JP2002241143A - Sealing composition - Google Patents
Sealing compositionInfo
- Publication number
- JP2002241143A JP2002241143A JP2001033860A JP2001033860A JP2002241143A JP 2002241143 A JP2002241143 A JP 2002241143A JP 2001033860 A JP2001033860 A JP 2001033860A JP 2001033860 A JP2001033860 A JP 2001033860A JP 2002241143 A JP2002241143 A JP 2002241143A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- glass
- sealing
- low
- sealing composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、低融点ガラスを含
む封着用組成物に関するものであって、特に、前記低融
点ガラスの組成の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing composition containing a low-melting glass, and more particularly to an improvement in the composition of the low-melting glass.
【０００２】[0002]
【従来の技術】従来、電子部品の接着、封着、被覆、絶
縁などの目的に、低融点ガラスを含む封着用組成物が用
いられている。この封着用組成物は、前記目的のために
６００℃以下の温度で焼成可能であることが要件であ
り、そのための低融点ガラスとして、いくつかの研究、
開発がなされている。例えば、特開平１０−１３９４７
８号公報、特開平９−２６８０２６号公報には、ＰｂＯ
を含まず、酸化ビスマス（Ｂｉ2Ｏ3）を必須成分とする
低融点ガラスが開示されている。2. Description of the Related Art Conventionally, a sealing composition containing a low-melting glass has been used for the purpose of bonding, sealing, coating, insulating and the like of electronic parts. It is a requirement that the sealing composition can be fired at a temperature of 600 ° C. or lower for the above purpose.
Development is being done. For example, JP-A-10-13947
No. 8 and JP-A-9-268026 disclose PbO
And a low-melting glass containing bismuth oxide (Bi 2 O 3 ) as an essential component is disclosed.
【０００３】ところが、これらの低融点ガラスは、成分
としてＳｉＯ2を含まないか、または少量しか含んでお
らず、ガラス化する際にシャモット質や石英質製容器を
用いて溶融を行うと、容器の浸蝕性が激しく、所望の性
能のガラスが得られない。また、白金製容器を用いて
も、浸蝕程度は軽減するものの、数回、使用するだけで
容器の改鋳が必要であり、製造コストが異常に高くなる
などという製造上の問題があった。However, these low-melting glasses do not contain or contain only a small amount of SiO 2 as a component, and when vitrification is carried out using a chamotte or quartz container, the melting point of the container becomes low. Is so corrosive that glass with desired performance cannot be obtained. Further, even when a platinum container is used, although the degree of erosion is reduced, recasting of the container is required only by using the container several times, and there has been a problem in manufacturing that the manufacturing cost becomes abnormally high.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の問題
点を解決するためになされたものであり、封着用組成物
としての物性を維持しながら、製造時の浸蝕性を緩和し
た新規な組成の低融点ガラスを提供するとともに、封着
用組成物としての構成材料の新しい組合わせを提供す
る。DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a novel erosion property at the time of production has been reduced while maintaining physical properties as a sealing composition. The present invention provides a low-melting glass of a composition and a new combination of constituent materials as a sealing composition.
【０００５】[0005]
【課題を解決するための手段】上記の問題は、酸化物組
成で、Ｂｉ2Ｏ3：４０〜９０％（重量％、以下同じ）、
ＳｉＯ2：３〜２０％、ＺｎＯ：４〜２０％、Ａｌ
2Ｏ3：０〜１０％、Ｂ2Ｏ3：０〜２０％、Ｐ2Ｏ5：０〜
１０％の組成のガラスを含むことを特徴とする本発明の
封着用組成物によって、解決することができる。また、
この本発明は、前記ガラスが、その軟化点が５５０℃以
下の低融点ガラスである形態、あるいは前記したガラス
の粉末と低熱膨張性のセラミックスフィラーの粉末を含
むことを特徴とする封着用組成物に具体化することがで
きる。The above problem [Summary of] is the oxide composition, Bi 2 O 3: 40~90% ( wt%, hereinafter the same),
SiO 2 : 3 to 20%, ZnO: 4 to 20%, Al
2 O 3 : 0 to 10%, B 2 O 3 : 0 to 20%, P 2 O 5 : 0
The problem can be solved by the sealing composition of the present invention, which comprises 10% of glass. Also,
The present invention provides a sealing composition, wherein the glass is a low-melting glass having a softening point of 550 ° C. or lower, or contains the above-mentioned glass powder and a low thermal expansion ceramic filler powder. It can be embodied in
【０００６】[0006]
【発明の実施の形態】次に、本発明の封着用組成物に係
る実施形態について、その実施例の結果を示す表１を参
照しながら説明する。本発明の封着用組成物は、主要構
成材料として、下記の低融点ガラスを含み、その他に、
ジルコン、コージライト、β−ユークリプタイトなど補
助的添加物を含み得るものである。先ず、本発明の特徴
事項は、主要構成材料である低融点ガラスが次の組成か
らなるところにある。すなわち、それは、酸化物組成
で、Ｂｉ 2Ｏ3：４０〜９０％（重量％、以下同じ）、Ｓ
ｉＯ2：３〜２０％、ＺｎＯ：４〜２０％、Ａｌ2Ｏ3：
０〜１０％、Ｂ2Ｏ3：０〜２０％、Ｐ2Ｏ5：０〜１０％
の組成である。また、より好ましくは、Ｂｉ2Ｏ3：５５
〜７５％、ＳｉＯ2：５〜１５％、ＺｎＯ：７〜１５
％、Ａｌ2Ｏ3：０〜５％、Ｂ2Ｏ3：２〜１８％、Ｐ
2Ｏ5：０〜８％の組成である。Next, the sealing composition of the present invention will be described.
Table 1 showing the results of the examples of the embodiments.
It will be explained while referring to the figures. The sealing composition of the present invention has a main structure
As a material, including the following low-melting glass, in addition,
Complements such as zircon, cordierite, and β-eucryptite
It may contain auxiliary additives. First, the features of the present invention
Matters are whether the low melting glass, which is the main constituent material, has the following composition:
Is where it comes from. That is, it is the oxide composition
And Bi TwoOThree: 40 to 90% (% by weight, the same applies hereinafter), S
iOTwo: 3 to 20%, ZnO: 4 to 20%, AlTwoOThree:
0-10%, BTwoOThree: 0 to 20%, PTwoOFive: 0 to 10%
The composition of Also, more preferably, BiTwoOThree: 55
~ 75%, SiOTwo: 5 to 15%, ZnO: 7 to 15
%, AlTwoOThree: 0-5%, BTwoOThree: 2 to 18%, P
TwoOFive: 0 to 8% composition.
【０００７】次に、本発明の封着用組成物の主構成材で
ある低融点ガラスの各成分について説明する。先ず、Ｂ
ｉ2Ｏ3 は、本発明のガラスの軟化点を低く維持するた
めの必須成分であって、その含有量は４０〜９０％（重
量％、以下同じ）である。これは、Ｂｉ2Ｏ3 の含有量
がこの下限を下回ると軟化点が高くなり、封着のための
６００℃以下での焼成処理が困難になるからであり、ま
た同様に上限値を超えても軟化点が高くなるからであ
る。さらに好ましい含有量は５５〜７５％である。Next, each component of the low-melting glass, which is a main component of the sealing composition of the present invention, will be described. First, B
i 2 O 3 is an essential component for keeping the softening point of the glass of the present invention low, and its content is 40 to 90% (% by weight, the same applies hereinafter). This is because if the content of Bi 2 O 3 falls below this lower limit, the softening point becomes higher, and it becomes difficult to perform a baking treatment at 600 ° C. or lower for sealing. This is also because the softening point becomes higher. A more preferred content is 55 to 75%.
【０００８】ＳｉＯ2もＢｉ2Ｏ3 同様に必須成分であ
り、ガラスを安定させるとともに、溶融時に容器である
耐火物の浸蝕を低減する成分として作用する。その好ま
しい含有量は３〜２０％である。これは、その含有量が
下限値を下回ると前記の耐火物に対する浸蝕が激しくな
り、一方、上限値を超えると軟化点が高くなって好まし
い６００℃以下での焼成処理が困難になるからである。
より好ましい含有量は、５〜１５％が適当である。[0008] SiO 2 is also an essential component like Bi 2 O 3 , and serves as a component that stabilizes glass and reduces erosion of a refractory which is a container during melting. Its preferred content is 3-20%. This is because if the content is below the lower limit, the erosion of the refractory becomes severe, while if the content exceeds the upper limit, the softening point becomes high, and it becomes difficult to perform the firing treatment at a preferable 600 ° C. or lower. .
More preferably, the content is 5 to 15%.
【０００９】ＺｎＯは、ガラスの安定化に大きく寄与す
る成分であり、４〜２０％の含有量が必須である。この
理由は、ＺｎＯの含有量が下限値を下回ると、ガラスが
不安定となり結晶質が発生しやすく、失透する場合があ
り、また上限値を超えると溶融時のガラスの粘性が高く
なり、好ましい６００℃以下での焼成処理では封着が困
難になるからである。さらに好ましい含有量は、７〜１
５％が適当である。[0009] ZnO is a component that greatly contributes to the stabilization of glass, and its content of 4 to 20% is essential. The reason for this is that if the ZnO content is below the lower limit, the glass becomes unstable and crystallinity is likely to occur, and the glass may be devitrified.If it exceeds the upper limit, the viscosity of the glass at the time of melting increases, This is because sealing becomes difficult in a preferable firing treatment at 600 ° C. or lower. More preferable content is 7-1.
5% is appropriate.
【００１０】Ａｌ2Ｏ3成分は、ガラスの安定化に有効な
成分ではあるが、本発明では必須成分ではなく、好まし
い含有量は０〜１０％であり、これは、この上限値を超
えると前記に同じくガラスの粘性が高くなり、６００℃
以下での焼成処理では封着が困難になるからである。そ
して、より好ましい含有量は０〜５％である。Although the Al 2 O 3 component is a component effective for stabilizing glass, it is not an essential component in the present invention, and its preferable content is 0 to 10%. As before, the viscosity of the glass increases,
This is because sealing becomes difficult in the following firing treatment. And more preferable content is 0-5%.
【００１１】Ｂ2Ｏ3は、ガラスを安定化させる成分であ
り、含有量は０〜２０％の範囲が適当であり、好ましく
は、２〜１８％の範囲で含有させるのがより適当であ
る。これはＢ2Ｏ3の含有量が上限値を超えるようになる
と、前記に同じく、６００℃以下での焼成処理では封着
が困難になるからである。B 2 O 3 is a component for stabilizing glass, and its content is suitably in the range of 0 to 20%, preferably in the range of 2 to 18%. . This is because if the content of B 2 O 3 exceeds the upper limit, sealing becomes difficult in the calcination treatment at 600 ° C. or lower, as described above.
【００１２】Ｐ2Ｏ5：は、溶融時のガラスをより低粘性
化する成分であり、その含有量は０〜１０％である。こ
のＰ2Ｏ5を多く含有させるとガラスの化学的耐久性が低
下するので、より好ましくは、８％以下の含有量が適当
である。P 2 O 5 : is a component for lowering the viscosity of glass at the time of melting, and its content is 0 to 10%. Since P 2 O 5 the number is contained chemical durability of the glass decreases, and more preferably, is suitable content of 8% or less.
【００１３】以上説明した低融点ガラスは、その製造時
の溶融状態における浸蝕性が緩和され、シャモット質、
石英質などのセラミック製耐火容器が実用的に使用可能
となるので、従来の白金製容器に比較して材料費が大幅
に低減することができるようになった。さらに、本発明
の封着用組成物では、かくして得られた低融点ガラスを
主成分として含有させることにより、その熱膨張係数が
好ましい５０〜９０×１０-7／℃の範囲のものとなり、
かつ、６００℃以下での好ましい温度での封着のための
焼成処理が可能となる。なお、本発明の封着用組成物
は、対象物との封着、接着、被覆、絶縁などに用いられ
得る組成物を意味し、狭義の封着用に限定されるもので
はないことを注記する。The low-melting glass described above has a reduced erodibility in the molten state during its production,
Since a ceramic refractory container made of quartz or the like can be used practically, material costs can be greatly reduced as compared with a conventional platinum container. Furthermore, in the sealing composition of the present invention, the low-melting-point glass thus obtained is contained as a main component, so that the coefficient of thermal expansion thereof is preferably in the range of 50 to 90 × 10 −7 / ° C.,
In addition, a firing treatment for sealing at a preferable temperature of 600 ° C. or less can be performed. It should be noted that the sealing composition of the present invention means a composition that can be used for sealing, adhesion, coating, insulation, and the like with an object, and is not limited to sealing in a narrow sense.
【００１４】ここで、本発明の封着用組成物の添加成分
であるフィラー成分について、説明する。以下に説明す
るフィラー成分は、本発明の封着用組成物による対象物
との封着、接着、被覆、絶縁などの構造体の機械的強度
を向上させる目的で添加されるほか、対象物との熱膨張
特性の差異を是正する目的で添加される成分である。Here, the filler component which is an additive component of the sealing composition of the present invention will be described. The filler component described below is added for the purpose of improving the mechanical strength of the structure such as sealing, adhesion, coating, and insulation with the object by the sealing composition of the present invention. It is a component added for the purpose of correcting differences in thermal expansion characteristics.
【００１５】本発明では、フィラー成分として、低膨張
性セラミックス、例えば、ジルコン、コージライト、ア
ルミナ、ムライト、シリカ、β−ユークリプタイト、β
−スポジュメン、β−石英固溶体から選択される１種ま
たは２種以上の粉末が好ましい添加物である。特に、コ
ージライト、β−ユークリプタイト、β−スポジュメ
ン、β−石英固溶体は、前記性能向上の効果に加えて、
熱膨張係数が特に低いので好ましい。そして、本発明の
封着用組成物の好ましい配合は、前記低融点ガラスを５
０〜１００重量％、前記フィラーを０〜５０重量％とす
るのが、焼成時の流動性を確保するために適当である。In the present invention, low-expandable ceramics such as zircon, cordierite, alumina, mullite, silica, β-eucryptite, β
One or more powders selected from spodumene and β-quartz solid solution are preferred additives. In particular, cordierite, β-eucryptite, β-spodumene, β-quartz solid solution, in addition to the effect of improving the performance,
This is preferable because the coefficient of thermal expansion is particularly low. The preferred composition of the sealing composition of the present invention is such that the low melting glass is
It is appropriate to set the amount of the filler to 0 to 100% by weight and the amount of the filler to 0 to 50% by weight in order to secure fluidity during firing.
【００１６】[0016]
【実施例】次に、本発明のいくつかの実施例とその比較
例に関して、その低融点ガラスの組成に基づき、組成物
の構成、得られた物性などを次の表１に示す。ここで、
低融点ガラスは、表の組成になるよう適宜な化合物を配
合し、シャモット質製容器に収容し、電気炉中で１００
０℃〜１２００℃で溶融して、製作した。次いで、この
ガラスをボールミルで粉砕し、低融点ガラス粉末を得
た。EXAMPLES Table 1 below shows the composition of the composition and the properties obtained based on the composition of the low-melting glass for some examples of the present invention and comparative examples. here,
The low-melting glass was mixed with an appropriate compound so as to have the composition shown in the table, stored in a chamber made of chamotte, and placed in an electric furnace for 100 minutes.
It was manufactured by melting at 0 ° C to 1200 ° C. Next, this glass was pulverized with a ball mill to obtain a low-melting glass powder.
【００１７】これらの低融点ガラス粉末と、低膨張セラ
ミックスフィラー粉末とを表１の構成欄に示す重量割合
で混合し、封着用組成物を調製した。次いで、この封着
用組成物について得られたガラス転移点、軟化点、熱膨
張係数、および焼成温度を表１下段に示す。なお、例１
〜７は実施例、例２１〜２４は比較例である。These low-melting glass powders and low-expansion ceramic filler powder were mixed in the weight ratios shown in the constitution column of Table 1 to prepare a sealing composition. Next, the lower part of Table 1 shows the glass transition point, softening point, coefficient of thermal expansion, and firing temperature obtained for this sealing composition. Example 1
7 to 7 are Examples, and Examples 21 to 24 are Comparative Examples.
【００１８】ここで、ガラス転移点、軟化点は、示差熱
分析装置（ＤＴＡ）により求めた。熱膨張係数は、この
封着用組成物をプレス成形し、焼成して得られた試料に
ついて熱機械的分析装置（ＴＭＡ）を用いて測定した、
１００℃〜３００℃の範囲の平均熱膨張係数である。な
お、焼成温度は、封着用組成物を樹脂と混練して、ガラ
ス基板上に厚み１００μｍで印刷して得た試料につい
て、電気炉中で焼成して前記ガラス基板上に焼き付ける
ことが可能な温度を示した。Here, the glass transition point and the softening point were determined by a differential thermal analyzer (DTA). The coefficient of thermal expansion was measured using a thermomechanical analyzer (TMA) on a sample obtained by press-molding and baking the sealing composition.
Average coefficient of thermal expansion in the range of 100 ° C to 300 ° C. The firing temperature is a temperature at which a sample obtained by kneading the sealing composition with a resin and printing it on a glass substrate with a thickness of 100 μm can be fired in an electric furnace and baked on the glass substrate. showed that.
【００１９】また、浸蝕性は、次の方法で評価した。表
１に記載したガラスを溶融した容器の断面を観察し、浸
蝕部位の容器内面からの距離を測定した。その距離が２
ｍｍ以内を○：浸蝕が少ない、２〜５ｍｍを△：実用困
難、それ以上を×：浸蝕性大で実用不可と判定した。な
お、結晶性は、封着のための熱処理で結晶化が認められ
るか否かで判定した。この結晶性の場合は非結晶性に較
べて、機械的強度が向上し、封着部位を再加熱したとき
に、再流動するのを抑制する機能があるものである。The erodibility was evaluated by the following method. The cross section of the container in which the glass described in Table 1 was melted was observed, and the distance of the erosion site from the inner surface of the container was measured. That distance is 2
Within mm, ：: little erosion, 2-5 mm: △: practically difficult, and beyond: ：: large erosion, judged unpracticable. The crystallinity was determined based on whether or not crystallization was observed in the heat treatment for sealing. In the case of the crystallinity, the mechanical strength is improved as compared with the non-crystallinity, and it has a function of suppressing reflow when the sealing portion is reheated.
【００２０】この表１の結果によれば、本発明の組成範
囲の低融点ガラスは、比較例のガラスが耐火物に対する
激しい浸蝕性を示すのに対して、その浸蝕性はきわめて
穏やかであり、セラミックス製の耐火物容器が使用でき
るようになったことが理解される。また、この低融点ガ
ラスを用いた封着用組成物は、熱膨張係数が５０〜９０
×１０-7／℃の範囲にあり、かつ、６００℃以下の封着
のための低温度の焼成処理が可能であるものとなった。
これに対して、比較例の場合は、焼成温度が不適当であ
るか、またはそのガラスは浸蝕性が極めて劣ることが理
解される。According to the results shown in Table 1, the low melting point glass having the composition range of the present invention has a very mild erosion while the glass of the comparative example shows severe erosion to refractories. It is understood that a ceramic refractory container can now be used. The sealing composition using the low-melting glass has a coefficient of thermal expansion of 50 to 90.
It was in the range of × 10 −7 / ° C., and a low-temperature baking treatment for sealing at 600 ° C. or less was possible.
On the other hand, in the case of the comparative example, it is understood that the sintering temperature is inappropriate or that the glass has extremely poor erosion.
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【発明の効果】本発明の封着用組成物では、以上説明し
たように構成されているので、その構成主材料である無
鉛系低融点ガラスを低コストに製造することができるの
で、従来より安価な封着用組成物を提供できる。かくし
て、封着用焼成温度が適当であり、封着後の適度な熱膨
張係数など、電子部品の封着のほか、接着、被覆、絶縁
などの目的に好適に応用することができるという優れた
効果がある。よって本発明は、従来の問題点を解消した
封着用組成物として、工業的価値はきわめて大なるもの
がある。According to the sealing composition of the present invention, since it is constituted as described above, it is possible to produce a lead-free low-melting glass, which is a main constituent material thereof, at a low cost, so that it is less expensive than the conventional one. The present invention can provide a novel sealing composition. Thus, an excellent effect that the firing temperature for sealing is appropriate, and it can be suitably applied to purposes such as bonding, coating, and insulation, in addition to sealing electronic components, such as an appropriate coefficient of thermal expansion after sealing. There is. Therefore, the present invention has an extremely large industrial value as a sealing composition which has solved the conventional problems.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小塚 達矢 愛知県半田市港町４丁目５番地５ 日本フ リット株式会社内 Ｆターム(参考） 4G062 DA03 DA04 DB01 DB02 DB03 DC01 DC02 DC03 DC04 DD01 DD02 DD03 DE03 DE04 DF01 EA01 EA10 EB01 EC01 ED01 EE01 EF01 EG01 FA01 FA10 FB01 FC01 FD01 FE01 FF01 FG01 FH01 FJ01 FK01 FL01 GA05 GA06 GA07 GB01 GC01 GD01 GE01 HH01 HH03 HH05 HH07 HH09 HH11 HH13 HH15 HH17 HH20 JJ01 JJ03 JJ05 JJ07 JJ10 KK01 KK03 KK05 KK07 KK10 MM23 MM40 NN32 NN33 NN34 NN40 PP01 PP02 PP03 PP06 4M109 AA03 EA18 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Tatsuya Kozuka 4-5-5 Minatomachi, Handa-shi, Aichi F-Term in Japan Flit Co., Ltd. 4G062 DA03 DA04 DB01 DB02 DB03 DC01 DC02 DC03 DC04 DD01 DD02 DD03 DE03 DE04 DF01 EA01 EA10 EB01 EC01 ED01 EE01 EF01 EG01 FA01 FA10 FB01 FC01 FD01 FE01 FF01 FG01 FH01 FJ01 FK01 FL01 GA05 GA06 GA07 GB01 GC01 GD01 GE01 HH01 HH03 HH05 HH07 HH09 KKHJ KK NN32 NN33 NN34 NN40 PP01 PP02 PP03 PP06 4M109 AA03 EA18
Claims (3)
（重量％、以下同じ）、ＳｉＯ2：３〜２０％、Ｚｎ
Ｏ：４〜２０％、Ａｌ2Ｏ3：０〜１０％、Ｂ2Ｏ3：０〜
２０％、Ｐ2Ｏ5：０〜１０％の組成のガラスを含むこと
を特徴とする封着用組成物。An oxide composition, Bi 2 O 3 : 40-90%
(% By weight, the same applies hereinafter), SiO 2 : 3 to 20%, Zn
O: 4~20%, Al 2 O 3: 0~10%, B 2 O 3: 0~
A sealing composition comprising glass having a composition of 20% and P 2 O 5 : 0 to 10%.
の低融点ガラスである請求項１に記載の封着用組成物。2. The sealing composition according to claim 1, wherein the glass is a low-melting glass having a softening point of 550 ° C. or lower.
低熱膨張性のセラミックスフィラーの粉末を含むことを
特徴とする封着用組成物。3. A sealing composition comprising the glass powder according to claim 1 and a ceramic filler powder having low thermal expansion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001033860A JP2002241143A (en) | 2001-02-09 | 2001-02-09 | Sealing composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001033860A JP2002241143A (en) | 2001-02-09 | 2001-02-09 | Sealing composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002241143A true JP2002241143A (en) | 2002-08-28 |
Family
ID=18897551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001033860A Pending JP2002241143A (en) | 2001-02-09 | 2001-02-09 | Sealing composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002241143A (en) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003034550A (en) * | 2001-07-24 | 2003-02-07 | Asahi Glass Co Ltd | Lead-free glass, glass frit, glass paste, electronic circuit part and electronic circuit |
| WO2004037736A1 (en) * | 2002-10-23 | 2004-05-06 | Matsushita Electric Industrial Co., Ltd. | Gap bonding glass for magnetic heads and magnetic head |
| JP2006160599A (en) * | 2004-11-11 | 2006-06-22 | Sony Corp | Lead-free glass composition and magnetic head |
| KR100653408B1 (en) * | 2006-05-01 | 2006-12-04 | (주)세라 | Lead-free frit composition and paste composition comprising said frit for flat display panel sealing |
| KR100833474B1 (en) * | 2006-10-27 | 2008-05-29 | 대주전자재료 주식회사 | Hermetically sealed and low melted glass and glass composite in OLED |
| JP2008303076A (en) * | 2007-06-05 | 2008-12-18 | Central Glass Co Ltd | Lead-free insulating coating material |
| WO2009014029A1 (en) | 2007-07-20 | 2009-01-29 | Nippon Electric Glass Co., Ltd. | Sealing material, sealing tablet, and glass composition for sealing |
| KR100882789B1 (en) | 2007-06-15 | 2009-02-09 | 건국대학교 산학협력단 | Spherical shape glass frit powders with high dispersabiltiy and Process for the Same |
| JP2009120462A (en) * | 2007-11-19 | 2009-06-04 | Asahi Glass Co Ltd | Lead-free glass for manufacturing dye-sensitized type solar cell and glass ceramic composition |
| KR100907455B1 (en) | 2007-09-28 | 2009-07-13 | 삼성전기주식회사 | Low temperature sintering nano-glass and manufacturing method the same |
| WO2009128527A1 (en) | 2008-04-18 | 2009-10-22 | 日本電気硝子株式会社 | Glass composition for dye-sensitized solar cell and material for dye-sensitized solar cell |
| CN101973708A (en) * | 2010-10-20 | 2011-02-16 | 北京印刷学院 | Phosphorus-bismuth non-lead low-melting point glass |
| JP2011102228A (en) * | 2009-10-15 | 2011-05-26 | Asahi Glass Co Ltd | Optical glass, glass frit, and light-transmissive substrate with glass layer |
| WO2012035565A1 (en) * | 2010-09-16 | 2012-03-22 | Daunia Solar Cell S.R.L. | Sealing agent with low softening temperature useful in the preparation of electronic devices |
| JP2012229131A (en) * | 2011-04-25 | 2012-11-22 | Nippon Electric Glass Co Ltd | Glass for dye-sensitized solar cell and material for dye-sensitized solar cell |
| CN102875020A (en) * | 2012-09-27 | 2013-01-16 | 广东风华高新科技股份有限公司 | Lead-free glass material and preparation method thereof |
| US8871348B2 (en) | 2009-07-24 | 2014-10-28 | Nippon Electric Glass Co. Ltd. | Glass substrate with conductive film for solar cell |
| WO2015119952A1 (en) * | 2014-02-04 | 2015-08-13 | Guardian Industries Corp. | Frits for use in vacuum insulating glass (vig) units, and/or associated methods |
| WO2015119914A1 (en) * | 2014-02-04 | 2015-08-13 | Guardian Industries Corp. | Vacuum insulating glass (vig) unit with lead-free dual-frit edge seals and/or methods of making the same |
| EP2489643A4 (en) * | 2009-10-15 | 2015-08-26 | Asahi Glass Co Ltd | Glass for diffusion layer in organic led element, and organic led element utilizing same |
| JP2016074575A (en) * | 2014-10-08 | 2016-05-12 | 株式会社オハラ | Glass |
| US9776910B2 (en) | 2011-02-22 | 2017-10-03 | Guardian Glass, LLC | Vanadium-based frit materials, and/or methods of making the same |
| US10087676B2 (en) | 2011-02-22 | 2018-10-02 | Guardian Glass, LLC | Vanadium-based frit materials, and/or methods of making the same |
| CN110092585A (en) * | 2019-06-12 | 2019-08-06 | 李海洋 | Radiation resistance high reliability low-melting-point fluorescent glass encapsulating material and preparation method thereof |
-
2001
- 2001-02-09 JP JP2001033860A patent/JP2002241143A/en active Pending
Cited By (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003034550A (en) * | 2001-07-24 | 2003-02-07 | Asahi Glass Co Ltd | Lead-free glass, glass frit, glass paste, electronic circuit part and electronic circuit |
| WO2004037736A1 (en) * | 2002-10-23 | 2004-05-06 | Matsushita Electric Industrial Co., Ltd. | Gap bonding glass for magnetic heads and magnetic head |
| JP2006160599A (en) * | 2004-11-11 | 2006-06-22 | Sony Corp | Lead-free glass composition and magnetic head |
| KR100653408B1 (en) * | 2006-05-01 | 2006-12-04 | (주)세라 | Lead-free frit composition and paste composition comprising said frit for flat display panel sealing |
| KR100833474B1 (en) * | 2006-10-27 | 2008-05-29 | 대주전자재료 주식회사 | Hermetically sealed and low melted glass and glass composite in OLED |
| JP2008303076A (en) * | 2007-06-05 | 2008-12-18 | Central Glass Co Ltd | Lead-free insulating coating material |
| KR100882789B1 (en) | 2007-06-15 | 2009-02-09 | 건국대학교 산학협력단 | Spherical shape glass frit powders with high dispersabiltiy and Process for the Same |
| EP2168927A4 (en) * | 2007-07-20 | 2012-01-11 | Nippon Electric Glass Co | Sealing material, sealing tablet, and glass composition for sealing |
| WO2009014029A1 (en) | 2007-07-20 | 2009-01-29 | Nippon Electric Glass Co., Ltd. | Sealing material, sealing tablet, and glass composition for sealing |
| EP2168927A1 (en) * | 2007-07-20 | 2010-03-31 | Nippon Electric Glass Co., Ltd. | Sealing material, sealing tablet, and glass composition for sealing |
| KR100907455B1 (en) | 2007-09-28 | 2009-07-13 | 삼성전기주식회사 | Low temperature sintering nano-glass and manufacturing method the same |
| JP2009120462A (en) * | 2007-11-19 | 2009-06-04 | Asahi Glass Co Ltd | Lead-free glass for manufacturing dye-sensitized type solar cell and glass ceramic composition |
| WO2009128527A1 (en) | 2008-04-18 | 2009-10-22 | 日本電気硝子株式会社 | Glass composition for dye-sensitized solar cell and material for dye-sensitized solar cell |
| EP2295383A4 (en) * | 2008-04-18 | 2012-10-10 | Nippon Electric Glass Co | Glass composition for dye-sensitized solar cell and material for dye-sensitized solar cell |
| US8871348B2 (en) | 2009-07-24 | 2014-10-28 | Nippon Electric Glass Co. Ltd. | Glass substrate with conductive film for solar cell |
| JP2011102228A (en) * | 2009-10-15 | 2011-05-26 | Asahi Glass Co Ltd | Optical glass, glass frit, and light-transmissive substrate with glass layer |
| EP2489643A4 (en) * | 2009-10-15 | 2015-08-26 | Asahi Glass Co Ltd | Glass for diffusion layer in organic led element, and organic led element utilizing same |
| WO2012035565A1 (en) * | 2010-09-16 | 2012-03-22 | Daunia Solar Cell S.R.L. | Sealing agent with low softening temperature useful in the preparation of electronic devices |
| US8927445B2 (en) | 2010-09-16 | 2015-01-06 | Daunia Solar Cell S.R.L. | Sealing agent with low softening temperature useful in the preparation of electronic devices |
| CN103153890A (en) * | 2010-09-16 | 2013-06-12 | 多尼亚太阳能电池公司 | Sealing agent with low softening temperature useful in the preparation of electronic devices |
| CN101973708A (en) * | 2010-10-20 | 2011-02-16 | 北京印刷学院 | Phosphorus-bismuth non-lead low-melting point glass |
| US9776910B2 (en) | 2011-02-22 | 2017-10-03 | Guardian Glass, LLC | Vanadium-based frit materials, and/or methods of making the same |
| US11014847B2 (en) | 2011-02-22 | 2021-05-25 | Guardian Glass, LLC | Vanadium-based frit materials, and/or methods of making the same |
| US10196299B2 (en) | 2011-02-22 | 2019-02-05 | Guardian Glass, LLC | Vanadium-based frit materials, and/or methods of making the same |
| US10087676B2 (en) | 2011-02-22 | 2018-10-02 | Guardian Glass, LLC | Vanadium-based frit materials, and/or methods of making the same |
| JP2012229131A (en) * | 2011-04-25 | 2012-11-22 | Nippon Electric Glass Co Ltd | Glass for dye-sensitized solar cell and material for dye-sensitized solar cell |
| CN102875020A (en) * | 2012-09-27 | 2013-01-16 | 广东风华高新科技股份有限公司 | Lead-free glass material and preparation method thereof |
| US9988302B2 (en) | 2014-02-04 | 2018-06-05 | Guardian Glass, LLC | Frits for use in vacuum insulating glass (VIG) units, and/or associated methods |
| CN111517638A (en) * | 2014-02-04 | 2020-08-11 | 佳殿玻璃有限公司 | Vacuum Insulating Glass (VIG) unit with lead-free dual frit edge seal and/or method of making the same |
| CN106164001A (en) * | 2014-02-04 | 2016-11-23 | 佳殿工业公司 | Frit and/or correlation technique for vacuum insulated glass building (VIG) unit |
| US9593527B2 (en) | 2014-02-04 | 2017-03-14 | Guardian Industries Corp. | Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same |
| JP2017507885A (en) * | 2014-02-04 | 2017-03-23 | ガーディアン インダストリーズ コーポレイションＧｕａｒｄｉａｎ Ｉｎｄｕｓｔｒｉｅｓ Ｃｏｒｐ． | Frit used in vacuum insulated glass (VIG) unit and / or associated method |
| JP2017509573A (en) * | 2014-02-04 | 2017-04-06 | ガーディアン インダストリーズ コーポレイションＧｕａｒｄｉａｎ Ｉｎｄｕｓｔｒｉｅｓ Ｃｏｒｐ． | Vacuum insulated glass (VIG) unit with lead-free double frit end seal and / or method of manufacturing the same |
| KR20160118267A (en) * | 2014-02-04 | 2016-10-11 | 가디언 인더스트리즈 코퍼레이션. | Vacuum insulating glass (vig) unit with lead-free dual-frit edge seals and/or methods of making the same |
| WO2015119952A1 (en) * | 2014-02-04 | 2015-08-13 | Guardian Industries Corp. | Frits for use in vacuum insulating glass (vig) units, and/or associated methods |
| KR20160117468A (en) * | 2014-02-04 | 2016-10-10 | 가디언 인더스트리즈 코퍼레이션. | Frits for use in vacuum insulating glass (vig) units, and/or associated methods |
| JP7096867B2 (en) | 2014-02-04 | 2022-07-06 | ガーディアン・グラス・エルエルシー | Vacuum insulated glass (VIG) unit with lead-free double frit end seal and / or method of manufacturing thereof |
| KR102316128B1 (en) * | 2014-02-04 | 2021-10-25 | 가디언 글라스, 엘엘씨 | Vacuum insulating glass (vig) unit with lead-free dual-frit edge seals and/or methods of making the same |
| US10421684B2 (en) | 2014-02-04 | 2019-09-24 | Guardian Glass, LLC | Frits for use in vacuum insulating glass (VIG) units, and/or associated methods |
| US10465433B2 (en) * | 2014-02-04 | 2019-11-05 | Guardian Glass, Llc. | Vacuum insulating glass (VIG) unit with lead-free dual-frit seals and/or methods of making the same |
| CN106132887A (en) * | 2014-02-04 | 2016-11-16 | 佳殿工业公司 | Vacuum insulated glass building (VIG) unit having unleaded pair of frit edge seal and/or the method preparing it |
| JP2020203832A (en) * | 2014-02-04 | 2020-12-24 | ガーディアン・グラス・エルエルシーＧｕａｒｄｉａｎ Ｇｌａｓｓ， Ｌｌｃ | Vacuum insulation glass (vig) unit with lead-free double frit end seal and/or its manufacturing method |
| WO2015119914A1 (en) * | 2014-02-04 | 2015-08-13 | Guardian Industries Corp. | Vacuum insulating glass (vig) unit with lead-free dual-frit edge seals and/or methods of making the same |
| KR102285744B1 (en) * | 2014-02-04 | 2021-08-04 | 가디언 글라스, 엘엘씨 | Frits for use in vacuum insulating glass (vig) units, and/or associated methods |
| JP2016074575A (en) * | 2014-10-08 | 2016-05-12 | 株式会社オハラ | Glass |
| CN110092585A (en) * | 2019-06-12 | 2019-08-06 | 李海洋 | Radiation resistance high reliability low-melting-point fluorescent glass encapsulating material and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002241143A (en) | Sealing composition | |
| EP0630867B1 (en) | Non-lead sealing glasses | |
| JP4774721B2 (en) | Low melting glass, sealing composition and sealing paste | |
| JP2003095697A (en) | Sealing composition | |
| JP2000128574A (en) | Bismuth-based glass composition | |
| CN112055699B (en) | Glass composition and sealing material | |
| JP4498765B2 (en) | Sealing composition | |
| WO2019159599A1 (en) | Glass composition and sealing material | |
| CN112789248B (en) | Glass composition and sealing material | |
| JP4093342B2 (en) | Press frit | |
| JP4874492B2 (en) | Glass composition and glass-forming material containing the composition | |
| JP2001199740A (en) | Lead-free glass and composition for sealing | |
| JP2007161524A (en) | Bismuth-based glass composition | |
| CN113614042B (en) | Glass composition and sealing material | |
| JP7385169B2 (en) | Glass compositions and sealing materials | |
| JP2001322832A (en) | Sealing composition | |
| KR101008201B1 (en) | Lead-free frit composition for flat display panel sealing | |
| JP2007169162A (en) | Bismuth-based glass composition and bismuth-based material | |
| JP2019031403A (en) | Sealing material | |
| WO2020262109A1 (en) | Glass composition and sealing material | |
| US20230303425A1 (en) | Glass composition and sealing material | |
| WO2016114075A1 (en) | Lead-free glass and sealing material | |
| JP2022155512A (en) | Sealing composition | |
| JP2020040848A (en) | Glass composition and sealing material | |
| JPS6411583B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061128 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090206 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090616 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091016 |