JP2002231440A - Electroluminescence element - Google Patents
Electroluminescence elementInfo
- Publication number
- JP2002231440A JP2002231440A JP2001022006A JP2001022006A JP2002231440A JP 2002231440 A JP2002231440 A JP 2002231440A JP 2001022006 A JP2001022006 A JP 2001022006A JP 2001022006 A JP2001022006 A JP 2001022006A JP 2002231440 A JP2002231440 A JP 2002231440A
- Authority
- JP
- Japan
- Prior art keywords
- sealing member
- light
- laminate
- electroluminescent device
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005401 electroluminescence Methods 0.000 title abstract 2
- 238000007789 sealing Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 230000008646 thermal stress Effects 0.000 claims abstract description 9
- 239000003230 hygroscopic agent Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011521 glass Substances 0.000 description 19
- 239000010410 layer Substances 0.000 description 15
- 239000012044 organic layer Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002250 absorbent Substances 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電界発光素子に関
するものであり、特に、透明電極，発光層及び背面電極
等からなる積層体を封止する封止部材を備えた電界発光
素子に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroluminescent device, and more particularly to an electroluminescent device provided with a sealing member for sealing a laminate comprising a transparent electrode, a light emitting layer, a back electrode and the like. is there.
【０００２】[0002]
【従来の技術】従来より、図４に示す電界発光素子１が
ある。電界発光素子１はガラス基板２に積層体３を形成
したものであり、この積層体３は透明電極４，絶縁層
５，有機層６，背面電極７を有する。有機層６は正孔注
入層，正孔輸送層，発光層及び電子輸送層からなるもの
である。積層体３は、ステンレスからなる封止部材８に
覆われており、この封止部材８はガラス基板２の後面に
接着剤９により接着されている。封止部材８の積層体３
に対向する面８ａには吸湿剤１０が塗布されており、積
層体３が湿気を吸収して劣化することを防止している。2. Description of the Related Art Conventionally, there is an electroluminescent device 1 shown in FIG. The electroluminescent device 1 is obtained by forming a laminate 3 on a glass substrate 2, and the laminate 3 has a transparent electrode 4, an insulating layer 5, an organic layer 6, and a back electrode 7. The organic layer 6 includes a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer. The laminate 3 is covered with a sealing member 8 made of stainless steel, and the sealing member 8 is adhered to the rear surface of the glass substrate 2 with an adhesive 9. Laminated body 3 of sealing member 8
The surface 8a facing the surface is coated with a hygroscopic agent 10 to prevent the laminate 3 from absorbing moisture and being deteriorated.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、ガラス
基板２と封止部材８の熱膨張係数が違うために、周囲の
温度が変化したときに、電界発光素子１が破損する虞が
あった。即ち、ステンレス（封止部材８）の熱膨張係数
は、ガラス（ガラス基板２）の熱膨張係数より大きいた
め、電界発光素子１の周囲の温度が上昇した場合、封止
部材８の膨張率がガラス基板２より大きいため、熱応力
によって接着剤９が損傷して、ガラス基板２から封止部
材８が剥離する虞があった。本発明は、この問題に鑑み
なされたものであり、周囲温度が変化したときであって
も、破損しにくい電界発光素子を提供するものである。However, since the thermal expansion coefficients of the glass substrate 2 and the sealing member 8 are different, when the ambient temperature changes, the electroluminescent device 1 may be damaged. That is, since the coefficient of thermal expansion of stainless steel (sealing member 8) is larger than the coefficient of thermal expansion of glass (glass substrate 2), when the temperature around electroluminescent element 1 increases, the coefficient of expansion of sealing member 8 increases. Since it is larger than the glass substrate 2, the adhesive 9 may be damaged by thermal stress, and the sealing member 8 may be peeled off from the glass substrate 2. The present invention has been made in view of this problem, and an object of the present invention is to provide an electroluminescent element that is hardly damaged even when the ambient temperature changes.
【０００４】[0004]
【課題を解決するための手段】本発明は、前記課題を解
決するため、透光性基板１３と、少なくとも透明電極１
６と発光層２０と背面電極１９とを有し前記透光性基板
１３に積層された積層体１４と、前記透光性基板１３に
接着され前記積層体１４を気密的に封止する封止部材１
５と、を有する電界発光素子１２であって、前記封止部
材１５は熱応力を吸収可能な金属薄板からなるものであ
る。According to the present invention, a light-transmitting substrate 13 and at least a transparent electrode 1 are provided.
6, a laminated body 14 having a light-emitting layer 20, a back electrode 19, and laminated on the translucent substrate 13, and a seal bonded to the translucent substrate 13 to hermetically seal the laminated body 14. Member 1
5, the sealing member 15 is made of a thin metal plate capable of absorbing thermal stress.
【０００５】また、本発明は、前記金属薄板は、アルミ
ニウムからなるものである。According to the present invention, the metal sheet is made of aluminum.
【０００６】また、本発明は、前記封止部材１５は、前
記積層体１４と対向する箇所に設けられた凹凸部１５ｃ
を有するものである。Further, according to the present invention, the sealing member 15 includes an uneven portion 15 c provided at a position facing the laminate 14.
It has.
【０００７】また、本発明は、前記凹凸部１５ｃにゼリ
ー状の吸湿剤２９を塗布したものである。In the present invention, the uneven portion 15c is coated with a jelly-like hygroscopic agent 29.
【０００８】[0008]
【発明の実施の形態】以下、添付の図面に基いて、本発
明の一実施形態を説明する。電界発光素子１２は、ガラ
ス基板１３（透光性基板），積層体１４，封止部材１５
を有している。積層体１４は、ＩＴＯ（Indium Tin Oxi
de）からなる透明電極１６，ポリイミド系のレジストか
らなる絶縁層１７，有機層１８，背面電極１９からなる
ものであり、ガラス基板１３の後面に積層形成されてい
る。有機層１８は少なくとも発光層２０を有するもので
あるが、有機層１８に正孔注入層２１，正孔輸送層２２
及び電子輸送層２３を設けても良い（図３参照）。背面
電極１９は、アルミニウム（Al），アルミリチウム（A
l:Li），マグネシウム銀（Mg:Ag）等の金属性の導電性
材料を蒸着法あるいはスパッタリング法等の手段によっ
て形成したものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. The electroluminescent element 12 includes a glass substrate 13 (light-transmitting substrate), a laminate 14, and a sealing member 15.
have. The laminate 14 is made of ITO (Indium Tin Oxi).
de), an insulating layer 17 made of a polyimide-based resist, an organic layer 18, and a back electrode 19, which are laminated on the rear surface of the glass substrate 13. The organic layer 18 has at least the light emitting layer 20, and the organic layer 18 has a hole injection layer 21 and a hole transport layer 22.
And an electron transport layer 23 (see FIG. 3). The back electrode 19 is made of aluminum (Al), aluminum lithium (A
Metallic conductive materials such as l: Li) and magnesium silver (Mg: Ag) are formed by means such as vapor deposition or sputtering.
【０００９】透明電極１６は、リード部２４と、リード
部２４の一端と連なる表示セグメント部２５と、リード
部２４の他端と連なる陽極端子部２６と、陰極端子部２
７とを有している（図２参照）。表示セグメント部２５
は日字形に配設されており、この表示セグメント部２５
に各々リード部２４が連設されている。リード部２４は
ガラス基板１３の一辺側に引き回されており、陽極端子
部２６が連設されている。陽極端子部２６及び陰極端子
部２７はガラス基板１３の一辺側に列状に配置されてい
る。The transparent electrode 16 includes a lead portion 24, a display segment portion 25 connected to one end of the lead portion 24, an anode terminal portion 26 connected to the other end of the lead portion 24, and a cathode terminal portion 2.
7 (see FIG. 2). Display segment unit 25
Are arranged in the shape of a Japanese character.
Are connected to each other. The lead portion 24 is routed to one side of the glass substrate 13, and an anode terminal portion 26 is provided continuously. The anode terminal section 26 and the cathode terminal section 27 are arranged in a row on one side of the glass substrate 13.
【００１０】２８は紫外線硬化性の接着剤であり、この
接着剤２８によりガラス基板１３の後面と封止部材１５
の接着面１５ｂが接着される。封止部材１５は、プレス
成形されたアルミニウムの金属薄板（厚さ約０．２ｍ
ｍ）からなるものである。封止部材１５の積層体１４に
対向する面１５ａには、連続した複数の凹凸部１５ｃが
設けられており、波状になっている。また、封止部材１
５は、フランジ部１５ｄを有しており、このフランジ部
１５ｄのガラス基板１３に対向する面が接着面１５ｂと
なっている。Reference numeral 28 denotes an ultraviolet-curing adhesive, and the adhesive 28 allows the rear surface of the glass substrate 13 and the sealing member 15
Is adhered. The sealing member 15 is made of a press-formed aluminum thin metal plate (having a thickness of about 0.2 m).
m). A plurality of continuous concave and convex portions 15c are provided on a surface 15a of the sealing member 15 facing the laminated body 14, and have a wavy shape. Also, the sealing member 1
5 has a flange portion 15d, and a surface of the flange portion 15d facing the glass substrate 13 is an adhesive surface 15b.
【００１１】２９は吸湿剤であり、この吸湿剤２９は、
封止部材１５の凹凸部１５ｃに塗布されている。吸湿剤
２９は、活性アルミナ，モレキュラシーブス，酸化カリ
ウム，及び酸化バリウム等の物理的若しくは化学的に湿
気を吸着する吸着剤を含有するもので、吸着剤が流動し
ない程度の粘性があるゼリー状になっている。Reference numeral 29 denotes a hygroscopic agent.
It is applied to the uneven portion 15c of the sealing member 15. The hygroscopic agent 29 contains an adsorbent such as activated alumina, molecular sieves, potassium oxide, and barium oxide that physically or chemically adsorbs moisture. Has become.
【００１２】封止部材１５は柔軟な金属薄板であるた
め、周囲の温度が変化しても、電界発光素子１２が破損
しにくい。つまり、電界発光素子１２の周囲の温度が上
昇した場合、アルミニウム（封止部材１２）の熱膨張係
数は、ガラス（ガラス基板１３）より大きいため、封止
部材１５がガラス基板１３より大きく膨張するが、封止
部材１５が柔軟であるため撓み、熱応力を吸収するた
め、ガラス基板１３から封止部材１５が剥離しにくい。Since the sealing member 15 is a flexible thin metal plate, the electroluminescent element 12 is hardly damaged even when the ambient temperature changes. That is, when the temperature around the electroluminescent element 12 increases, the thermal expansion coefficient of aluminum (the sealing member 12) is larger than that of the glass (the glass substrate 13), so that the sealing member 15 expands more than the glass substrate 13. However, since the sealing member 15 is flexible, it bends and absorbs thermal stress, so that the sealing member 15 is hardly peeled off from the glass substrate 13.
【００１３】なお、封止部材１５の凹凸部１５ｃはなく
ても良いが、凹凸部１５ｃを設けることにより、封止部
剤１５が撓みやすくなり、更に熱応力を吸収しやすくな
る。また、吸湿剤２９を設ける場合は、凹凸部１５ｃに
塗布することが望ましく、吸湿剤２９を平面に塗布する
よりも表面積を増やすことができ、吸湿剤２９の吸湿効
果を上げることができる。It is to be noted that the concave-convex portion 15c of the sealing member 15 may not be provided, but by providing the concave-convex portion 15c, the sealing agent 15 is easily bent, and the thermal stress is easily absorbed. In the case where the moisture absorbent 29 is provided, it is desirable to apply the moisture absorbent 29 to the uneven portion 15c, so that the surface area can be increased as compared with the case where the moisture absorbent 29 is applied to a flat surface, and the moisture absorbing effect of the moisture absorbent 29 can be enhanced.
【００１４】また、本実施形態は、日字形に配設された
表示セグメント部２５を有するものであったが、例え
ば、液晶表示素子のバックライトとして用いられるよう
な略全面が発光する電界発光素子にも本発明を適用でき
る。また、本実施形態は有機電界発光素子であったが、
本発明は無機電界発光素子にも適用できることは言うま
でもない。Although the present embodiment has the display segment portions 25 arranged in the shape of a Japanese character, for example, an electroluminescent device which emits light over substantially the entire surface, such as a backlight of a liquid crystal display device, is used. The present invention can also be applied to Further, although the present embodiment is an organic electroluminescent element,
Needless to say, the present invention can be applied to an inorganic electroluminescent element.
【００１５】[0015]
【発明の効果】本発明は、透光性基板と、少なくとも透
明電極と発光層と背面電極とを有し前記透光性基板に積
層された積層体と、前記透光性基板に接着され前記積層
体を気密的に封止する封止部材と、を有する電界発光素
子であって、前記封止部材は熱応力を吸収可能な金属薄
板からなるものであり、電界発光素子の周囲の温度が上
昇した場合であっても、封止部材が熱応力を吸収するた
め、ガラス基板から封止部材が剥離しにくい。According to the present invention, there is provided a light-transmitting substrate, a laminate having at least a transparent electrode, a light-emitting layer, and a back electrode laminated on the light-transmitting substrate; A sealing member for hermetically sealing the stacked body, wherein the sealing member is made of a thin metal plate capable of absorbing thermal stress, and the temperature around the electroluminescent element is reduced. Even when the sealing member rises, the sealing member absorbs thermal stress, so that the sealing member is not easily peeled from the glass substrate.
【００１６】また、本発明は、前記封止部材は、前記積
層体と対向する箇所に設けられた凹凸部を有するもので
あり、更に封止部材が熱応力を吸収しやすくなり、電界
発光素子が破損しにくい。Further, according to the present invention, the sealing member has an uneven portion provided at a position facing the laminate, and the sealing member easily absorbs thermal stress, and Is not easily damaged.
【００１７】また、本発明は、前記凹凸部にゼリー状の
吸湿剤を塗布したものであり、吸湿剤の表面積を増加さ
せることができ、吸湿効果を上げることができる。Further, in the present invention, a jelly-like hygroscopic agent is applied to the uneven portion, so that the surface area of the hygroscopic agent can be increased and the hygroscopic effect can be enhanced.
【図１】 本発明の実施形態を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】 同上実施形態を示す正面図。FIG. 2 is a front view showing the embodiment.
【図３】 同上実施形態を示す有機層の断面図。FIG. 3 is a sectional view of an organic layer according to the embodiment.
【図４】 従来例を示す断面図。FIG. 4 is a sectional view showing a conventional example.
１２ 電界発光素子 １３ ガラス基板（透光性基板） １４ 積層体 １５ 封止部材 １５ｃ 凹凸部 １６ 透明電極 １７ 絶縁層 １８ 有機層 １９ 背面電極 ２０ 発光層 １７ リード部 １８ 表示セグメント部 １９ 端子部 ２９ 吸湿剤 REFERENCE SIGNS LIST 12 electroluminescent element 13 glass substrate (translucent substrate) 14 laminate 15 sealing member 15 c uneven portion 16 transparent electrode 17 insulating layer 18 organic layer 19 back electrode 20 light emitting layer 17 lead portion 18 display segment portion 19 terminal portion 29 moisture absorption Agent
Claims (4)
光層と背面電極とを有し前記透光性基板に積層された積
層体と、前記透光性基板に接着され前記積層体を気密的
に封止する封止部材と、を有する電界発光素子であっ
て、前記封止部材は熱応力を吸収可能な金属薄板からな
ることを特徴とする電界発光素子。1. A light-transmitting substrate, a laminate having at least a transparent electrode, a light-emitting layer, and a back electrode, laminated on the light-transmissive substrate, and hermetically sealed to the light-transmissive substrate. An electroluminescent device comprising: a sealing member that seals electrically; wherein the sealing member is made of a thin metal plate capable of absorbing thermal stress.
て、前記金属薄板は、アルミニウムからなることを特徴
とする電界発光素子。2. The electroluminescent device according to claim 1, wherein said thin metal plate is made of aluminum.
光素子において、前記封止部材は、前記積層体と対向す
る箇所に設けられた凹凸部を有することを特徴とする電
界発光素子。3. The electroluminescent device according to claim 1, wherein the sealing member has a concave / convex portion provided at a position facing the laminate.
て、前記凹凸部にゼリー状の吸湿剤を塗布したことを特
徴とする電界発光素子。4. The electroluminescent device according to claim 3, wherein a jelly-like hygroscopic agent is applied to the uneven portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001022006A JP2002231440A (en) | 2001-01-30 | 2001-01-30 | Electroluminescence element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001022006A JP2002231440A (en) | 2001-01-30 | 2001-01-30 | Electroluminescence element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002231440A true JP2002231440A (en) | 2002-08-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001022006A Pending JP2002231440A (en) | 2001-01-30 | 2001-01-30 | Electroluminescence element |
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| JP (1) | JP2002231440A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100662991B1 (en) | 2005-12-09 | 2006-12-28 | 삼성에스디아이 주식회사 | Organic light-emitting display device |
| JP2007250355A (en) * | 2006-03-16 | 2007-09-27 | Seiko Epson Corp | Sealing structure for light emitting device, its manufacturing method, light emitting device, and electronic device |
| CN102593148A (en) * | 2011-01-04 | 2012-07-18 | 三星移动显示器株式会社 | Flat panel display apparatus and organic light-emitting display apparatus |
| KR20160056585A (en) * | 2014-11-12 | 2016-05-20 | 엘지디스플레이 주식회사 | Organic light emitting display |
-
2001
- 2001-01-30 JP JP2001022006A patent/JP2002231440A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100662991B1 (en) | 2005-12-09 | 2006-12-28 | 삼성에스디아이 주식회사 | Organic light-emitting display device |
| JP2007250355A (en) * | 2006-03-16 | 2007-09-27 | Seiko Epson Corp | Sealing structure for light emitting device, its manufacturing method, light emitting device, and electronic device |
| CN102593148A (en) * | 2011-01-04 | 2012-07-18 | 三星移动显示器株式会社 | Flat panel display apparatus and organic light-emitting display apparatus |
| US9147858B2 (en) | 2011-01-04 | 2015-09-29 | Samsung Display Co., Ltd. | Flat panel display apparatus and organic light-emitting display apparatus |
| TWI575485B (en) * | 2011-01-04 | 2017-03-21 | 三星顯示器有限公司 | Flat panel display apparatus and organic light-emitting display apparatus |
| KR20160056585A (en) * | 2014-11-12 | 2016-05-20 | 엘지디스플레이 주식회사 | Organic light emitting display |
| KR102327434B1 (en) | 2014-11-12 | 2021-11-16 | 엘지디스플레이 주식회사 | Organic light emitting display |
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