JP2002236902A - Ic carrier with plate-like frame and manufacturing method for it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC carrier with a plate-like frame and a manufacturing method for it allowing the IC carrier to be easily detached from the plate-like frame and preventing burrs of a bridge part from being left when the IC carrier is detached from the plate-like frame. SOLUTION: The plate-like frame 11 is provided with an IC carrier detaching slit 13 having a hole penetrating through the plate-like frame formed in the periphery of a recessed part 22 for mounting an IC module 12 with a portion left undone, and a bridge part 14 having an easily broken notch formed on one side or both sides of one portion of the plate-like frame 11 having no IC carrier detaching slit 13 in the periphery of the recessed part 22. The IC module 12 is mounted in the recessed part 22. Preferably the injection of forming resin into a cavity of a metal mold in forming the plate-like frame 11 is performed so that the cutting plane line of a bridge for holding the IC carrier on the plate-like frame is aligned with the flow direction of injected resin. Further preferably the notch part of the bridge part is formed so that the wall thickness is reduced along the cutting plane line.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC carrier having an IC module mounted in a recess of a plate-like frame, and
It relates to the manufacturing method.

[0002]

2. Description of the Related Art IC carriers are used in various fields. As a usage mode of such an IC carrier, for example, a usage mode as a SIM card has been put into practical use (for example, EP 0495216B1). S
As an example of the use form of an IM card, an SI in which subscriber identification information, authentication data, and the like are registered in a portable telephone is given.
A method has been proposed in which an M card is attached and only a specific user can use the mobile phone, and a call volume, a purchase price, and the like made using the mobile phone are determined using a SIM card as an IC carrier. ing.

[0003] Such an IC carrier as a SIM card is very small and difficult to handle as it is.
The contents of the SIM card are also difficult to see. Therefore, usually, it is often fixed to a plate-shaped frame body having the same size as an ordinary IC card so as to be easily detachable and distributed. An IC carrier attached to such a plate-shaped frame is called an IC carrier with a plate-shaped frame.

A conventional method of manufacturing an IC carrier with a plate-like frame is disclosed in, for example, Japanese Patent Application Laid-Open No. 6-24188, in which an IC card having a standard size is first manufactured, and then an IC card including an IC module is manufactured. In order to allow the carrier to be removed from the plate-like frame, a removal slit leaving a bridge portion was formed by punching.

As shown in FIG. 9, the manufacturing method is as follows. (1) First, an IC card substrate having an IC module embedded recess is formed by injection molding (step a), and (2) then Then, a printed pattern showing the outline of the IC carrier is printed on the plate-like frame (step b), and (3) the IC is inserted into the IC module base recess formed in the IC card substrate manufactured by injection molding.
The carrier is mounted (process c), and (4) the IC is removed from the plate-shaped frame.
A slit for removing an IC carrier for separating the module is punched (step d).

FIGS. 10A to 10D show examples of slits 33A to 33D for removing an IC carrier. 10A to 10D, an IC module 32 is mounted on a plate-shaped frame 31, and IC carrier removal slits 33A to 33D illustrated in white are formed around the IC module 32. I have. The IC carrier removal slits 33A to 33D
The IC module 32 is surrounded by the plate-shaped frame body 31 so that the IC module 32 can be easily separated from the plate-shaped frame body 31 at the time of use.
As the carrier 32 is fixed to the plate-shaped frame 31,
These holes are partially (intermittently) formed in the plate frame 31 around the IC module 32. Other portions remain on the plate-like frame 31 as a plurality of bridges 34. The bridge 34 has the same thickness as the plate-shaped frame 31.

Conventionally, such punched shapes of the IC carrier removing slits 33A to 33D have been devised mainly from the aspect of appearance, that is, from the viewpoint of design.

[0008]

According to the study of the present inventor, a problem of anisotropy of the resin was found in the injection molding step of manufacturing the card base in the step a of FIG. That is, according to the study of the inventor of the present application, as illustrated in FIGS. 4A to 4C, molecular orientation occurs in the direction in which the resin is injected into the mold, and the flow direction of the resin and the direction perpendicular thereto. It was found that there was a difference in the physical properties of the molded product. FIG. 4 (A)-
(C) is a diagram illustrating the molecular orientation (flow of resin) of the plate-shaped frame.

In the conventional manufacturing method described with reference to FIG. 9, since the slits 33A to 33D for removing the IC carrier are not considered in the anisotropy and are mainly determined by the design in appearance as described above, When removing the IC module 32 from the plate frame 31, it is difficult to remove it,
In some cases, excessive force is applied to the IC module 32, causing the IC module 32 to fail.

When the plurality of bridges 34 are removed,
Some of them have large burrs, and the removed IC module 32 cannot be attached to the IC connector,
I was worried that my burr would injure my hand (finger).

SUMMARY OF THE INVENTION It is an object of the present invention to provide an IC carrier with a plate-like frame which is easy to remove from the plate-like frame, and which does not leave burrs at a bridge portion when the IC carrier is removed from the plate-like frame. Is to provide.

[0012]

According to a first aspect of the present invention, a concave portion for mounting an IC module, a partial bridge around the concave portion, and the concave portion excluding the bridge portion are provided. And a slit for removing an IC carrier formed with a hole penetrating through the plate frame, a plate frame formed of resin, and an IC carrier mounted in a concave portion of the plate frame. A plate-shaped frame, wherein the bridge is arranged such that a cut surface of the bridge when the IC carrier is removed and a flow direction of a resin when the plate-shaped frame is formed coincide with each other. A body mounted IC carrier is provided.

[0013] Preferably, at least one surface of the plate-shaped frame of the bridge portion is formed with a cut that is easily broken. Preferably, the width of the opposite end of the slit for removing the IC carrier is formed at an acute angle.

More preferably, personal information for specifying a user stored in the IC module is displayed or printed on at least one surface of the plate-shaped frame.

According to a second aspect of the present invention, a molding resin is injected into a cavity of a mold for manufacturing a card base for an IC carrier with a plate-shaped frame, and a card base for an IC carrier with a plate-shaped frame. Forming a concave portion for mounting an IC module on the formed IC carrier card base material with the plate-shaped frame, mounting a pre-manufactured IC module in the formed concave portion, A method for manufacturing an IC carrier with a plate-like frame, wherein a slit for removing an IC carrier is formed while leaving a bridge portion around a portion.

According to a third aspect of the present invention, a molding resin is injected into a cavity of a mold for manufacturing a card base material for an IC carrier having a plate-shaped frame in which a recess for mounting an IC module is defined. Forming a card base for an IC carrier with a plate-shaped frame, mounting a pre-manufactured IC module in a recess of the formed card base for an IC carrier with a plate-shaped frame, and surrounding the recess. IC leaving bridge part
Provided is a method for manufacturing an IC carrier with a plate-like frame, which forms a carrier removal slit.

Preferably, the injection of the molding resin into the cavity of the mold is performed so that the cut surface of the bridge for holding the IC carrier in the plate-shaped frame coincides with the flow direction of the injected resin.

Preferably, when the slit for removing the IC carrier is formed, a notch that is easily broken is formed on at least one surface of the plate-shaped frame of the bridge portion. Preferably, the width of the opposite end of the slit for removing the IC carrier is formed to be an acute angle.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC carrier with a plate-like frame and a method of manufacturing the same according to the present invention will be described with reference to FIGS.

[0020] Embodiment Figure 1 of the first embodiment is a plan view of a sheet-framed IC carrier in the first embodiment of the present invention, FIG. 2 is a plate-like frame as viewed from line A-A of FIG. 1 FIG. 2 is a cross-sectional view of an attached IC carrier.

In FIG. 1 and FIG.
The C carrier 1 has a plate-shaped frame 11 and an IC module 12 embedded in the plate-shaped frame 11. This IC module 12 is a contact IC module. Plate frame 1
On at least one of the surfaces 1, a picture 16 which is personal information for identifying a user stored in the IC module 12 is displayed or printed. The picture 16 includes character information.

The portion of the plate-like frame 11 on which the IC module 12 is mounted is recessed. This portion is called a recess 22. The method of manufacturing the recess 22 will be described later. Around the concave portion 22 on which the IC module 12 is mounted,
And a slit 13 for removing the IC carrier, which is formed as a continuous hole penetrating therethrough. However,
The slit 13 for removing the IC carrier is not formed on the entire periphery of the IC module 12, but the bridge portion 14 is partially left in one part in the illustrated example, and the concave portion 22 is formed as a plate-shaped frame. 11 and one. The bridge portion 14 surrounds the recessed portion 22 continuously with the slit 13 for removing the IC carrier, but is not a hole penetrating the plate-shaped frame 11 like the slit 13 for removing the IC carrier. The slit 13 for removing the IC carrier is the remaining portion where the slit 13 for removing the IC carrier is formed in the plate-shaped frame 11. The bridge portion 14 may be in a state where the slit 13 for removing the IC carrier is formed, or may be provided with a cut on both sides or one side of the plate-shaped frame 11 as illustrated. Hereinafter, as illustrated, the bridge portion 14 in which the notch is formed will be described.

In this embodiment, since the bridge portion 14 in which the cut is formed is one place, when the IC module 12 described later is separated from the plate-like frame 11, for example,
When the user presses the IC module 12 downward with a finger, the IC module 12 is easily bent by the pressing on the cut surface, and when further pressed, the IC module 12 is easily broken from the bent cut surface portion, and the IC module 12 is cut into a plate-like frame. It can be separated from the body 11. The IC module 12 separated from the plate-like frame 11 in this manner is used for a desired purpose, for example, by mounting it on a mobile phone.

As will be described later, at the stage of forming the plate-shaped frame 11, when forming the plate-shaped frame 11 using the cut surface obtained when the bridge portion 14 is removed from the plate-shaped frame 11 and the molding resin. Are arranged so that the flow direction of the resin coincides with that of the resin, so that cutting can be easily performed on the cut surface without cutting. Therefore, the bridge portion 14 does not necessarily have to be cut.

However, if there is a cut in the bridge portion 14, the IC module 1 mounted in the recess 22
It becomes easier to remove 2 from plate-like frame 11.
Therefore, the bridge portion 14 is formed at least in the plate-like frame 1.
It is sufficient that a cut is formed on one side of the plate frame 1. However, from the viewpoint of easy removal of the IC module 12 and prevention of generation of burrs, preferably, as illustrated, both sides of the plate-shaped frame 11 are illustrated. Preferably, a cut is formed.

Referring to FIG. 3, the above-mentioned I with plate-shaped frame
A specific embodiment of the method for manufacturing the C carrier 1 will be described. FIG. 3 is a flowchart illustrating a method for manufacturing the IC carrier 1 with a plate-shaped frame. In the present embodiment, I
This is an example of a case where the concave portion 22 for mounting the C module 12 is manufactured in a resin molding step of forming the IC carrier card base material 21.

Step 1: Car for IC carrier with plate frame
A molding resin was injected into a metal mold to produce a 0.8 mm-thick IC carrier card substrate 21 with a plate-shaped frame. As a molding resin, a composite material of polycarbonate and ABS was used. The IC carrier card base material 21 serves as a prototype of the plate-shaped frame body 11 as illustrated in FIG. I
A concave portion 22 on which the IC module 12 is mounted (mounted) is formed in the C carrier card base 21.

As the mold gate 31 illustrated in FIG. 1, a film gate is adopted on the right short side of the card (IC carrier 1 with a plate-shaped frame), and a molding resin at 260 ° C. is introduced into the cavity of the mold. Injection filled. At this time, the injection pressure is 8MP
a, the filling time was 0.3 seconds, the holding pressure was 4 MPa, the holding time was 10 seconds, and the temperature of the mold was adjusted to 50 ° C.

As the gate shape of the mold, a side gate, a pin gate, a valve gate and the like can be used, but a gate having a wide width in which the flow of the resin is relatively linear is desirable, and for example, a film gate is preferable.

In the mold for manufacturing an IC carrier having a plate-like frame, the IC carrier is formed into a plate-like frame as illustrated in FIG. 4B in consideration of the molecular orientation (anisotropic property accompanying the flow of the resin). It is preferable to inject the resin by arranging the gate so that the cut surface of the bridge portion 14 held by the body and the flow direction of the resin coincide with each other, from the viewpoint of cutting off the bridge portion 14 and preventing generation of burrs. That is, it is desirable that the injection direction of the resin be parallel to the cut surface of the bridge portion 14.

FIGS. 4A to 4C are diagrams illustrating the molecular orientation (flow of resin) of the plate-like frame. FIG. 4 (A),
4C illustrates a state where the molecular orientation does not match the cutting line, and FIG. 4B illustrates a state where the molecular orientation matches the cutting line.

Further, from the viewpoint of preventing the occurrence of nests and the like in the recess 22 and the like, it is preferable to inject the resin from a distance from the recess 22 as illustrated in FIGS. 1 and 4B. Therefore, it is desirable that the gate of the mold for manufacturing an IC carrier with a plate-shaped frame be provided on the short side of the plate-shaped frame 11 far from the recess 22 as illustrated in FIG.

Step 2: Printing of a picture I thus formed with a plate-like frame illustrated in FIG.
As illustrated in FIG. 5B, the IC is formed on the front and back of the C carrier card base material 21 by offset and silk printing.
The pictures 16A and 16B indicating the unique information for identifying the user stored in the module 12 were printed. The printing of the picture 16 is optional. Picture 16
The printing of A and 16B does not necessarily require printing on both sides of the plate-shaped frame 11, but can be performed on one side as necessary. The printing position of the picture 16 is also arbitrary.

Step 3: Mounting of IC module Then, as illustrated in FIG.
After mounting the IC module 12 in the concave portion 22 of the C carrier card base material 21, it was adhered and fixed.

Step 4: Slit for removing IC carrier
And formation of the bridge then, leaving a bridge portion 14, around the recess 22, to form an IC carrier removal slits 13 (FIG. 5). As a method for forming the slit 13 for removing the IC carrier, for example, punching or cutting is performed.

The bridge portion 14 is a portion around the concave portion 22 of the plate-like frame 11 left by forming the slit 13 for removing the IC carrier. The bridge portion 14
As illustrated in FIG. 4B, the cut surface when the bridge 14 is removed and the IC carrier card base material 21 (plate-like frame body 11) are formed in consideration of the molecular orientation (anisotropic). Are arranged in such a manner that the flow direction of the resin coincides with the flow direction.

When a cut is made in the bridge portion 14, the slit 13 for removing the IC carrier is formed, and a half is formed on both sides of the plate-like frame 11 along the cutting line (dashed line in FIG. 1) of the bridge portion. It can be cut, or can be formed by a metal mold in an injection molding step of forming the IC carrier card base material 21.

FIG. 5D shows the IC carrier with a plate-like frame manufactured by the above steps. The state of FIG. 5D is the same as the cross-sectional view of FIG.

The IC carrier 1 with the plate-shaped frame manufactured by the above-described method has the cut surface from which the bridge 14 is removed and the card base material 21 for the IC carrier (the plate-shaped frame 11).
Are formed so as to coincide with the flow direction of the resin at the time of formation of
The IC module 12 can be easily removed from the device, and the user can safely and securely handle the IC module 12 without fear of injuring the user's finger or the like.

Second Embodiment In the method of manufacturing the IC carrier 1 with a plate-shaped frame described with reference to FIG. 3, in the step of manufacturing a card base material for an IC carrier with a plate-shaped frame in the step 1, Although the example in which the IC carrier card base 21 having the recess 22 is manufactured using the mold in which the recess 22 is formed has been described, the recess 22 is formed in the second embodiment. Not flat I
First, a card base material for a C carrier is manufactured.

Thereafter, between the above steps 2 to 4, for example, at the stage of mounting the IC module 12 in the step 3,
Prior to mounting the C module 12, for example, the concave portion 22 can be formed in a flat IC carrier card substrate by spot facing.

The other method is the same as the method described with reference to FIG.

According to such a method, counterbore processing is required, but the possibility of occurrence of nests due to the flow state of the molding resin in the mold described with reference to FIG. 3 is reduced.

Third Embodiment In the first and second embodiments, the case where the bridge portion 14 is formed only at one place in the lateral direction has been described.
The number and the direction of the bridge portions 14 are not limited to those in the above embodiment, and are arranged such that the cut surface when the bridge portions 14 are removed and the flow direction of the resin when the plate-shaped frame 11 is formed coincide with each other. If so, any number can be provided in any direction. Such an example is shown in FIG.
(A)-(C) and FIGS. 7 (A) -C). In these figures, the broken lines indicate the cut surfaces of the bridge portions 14. FIGS. 6 and 7 show, by way of dashed lines, cut surfaces when the IC carrier is removed from the bridge for the sake of explanation. 6 and 7 show the positions of the gates, which are not provided in the product.

FIGS. 6A to 6C show an IC with a plate-like frame.
One or more bridge portions 1 in the longitudinal direction of the carrier 1
4 is provided. FIGS. 7A to 7C show a plurality of bridge portions 1 in the lateral direction of the IC carrier 1 with a plate-shaped frame.
4 is provided.

Fourth Embodiment A fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 illustrates an example in which the width of the end of the slit 13 for removing the IC carrier is formed to be an acute angle. The slit 13 for removing the IC carrier described in the first to third embodiments is
Usually, it is formed with a width of 1 to 2 mm.
When the IC module 12 mounted on the device is removed, burrs may be generated. Therefore, as described above, a cut is made in the bridge portion 14 to reduce the possibility of burrs. In the fourth embodiment, the width of the end of the slit 13 for removing the IC carrier is set to an acute angle without making a cut in the bridge portion 14 to prevent burrs when the IC module 12 is removed. Although the width of the slit is not limited in the one illustrated in FIG. 8, the end of the slit in contact with the bridge portion is 45 degrees or less, preferably 3 degrees.
It was formed at an acute angle of 0 ° or less. By forming the end of the slit at an acute angle, the cutting line of the bridge coincides with the flow direction of the resin, and
Burrs generated when the C carrier is removed can be more effectively suppressed.

The IC carrier with a plate-shaped frame of the present invention and its manufacture are not limited to the above-described embodiments, but may take various modifications. Further, the types of the molding resin and the molding conditions described above are merely examples.

[0048]

According to the present invention, the IC module can be easily removed from the plate-shaped frame, and no excessive force is applied, so that the IC can be prevented from being broken.

Further, according to the present invention, when the IC carrier is removed, the occurrence of burrs in the bridge portion can be suppressed.
The module can be securely connected to the IC connector of the mobile phone, for example.

Further, according to the present invention, there is no fear of the hand being injured by burrs, and the device can be used with confidence.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC carrier with a plate-shaped frame according to the present invention.

FIG. 2 is a perspective view of an I with a plate-like frame taken along line AA in FIG. 1;
It is sectional drawing of C carrier.

FIG. 3 is a flowchart illustrating a method of manufacturing the IC carrier with a plate-like frame illustrated in FIGS. 1 and 2;

FIGS. 4A to 4C are diagrams illustrating the molecular orientation (flow of resin) of a plate-like frame.

5 (A) to 5 (D) are diagrams illustrating a manufacturing state of an IC carrier with a plate-like frame in each step of the manufacturing method illustrated in FIG. 3;

FIGS. 6A to 6C are diagrams illustrating an example of forming a bridge portion of an IC carrier with a plate-shaped frame according to a third embodiment of the present invention.

FIGS. 7A to 7C are diagrams showing another example of forming a bridge portion of the IC carrier with a plate-shaped frame according to the third embodiment of the present invention.

FIG. 8 is a diagram illustrating an end shape of an IC carrier removing slit of an IC carrier with a plate-shaped frame according to a fourth embodiment of the present invention.

FIG. 9 is a flowchart illustrating a method for manufacturing a conventional IC carrier with a plate-shaped frame.

FIGS. 10A to 10D are views showing examples of a conventional slit for removing an IC carrier.

[Explanation of symbols]

 1 IC carrier with plate-shaped frame 11 Plate-shaped frame 12 IC module 13 Slit for removing IC carrier 14 Bridge portions with cuts formed 16A, 16B Printed pattern 21 Card carrier for IC carrier with plate-shaped frame 22 Depressed portion 31 Plate-shaped frame 32 IC module 33A-33D Slit for removing IC carrier 34 Bridge

Claims (9)

[Claims] 1. A recess for mounting an IC module, a partial bridge around the recess, and a hole formed through the plate frame around the recess except for the bridge. An IC carrier removal slit, a plate-shaped frame formed of resin, and an IC carrier mounted in a recessed portion of the plate-shaped frame, wherein the bridge replaces the IC carrier in the bridge. An IC carrier with a plate-shaped frame arranged so that the cut surface when detached and the flow direction of the resin when forming the plate-shaped frame coincide with each other. 2. The IC carrier with a plate-shaped frame according to claim 1, wherein a notch that is easily broken is formed on at least one surface of the plate-shaped frame of the bridge portion. 3. The IC carrier with a plate-like frame according to claim 1, wherein the width of the opposite end of the IC carrier removing slit is formed at an acute angle. 4. The IC carrier with a plate-shaped frame according to claim 1, wherein personal information for specifying a user stored in the IC module is displayed or printed on at least one surface of the plate-shaped frame. 5. A card base for an IC carrier with a plate-shaped frame is formed by injecting a molding resin into a cavity of a mold for producing a card base for an IC carrier with a plate-shaped frame. A recess for mounting the IC module is formed in the IC carrier card base with the frame, and a pre-manufactured IC module is mounted in the formed recess, and a bridge portion is left around the recess. A method for manufacturing an IC carrier with a plate-like frame formed with a slit for removing an IC carrier. 6. A molding resin injection molding method is applied to a cavity of a mold for manufacturing a card base material for an IC carrier with a plate-shaped frame in which a recess for mounting an IC module is defined.
Forming a C carrier card base, mounting a pre-manufactured IC module in the recess of the formed IC carrier card base with the plate-shaped frame, leaving a bridge portion around the recess; A method for manufacturing an IC carrier with a plate-like frame formed with a slit for removing an IC carrier. 7. The molding resin is injected into the cavity of the mold such that the cut surface of the bridge holding the IC carrier in the plate-shaped frame coincides with the flow direction of the injected resin. 7. The method for producing an IC carrier with a plate-shaped frame according to item 6. 8. The IC with a plate-shaped frame according to claim 7, wherein when the slit for removing the IC carrier is formed, a notch that is easily broken is formed on at least one surface of the plate-shaped frame in the bridge portion. Carrier manufacturing method. 9. The method for manufacturing an IC carrier with a plate-like frame according to claim 5, wherein the width of the opposite end of the slit for removing the IC carrier is formed at an acute angle.