JP2002241565A - Diallyl phthalate resin molding material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To impart a diallyl phthalate resin molding material with excellent flexibility without deteriorating the excellent electrical properties, heat resistance, etc., of conventional diallyl phthalate resin. SOLUTION: The diallyl phthalate resin molding material contains (a) 20-40 wt.% (based on the total molding material) diallyl phthalate resin and (b) 40-60 wt.% inorganic base material as essential components and further contains (c) 10-25 pts.wt. (based on 100 pts.wt. of the diallyl phthalate resin (a)) of a bisphenol A-type vinyl ester.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a diallyl phthalate resin molding material having excellent flexibility. The diallyl phthalate resin molding material of the present invention has excellent electrical properties and heat resistance, and is particularly used for molded articles having excellent mechanical properties useful for small electronic parts.

[0002]

2. Description of the Related Art A diallyl phthalate resin is required to have high reliability along with an epoxy resin and an unsaturated polyester resin because of its excellent arc resistance, insulation, dielectric properties and electric resistance under high temperature and high humidity. It is widely used for molding materials for electric and electronic parts. In addition, it has excellent dimensional stability, heat resistance, and chemical resistance, and is used as a resin for decorative plates and laminates. Ammonia-free phenolic resins are also used for electric and electronic parts because of their high strength and high heat resistance, but their use is limited due to their poor electrical properties compared to the diallyl phthalate resin.

[0003] Since diallyl phthalate resin is hard and brittle like other thermosetting resins, diallyl phthalate resin molding materials have conventionally been used for organic base materials such as pulp and inorganic base materials such as glass and clay. The material is mainly blended for the purpose of improving mechanical properties such as impact resistance and bending strength. However, with recent miniaturization of electrical and electronic equipment, the demands on mechanical properties, heat resistance, and the like of each component have become strict, and cracks and chips at thin portions have become a problem. One of the methods for improving this defect is a method for imparting flexibility. However, the improvement by the above-described base material blending often causes a decrease in heat resistance and electrical properties, and the effect is not sufficient. I can't say. Therefore, it is required to impart flexibility to the diallyl phthalate resin molding material while maintaining electrical characteristics, heat resistance, and the like.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a diallyl phthalate resin molding material with flexibility without impairing the excellent electrical properties and heat resistance of the conventional diallyl phthalate resin. The purpose is to improve the characteristics.

[0005]

According to the present invention, there are provided (1) 20 to 40% by weight of diallyl phthalate resin and (b) 40 to 60% by weight of an inorganic base material based on the whole molding material. A diallyl phthalate resin molding material, which is contained as an essential component and contains 10 to 25 parts by weight of a bisphenol A type vinyl ester with respect to 100 parts by weight of the diallyl phthalate resin of (a), (2) bisphenol A type Number average molecular weight of the vinyl ester is from 1000 to 20
The diallyl phthalate resin molding material according to item (1), which is 00.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the diallyl phthalate resin is used in an ortho-type, an iso-type or a para-type or in combination of two or more. When high heat resistance is required for molded articles, it is preferable to use isotype or paratype ones. Further, considering the viscosity of the resin and the like, the weight average molecular weight is 15,000 to 500.
It is preferable to use those having an iodine value of 55 to 90 and a softening point of 50 to 85 ° C.

The amount of the diallyl phthalate resin is preferably 20 to 40% by weight based on the whole molding material. When the diallyl phthalate resin is more than 40% by weight,
The viscosity decreases and it becomes difficult to make a molding material. On the other hand, if it is less than 20% by weight, the electrical properties and mechanical properties of the molded article tend to decrease, which is not preferred. In consideration of the balance between the electrical properties, moldability, and the like, the content is more preferably 30 to 40% by weight.

The bisphenol A type vinyl ester used in the present invention is not particularly limited, but preferably has a number average molecular weight of 1,000 to 2,000, is solid at ordinary temperature, and has a melting point of 50 to 80 ° C. In order to improve the mechanical properties without lowering the electrical properties, bisphenol A is used with respect to 100 parts by weight of the diallyl phthalate resin.
It is desirable to use the vinyl ester in a ratio of 10 to 25 parts by weight. If the amount is less than 10 parts by weight, the effect of improving the mechanical properties is insufficient, and if it exceeds 25 parts by weight, the viscosity decreases and it becomes difficult to form a molding material. In consideration of mechanical properties and the like, the content is more preferably 15 to 25 parts by weight.

In the present invention, 22 to 50% by weight of the diallyl phthalate resin and the bisphenol A type vinyl ester can be added to the entire molding material, but the workability during molding material production and the Considering the mechanical properties of the product, it is more preferably 35 to 50% by weight.

The bisphenol A type vinyl ester used in the present invention has a characteristic of being excellent in chemical resistance, heat resistance, especially toughness and impact resistance even when used alone, and is cured by an organic peroxide like diallyl phthalate resin. By blending the bisphenol A type vinyl ester with the diallyl phthalate resin, a bisphenol A type vinyl ester having excellent flexibility can be incorporated into the crosslinked structure, and as a result, the mechanical properties of the molded article can be improved. I can do it.

The inorganic substrate used in the present invention includes glass fiber, clay, calcium carbonate, magnesium oxide and the like. If necessary, a flame retardant substrate such as magnesium hydroxide and antimony trioxide may be used in combination. Good. It is preferable that the blending amount of the inorganic base material with respect to the whole molding material is 40 to 60% by weight. If it exceeds 60% by weight, it becomes difficult to form a molding material, and if it is less than 40% by weight, mechanical properties and dimensional stability deteriorate. In consideration of moldability and mechanical properties, the content is more preferably 40 to 50% by weight.

When glass fibers are blended as an inorganic base material with the diallyl phthalate resin molding material, mechanical strength and dimensional stability can be improved while maintaining heat resistance. It is preferable that the ratio of the glass fiber to be added to the molding material is 60 to 100% by weight based on the whole inorganic base material.
If it is less than 60% by weight, the mechanical properties are not sufficiently improved. Chopped strands and the like can be used as glass fibers. Chopped strand has an average fiber diameter of 3 to 15μ
m and a fiber length of 1.5 to 6.0 mm are preferably used.

[0013] The diallyl phthalate resin molding material of the present invention is mixed with the above-described raw materials and blending materials, and if necessary, raw materials such as a release agent, a pigment, a reaction initiator, a silane coupling agent and the like are added thereto. It is obtained by melt-kneading using a roll, a pressure roll, and a twin-screw extruder, and pulverizing or granulating.

[0014]

EXAMPLES The present invention will be described below with reference to examples. The composition having the composition shown in Table 1 was kneaded with a heating roll at 90 ° C. for 5 minutes, cooled, and pulverized to obtain a molding material. A test piece was prepared from the obtained molding material using an injection molding machine (molding condition: mold temperature 170 ° C .; curing time 4 minutes) according to JIS K 6911, and the characteristics were measured. The results shown in Table 2 were obtained.

[0015]

[Table 1]

[0016]

[Table 2]

As shown in Tables 1 and 2, the molded articles made of the molding material of the present invention (Examples 1, 2 and 3) were different from the molded articles containing no bisphenol A type vinyl ester (Comparative Example 2). Bending strength, Charpy impact strength,
Although there is no difference between the solder heat resistance and the insulation resistance, the flexural modulus is small and the flexibility is excellent. In Comparative Example 1, the amount of the compound containing bisphenol A-type vinyl ester was small, and the effect of improving flexibility was small as compared with Comparative Example 2 in which the compound was not mixed.

[0018]

According to the present invention, the entire molding material is
(A) 20 to 40% by weight of diallyl phthalate resin,
(B) an inorganic base material containing 40 to 60% by weight as an essential component, and (a) the diallyl phthalate resin 100
1 part by weight of bisphenol A type vinyl ester
It is a diallyl phthalate resin molding material characterized by containing 0 to 25 parts by weight, and excellent flexibility of the diallyl phthalate resin molding material without impairing the excellent electrical properties and heat resistance of the conventional diallyl phthalate resin. Can be given.

Claims (2)

[Claims] 1. An essential component comprising (a) 20 to 40% by weight of a diallyl phthalate resin and (b) 40 to 60% by weight of an inorganic base material with respect to the whole molding material; A) a diallyl phthalate resin molding material, which contains 10 to 25 parts by weight of a bisphenol A type vinyl ester based on 100 parts by weight of the diallyl phthalate resin of the above). 2. The diallyl phthalate resin molding material according to claim 1, wherein the bisphenol A type vinyl ester has a number average molecular weight of 1,000 to 2,000.