JP2002220393A - Manufacturing method for tetra tertiary alkoxysilane - Google Patents

Manufacturing method for tetra tertiary alkoxysilane

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Publication number
JP2002220393A
JP2002220393A JP2001060936A JP2001060936A JP2002220393A JP 2002220393 A JP2002220393 A JP 2002220393A JP 2001060936 A JP2001060936 A JP 2001060936A JP 2001060936 A JP2001060936 A JP 2001060936A JP 2002220393 A JP2002220393 A JP 2002220393A
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JP
Japan
Prior art keywords
otbu
alkoxysilane
producing
tetratertiary
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2001060936A
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Japanese (ja)
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JP4262900B2 (en
Inventor
Setsuo Hashiguchi
節夫 橋口
Hidekimi Kadokura
秀公 門倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kojundo Kagaku Kenkyusho KK
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Kojundo Kagaku Kenkyusho KK
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Abstract

PROBLEM TO BE SOLVED: To manufacture Si(OtBu)4 by reacting intermediate raw materials of Si(OtBu)3Cl or Si(OtBu)2Cl2 under mild conditions such as temperature less than 200 deg.C and atmospheric pressure without using an autoclave as a reactor, and to manufacture Si(OtAm)4 as well. SOLUTION: K(OtBu) used as a reaction agent is reacted with Si(OtBu)3Cl or Si(OtBu)2Cl2 in xylene solvent at 150 deg.C for 7 hours, and the reactant is filtered and distilled. Thereby, Si(OtBu)4 with high purity is obtained at yield of 58%.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、シリカ含有酸化物
膜を、化学気相成長法(CVD法)にて形成するための
原料として好適なテトラターシャリーアルコキシシラン
の製法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing tetra-tertiary alkoxysilane suitable as a raw material for forming a silica-containing oxide film by a chemical vapor deposition (CVD) method.

【0002】[0002]

【従来の技術】半導体装置製造において、SiO含有
膜をCVD法で形成するためのアルコキシシラン原料と
しては、主にテトラエトキシシランSi(OC
が用いられている。しかし、他の金属ターシャリーア
ルコキシドと合わせて使用する場合には、アルコキシ基
の交換を防ぐためにSi源はテトラターシャリーアルコ
キシシランであることが望ましい。また、テトラエトキ
シシランの熱分解温度は高いので、より低い温度で熱分
解したい場合には、テトラターシャリーアルコキシシラ
ンが好ましい。本発明者らは、特願2000−2722
83号において、ゲート絶縁膜として有用なジルコニア
−シリカ含有酸化物膜を製造するためのCVD原料組成
物として、Zr(OtBu)とSi(OtBu)
の混合物を開示している(OtBuはターシャリーブト
キシ基OC(CHを表す)。
2. Description of the Related Art In the manufacture of semiconductor devices, an alkoxysilane raw material for forming an SiO 2 -containing film by a CVD method is mainly tetraethoxysilane Si (OC 2 H 5 ).
4 is used. However, when used in combination with other metal tertiary alkoxides, it is desirable that the Si source be tetratertiary alkoxysilane to prevent the exchange of alkoxy groups. In addition, since the thermal decomposition temperature of tetraethoxysilane is high, when it is desired to perform thermal decomposition at a lower temperature, tetratertiary alkoxysilane is preferable. The present inventors have disclosed in Japanese Patent Application No. 2000-2722.
No. 83 discloses a mixture of Zr (OtBu) 4 and Si (OtBu) 4 as a CVD raw material composition for producing a zirconia-silica-containing oxide film useful as a gate insulating film (OtBu. tertiary butoxy group OC represents a (CH 3) 3).

【0003】しかし、Si(OtBu)の製造は、S
iClを原料とする場合、OtBuが嵩高いため4つ
目のClと置換しにくく、厳しい反応条件が必要である
という問題があった。M.G.VoronkovらZh
ur.Obshchei Khim.Vol.26,3
072(1956)(抄録Chem.Ab.Vol.5
1,8643)は、Si(OtBu)ClとNa(O
tBu)とトルエン溶媒を鋼製オートクレーブに仕込
み、220℃で18時間加熱し、生成物を蒸留し、粗S
i(OtBu)を47%の収率で得、次いでエタノー
ルから再結晶し、融点51.5℃の精Si(OtBu)
を得ている。オートクレーブを使用し、かつ条件も厳
しい。なお中間原料のSi(OtBu)Clは、トル
エン溶媒中、tBuOHとピリジンとSiClを加熱
反応させ、濾過後、蒸留して得ている。
[0003] However, the production of Si (OtBu) 4
When iCl 4 is used as a raw material, OtBu is bulky, so that it is difficult to replace it with the fourth Cl, and there is a problem that strict reaction conditions are required. M. G. FIG. Voronkov et al. Zh
ur. Obshchei Khim. Vol. 26,3
072 (1956) (Abstract Chem. Ab. Vol. 5)
1,8643) is composed of Si (OtBu) 3 Cl and Na (O
tBu) and a toluene solvent were charged into a steel autoclave, heated at 220 ° C. for 18 hours, and the product was distilled to obtain crude S
i (OtBu) 4 was obtained in a yield of 47% and then recrystallized from ethanol to give pure Si (OtBu) with a melting point of 51.5 ° C.
I got 4 . Uses an autoclave and has strict conditions. The intermediate material Si (OtBu) 3 Cl is obtained by heating and reacting tBuOH, pyridine and SiCl 4 in a toluene solvent, filtering, and then distilling.

【0004】H.BreederveldらRec.t
rav.chim.vol.73,871(1954)
(抄録Chem.Ab.Vol.49,8792)は、
反応性の高いSiBrを原料として、Na(OtB
u)と反応させ、Si(OtBu)Brを得、これと
tBuOHとを封管中220℃で10時間加熱し、濾過
後、蒸留してSi(OtBu)を得ている。ここでも
4つ目のOtBuを入れるために厳しい条件を用いてい
る。以上述べたように、いずれもオートクレーブ中、2
20℃で10〜18時間という厳しい条件が必要であっ
た。
[0004] H. Breederveld et al. Rec. t
rv. chim. vol. 73, 871 (1954)
(Abstract Chem. Ab. Vol. 49, 8792)
Using highly reactive SiBr 4 as a raw material, Na (OtB
u) to obtain Si (OtBu) 3 Br, which is heated in a sealed tube at 220 ° C. for 10 hours, filtered, and distilled to obtain Si (OtBu) 4 . Again, a strict condition is used to insert the fourth OtBu. As mentioned above, in any case during autoclave,
Strict conditions of 10 to 18 hours at 20 ° C. were required.

【0005】[0005]

【発明が解決しようとする課題】Si(OtBu)
lやSi(OtBu)Clを中間原料として用い、
反応器にオートクレーブを用いないで、大気圧下で20
0℃以下の温和な条件で反応させて、Si(OtBu)
を製造する方法を提供することである。同様にしてS
i(OtAm)(ここでOtAmはターシャリーアミ
ロキシ基OC(CHを表す)を製造する
方法を提供することである。
SUMMARY OF THE INVENTION Si (OtBu) 3 C
l or Si (OtBu) 2 Cl 2 as an intermediate material,
Do not use an autoclave in the reactor,
The reaction is carried out under a mild condition of 0 ° C. or less, and Si (OtBu)
4 to provide a method of manufacturing the same. Similarly, S
It is to provide a method for producing i (OtAm) 4, where OtAm represents a tertiary amyloxy group OC (CH 3 ) 2 C 2 H 5 .

【0006】[0006]

【課題を解決するための手段】本発明は、Si(OR)
Cl4−nを原料としてSi(OR)を製造する方
法において、反応剤としてK(OR)(カリウムターシ
ャリーアルコキシド)を用いることを特徴とするテトラ
ターシャリーアルコキシシランの製法である。ここでR
はC(CHまたはC(CH(C
を、nは3または2を表す。本発明は、Si(OR)
Cl4−nとK(OR)との反応を、不活性有機溶媒
中、130〜170℃、大気圧下で行うことを特徴とす
るテトラターシャリーアルコキシシランの製法である。
本発明は、Si(OR)Cl4−nに対するK(O
R)の仕込量を、Clの当量である(4−n)の1.1
〜1.5倍量とすることを特徴とするテトラターシャリ
ーアルコキシシランの製法である。本発明は、Si(O
R)Cl4−nとK(OR)との反応に使用する不活
性有機溶媒が沸点130〜170℃であることを特徴と
するテトラターシャリーアルコキシシランの製法であ
る。本発明は、Si(OR)Cl4−nとK(OR)
との反応に使用する不活性有機溶媒がキシレンであるこ
とを特徴とするテトラターシャリーアルコキシシランの
製法である。本発明は、Si(OR)Cl4−nとK
(OR)との反応をさせた後、副生したKCl結晶を濾
過分離し、次いで減圧蒸留回収することを特徴とするテ
トラターシャリーアルコキシシランの製法である。本発
明は、Si(OR)Cl4−nとK(OR)との反応
をさせた後、副生したKCl結晶を濾過分離し、次いで
減圧蒸留回収して得られるSi(OR)中のCl含量
が10ppm以下、K含量が1ppm以下であることを
特徴とするテトラターシャリーアルコキシシランの製法
である。
SUMMARY OF THE INVENTION The present invention is directed to a Si (OR)
The n Cl 4-n in a method for producing a Si (OR) 4 as a raw material, a process for preparing tetra-tertiary alkoxysilane, which comprises using a K (OR) (potassium tertiary alkoxide) as a reactant. Where R
Is C (CH 3 ) 3 or C (CH 3 ) 2 (C 2 H 5 )
And n represents 3 or 2. The present invention relates to Si (OR) n
A process for producing tetratertiary alkoxysilane, wherein the reaction between Cl 4-n and K (OR) is performed in an inert organic solvent at 130 to 170 ° C. under atmospheric pressure.
The present invention relates to K (O) for Si (OR) n Cl 4-n .
The charge amount of R) was changed to 1.1 of (4-n), which is the equivalent of Cl.
A method for producing tetratertiary alkoxysilane, characterized in that the amount is up to 1.5 times. The present invention relates to Si (O
R) n Cl 4-n is a method for producing tetratertiary alkoxysilane, wherein the inert organic solvent used in the reaction of K (OR) has a boiling point of 130 to 170 ° C. The present invention relates to Si (OR) n Cl 4-n and K (OR)
And xylene is the inert organic solvent used in the reaction with the tertiary alkoxysilane. The present invention relates to Si (OR) n Cl 4-n and K
A method for producing tetratertiary alkoxysilane, comprising reacting with (OR), separating KCl crystals by-produced by filtration, and collecting the crystals by distillation under reduced pressure. In the present invention, the reaction of Si (OR) n Cl 4-n with K (OR), KCl crystals by-produced are separated by filtration, and then, the Si (OR) 4 obtained by vacuum distillation recovery is obtained. Wherein the Cl content is 10 ppm or less and the K content is 1 ppm or less.

【0007】[0007]

【発明の実施の形態】以下はSi(OtBu)の場合
について述べるが、Si(OtAm)でも同様であ
る。本発明に使用する中間原料は、Si(OtBu)
ClまたはSi(OtBu)ClとSi(OtBu)
Clの混合物である。これらは、前述のM.G.V
oronkovらの方法により得られる。すなわち、t
BuOH4モルとピリジン4モルのトルエン溶液中にS
iCl1モルを滴下し水浴加熱で10時間反応させた
後、濾過し、蒸留してSi(OtBu)Clを43.
4%の収率で得ている。Si(OtBu)Clの大気
圧下の沸点は202〜203℃である。本発明者らの検
討結果では、反応の温度と時間を温和な条件にすると、
Si(OtBu)ClとSi(OtBu)Cl
混合物となるが、本発明の中間原料として充分使用でき
る。Si(OtBu)ClとSi(OtBu)Cl
の比率は、ガスクロマトグラフィーにより容易に分析
できるので、好ましい仕込みK(OtBu)の量を計算
できる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The case of Si (OtBu) 4 will be described below, but the same applies to Si (OtAm) 4 . The intermediate material used in the present invention is Si (OtBu) 3
Cl or Si (OtBu) 3 Cl and Si (OtBu)
It is a mixture of 2 Cl 2 . These are described in the M.D. G. FIG. V
It can be obtained by the method of Oronkov et al. That is, t
S in a toluene solution of 4 mol of BuOH and 4 mol of pyridine
After 1 mol of iCl 4 was added dropwise and reacted for 10 hours by heating in a water bath, the mixture was filtered and distilled to obtain Si (OtBu) 3 Cl.
Obtained in 4% yield. Si (OtBu) 3 the boiling point at atmospheric pressure of Cl is 202-203 ° C.. According to the study results of the present inventors, if the reaction temperature and time are set to mild conditions,
A mixture of Si (OtBu) 3 Cl and Si (OtBu) 2 Cl 2 can be sufficiently used as an intermediate material in the present invention. Si (OtBu) 3 Cl and Si (OtBu) 2 Cl
Since the ratio of 2 can be easily analyzed by gas chromatography, a preferable amount of charged K (OtBu) can be calculated.

【0008】本発明に使用するK(OtBu)は、tB
uOH中に金属カリウムKを室温で投入し反応させ、次
いで未反応原料tBuOHを減圧留去することにより容
易に得られる。KはNaよりかなり活性が高いので反応
時間は短くてよい。また、K(OtBu)は工業的に市
販されているのでそれを使うこともできる。
[0008] K (OtBu) used in the present invention is tB
It is easily obtained by introducing metal potassium K into uOH at room temperature to cause a reaction, and then distilling off unreacted raw material tBuOH under reduced pressure. Since K is much more active than Na, the reaction time may be short. In addition, K (OtBu) is commercially available and can be used.

【0009】本発明で使う反応式は次式である。The reaction formula used in the present invention is as follows.

【0010】[0010]

【化1】 Embedded image

【0011】Si(OtBu)Cl4−nに対するK
(OtBu)の仕込量は、Clの当量である(4−n)
の1.1〜1.5倍量とすることが好ましい。1.1倍
以下では、Clが残りやすく好ましくなく、1.5倍以
上では多く使用するに足りる利点がなくなる。
K for Si (OtBu) n Cl 4-n
The charged amount of (OtBu) is the equivalent of Cl (4-n).
It is preferable that the amount is 1.1 to 1.5 times the amount. When the ratio is 1.1 times or less, Cl is likely to remain, which is not preferable. When the ratio is 1.5 times or more, there is no advantage of using it frequently.

【0012】反応は不活性有機溶媒中、130〜170
℃で2〜10時間行う。反応器に溶媒とK(OtBu)
を仕込み、攪拌分散させ、室温付近で油状のSi(Ot
Bu)Cl4−nを滴下していくと、まずSi(Ot
Bu)Clが反応しその発熱反応で液温度が80℃
付近まで上昇する。Si(OtBu)Clの本格的な
反応は150℃付近で急激に起こる。その反応温度制御
のため、溶媒がリフラックスして除熱できるとよい。S
i(OtBu)の大気圧下の沸点は222℃であるの
で、蒸留で溶媒を分離するためには、溶媒の沸点は、1
70℃以下のものが好ましい。また、大気圧下で130
℃以上の反応条件が必要なので、溶媒がリフラックスし
て除熱、反応温度制御できるとよいので、その沸点は1
30℃以上のものが好ましい。よって用いる溶媒は沸点
130〜170℃のものが好ましい。好ましい不活性有
機溶媒としては、キシレンである。キシレンの場合は、
そのリフラックスを利用して、反応温度を150℃付近
に制御できる。キシレンであれば、オルトキシレン(沸
点144.4℃)、メタキシレン(139.1℃)、パ
ラキシレン(138.4℃)のいずれか、またはそれら
の混合物でよい。
The reaction is carried out in an inert organic solvent at 130 to 170
C. for 2-10 hours. Solvent and K (OtBu) in reactor
, And dispersed by stirring. At room temperature, oily Si (Ot
When (Bu) n Cl 4-n is dropped, first, Si (Ot
Bu) 2 Cl 2 reacts and the exothermic reaction causes a liquid temperature of 80 ° C.
Rise to near. The full-scale reaction of Si (OtBu) 3 Cl occurs rapidly around 150 ° C. In order to control the reaction temperature, it is preferable that the solvent be refluxed to remove heat. S
Since the boiling point of i (OtBu) 4 at atmospheric pressure is 222 ° C., in order to separate the solvent by distillation, the boiling point of the solvent must be 1
Those having a temperature of 70 ° C. or lower are preferred. Also, under atmospheric pressure, 130
Since the reaction conditions are required to be higher than ℃, it is preferable that the solvent is refluxed to remove heat and control the reaction temperature.
Those having a temperature of 30 ° C. or higher are preferred. Therefore, the solvent used preferably has a boiling point of 130 to 170 ° C. A preferred inert organic solvent is xylene. For xylene,
The reaction temperature can be controlled to around 150 ° C. by using the reflux. As xylene, any of ortho-xylene (boiling point: 144.4 ° C.), meta-xylene (139.1 ° C.), para-xylene (138.4 ° C.), or a mixture thereof may be used.

【0013】上記溶媒を用い大気圧下の反応でSi(O
tBu)を製造できるが、時間短縮や溶媒分離の容易
さに着目して、オートクレーブで130〜170℃の反
応を行ってもよい。その場合には溶媒としてトルエンな
ども使える。この場合でも、K(OtBu)を使うこと
により、Na(OtBu)より、反応条件が温和にな
り、収率が向上する。
[0013] Si (O
tBu) 4 can be produced, but the reaction at 130 to 170 ° C. may be performed in an autoclave, focusing on the reduction of time and the ease of solvent separation. In that case, toluene or the like can be used as a solvent. Also in this case, by using K (OtBu), the reaction conditions are milder than Na (OtBu), and the yield is improved.

【0014】Si(OtBu)ClとK(OtBu)
との反応をさせた後、副生したKCl結晶を濾過分離
し、次いで減圧蒸留で、溶媒を初留として除き、Si
(OtBu)を主留分として得る。減圧蒸留は5〜1
00Torrで行う。一例として、15TorrでSi
(OtBu)の留出温度は105℃付近である。上記
工程を経て得られたSi(OtBu)中のCl含量は
10ppm以下と非常に小さくできる。またK(OtB
u)は昇華圧が非常に小さいので、蒸留により除かれ、
K含量を1ppm以下にできる。ClとKが少ないこと
は半導体装置製造の原料としては非常に好ましいことで
ある。大気圧下の蒸留では釜の加熱温度が250℃と高
くなりすぎ、一部Si(OtBu)の熱分解が起こ
り、生成したtBuOHなどが主留分に混入してくる。
Si (OtBu) 3 Cl and K (OtBu)
After that, KCl crystals by-produced were separated by filtration, and then the solvent was removed as a first distillation by vacuum distillation to remove SiCl.
(OtBu) 4 is obtained as the main fraction. Vacuum distillation is 5-1
Perform at 00 Torr. As an example, Si at 15 Torr
The distillation temperature of (OtBu) 4 is around 105 ° C. The Cl content in the Si (OtBu) 4 obtained through the above process can be very small, 10 ppm or less. K (OtB
Since u) has a very low sublimation pressure, it is removed by distillation,
The K content can be reduced to 1 ppm or less. The fact that Cl and K are small is very preferable as a raw material for manufacturing semiconductor devices. In distillation under atmospheric pressure, the heating temperature of the kettle becomes too high at 250 ° C., and thermal decomposition of a part of Si (OtBu) 4 occurs, and the generated tBuOH and the like are mixed into the main fraction.

【0015】[0015]

【実施例】Si(OtBu)の製造 リフラックスコンデンサー、温度計、攪拌器の付いた5
Lフラスコに脱水tBuOH741g(10.0mo
l)と脱水ピリジン791g(10.0mol)とトル
エン0.7Lを仕込み攪拌しながら、脱水トルエン0.
5Lで希釈されたSiCl425g(2.5mol)
を室温で滴下した。次いで昇温し75℃に4時間保っ
た。冷却後濾過し、溶媒を減圧留去した。次いで15T
orrで蒸留し、50〜90℃の留分400gを回収し
た。この留分をガスクロマトグラフィーで分析したとこ
ろSi(OtBu)Cl52%とSi(OtBu)
Cl48%の混合物であった(Siとして1.52m
ol、収率61%)。
EXAMPLE Production of Si (OtBu) 4 5 equipped with a reflux condenser, thermometer and stirrer
741g of dehydrated tBuOH (10.0mo
l), 791 g (10.0 mol) of dehydrated pyridine and 0.7 L of toluene were charged and stirred with 0.1 mL of dehydrated toluene.
425 g (2.5 mol) of SiCl 4 diluted with 5 L
Was added dropwise at room temperature. Then, the temperature was raised and kept at 75 ° C. for 4 hours. After cooling, the mixture was filtered and the solvent was distilled off under reduced pressure. Then 15T
Distillation was performed at orr, and 400 g of a 50-90 ° C distillate was recovered. This fraction was analyzed by gas chromatography to find out that 52% of Si (OtBu) 2 Cl 2 and Si (OtBu)
3 Cl 48% (1.52 m as Si)
ol, 61% yield).

【0016】次いでリフラックスコンデンサー、温度
計、攪拌器の付いた3Lフラスコにキシレン0.35L
とK(OtBu)274g(2.44mol)を仕込
み、攪拌し、分散させた。次いで上記回収留分300g
(Siとして1.14mol、Clとして1.77mo
lを含んでいるのでK/Cl=1.38となる)を室温
からゆっくり滴下すると発熱反応し液温は80℃程度ま
で上昇した。この時点でSi(OtBu)ClはS
i(OtBu)Clへ変化していた。次いで加熱昇温
していくと、130℃程度から激しい発熱反応がおこ
り、リフラックスが起こり、液温を150℃付近に制御
した。150℃で7時間攪拌保持した後、冷却し、濾過
した。
Then, 0.35 L of xylene was placed in a 3 L flask equipped with a reflux condenser, a thermometer and a stirrer.
And K (OtBu) (274 g, 2.44 mol) were charged, stirred, and dispersed. Next, 300 g of the recovered fraction
(1.14 mol of Si, 1.77 mol of Cl)
When K / Cl = 1.38 was added dropwise slowly from room temperature, an exothermic reaction occurred and the liquid temperature rose to about 80 ° C. At this point, Si (OtBu) 2 Cl 2 is converted to S
i (OtBu) 3 Cl. Then, when the temperature was increased by heating, a violent exothermic reaction occurred from about 130 ° C., reflux occurred, and the liquid temperature was controlled at about 150 ° C. After stirring and holding at 150 ° C. for 7 hours, the mixture was cooled and filtered.

【0017】次いで、濾液を減圧蒸留装置に仕込み、1
5Torrで蒸留を行った。初留として40〜80℃で
主にキシレンを回収した。次いでSi(OtBu)
凝固しないように、温水で冷却し、蒸留温度105℃付
近で主留分Si(OtBu)210g(0.66mo
l)を得た。後工程のSi基準の収率は58%であっ
た。融点51℃。この主留分のトルエン溶液での測定結
果、ガスクロマトグラフィー純度は99.5%であっ
た。この測定結果を図1に示す。不純物分析の結果、C
l<10ppm、K<1ppm、Na<1ppm、Fe
<1ppm、Ca<1ppm、その他の金属元素もすべ
て1ppm以下であり、高純度であった。
Next, the filtrate is charged into a vacuum distillation apparatus, and
Distillation was performed at 5 Torr. Xylene was mainly recovered at 40 to 80 ° C as the first distillation. Then, it is cooled with hot water so that Si (OtBu) 4 does not solidify, and 210 g (0.66 mo) of main fraction Si (OtBu) 4 at a distillation temperature of around 105 ° C.
1) was obtained. The yield based on Si in the subsequent step was 58%. Melting point 51 [deg.] C. As a result of measurement of this main fraction with a toluene solution, the purity by gas chromatography was 99.5%. FIG. 1 shows the measurement results. As a result of impurity analysis, C
l <10 ppm, K <1 ppm, Na <1 ppm, Fe
<1 ppm, Ca <1 ppm, and all other metal elements were also 1 ppm or less, indicating high purity.

【0018】[0018]

【発明の効果】Si(OtBu)Clを中間原料と
し、反応剤としてK(OtBu)を使うことにより、大
気圧下の反応で、150℃の温和な条件でSi(OtB
u)が製造できる。反応装置として、オートクレーブ
を必要としない。得られたSi(OtBu)はCl、
Kなどの不純物含量が小さいので、半導体装置製造用の
原料として使える。
By using Si (OtBu) 3 Cl as an intermediate material and using K (OtBu) as a reactant, Si (OtBu) can be reacted under atmospheric pressure under mild conditions at 150 ° C.
u) 4 can be manufactured. No autoclave is required as a reactor. The obtained Si (OtBu) 4 is Cl,
Since the content of impurities such as K is small, it can be used as a raw material for manufacturing semiconductor devices.

【図面の簡単な説明】[Brief description of the drawings]

【図1】主留分Si(OtBu)のトルエン溶液のG
C−FIDによる測定結果を示す図である。
FIG. 1 G of toluene solution of main fraction Si (OtBu) 4
It is a figure showing the measurement result by C-FID.

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】Si(OR)Cl4−nを原料としてS
i(OR)を製造する方法において、反応剤としてK
(OR)を用いることを特徴とするテトラターシャリー
アルコキシシランの製法。ここでRはC(CH
たはC(CH(C)、nは3または2を表
す。
1. A method using S (OR) n Cl 4-n as a raw material
In the method for producing i (OR) 4 , K is used as a reactant.
A method for producing tetratertiary alkoxysilane, comprising using (OR). Here, R represents C (CH 3 ) 3 or C (CH 3 ) 2 (C 2 H 5 ), and n represents 3 or 2.
【請求項2】Si(OR)Cl4−nとK(OR)と
の反応を、不活性有機溶媒中、130〜170℃、大気
圧下で行うことを特徴とする請求項1記載のテトラター
シャリーアルコキシシランの製法。
2. The method according to claim 1, wherein the reaction between Si (OR) n Cl 4-n and K (OR) is carried out in an inert organic solvent at 130 to 170 ° C. under atmospheric pressure. Method for producing tetratertiary alkoxysilane.
【請求項3】K(OR)の仕込量を、Clの当量である
(4−n)の1.1〜1.5倍量とすることを特徴とす
る請求項2記載のテトラターシャリーアルコキシシラン
の製法。
3. The tetratertiary alkoxy according to claim 2, wherein the amount of K (OR) charged is 1.1 to 1.5 times the equivalent of (4-n), which is the equivalent of Cl. Production method of silane.
【請求項4】不活性有機溶媒が沸点130〜170℃で
あることを特徴とする請求項2記載のテトラターシャリ
ーアルコキシシランの製法。
4. The process for producing tetratertiary alkoxysilane according to claim 2, wherein the inert organic solvent has a boiling point of 130 to 170 ° C.
【請求項5】不活性有機溶媒がキシレンであることを特
徴とする請求項2記載のテトラターシャリーアルコキシ
シランの製法。
5. The method according to claim 2, wherein the inert organic solvent is xylene.
【請求項6】Si(OR)Cl4−nとK(OR)と
の反応をさせた後、副生したKCl結晶を濾過分離し、
次いで減圧蒸留回収することを特徴とする請求項1、
2、3、4、5記載のテトラターシャリーアルコキシシ
ランの製法。
6. After reacting Si (OR) n Cl 4-n with K (OR), KCl crystals by-produced are separated by filtration.
2. The method according to claim 1, wherein the solution is recovered by distillation under reduced pressure.
2. The method for producing a tetratertiary alkoxysilane according to 2, 3, 4, or 5.
【請求項7】得られたSi(OR)のCl含量が10
ppm以下、K含量が1ppm以下であることを特徴と
する請求項6記載のテトラターシャリーアルコキシシラ
ンの製法。
7. The obtained Si (OR) 4 has a Cl content of 10%.
7. The method for producing a tetratertiary alkoxysilane according to claim 6, wherein the K content is 1 ppm or less.
JP2001060936A 2001-01-29 2001-01-29 Tetra-tertiary alkoxysilane production method Expired - Fee Related JP4262900B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116284096A (en) * 2023-05-19 2023-06-23 研峰科技(北京)有限公司 Synthesis method of tri (tert-butoxy) silanol with ultralow chloride ion content

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116284096A (en) * 2023-05-19 2023-06-23 研峰科技(北京)有限公司 Synthesis method of tri (tert-butoxy) silanol with ultralow chloride ion content
CN116284096B (en) * 2023-05-19 2023-09-19 研峰科技(北京)有限公司 Synthesis method of tri (tert-butoxy) silanol with ultralow chloride ion content

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