JPH08332790A - Manufacture of card - Google Patents

Abstract

PURPOSE: To obtain a card capable of being easily molded and rapidly printing without protrusion by so cutting out the card as not to include the protrusion in an injection port from the previously decided cut-out position from an original plate manufactured by injection molding. CONSTITUTION: An IC card 10 has a card 11 formed with an IC chip containing recess 12, and an IC chip 13 die bonded to the card 11, and is entirely covered with transparent hard plastic. The chip 13 is manufactured by storing predetermined information, and die bonded as it remains positioned in the recess by adhesive. The card 11 is made of plastic, and molded by cutting out from an original plate. Since the card 11 is so cut out from the original plate as to avoid the injection port protrusion, the cut-out card 11 has no injection protrusion, and hence the card 11 is not only molded accurately but also labor-saved in the manufacturing steps.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a credit card, an ID card, a cash card and the like.
The present invention relates to a method for manufacturing a card that is a card substrate including C cards and telephone cards used for public telephones and the like.

[0002]

2. Description of the Related Art An IC card is an I card that stores predetermined information.
The C chip is attached to the card that is the substrate, and I
By reading the stored information from the C chip, the user is identified and the amount of money used is calculated. Conventionally, such a card is manufactured by laminating plastic plates or injection molding plastic. Figure 5
Indicates an IC card manufactured by the above. First with a chip hole 1a formed as a recess for accommodating the IC chip 3
And a second plastic plate 2 to which the first plastic plate 1 is attached on its upper surface. Both of the plastic plates 1 and 2 are made of vinyl chloride resin, and the second plastic plate 2 is entirely flat. Designed patterns, characters, etc. are printed in advance on the upper surface of the first plastic plate 1 and the lower surface of the second plastic plate. And the second
IC chip 3 is die-bonded with an adhesive into the chip hole 1a of the first plastic plate 1 attached to the plastic plate 2 and then the whole is covered with a transparent hard plastic (not shown) to form an IC. The card is manufactured.

Next, FIG. 6 shows the above method.
A plurality of cavities 4 formed in a predetermined card shape are formed in the injection molding die 5. The injection port 6 of each cavity 4 is communicated with the introduction chamber 7 of the mold 5, and molten plastic is injected from the gate 8 so that each cavity 4
By cooling and hardening inside, one card is molded from each cavity 4.

[0004]

However, in the card shown in the prior art, the plastic plates 1 and 2 are individually molded and then bonded to each other, so that not only the number of manufacturing steps is large, but also the plastic is not used at the time of bonding. Boards 1,2
However, there is a problem in that the positioning is difficult and the accuracy is poor.
On the other hand, the card shown in the prior art cannot be used as a card as it is because the plastic cured at the injection port 6 of the mold 5 adheres to the card as an injection port protrusion (burr), and this protrusion is ground. The process to do is required. However, this protrusion has an irregular shape and is small, so that its grinding is difficult. Also, when printing on a card, it is necessary to print one card at a time or print several cards at a time and print them at once. In the former case, it takes a long time to print, and in the latter case, In the case of, there is a problem that print misalignment is likely to occur.

The present invention solves all the problems of the prior art, and provides a card which is easy to mold, has no protrusions, and can be printed quickly.

[0006]

In order to achieve the above-mentioned object, the present invention is a method for producing a base plate by injection molding or injection molding press of plastic, and cutting out the base plate to produce a card. The cutting position of the card is determined in advance, the mold of the injection molding or injection molding press is formed corresponding to this original plate, and its injection port is a position deviated from the cutting position of the card of the original plate to be manufactured. It is characterized in that the original plate is manufactured by injection molding or an injection molding press using this mold, and a card is cut out from the original plate from a predetermined cutting position so that the injection port does not include a projection.

Since the cutting position of the card is determined in advance on the original plate to be manufactured, and the original plate is manufactured by injection molding or an injection molding press by providing an injection port at a position removed from the cutting position of the card of the manufactured original plate, The ejection port projection is manufactured by deviating from a predetermined card cutting position of the manufactured original plate. When the card is cut out from this original plate along a predetermined cutting position, the card can be cut out without including the ejection port projection. Therefore, it is possible to obtain a card with no ejection port protrusion.

Further, since printing can be performed on the original plate, it is possible to perform printing neatly and quickly.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments in which the present invention is applied to an IC card will be specifically described below with reference to the drawings. FIG. 1 is a perspective view of an IC card 10 according to an embodiment, and FIG. 2 is a perspective view of an original plate 20 thereof. The IC card 10 includes a card 11 having a recess 12 for storing an IC chip and a card 1
1 and a die-bonded IC chip 13, and the whole is covered with transparent hard plastic (not shown). The IC chip 13 is manufactured by storing predetermined information, and is die-bonded while being positioned in the IC chip housing recess 12 by an adhesive or metallization.

The card 11 is made of plastic,
It is formed by cutting out from the original plate 20 shown in FIG. The original plate 20 is formed into a thin shape by injection molding of plastic. As a plastic material, a material capable of thin-walled injection molding, for example, vinyl chloride resin, ABS resin or engineering plastic can be selected and used.

When the original plate 20 is molded, a plurality of IC chip accommodating recesses 12 are formed in an array.
Then, the card 11 is cut out from the original plate 20 so as to have the IC chip housing recesses 12 individually. Card 11
Can be cut out by punching the original plate 20 with a punch or the like, whereby a large number of cards 11 can be simultaneously obtained from one original plate 20. In FIG.
A two-dot chain line shows a cutting line 21 for cutting out the card 11. The cutting of the card 11 can also be performed by laser cutting.

When cutting out such a card 11,
Predetermined printing is applied to the surface of the original plate 20 in advance. That is, printing is performed on the portion corresponding to each card in the state of the original plate 20. When printing in the state of the original plate 20 as described above, a large number of cards can be printed by one printing, the time and effort for printing the cards one by one can be saved, and not only mass printing is possible, There is an advantage that printing misregistration is reduced and printing errors are reduced.

This printing may be made into a card,
Whether to print and then cut or to cut and form a card and then print is selectively performed.

The original plate 20 as described above is molded by injection molding or an injection molding press. FIG. 3 shows an injection molding die 30 used for molding the original plate 20. A cavity 31 for the original plate 20 is formed in the mold 30, and the cavity 31 is communicated with the introduction chamber 33 via a plurality of injection ports 32. It is not always necessary to provide a plurality of injection ports 32, and one injection port 32 may be provided as long as the resin can be uniformly injected. When plastic injection molding is performed using this mold 30, the plastic hardened at the injection port 32 portion becomes the injection port projections 22 which remain as irregular small projections, thus forming the original plate 2.
0 (see FIG. 2).

In the present invention, the card 11 is cut out from the original plate 20 so as to avoid the ejection port projection 22, and the ejection port projection 22 does not exist in the portion surrounded by the cutting line 21. There is. In order to enable such cutting, the injection port 32 is formed in the mold 30 so as to be located outside the cutting line 21. Therefore,
The cut-out card 11 does not have the injection port projection 22, and grinding of this projection is not necessary, so that not only the card 11 can be molded with high accuracy, but also the manufacturing process thereof can be simplified.

FIG. 4 shows an injection molding press die 40 used for molding the original plate 20. The mold 40 is composed of a female mold 42 having a resin injection gate 41 and a male mold 43 fitted into the female mold 42. Then, the resin injection gate 41
The original resin 20 is formed by pressing the molten resin injected into the female mold 42 via the resin introduction pipe 44 connected to the male mold 43. It should be noted that the female mold 42 or the male mold 43 is provided with air escape holes (not shown) at appropriate positions.
Then, the original plate 20 is cut out in the same manner as described above to obtain the card 11.

Although the above embodiment has been described as applied to an IC card, the present invention can be applied to any card including a magnetic card, a telephone card and the like.

[0018]

As described above, according to the present invention, the cutting is performed so as to avoid the projection of the injection port, so that grinding for removing the projection is unnecessary, and the manufacturing process is simplified and facilitated. Further, since the original plate obtained by injection molding is printed and then individually cut out from the original plate, it is possible to manufacture a large amount in a state in which the molding accuracy is good and there is no print deviation.

[Brief description of drawings]

FIG. 1 is a perspective view of a card according to an embodiment of the present invention.

FIG. 2 is a perspective view of an original plate.

FIG. 3 is a cross-sectional view of a mold for forming an original plate.

FIG. 4 is a cross-sectional view of a mold for forming an original plate showing another embodiment.

FIG. 5 is a cross-sectional view of a card showing a conventional example.

FIG. 6 is a cross-sectional view of a mold used for card molding showing another conventional example.

[Explanation of symbols]

 10 card 12 IC chip storing recess 13 IC chip 20 original plate 21 cutting line 22 ejection port protrusion

Claims (1)

[Claims] 1. A method for manufacturing a card by injection molding or injection molding press of plastic, and cutting the card to manufacture a card, wherein a cutting position of the card is determined in advance on the card to be manufactured, and injection molding or The mold of the injection molding press is formed corresponding to this original plate, its injection port is provided at a position outside the cutting position of the card of the above-mentioned original plate, and the original plate is injection molded using this mold. Alternatively, a card manufacturing method is characterized in that the card is manufactured by an injection molding press, and the card is cut out from the original plate at a predetermined cutting position so that the injection port does not include a protrusion.