JP2002245855A - Resin component for insulation material, and insulation material using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulation material displaying excellent thermal property and electric property when used for semiconductor. SOLUTION: The resin component for insulation material has a component having a foamed structure of 1,000-2,000 m2/g (A), and a heat resistant resin or a precursor of it (B), as essential components, and the insulation material using the same is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating material, and more particularly, to a resin composition for an insulating material having excellent characteristics for use in electric / electronic devices and semiconductor devices, and an insulating material using the same. It is about.

[0002]

2. Description of the Related Art Among the characteristics required for materials for electric / electronic devices and semiconductor devices, electric characteristics and heat resistance are the most important characteristics. In particular, in recent years, with miniaturization of circuits and speeding up of signals, an insulating material having a low dielectric constant has been required. An insulating material using a heat-resistant resin is expected as a material for achieving both of these characteristics. For example,
Conventionally used inorganic insulating materials such as silicon dioxide have high heat resistance, but have a high dielectric constant and the required characteristics are becoming more sophisticated. . A heat-resistant resin typified by a polyimide resin has excellent electrical characteristics and heat resistance, and can achieve both of the two characteristics, and is actually used for a coverlay of a printed circuit, a passivation film of a semiconductor device, and the like.

[0003] However, with recent advances in the functions and performance of semiconductor devices, remarkable improvements in electrical characteristics and heat resistance have been required, so that even higher performance resins have been required. ing. In particular, a low dielectric constant material having a dielectric constant of less than 2.5 is expected, and a conventional insulating material does not reach required characteristics. On the other hand, heretofore, for example, a resin composition comprising a polyimide resin and a solvent to which a thermally decomposable resin is added or copolymerized is decomposed by heating in a later step. Since the polyimide resin structure does not change even when heat is applied, voids are formed after thermal decomposition. Since it is considered that air having a dielectric constant of about 1 is present in this gap, attempts have been made to reduce the dielectric constant of the insulating material using this gap. However, when the heat-resistant resin and the thermally decomposable resin of polyimide are compatible with each other, the glass transition point becomes low due to the plasticizing effect.In a temperature range where the thermally decomposable resin is decomposed, the polyimide resin becomes soft and the voids are crushed. The effect of reducing the dielectric constant is small. Even if a heat-resistant resin such as polyimide and a thermally decomposable resin can be successfully formed into a phase-separated structure without being compatible with each other, a large amount of labor is required for heating and the like when decomposing the thermally decomposed resin in a manufacturing process. Required.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a resin composition for an insulating material which exhibits an extremely low dielectric constant and good insulating properties, and also has excellent heat resistance and an insulating material using the same. is there.

[0005]

Means for Solving the Problems The present inventors have made intensive studies in view of the above-mentioned conventional problems, and as a result, have completed the present invention by the following means.

That is, the present invention is as described in items 1 to 5. 1. A resin composition for an insulating material comprising a component (A) having a pore structure having a specific surface area of 1,000 to 2,000 m ² / g and a heat-resistant resin or its precursor (B) as essential components.

[0007] 2. Specific surface area is 1,000-2,000m
^{2. The} resin composition for an insulating material according to claim 1, wherein the component (A) having a pore structure of ² / g is activated carbon.

[0008] 4. Heat resistant resin or its precursor (B)
Is a polyimide resin or a polyimide precursor,
Item 4. The resin composition for an insulating material according to any one of Items 3 to 3.

[0009] 5. Heat resistant resin or its precursor (B)
Is a polybenzoxazole resin or a polybenzoxazole precursor, The resin composition for insulating materials according to any one of Items 1 to 2.

[0010] 6. An insulating material obtained by using the resin composition for an insulating material according to any one of items 1 to 4.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The resin composition for insulating material of the present invention comprises:
It comprises, as essential components, a component (A) having a pore structure having a specific surface area of 1,000 to 2,000 m ² / g and a heat-resistant resin or its precursor (B). As a component other than the components (A) and (B), a solvent can be used.

The resin composition for an insulating material of the present invention comprises a component (A) having a pore structure having a specific surface area of 1,000 to 2,000 m ² / g, a heat-resistant resin or a precursor (B) thereof.
And a chemical bond.

The resin composition for an insulating material of the present invention is coated on a substrate or the like to form a coating film, and then heated to form a film, or impregnated in a glass cloth or the like, and heated. By doing so, an insulating material can be obtained.

The hollow interior of the component (A) used in the present invention comprises:
Since the air is air, the dielectric constant of the air is considered to be 1. Therefore, the dielectric constant is reduced by adding the component (A) to the heat-resistant resin having a dielectric constant larger than 1 or its precursor (B). The pore structure is maintained even after the insulating material is formed, and an insulating material having a low dielectric constant can be obtained. Further, the specific surface area of the pores of the component (A) is 1,0.
If it is less than 00 m ² / g, the pore size distribution will be in the order of micrometers and will be dispersed in the film, and the apparent dielectric constant as a whole will be reduced. If the vacancies of the order are not dispersed, the true dielectric constant does not decrease. In addition, 2,000 cm ² /
When the value exceeds g, it is considered that very small pores increase and the dielectric constant further decreases. However, the dielectric constant is reduced to the order of nanometers or less, and the dielectric constant does not decrease.

[0015] The BET specific surface area method mentioned here means that nitrogen is adsorbed at the boiling point of liquid nitrogen, and the amount of adsorption (v) when nitrogen covers the entire surface of the adsorbent, for example, activated carbon in a monolayer.
The specific surface area is calculated from m) and the area occupied by one nitrogen molecule.

The specific surface area used in the present invention is 1,000 to
Component (A) having a pore structure of 2,000 m ² / g
Examples thereof include a SiO ₂ film, a siloxane film, and activated carbon, but activated carbon is preferred.

As a raw material of the activated carbon used in the present invention, since most of the activated carbon is made of carbon, any substance which is carbonized by heating and burning can be used as the raw material.
Sawdust,
Charcoal, coal, coconut shell, etc. are used. In recent years, from the viewpoint of recycling, thermosetting resin products containing phenolic resin, such as spools, culls, runners, etc., and waste paper impregnated with phenolic resin have been studied, but these can be used. . In addition, as a method for producing activated carbon, first, a raw material is placed in a nitrogen gas stream at 600 to 10%.
The carbonization is performed at a temperature of 00 ° C, more preferably 700 to 900 ° C. Subsequently, the temperature was maintained at this temperature, nitrogen gas was flowed during the carbonization, and after natural cooling, the carbide was taken out.
After the temperature is raised to a temperature of 800 to 900 ° C., more preferably 800 to 900 ° C., activation is performed by flowing steam. After carbonization, activation and cooling, it is pulverized and used.

Examples of the heat-resistant resin or its precursor (B) used in the present invention include polyimide resin, polyisoimide resin, polyamide-imide resin, and the like.
Examples thereof include a polyamide resin, a bismaleimide resin, a polybenzoxazole resin, a polyhydroxyamide resin, and a polybenzothiazole resin, but are not limited thereto. Examples of the precursor (B) of the heat-resistant resin include polyimide precursors such as polyamic acid, polyamic acid, polyamic acid ester and polyisoimide, and polybenzoxazole precursors such as polyhydroxyamide. It is not limited to. Among them, polyimide resin and polybenzoxazole resin are preferable because of their high heat resistance. These may be used alone, or may be mixed or copolymerized.

When a solvent is used as a component of the resin composition for insulating material of the present invention, examples of preferred solvents include N, N-dimethylacetamide, N-methyl-2-pyrrolidone, tetrahydrofuran, propylene glycol monomethyl Ether, propylene glycol monomethyl ether acetate, diethylene glycol monomethyl ether, γ-butyrolactone, 1,1,2,2-tetrachloroethane, and the like, but are not limited thereto. Also,
Two or more of these may be used simultaneously.

Further, additives other than the above components can be added to the resin composition for insulating material of the present invention according to the purpose. For example, a surfactant or the like may be added to improve applicability and impregnation.

The resin composition for an insulating material of the present invention is blended with each component so that the porosity of the insulating material is 18 to 30%. The weight ratio of component (A) to component (B) is from 5/95 to 20/80, more preferably from 7/93 to 15/85.
is there. They are obtained by uniformly mixing or chemically bonding them.

As an example of the method for producing an insulating material of the present invention, a resin composition for an insulating material of the present invention is dissolved in the above-mentioned solvent to form a varnish, and then a suitable support, for example, glass, metal,
Apply to silicon wafers and ceramic substrates. As a specific coating method, spin coating using a spinner,
Spray coating using a spray coater, dipping, printing, roll coating and the like can be mentioned. In this manner, an insulating material having a low dielectric constant can be formed by forming a coating film and drying by heating or heat condensation and drying.

[0023]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, which by no means limit the present invention.

Example 1 (1) Synthesis of polyimide resin In a separable flask equipped with a stirrer, a nitrogen inlet tube, and a raw material inlet, 2,2-bis (4- (4,4'-aminophenoxy) ) Phenyl) hexafluoropropane 5.1
8 g (0.01 mol) and 9.60 g of 2,2'-bis (trifluoromethyl) -4,4'-diaminobiphenyl
(0.03 mol) is dissolved in 200 g of dried N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP). The solution was cooled to 10 ° C. under dry nitrogen, and 2.94 g (0.01 mol) of biphenyltetracarboxylic dianhydride and 13.32 g of hexafluoroisopropylidene-2,2′-bis (phthalic anhydride) ( 0.03 mol) was added. After stirring for 5 hours after the addition, return to room temperature,
The mixture was stirred at room temperature for 2 hours to obtain a solution of polyamic acid as a polyimide precursor. After adding 50 g of pyridine to this polyamic acid solution, 5.1 g of acetic anhydride (0.05 mol) was added.
l) was added dropwise, and an imidization reaction was carried out for 7 hours while maintaining the temperature of the system at 70 ° C. This solution was dropped into a 20-fold amount of water to collect a precipitate, followed by vacuum drying at 60 ° C. for 72 hours to obtain a solid polyimide resin as a heat-resistant resin. The number average molecular weight of the polyimide resin was 26,000.

(2) Preparation of Activated Carbon Sawdust was crushed and sieved to a particle size of 9 to 24 mesh. 90g of the above sieved sample
Into a quartz tube having a diameter of about 60 mm and a length of about 1.5 m, and heated to 800 ° C. at a rate of 5 ° C./min in a tubular furnace.
The temperature was maintained for 40 minutes, and after natural cooling, a carbonized sample was taken out. During carbonization, nitrogen gas was flowed at 400 ml / min. Thereafter, 8 g of the carbonized sample was placed in a quartz tube having a diameter of about 40 mm and a length of about 1 m, and the temperature was raised at a rate of 30 ° C./m in a tube furnace.
The temperature was raised to 800 ° C. in, and after reaching the temperature, steam was flowed to activate for a predetermined time. During activation, nitrogen gas was flowed at 300 ml / min. After natural cooling, the activated carbon was taken out. 30 ml of 1 mol / L hydrochloric acid was added, and
Shaking acid washing was performed for 4 hours. After washing thoroughly with water,
It was air-dried and finely pulverized to 0.1 μmφ or less using a pulverizer. The specific surface area of the pores of the obtained activated carbon was measured by the BET specific surface area method and found to be 2,000 m ² / g.

(3) Preparation of Resin Composition for Insulating Material and Production of Insulating Material 10.0 g of the polyimide resin synthesized above was
After dissolving in 50.0 g of butyrolactone / 1,1,2,2-tetrachloroethane (70/30, vol / vol), add 1.5 g of the activated carbon obtained above and stir to obtain a resin composition for insulating material. I got This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere. In case of heat curing, 120 ° C / 4 minutes, 150 ° C
/ 30 minutes and then at 400 ° C. for 60 minutes.
Thus, a 0.8 μm thick insulating film was obtained. An aluminum electrode having an area of 0.1 cm ² was formed on the insulating film by vapor deposition, and the capacitance between the electrode and tantalum on the substrate was measured by an LCR meter. Film thickness,
The dielectric constant of the insulating material calculated from the electrode area and the capacitance was 2.35. Moreover, the density of the insulating material was determined to be 1.20 using a density gradient tube. The density when no activated carbon was added and there were no voids was 1.41, and the porosity was calculated from this to be 15.0%.

Example 2 (1) Synthesis of Polyimide Precursor In the synthesis of the polyimide resin of Example 1, 2,2′-bis (4- (4,4′-
5.18 g (0.01 mol) of aminophenoxy) phenyl) hexafluoropropane and 2,2′-bis (trifluoromethyl) -4,4′-diaminobiphenyl
60 g (0.03 mol) and 4,01′-diaminodiphenyl ether (8.01 g, 0.04 mol) and biphenyltetracarboxylic dianhydride 2.94 g (0.01
mol) and hexafluoroisopropylidene-2,2 '
13.32 g of bis (phthalic anhydride) (0.03 mol
l) and 8.72 g (0.04 g) of pyromellitic dianhydride
mol), a solution of polyamic acid as a polyimide precursor was obtained in the same manner as in Example 1. This solution was dropped into 20 times the volume of water to collect a precipitate.
Vacuum drying was performed for 2 hours to obtain a solid of polyamic acid, which is a precursor of polyimide as a heat-resistant resin. The number average molecular weight of the obtained polyamic acid was 28,000.

(2) Preparation of Activated Carbon Phenol resin (45 wt%) is used as phenol resin waste material which is a molding failure (including spools and runners).
Calcium carbonate (10 wt%), wood flour (35 wt%),
The material containing the curing agent (5 wt%) and the coloring agent (5 wt%) was crushed and sieved to a particle size of 9 to 24 mesh. 90 g of the above sieved sample is placed in a quartz tube having a diameter of about 60 mm and a length of about 1.5 m, and heated to 700 ° C. at a rate of 5 ° C./min in a tube furnace, and held at that temperature for 40 minutes. After natural cooling, a carbonized sample was taken out. During carbonization, nitrogen gas was flowed at 400 ml / min.
8 g of the carbonized sample obtained above was weighed at about 40 mm in diameter and about 1 in length.
m in a quartz tube and in a tube-shaped furnace at a heating rate of 30 ° C./min.
The temperature was raised to 900 ° C. at that temperature, and after reaching the temperature, steam was flowed to activate for a predetermined time. 3 nitrogen gas during activation
The flow was 00 ml / min. After natural cooling, the activated carbon was taken out. 2mol because raw material contains calcium carbonate etc.
Then, 30 ml of / L hydrochloric acid was added, and the mixture was shaken at room temperature for 24 hours to carry out acid washing. After washing with water, air drying was performed, and the mixture was finely pulverized to 0.1 μmφ or less using a pulverizer. The specific surface area of the pores of the activated carbon obtained above was measured by the BET specific surface area method.
00 m ² / g.

(3) Preparation of Resin Composition for Insulating Material and Production of Insulating Material 10.0 g of the polyamic acid synthesized as described above was treated with γ-butyrolactone / 1,1,2,2-tetrachloroethane (7
(0/30, vol / vol) 50.0 g, and then added with 1.0 g of the activated carbon obtained above and stirred to obtain a resin composition for insulating material. This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere.
In the case of heat curing, the film was kept at 120 ° C. for 4 minutes and 150 ° C. for 30 minutes, and then kept at 400 ° C. for 60 minutes. Thus, a coating of an insulating material having a thickness of 0.7 μm was obtained. The dielectric constant of this heat-resistant resin was measured in the same manner as in Example 1 and found to be 2.4. The density of the insulating material was determined to be 1.10. Since the density when no activated carbon was added and there were no voids was 1.43, the porosity was calculated to be 23.0% from this. Further, when the cross section of the insulating material film was observed with a TEM, it was found that voids having a diameter of 0.7 nm were uniformly dispersed.

Example 3 (1) Synthesis of polybenzoxazole resin 25 g of 4,4'-hexafluoroisopropylidenediphenyl-1,1'-dicarboxylic acid, thionyl chloride 45 m
l and 0.5 ml of dry dimethylformamide were placed in a reaction vessel and reacted at 60 ° C. for 2 hours. After completion of the reaction, excess thionyl chloride was distilled off by heating and reduced pressure. The residue was recrystallized using hexane to obtain 4,4'-hexafluoroisopropylidenediphenyl-1,1'dicarboxylic acid chloride. In a separable flask equipped with a stirrer, a nitrogen introducing tube, and a dropping funnel, 7.32 g (0.02 mol) of 2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoropropane was dried with dimethyl 2. Dissolved in 100 g of acetamide and pyridine
After adding 96 g (0.05 mol), under dry nitrogen introduction,
8.55 g of 4,4′-hexafluoroisopropylidenediphenyl-1,1′-dicarboxylic acid chloride synthesized above was added to 50 g of dimethylacetamide at −15 ° C.
(0.02 mol) was added dropwise over 30 minutes. After completion of the dropwise addition, the mixture was returned to room temperature and stirred at room temperature for 5 hours. Thereafter, the reaction solution was dropped into 1000 ml of water,
The precipitate was collected and vacuum-dried at 40 ° C. for 48 hours to obtain a solid polyhydroxyamide as a polybenzoxazole precursor. This polyhydroxyamide is converted to N
After 50 g of pyridine was added to the solution dissolved in 200 g of MP, 3.1 g (0.03 mol) of acetic anhydride was added dropwise, and the oxazole-forming reaction was carried out for 7 hours while maintaining the temperature of the system at 70 ° C. This solution was dropped into a 20-fold amount of water to collect a precipitate, followed by vacuum drying at 60 ° C. for 72 hours to obtain a polybenzoxazole resin solid as a heat-resistant resin. The number average molecular weight of the obtained polybenzoxazole resin is 20,0.
00.

(2) Preparation of Activated Carbon Phenol resin (45 wt%) is used as phenol resin waste material which is defective in molding (including spool and runner).
A material containing calcium carbonate (5 wt%), wood flour (40 wt%), a hardener (5 wt%) and a coloring agent (5 wt%) was crushed and sieved to a particle size of 9 to 24 mesh. 90 g of the sieved sample is placed in a quartz tube having a diameter of about 60 mm and a length of about 1.5 m, and the temperature is raised to 900 ° C. at a rate of 5 ° C./min in a tubular furnace, and the temperature is maintained for 40 minutes. After natural cooling, a carbonized sample was taken out. During carbonization, nitrogen gas was flowed at 400 ml / min. 8 g of the carbonized sample is placed in a quartz tube having a diameter of about 40 mm and a length of about 1 m, and heated at a rate of 30 ° C./min to 900 ° C. in a tubular furnace.
Then, after reaching the temperature, steam was flowed to activate for a predetermined time. During activation, nitrogen gas was added at 300 ml /
min. After natural cooling, the activated carbon was taken out. Since the raw material contains calcium carbonate and the like, 30 ml of 1 mol / L hydrochloric acid was added, and the mixture was shaken and washed with acid at room temperature for 24 hours. Perform air drying after washing with water and use a crusher to
It was pulverized to mφ or less. The specific surface area of the pores of the obtained activated carbon was measured by the BET specific surface area method. As a result, 2,000 m ² /
g.

(3) Preparation of Resin Composition for Insulating Material and Production of Insulating Material Polybenzoxazole resin synthesized as described above.
After dissolving 0 g in 50.0 g of γ-butyrolactone / 1,1,2,2-tetrachloroethane (70/30, vol / vol), 0.8 g of the activated carbon obtained above was added thereto, followed by stirring. A resin composition for materials was obtained. This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere. In case of heat curing, 120 ° C / 4 minutes,
After holding at 150 ° C. for 30 minutes, it was held at 400 ° C. for 60 minutes. Thus, a 0.7 μm thick insulating film was obtained. Thereafter, the dielectric constant of this heat-resistant resin was measured in the same manner as in Example 1, and it was 2.1. Further, the density of the insulating material was determined to be 1.11 by a density gradient tube. Since the density in the case where no activated carbon was added and there were no voids was 1.41, the porosity was calculated from this to be 21.3%. Further, when the cross section of the insulating material film was observed with a TEM, it was found that voids having a diameter of 0.6 nm were uniformly dispersed.

Example 4 (1) Synthesis of polyhydroxyamide 2,2'-bis (trifluoromethyl) biphenyl-
4,4'-dicarboxylic acid 22g, thionyl chloride 45ml
And 0.5 ml of dry dimethylformamide was put into a reaction vessel and reacted at 60 ° C. for 2 hours. After completion of the reaction, excess thionyl chloride was distilled off by heating and reduced pressure. The residue was recrystallized using hexane to obtain 2,2′-bis (trifluoromethyl) biphenyl-4,4′-dicarboxylic acid chloride. In a separable flask equipped with a stirrer, a nitrogen inlet tube, and a dropping funnel, 7.32 g (0.02 mol) of 2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoropropane was dried with dimethyl Dissolved in 100 g of acetamide and 3.96 g of pyridine
(0.05 mol), and then -15 under dry nitrogen introduction.
At 50 ° C., 50 g of dimethylacetamide was added to 2,2′-bis (trifluoromethyl) biphenyl-
8.30 g of 4,4'-dicarboxylic acid chloride (0.02
mol) was dropped over 30 minutes.
After completion of the dropwise addition, the mixture was returned to room temperature and stirred at room temperature for 5 hours.
Thereafter, the reaction solution was dropped into 1,000 ml of water, and the precipitate was collected and vacuum-dried at 40 ° C. for 48 hours to obtain a solid substance of polyhydroxyamide, which is a polybenzoxazole precursor which is a heat-resistant resin. The number average molecular weight of the obtained polyhydroxyamide was 20,000.

(2) Production of Activated Carbon Phenol resin (45 wt%) is used as phenol resin waste material which is defective in molding (including spools and runners).
Calcium carbonate (10 wt%), wood flour (35 wt%),
The material containing the curing agent (5 wt%) and the coloring agent (5 wt%) was crushed and sieved to a particle size of 9 to 24 mesh. 90 g of the above sieved sample is placed in a quartz tube having a diameter of about 60 mm and a length of about 1.5 m, heated in a tubular furnace to 900 ° C. at a rate of 5 ° C./min, held at that temperature for 40 minutes, and naturally cooled. After the carbonization sample was taken out. During carbonization, nitrogen gas was flowed at 400 ml / min. 8 g of the carbonized sample obtained above was placed in a quartz tube having a diameter of about 40 mm and a length of about 1 m, and heated to 800 ° C. at a rate of 30 ° C./min in a tubular furnace. It was activated for a predetermined time. 300 ml / mi of nitrogen gas during activation
Flowed n times. After natural cooling, the activated carbon was taken out. Since the raw material contains calcium carbonate, etc., 30m of 1mol / L hydrochloric acid
The mixture was shaken at room temperature for 24 hours to carry out acid washing. After washing with water, air drying was performed, and the mixture was finely pulverized to 0.1 μmφ or less using a pulverizer. The specific surface area of the pores of the obtained activated carbon is determined by BE.
As a result of measurement by the T specific surface area method, it was 1,800 m ² / g.

(3) Preparation of Resin Composition for Insulating Material and Production of Insulating Material 10.0 g of the polyhydroxyamide synthesized as described above was treated with γ-butyrolactone / 1,1,2,2-tetrachloroethane (70/30, vol. / vol), dissolved in 50.0 g, added with 1.6 g of the activated carbon obtained above, and stirred to obtain a resin composition for insulating material. This resin composition for an insulating material was spin-coated on a silicon wafer on which a 200-nm-thick tantalum film was formed, and then heated and cured in an oven in a nitrogen atmosphere. In case of heat curing, 120 ° C / 4 minutes, 150 ° C
/ 30 minutes and then at 400 ° C. for 60 minutes.
Thus, a coating of an insulating material having a thickness of 0.7 μm was obtained. Thereafter, the dielectric constant of this heat-resistant resin insulating material was measured in the same manner as in Example 1, and was 2.2. Also, when the density of the heat-resistant resin insulating material was determined using a density gradient tube,
1.14. Since the density when no activated carbon was added and there were no voids was 1.42, the porosity was calculated to be 19.7% from this. Further, when the cross section of the insulating material film was observed with a TEM, it was found that voids having a diameter of 0.8 nm were uniformly dispersed.

Comparative Example 1 The procedure of Example 1 was repeated, except that 2.0 g of the activated carbon used for preparing the resin composition for insulating material was not added. And the production of insulating materials. The dielectric constant of the obtained heat-resistant resin insulating material was 2.9, and the density was 1.41.
No void was observed in the cross section of the insulating film by TEM.

"Comparative Example 2" In the same manner as in Example 2, except that 2.0 g of the activated carbon used for preparing the resin composition for insulating material was not added, the preparation of the resin composition for insulating material was carried out. And the production of insulating materials. The obtained heat-resistant resin had a dielectric constant of 3.0 and a density of 1.43. TEM
No void was observed in the cross-section observation of the insulating film by the method.

Comparative Example 3 The procedure of Example 3 was repeated except that 2.0 g of the activated carbon used in the preparation of the resin composition for insulating material was not added. And the production of insulating materials. The dielectric constant of the obtained heat-resistant resin was 2.8, and the density was 1.41. TEM
No void was observed in the cross-section observation of the insulating material film.

Comparative Example 4 In the same manner as in Example 4, except that 2.0 g of the activated carbon used for preparing the resin composition for the insulating material was not added, the preparation of the resin composition for the insulating material was carried out. And the production of insulating materials. The dielectric constant of the obtained heat-resistant resin was 2.9, and the density was 1.42. TEM
No void was observed in the cross-section observation of the insulating material film.

In Examples 1 to 4, the dielectric constant was 2.1.
A very low heat-resistant resin of ~ 2.4 was obtained.
In Comparative Examples 1 to 4, the specific surface area was 1,000 to 2,000 m.
^The dielectric constant could not be reduced because it did not have the component (A) having a void structure of ² / g.

[0041]

Industrial Applicability The resin composition for insulating material of the present invention and the insulating material using the same are excellent in electrical properties and heat resistance, and are used in various fields where these properties are required, for example,
Synthetic resin useful as an interlayer insulating film for semiconductors, an interlayer insulating film for multilayer circuits, and the like.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) C08L 79/04 C08L 79/04 B 79/08 79/08 Z H01L 21/312 H01L 21/312 AB 21/768 21 / 90 N 23/14 S 23/14 R

Claims (5)

[Claims] 1. A specific surface area of 1,000 m ² / g to 2.0
A resin composition for an insulating material comprising a component (A) having a pore structure of 00 m ² / g and a heat-resistant resin or its precursor (B) as essential components. 2. A specific surface area of 1,000 m ² / g to 2.0
The resin composition for an insulating material according to claim 1, wherein the component (A) having a pore structure of 00 m ² / g is activated carbon. 3. The heat-resistant resin or a precursor (B) thereof,
The resin composition for an insulating material according to any one of claims 1 to 3, which is a polybenzoxazole resin or a polybenzoxazole precursor. 4. The heat-resistant resin or a precursor (C) thereof,
2. A polyimide resin or a polyimide precursor.
3. The resin composition for an insulating material according to any one of items 2 to 2. 5. An insulating material obtained by using the resin composition for an insulating material according to claim 1. Description: