers are very complicated and expensive because they are configured to analyze a large number of elements, so they can be incorporated inside the substrate processing equipment to detect copper-coated substrates. Is not available. For this reason, there is no practical method for detecting a copper-coated substrate, and at present it is difficult to detect such a substrate.

The present invention has been made in view of such circumstances, and focuses on the peculiarity of the spectral reflectance of a substrate on which copper is deposited, so that copper can be deposited relatively easily. To provide a method for detecting a copper-coated substrate that can detect that a copper-coated substrate can be detected while using a relatively simple configuration to suppress a rise in cost. With the goal.

[0007]

The present invention has the following configuration to achieve the above object. That is, the invention according to claim 1 is a method for detecting a substrate having copper adhered on a processing surface, wherein the data measuring step of measuring spectral reflectance data on the processing surface of the substrate; A determination step of determining whether or not copper is deposited on the basis of the specificity of the method.

[0008] The invention described in claim 2 is the first invention.
The method of detecting a copper-coated substrate according to claim 1, wherein the data measuring step is performed at least at two points in a blue wavelength region and a green wavelength region, and a red wavelength region. Things.

[0009] The invention described in claim 3 is the first invention.
In the method for detecting a copper-coated substrate according to claim 2, the data measuring step is performed by capturing a spectral reflection image.

[0010] The invention described in claim 4 is the first invention.
In the method for detecting a copper-coated substrate according to any one of Items 3 to 3, the determination in the determination step is performed based on reference spectral reflectance data on a reference substrate on which copper is mounted and the spectral reflectance data. It is a feature.

The invention described in claim 5 is the first invention.
5. The method for detecting a copper-coated substrate according to any one of items 4 to 4, wherein the data measuring step is performed in a state where at least an area corresponding to one chip formed on the processing surface of the substrate is irradiated with illumination light. Is what you do.

[0012] The invention according to claim 6 is the same as the invention according to claim 5.
In the method of detecting a copper-coated substrate according to the above, the measurement of the spectral reflectance data in the data measurement process is performed on a plurality of locations at least a half pitch with respect to a maximum width of the copper pattern formed on one chip. It is characterized by being performed.

The invention described in claim 8 is the first invention.
7. The method for detecting a copper-coated substrate according to any one of Items 6 to 6, wherein the data measuring step and the determining step are performed on a plurality of substrates.

According to a ninth aspect of the present invention, in a substrate processing apparatus for performing a predetermined process on a substrate, an irradiation optical system for irradiating a processing surface of the substrate with illumination light and a reflection image of the processing surface of the substrate are taken. An image capturing unit and a spectral reflectance image of the processing surface of the substrate are captured via the image capturing unit, and spectral reflectance data obtained based on the spectral reflectance image and based on the specificity of the spectral reflectance data. The apparatus further comprises a copper-clad substrate detecting means provided with a discriminating means for discriminating the copper-clad substrate, and performs the specific processing only on the copper-clad substrate.

According to a tenth aspect of the present invention, in the substrate processing apparatus according to the ninth aspect, the image capturing means includes a CCD and sequentially illuminates the illumination light from the irradiation optical system to a plurality of measurement wavelength regions. And wavelength switching means for switching the wavelength to

According to an eleventh aspect of the present invention, in the substrate processing apparatus according to the ninth aspect, the image capturing means includes a plurality of CCDs, and the processing surface of the substrate is irradiated with the light from the irradiation optical system. Wavelength selecting means for simultaneously selecting only the measurement wavelength regions corresponding to the plurality of CCDs from the light reflected by the CCD.

[0017]

The operation of the first aspect of the invention is as follows. That is, conductive materials used in semiconductor processes and the like include aluminum, tungsten, copper, and the like.
As shown in FIG. 1, among these, aluminum has the highest reflectance, and the reflectance shows a substantially constant characteristic in a wavelength region of 450 to 750 nm. Tungsten has a lower reflectance than aluminum and higher than silicon,
Similar to aluminum, the reflectance is substantially constant in the above wavelength range.

On the other hand, copper exhibits specificity in the above wavelength range. That is, the reflectance gradually increases from the vicinity of the blue wavelength (450 nm) to the vicinity of the green wavelength (550 nm), the reflectance sharply increases from the vicinity of the green wavelength to the vicinity of the red wavelength (700 nm), and the reflectance substantially increases near the red wavelength. It shows the characteristic that the rate becomes constant.

Therefore, the spectral reflectance data is measured in the data measuring process, and it is determined in the determining process whether or not the specificity described above appears in the spectral reflectance data.

According to the second aspect of the present invention, even if the characteristic of the spectral reflectance data deviates from a general one due to interference with other films or the effect of diffraction by a fine pattern, the blue wavelength The erroneous determination can be prevented by measuring the spectral reflectance data at at least three points, one of the green wavelength and the green wavelength, and the red wavelength.

According to the third aspect of the present invention, the spectral reflectance is measured by capturing a spectral reflection image.

According to the fourth aspect of the present invention, it is determined whether or not copper is deposited on the basis of the reference spectral reflectance data on the reference substrate on which copper is deposited and the spectral reflectance data. can do.

According to the fifth aspect of the present invention, since a pattern for one chip is generally formed repeatedly on a semiconductor substrate or the like, at least a region corresponding to one chip is illuminated. Irradiation with light may be performed to measure spectral reflectance data.

According to the sixth aspect of the present invention, if the spectral reflectance data is measured at a plurality of locations at a pitch of at least half the maximum width of the copper pattern, the measurement position can be accurately determined in the data measurement process. , Any data becomes spectral reflectance data only from the copper pattern.

According to the seventh aspect of the present invention, in the case of a single-wafer processing in which substrates are processed one by one, the data measurement step and the discrimination step are performed for each sheet.

According to the present invention, in the case of a batch system in which a plurality of substrates are simultaneously processed, the data processing step and the determination step are performed on a plurality of substrates.

According to the ninth aspect of the present invention, the copper-coated substrate detecting means irradiates the processing surface of the substrate with irradiation light from the irradiation optical system, and takes in the reflected image by the image taking means. Then, the discriminating means discriminates the copper-coated substrate based on the spectral reflectance data obtained based on the spectral reflectance image and the specificity of the spectral reflectance data, and performs the specific processing only on the copper-coated substrate. .

According to the tenth aspect of the present invention,
While the wavelength switching means sequentially switches the illumination light from the irradiation optical system to a plurality of wavelength regions, C corresponding to the plurality of wavelength regions is used.
Spectral reflectance data corresponding to a plurality of measurement wavelength regions is measured by capturing a spectral reflection image with a CD (charge coupled device).

According to the eleventh aspect of the present invention,
The wavelength selecting means simultaneously selects only the measurement wavelength regions corresponding to a plurality of CCDs (charge coupled devices) from the irradiation light from the irradiation optical system, and captures the spectral reflection images corresponding to those wavelength regions. Is measured for the spectral reflectance data corresponding to the measurement wavelength region.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. <Method of Detecting Copper-Coated Substrate> Referring to FIGS. 1 is a graph showing the spectral reflectance of various materials, FIG. 2 is a flowchart showing an example of a method for detecting a copper-coated substrate, and FIG. 3 is a graph schematically showing a CCD output voltage for each measurement wavelength region. It is.

As shown in FIG. 1, when the spectral reflectance of copper is higher than that of aluminum near the red wavelength (700 nm), the spectral reflectance of copper is higher than that of aluminum, which is often used in the semiconductor process.
0 nm), and sharply decreases near the blue wavelength (45 nm).
0 nm), which is much lower than that of aluminum. Compared with tungsten, the wavelength is higher than tungsten from near the red wavelength (700 nm) to near the blue wavelength (450 nm). The same applies to silicon which is often used as a material for a substrate.

That is, copper has significantly different spectral reflectance characteristics from aluminum and tungsten, which are often used as wiring materials in a semiconductor process, and silicon, which is used as a substrate material. In the present invention, whether or not the substrate is a copper-coated substrate is determined by focusing on the specificity of the spectral reflectance.

Step S1 First, calibration (also called shading correction) is performed on a measuring instrument for measuring spectral reflectance.
For example, when a reflected image of each color is captured by a CCD and discrimination is performed based on the captured image, the dark current of the CCD and sensitivity variations of each element are corrected. The correction data obtained here is used for correcting the following reflectance data.

Step S2 First, for the substrate to be determined, the red wavelength (700 n
m) Capture the reflection image of the area. For example, a substrate is irradiated with white light as illumination light, and a reflected image is captured by a CCD through a band-pass filter that passes only a red wavelength region of the reflected light. The reflection image thus obtained is used as reflectance data in the red wavelength region.

Since a pattern corresponding to one chip is repeatedly formed on the substrate, it is preferable that at least a region corresponding to one chip formed on the substrate is irradiated with irradiation light and measured.

It is preferable to measure spectral reflectance data at a plurality of locations at a pitch of at least half the maximum width of a pattern formed on one chip of the substrate. As a result, even if the measurement position is not accurately adjusted at the time of data measurement, any data will include spectral reflectance data from only the copper pattern. Therefore, it is possible to detect the copper-coated substrate even if the alignment with the substrate is roughly performed at the time of measurement.

Step S3 Next, the green wavelength (550n) is determined for the substrate to be determined.
m) Capture the reflection image of the area. For example, step S2
Is measured in the same manner as described above, and this is used as reflectance data in the green wavelength region.

Step S4 Finally, for the substrate to be determined, the blue wavelength (450
(nm) region. For example, step S
Measurement is performed in the same manner as in No. 3, and this is used as reflectance data in the blue wavelength region.

FIG. 3 (a) schematically shows the output voltage of each element of the CCD obtained in the red wavelength region in step S2, and obtained in the green wavelength region in step S3. FIG. 3B shows the result obtained in the blue wavelength region in step S4, and FIG. 3C shows the result. The regular waves appear in each figure because the wiring of the substrate has regularity.

The above steps S2 to S4 correspond to the data measurement process in the present invention.

Step S5 The reflectance data in the wavelength region of each color measured as described above is used as spectral reflectance data, and it is checked whether or not this has the specificity described above.

For example, a reference substrate having copper adhered to the entire surface of the substrate is prepared in advance, and steps S2 to S4 described above are performed on this reference substrate. Then, the reflectance data in the red (R), green (G), and blue (B) wavelength regions is stored as “reference spectral reflectance data”. The reference spectral reflectance data is compared with the spectral reflectance data. If the spectral reflectance data of the corresponding color is within a certain range of the reference spectral reflectance data, it is determined that the substrate is a copper-coated substrate ( Step S6). On the other hand, if it is out of the predetermined range of the reference spectral reflectance data, it is determined that the substrate is not a copper-coated substrate (step S7).

This step S5 corresponds to the determination step in the present invention.

By the way, looking at the output voltage of the CCD in the example of FIG. 3, at the pixel positions p1 to p4, FIG.
3B is higher than FIGS. 3B and 3C, and FIG.
It is higher than (c). Therefore, pixel position p
From 1 to p4, it can be seen that specificity corresponding to the spectral reflectance of copper as shown in FIG. 1 appears. On the other hand, at the pixel position p5, almost no difference appears between FIGS. 3A to 3C. Therefore, pixel positions p1 to p4
It can be seen that copper is deposited on the processing surface of the substrate corresponding to the above, and that a material other than copper (tungsten or silicon from the magnitude of the output voltage) exists at the pixel position p5.

As described above, since the spectral reflectance data from the substrate on which copper is adhered shows peculiarity, it is determined whether or not the measured spectral reflectance data shows peculiarity. It can be determined whether or not the substrate is an adherend.
Therefore, the copper-coated substrate can be detected only by measuring the spectral reflectance data, and the copper-coated substrate can be detected relatively easily.

In the above-described example, the reflectance data was measured for the red, green, and blue wavelength regions, but at least two of the green wavelength region, the blue wavelength region, and the red wavelength region were measured. If there is reflectance data of a point, a copper-coated substrate can be detected. However, if the profile of the reflectance data (FIG. 3) becomes complicated due to interference or diffraction effects, the reflectance data may be measured in other wavelength regions in addition to the three-color wavelength region described above. Good.
Further, wavelength decomposition for increasing the wavelength selectivity by a band-pass filter may be performed.

In the above description, the spectral reflectance image is captured by the CCD and used as spectral reflectance data. However, the spectral reflectance image may be captured by another input device. The data may be reflectance data.

In the above description, the "reflectance" is described without specifying the absolute value or the relative value. However, if the reference spectral reflectance data is matched, the method of the present invention can be applied to the absolute reflectance and the relative reflectance. It can be implemented even at the rate.

<Substrate Processing Apparatus> An example of a substrate processing apparatus using the above-described method will be described with reference to FIGS.

FIG. 4 is a plan view showing a schematic configuration of a substrate processing apparatus provided with a copper-coated substrate detection mechanism, and FIG. 5 is a schematic configuration diagram of a copper-coated substrate detection mechanism suitable for a single wafer type. is there.

The substrates W are stacked and stored in a cassette C and mounted on the cassette mounting table 1. In this example, two cassettes C are mounted on the loading side of the cassette mounting table 1, and one cassette C is mounted on the unloading side. The first transport path 3 adjacent along the longitudinal direction of the cassette mounting table 1
Of these, a transfer robot 5 that takes out the substrate W from the cassette C on the loading side is provided at a position facing the cassette C on the loading side. In addition, a relay mechanism 7 is disposed in the vicinity between the cassette C on the loading side and the cassette C on the unloading side.

The transfer robot 5 is rotatable around a vertical axis, takes out the substrate W in the cassette C, transfers it, and places it on the relay mechanism 7. At this time, it is also possible to transfer all the substrates W in the cassette C at one time. In this case, the arm of the transfer robot 5 is changed from a single wafer type to a batch type. The relay mechanism 7 receives the substrate W from the transfer robot 5.
And has a function of temporarily mounting the substrate W and relaying the same. The relay mechanism 7 converts the posture of the substrate W from the horizontal posture to the standing posture by performing the falling operation itself. The relay mechanism 7 can also support both a single-wafer type and a batch type.

A transfer robot (not shown) is provided in the vicinity of the cassette C on the unloading side of the first transfer path 3, and the substrate W, which is in the upright position, is arranged orthogonally to the first transfer path 3 while maintaining the position. Is transferred to and from the second transport path 9. Second
The substrate W moved to the transport path 9 is transported by a transport robot (not shown) to any one of the four processing units 11 arranged along the second transport path 9, where the substrate W is processed. It has become.

On the upper part of the relay mechanism 7, a single-wafer-type copper-coated substrate for determining whether or not a single substrate W mounted on the relay mechanism 7 is a copper-coated substrate is determined. A detection mechanism 13 is provided. The copper-clad substrate detection mechanism 13 is provided above the relay mechanism 7 so as to be able to move up and down. That is, it moves up and down between the standby position above the relay mechanism 7 and the detection position near the substrate W placed on the relay mechanism 7.

Next, a description will be given of the single-wafer type copper-applied substrate detecting mechanism 13 with reference to FIG. FIG. 5 is a block diagram showing a schematic configuration of a copper-coated substrate detection mechanism suitable for a single wafer type.

Irradiation optical system 15 for irradiating substrate W with illumination light
Includes a light source 17, a filter switching unit 19, and a half mirror 21. The light source 17 emits, for example, white light as illumination light, and the filter switching unit 19 sequentially switches the light of the light source 17 to a wavelength region corresponding to three colors of RGB. Note that the switching timing is determined by a CPU, which will be described later.
Given from 31. The irradiation light is directed toward the substrate by the half mirror 21, and is applied to the processing surface of the substrate W through the objective lens 23.

As described above, the size of the illuminating light applied to the substrate W may be at least an area corresponding to one chip of the substrate W. For example, in the case of a 30 mm square chip, an irradiation spot having a diameter of at least 42.5 mm is formed.

The light reflected by the processing surface of the substrate W passes through the objective lens 23, passes through the half mirror 21, and is condensed on the 2D-CCD 27 (two-dimensional charge-coupled device) through the condenser lens 25. You. As the 2D-CCD 27,
One with 1000 pixels × 1000 pixels is exemplified. The spatial resolution on the processing surface of the substrate W is, for example, about 30 μm.

The 2D-CCD 27 corresponds to an image capturing unit in the present invention, and the filter switching unit 19 corresponds to a wavelength switching unit.

Further, as described above, if measurement is performed at a plurality of locations at a pitch of at least half the maximum width of the copper pattern formed on the substrate W, it is not necessary to accurately adjust the measurement position during data measurement. Any of the data includes spectral reflectance data from only the copper pattern. Therefore, even if the alignment with the substrate W is roughly performed at the time of measurement, the copper-coated substrate can be detected.

The video capture unit 29 has a 2D-CC
D27, and 2 in the measurement of spectral reflectance.
The output voltage of each pixel of the D-CCD 27 is taken. The capture is performed by the CPU 31 in accordance with the switching timing of the filter switching unit 19.

In the apparatus configured as described above, when the substrate W is conveyed from the cassette C and placed on the relay mechanism 7, the single-wafer type copper-coated substrate detecting mechanism 13 descends to the detecting position, The spectral reflectance data of the substrate W is measured while switching the wavelength of the light irradiated on the substrate W by the filter switching unit 19.
If at least one of the above-described specificities appears in each pixel of the 2D-CCD 27, it is determined that the substrate W is a copper-coated substrate. When a copper-coated substrate is detected, a specific process of returning the substrate W to the unloading side cassette C without transporting the substrate W in the direction of the second transport path 9 is performed, and a predetermined process performed by the processing unit 11 is performed. Not to be.

The copper-coated substrate is detected based on the spectral reflectance data obtained based on the spectral reflectance image and the specificity of the spectral reflectance data, and the specific processing is performed only on the copper-coated substrate. Since this is performed, it is possible to discriminate the copper-coated substrate with a relatively simple configuration while suppressing an increase in apparatus cost. When a copper-coated substrate is detected, a specific process different from the predetermined process is performed, so that it is possible to prevent the peripheral portion of the substrate processing apparatus from being contaminated or adversely affecting other substrates.

In the vicinity of the transfer robot 5, a batch-type copper coating for simultaneously detecting whether or not a plurality of substrates W stored in the cassette C are present is performed. A landing substrate detection mechanism 33 is also provided.

Next, the batch type copper-coated substrate detecting mechanism 33 will be described with reference to FIGS. FIG. 6 is a perspective view showing a schematic configuration of a copper-coated substrate detection mechanism suitable for a batch system, and FIG. 7 is a block diagram showing the schematic configuration.

In the case of the batch method, for example, it is necessary to determine whether or not any one of the substrates W is coated with copper in a state where 25 substrates W for one lot are accommodated in a cassette. Therefore, the above-described single-wafer type copper-coated substrate detection mechanism 13
More complex than the structure. In this example, a rotatable single-wafer type copper-adhered substrate detection mechanism 33 is provided at a position facing the cassette C on the loading side. In a state in which copper deposition on the substrate W is not detected, the substrate W is at a standby position where it does not interfere with the transfer robot 5,
Only at the time of detection, it turns to the detection position indicated by the two-dot chain line in FIG.

When a plurality of substrates W are stored in the cassette C, there is only a gap of about 10 mm between the substrates W. Therefore, in order to obtain spectral reflectance data of the processing surface of the substrate W, a plurality of measurement probes 35 to be inserted between the substrates are required. Each measurement probe 35
, One end of the optical fiber bundle 37 is connected separately.
The other end is connected to the irradiation optical system 15 as shown in FIG.

The light irradiated from the irradiation optical system 15 and reflected on the processing surface of the substrate W is
, And passes through the condenser lens 25 for each 2
The light is incident on the D-CCD 27. In this example, three 2D
-The CCD 27 corresponds to RGB. These 2D-CC
The output of D27 is connected to the video capture unit 29 as in the above-described embodiment. Note that the spectroscopy unit 39 corresponds to a wavelength selection unit in the present invention.

The measurement probe 35 will be described with reference to FIG. The measurement probe 35 is an optical fiber bundle 3
7 is connected. That is, the optical fiber bundle 3
The optical fiber 41 constituting 7 is divided and taken out,
It is attached to the measurement probe 35. The number of the attached optical fibers 41 is, for example, 1,000. A microlens array 43 is attached on the extension axis of each optical fiber 41, and a mirror 45 is attached to a tip of the microlens array 43.

In the apparatus having the above-described configuration, after moving the batch-type copper deposition detecting mechanism 33 to the detection position, the measuring probe 35 is stepped toward the center side of the substrate W by a predetermined distance. Measure the spectral reflectance data for each step. The step feed is performed so as to cover one chip. For example, it is about 30 mm.

When the spectral reflectance data obtained through the 2D-CCD 27 is compared with the reference spectral reflectance data and the spectral reflectance is found to be unique, a plurality of substrates are determined. This indicates that the copper-coated substrate is mixed in any of W. Therefore, in this case, the plurality of substrates W are transported to the unloading side of the cassette mounting table 1 via the relay mechanism 7. That is, these substrates W are unloaded as specific processing without performing predetermined processing.

As described above, according to the present embodiment, the copper-coated substrate detecting mechanism 33 can be configured with a relatively simple configuration, and the spectral reflectance data can be measured with high accuracy by the plurality of 2D-CCDs 27. it can.

In this embodiment, the 2D-CCD 2
7 are prepared and light of wavelengths corresponding to three colors is irradiated to the respective 2D-CCD 27 by the spectral unit 39. However, one RGB color 2D-CCD combining the 2D-CCD 27 with a color filter is provided. May be adopted.

[0074]

As is apparent from the above description, according to the first aspect of the present invention, since the spectral reflectance data from the substrate on which copper is deposited shows specificity, the measured spectral reflectance Whether or not the substrate is a copper-coated substrate can be determined based on whether or not specificity appears in the rate data. Therefore, the copper-coated substrate can be detected only by measuring the spectral reflectance data, and the copper-coated substrate can be detected relatively easily.

According to the second aspect of the present invention, even if the characteristics of the spectral reflectance data deviate from general characteristics, one of the blue wavelength and the green wavelength, and the red wavelength By measuring the spectral reflectance data at at least three points, erroneous determination can be prevented, and the detection accuracy can be improved.

According to the third aspect of the present invention, the spectral reflectance can be measured by capturing the spectral reflection image, and the copper-coated substrate can be determined based on the spectral reflectance.

According to the fourth aspect of the present invention, copper is discriminated based on the reference spectral reflectance data of the reference substrate on which copper is adhered and the measured spectral reflectance data. It is possible to accurately determine whether it is attached

According to the fifth aspect of the present invention, since a pattern for one chip is generally formed repeatedly on a semiconductor substrate or the like, spectral reflectance data is measured from the entire processing surface of the substrate. Even if it is not, it is possible to determine whether or not the substrate is a copper-coated substrate by irradiating at least an area corresponding to one chip with illumination light and measuring spectral reflectance data.

According to the sixth aspect of the present invention, if the spectral reflectance data is measured at a plurality of locations at a pitch of at least half the maximum width of the copper pattern, the measurement position can be accurately determined in the data measurement process. , Any data becomes spectral reflectance data only from the copper pattern.
Therefore, it is possible to detect the copper-coated substrate even if the alignment with the substrate is roughly performed at the time of measurement.

According to the present invention, in the case of a single-wafer processing in which the substrates are processed one by one, the data measurement process and the discrimination process are performed one by one to remove the copper-coated substrate. It is preferable to determine.

According to the present invention, in the case of a batch system in which a plurality of substrates are simultaneously processed, it is preferable that the data processing step and the discrimination step are performed on a plurality of substrates.

According to the ninth aspect of the present invention, a copper-coated substrate is detected based on spectral reflectance data obtained based on a spectral reflectance image and the specificity of the spectral reflectance data. Since the specific processing is performed only on the substrate to be adhered, it is possible to discriminate the copper adhered substrate with a relatively simple configuration while suppressing an increase in apparatus cost. When a copper-coated substrate is detected, a specific process different from the predetermined process is performed, so that it is possible to prevent the peripheral portion of the substrate processing apparatus from being contaminated or adversely affecting other substrates.

According to the tenth aspect of the present invention,
Since the copper-coated substrate detection mechanism can be configured with a relatively simple configuration, it is possible to add a function of detecting the copper-coated substrate while suppressing the cost of the substrate processing apparatus.

According to the eleventh aspect of the present invention,
While the copper-coated substrate detection mechanism can be configured with a relatively simple configuration, spectral reflectance data can be measured with high accuracy by a plurality of CCDs.

[Brief description of the drawings]

FIG. 1 is a graph showing the spectral reflectance of various materials.

FIG. 2 is a flowchart illustrating an example of a method for detecting a copper-coated substrate.

FIG. 3 is a graph schematically showing a CCD output voltage for each measurement wavelength region.

FIG. 4 is a plan view showing a schematic configuration of a substrate processing apparatus provided with a copper-coated substrate detection mechanism.

FIG. 5 is a block diagram showing a schematic configuration of a copper-coated substrate detection mechanism suitable for a single wafer type.

FIG. 6 is a perspective view showing a schematic configuration of a copper-coated substrate detection mechanism suitable for a batch type.

FIG. 7 is a block diagram illustrating a schematic configuration of a copper-coated substrate detection mechanism suitable for a batch method.

FIG. 8 is a schematic configuration diagram of an optical system.

[Explanation of symbols]

 W ... substrate 1 ... cassette mounting table 7 ... relay mechanism 13 ... single-wafer type copper-coated substrate detection mechanism 15 ... irradiation optical system 19 ... filter switching unit 21 ... half mirror 27 ... 2D-CCD 27 (image capturing means) 33 ... Batch type copper-coated substrate detection mechanism

Claims (11)

[Claims] 1. A method for detecting a substrate having copper applied to a processing surface, comprising: a data measuring step of measuring spectral reflectance data for the processing surface of the substrate; A determining step of determining whether or not the substrate is adhered. A method for detecting a copper-adhered substrate, comprising: 2. The method for detecting a copper-coated substrate according to claim 1, wherein the data measuring step is performed at least at two points of one of a blue wavelength region and a green wavelength region and a red wavelength region. A method for detecting a copper-coated substrate, which is performed. 3. The method for detecting a copper-coated substrate according to claim 1, wherein the data measuring step is performed by capturing a spectral reflection image. 4. The method for detecting a copper-coated substrate according to claim 1, wherein the determination in the determination step includes: determining reference spectral reflectance data for a reference substrate on which copper is mounted; and determining the spectral reflectance. A method for detecting a copper-coated substrate, wherein the method is performed based on data. 5. The method for detecting a copper-coated substrate according to claim 1, wherein the data measuring step includes irradiating at least an area corresponding to one chip formed on a processing surface of the substrate with illumination light. A method for detecting a copper-coated substrate, characterized in that the method is performed by: 6. The method for detecting a copper-coated substrate according to claim 5, wherein the measurement of the spectral reflectance data in the data measurement step is at least half of the maximum width of the copper pattern formed on one chip. A method for detecting a copper-coated substrate, wherein the method is performed on a plurality of locations at a pitch. 7. The method for detecting a copper-coated board according to claim 1, wherein the data measuring step and the discriminating step are performed for each single board. Method. 8. The method for detecting a copper-coated substrate according to claim 1, wherein the data measuring step and the determining step are performed on a plurality of substrates. Detection method. 9. A substrate processing apparatus for performing predetermined processing on a substrate, an irradiation optical system for irradiating a processing surface of the substrate with illumination light, an image capturing unit for capturing a reflection image of the processing surface of the substrate, and the image capturing unit. A spectral reflection image of the processing surface of the substrate via the CPU, and a spectral reflectance data obtained based on the spectral reflectance image, and a discriminating unit for determining a copper-coated substrate based on the specificity of the spectral reflectance data A substrate processing apparatus, comprising: a copper-coated substrate detection unit having the following configuration: and performing a specific process only on the copper-coated substrate. 10. The substrate processing apparatus according to claim 9, wherein the image capturing unit includes a CCD, and further includes a wavelength switching unit that sequentially switches illumination light from the irradiation optical system to a plurality of measurement wavelength regions. A substrate processing apparatus. 11. The substrate processing apparatus according to claim 9, wherein the image capturing means includes a plurality of CCDs, and the plurality of light beams emitted from the irradiation optical system and reflected by a processing surface of the substrate. A substrate processing apparatus comprising: a wavelength selecting unit that simultaneously selects only a measurement wavelength region corresponding to a plurality of CCDs.