JP2002220245A - Shelfing method - Google Patents

Shelfing method

Info

Publication number
JP2002220245A
JP2002220245A JP2001012895A JP2001012895A JP2002220245A JP 2002220245 A JP2002220245 A JP 2002220245A JP 2001012895 A JP2001012895 A JP 2001012895A JP 2001012895 A JP2001012895 A JP 2001012895A JP 2002220245 A JP2002220245 A JP 2002220245A
Authority
JP
Japan
Prior art keywords
setter
substrate
stage
upper lid
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001012895A
Other languages
Japanese (ja)
Other versions
JP4266073B2 (en
Inventor
Satoshi Taniguchi
聡 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP2001012895A priority Critical patent/JP4266073B2/en
Publication of JP2002220245A publication Critical patent/JP2002220245A/en
Application granted granted Critical
Publication of JP4266073B2 publication Critical patent/JP4266073B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Abstract

PROBLEM TO BE SOLVED: To provide a shelfing method by which heating velocity of a substrate placed on a second setter has approximately the same as that of a substrate placed on a first setter when the two setters coated with a film forming material such as a glass substrate for use in a plasma display panel are stacked and burned. SOLUTION: This method comprises a process wherein the two setters 3, 5 which place substrates 1a, 1b, respectively, coated with the film forming material are stacked through a spacer 9a and a process wherein a plate shaped upper lid 7 covers the second setter 5 through a spacer 9b. The upper lid 7 is made of a light transmissive material and the setters 3, 5 are made of a highly thermal conductive material.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】 本発明は、プラズマディス
プレイパネル用ガラス基板のような膜形成素材が塗布さ
れた基板を2段に積んで焼成する際の棚組方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling shelves when a substrate coated with a film forming material such as a glass substrate for a plasma display panel is stacked in two stages and fired.

【0002】[0002]

【従来の技術】 近年、壁掛けテレビやマルチメディア
用ディスプレイとして利用できる大画面フラットパネル
ディスプレイ(以下、「FPD」という。)の実用化が
着々と進行しつつある。このような大画面FPDとして
は、自発光型で広い視野角を持ち、品質表示が良いとい
う品質面のメリットと、作製プロセスが簡単で大型化が
容易という製造面でのメリットを兼ね備えた、プラズマ
ディスプレイパネル(以下、「PDP」という。)が最
有力候補として挙げられている。
2. Description of the Related Art In recent years, large-screen flat panel displays (hereinafter, referred to as “FPDs”) that can be used as wall-mounted televisions and multimedia displays have been steadily put into practical use. Such a large-screen FPD is a self-luminous type having a wide viewing angle and good quality display, and has a quality advantage and a manufacturing process that is simple and easy to increase in size. A display panel (hereinafter, referred to as “PDP”) is listed as a leading candidate.

【0003】 PDPの製造は、例えば図4に示すよう
に、前面ガラス、背面ガラスと称する大型ガラス基板の
表面に、印刷、乾燥、焼成の工程を複数回繰り返す厚膜
法により、電極、誘導体、蛍光体等の種々の部材を逐次
形成して行き、最終的に前面ガラスと背面ガラスとを封
着することにより行われる。
As shown in FIG. 4, for example, as shown in FIG. 4, a PDP is manufactured by using a thick film method in which printing, drying, and firing steps are repeated a plurality of times on the surface of a large glass substrate called a front glass or a back glass. This is performed by sequentially forming various members such as phosphors and finally sealing the front glass and the rear glass.

【0004】 前記PDP用ガラス基板のような膜形成
素材が塗布された基板の焼成は、当該基板を高熱伝導性
材料からなるセッター上に載置して行われ、最近では、
生産性向上のため基板を載置したセッターを2段に積み
上げた状態で焼成が行われるようになってきている。
[0004] The baking of a substrate coated with a film forming material such as the glass substrate for PDP is performed by placing the substrate on a setter made of a material having high thermal conductivity.
In order to improve productivity, baking is being performed in a state in which setters on which substrates are placed are stacked in two stages.

【0005】 図2は従来の2段積み焼成の状態を示し
たものであり、この場合の棚組方法としては、まず、基
板1aを載置した1段目のセッター23上にスペーサー
9aを介して基板1bを載置した2段目のセッター25
を積み上げ、更にボロフリによる基板の汚染を防止する
ため、2段目のセッター上にスペーサー9bを介して板
状の上蓋27を被せるようにしていた。なお、セッター
23、25及び上蓋27には、いずれもSi含浸SiC
のような光非透過性の高熱伝導性材料からなるものが使
用されていた。
FIG. 2 shows a conventional two-stage stacking firing state. In this case, as a shelf assembling method, first, a spacer 9a is interposed on a first-stage setter 23 on which a substrate 1a is placed. Second stage setter 25 on which the substrate 1b is placed
In order to prevent contamination of the substrate due to bolstering, a plate-like upper lid 27 is put on the second-stage setter via a spacer 9b. Each of the setters 23 and 25 and the upper lid 27 is made of Si-impregnated SiC.
A material made of a light-impermeable high heat conductive material such as described above has been used.

【0006】[0006]

【発明が解決しようとする課題】 2段積み焼成は、前
記のように2段積みした基板1a、1bを、ローラー等
の搬送手段15によって加熱室に搬送し、加熱室の上部
と下部とに設けられた電気ヒーター等の加熱手段11
a、11bで加熱することにより行われる。
In the two-stage firing, the substrates 1a and 1b stacked as described above are transported to the heating chamber by the transporting means 15 such as a roller, and the upper and lower portions of the heating chamber are transported. Heating means 11 such as an electric heater provided
This is performed by heating at a and 11b.

【0007】 しかしながら、前記のような棚組方法で
2段積み焼成を行った場合、1段目のセッター23に載
置された基板1aには、主に下部の加熱手段11bによ
り加熱された1段目のセッター23から直接熱が伝導す
るのに対し、2段目のセッター25に載置された基板1
bは、主に上部の加熱手段11aにより加熱された上蓋
27からの輻射により加熱されるため、1段目のセッタ
ー23に載置された基板1aよりも加熱速度が遅く、基
板内に温度分布も生じやすいという問題があった。
However, when the two-stage firing is performed by the above-described shelf assembly method, the substrate 1a placed on the first-stage setter 23 is mainly heated by the lower heating means 11b. While heat is directly conducted from the second-stage setter 23, the substrate 1 placed on the second-stage setter 25
b is heated mainly by radiation from the upper lid 27 heated by the upper heating means 11a, so that the heating speed is lower than that of the substrate 1a mounted on the first stage setter 23, and the temperature distribution in the substrate is lower. There is also a problem that it is easy to occur.

【0008】 本発明は、このような従来の事情に鑑み
てなされたものであり、その目的とするところは、PD
P用ガラス基板のような膜形成素材が塗布された基板を
2段積みで焼成する際に、2段目のセッターに載置した
基板の加熱速度が、1段目のセッターに載置した基板の
加熱速度と同程度となるような棚組方法を提供すること
にある。
The present invention has been made in view of such a conventional situation, and an object thereof is to provide a PD
When a substrate coated with a film forming material such as a glass substrate for P is fired in a two-stage stack, the heating rate of the substrate placed on the second-stage setter is the substrate placed on the first-stage setter. It is an object of the present invention to provide a method of assembling the shelves so as to be substantially equal to the heating speed of the shelves.

【0009】[0009]

【課題を解決するための手段】 本発明によれば、膜形
成素材が塗布された基板を載置したセッターを、スペー
サーを介して2段に積み上げ、更に2段目のセッター上
にスペーサーを介して板状の上蓋を被せる棚組方法であ
って、前記上蓋を光透過性材料からなるものとするとと
もに、前記セッターを高熱伝導性材料からなるものとし
たことを特徴とする棚組方法、が提供される。
According to the present invention, a setter on which a substrate on which a film-forming material is applied is placed in two stages via a spacer, and further, is set on the second-stage setter via a spacer. A shelf assembly method for covering the upper lid with a plate-like upper lid, wherein the upper lid is made of a light-transmitting material, and the setter is made of a high heat conductive material. Provided.

【0010】[0010]

【発明の実施の形態】 図1は、本発明の棚組方法を用
いた2段積み焼成の状態を示す説明図である。基本的な
棚組の構造は、従来と同様に、まず、膜形成素材が塗布
された基板(以下、単に「基板」という。)1aを載置
した1段目のセッター3上にスペーサー9aを介して同
じく基板1bを載置した2段目のセッター5を積み上
げ、更に2段目のセッター5上にスペーサー9bを介し
て板状の上蓋7を被せるが、本発明では、棚組の最上部
に位置する上蓋7を光透過性材料からなるものとするこ
とを特徴としている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory diagram showing a state of two-stage firing using the shelf assembly method of the present invention. The basic structure of the shelf assembly is as follows: first, a spacer 9a is placed on a first-stage setter 3 on which a substrate (hereinafter simply referred to as “substrate”) 1a on which a film forming material is applied is placed. The second-stage setter 5 on which the substrate 1b is mounted is also stacked, and a plate-shaped upper lid 7 is further placed on the second-stage setter 5 via a spacer 9b. Is made of a light transmissive material.

【0011】 このように、光透過性材料からなる上蓋
7を用いると、光非透過性材料からなる上蓋を用いた場
合に比して、加熱室の上部に設けられた電気ヒータ等の
加熱手段11aから発せられる熱が、2段目のセッター
5に載置した基板1bに直接伝わりやすくなり、その結
果、1段目のセッター3に載置した基板1aとの加熱速
度の差が小さくなる。なお、基板1a、1bとそれぞれ
直接接触する1段目及び2段目のセッター3、5は、加
熱手段から受けた熱を基板に効率よく伝導できるような
高熱伝導性材料からなるものとする。
As described above, when the upper lid 7 made of a light-transmitting material is used, a heating unit such as an electric heater provided at an upper portion of a heating chamber is used as compared with a case where an upper lid made of a light-impermeable material is used. The heat generated from 11a is easily transmitted directly to the substrate 1b placed on the second-stage setter 5, and as a result, the difference in heating speed between the substrate 1a placed on the first-stage setter 3 and the substrate 1b is reduced. Note that the first-stage and second-stage setters 3, 5 that are in direct contact with the substrates 1a, 1b, respectively, are made of a material having a high thermal conductivity that can efficiently transmit the heat received from the heating means to the substrates.

【0012】 本発明において、上蓋7を構成する光透
過性材料としては結晶化ガラスが好ましい。また、1段
目及び2段目のセッター3、5を構成する高熱伝導性材
料としてはSi含浸SiCが好ましい。ここで、Si含
浸SiCとは、金属SiとSiCを構成成分として含む
焼結体を総称するが、本発明においては、本出願人が既
に開示した、SiC粉体、黒煙粉、有機質バインダー及
び、水分又は有機溶剤を含有してなる成型用原料を成形
し、当該成形体を金属Si雰囲気で、かつ減圧の不活性
ガス雰囲気又は真空中において、1350〜2500℃
で焼成する方法により製造してなるSi−SiC焼結体
(特開平5−270917号公報)を用いることが好ま
しい。このようなSi含浸SiCからなるセッターは、
高強度で高い熱伝導率を有する。
In the present invention, crystallized glass is preferable as the light-transmitting material forming the upper lid 7. Further, as the high thermal conductive material constituting the first-stage and second-stage setters 3, 5, Si-impregnated SiC is preferable. Here, Si-impregnated SiC is a general term for a sintered body containing metal Si and SiC as constituent components. In the present invention, SiC powder, black smoke powder, organic binder and organic binder already disclosed by the present applicant have been disclosed. , A molding raw material containing water or an organic solvent, and molding the molded body in a metal Si atmosphere and a reduced pressure inert gas atmosphere or vacuum at 1350 to 2500 ° C.
It is preferable to use a Si-SiC sintered body (JP-A-5-270917) manufactured by a method of firing in the above. Such a setter made of Si-impregnated SiC is:
It has high strength and high thermal conductivity.

【0013】 また、本発明においては、2段目のセッ
ターの幅方向と長手方向の少なくとも一方の長さを、1
段目のセッター及び上蓋よりも長くなるようにすること
が好ましい。通常、基板の降温(徐冷)工程における冷
却は、加熱室の上部と下部とに設けた導入孔からエアー
を吹き込むことによって行うが、2段に積まれた基板の
どちらか一方の温度が下がりにくいような場合には、そ
の温度が下がりにくい方の基板を選択的に冷却する必要
が生ずる。しかしながら、従来の棚組方法においては、
2段に積まれた基板のどちらか一方にエアーを集中する
ことができず、降温工程での基板の温度管理が困難であ
った。
In the present invention, the length of at least one of the width direction and the longitudinal direction of the second stage setter is set to 1
It is preferable to make it longer than the setter and upper lid of the step. Usually, the cooling in the temperature lowering (gradual cooling) step of the substrate is performed by blowing air from inlet holes provided in the upper and lower portions of the heating chamber, but the temperature of one of the substrates stacked in two stages decreases. In such a case, it is necessary to selectively cool the substrate whose temperature is unlikely to decrease. However, in the conventional shelving method,
Air could not be concentrated on one of the substrates stacked in two stages, and it was difficult to control the temperature of the substrate in the temperature lowering step.

【0014】 これに対し、図1のように2段目のセッ
ター5の幅方向と長手方向の少なくとも一方の長さを、
1段目のセッター3及び上蓋7よりも長くなるようにす
ると、2段目のセッター5の突出した部分によって、上
部の導入孔13aから矢印方向に吹き込まれたエアーは
2段目のセッター5に載置された基板1bに集中的に当
たる一方で、1段目のセッター3に載置された基板1a
に当たるのは妨げられる。同様に、下部の導入孔13b
から吹き込まれたエアーは1段目のセッター3に載置さ
れた基板1aに集中的に当たる一方で、2段目のセッタ
ー5に載置された基板1bに当たるのを妨げられる。こ
のように、2枚の基板は、ぞれぞれ上部の導入孔11a
又は下部の導入孔11bからのエアーの吹き込みによっ
て、独立して冷却することができるので、一方の基板の
み選択的に冷却することも可能になる。
On the other hand, as shown in FIG. 1, the length of at least one of the width direction and the longitudinal direction of the second-stage setter 5 is
If it is made longer than the first-stage setter 3 and the upper lid 7, the air blown in the direction of the arrow from the upper introduction hole 13 a by the protruding portion of the second-stage setter 5 is transferred to the second-stage setter 5. The substrate 1a placed on the first stage setter 3 while intensively hitting the placed substrate 1b
Is prevented. Similarly, the lower introduction hole 13b
While the air blown from intensively strikes the substrate 1a placed on the first-stage setter 3, it is prevented from hitting the substrate 1b placed on the second-stage setter 5. As described above, the two substrates are respectively provided with the upper introduction holes 11a.
Alternatively, since cooling can be performed independently by blowing air from the lower introduction hole 11b, it is also possible to selectively cool only one of the substrates.

【0015】[0015]

【実施例】 以下、本発明を実施例に基づいて更に詳細
に説明するが、本発明はこれらの実施例に限定されるも
のではない。
EXAMPLES Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

【0016】(実施例)60インチのPDP用ガラス基
板をそれぞれ載置したSi含浸SiC製のセッターを、
スペーサーを介して2段に積み上げ、更に2段目のセッ
ター上にスペーサーを介して結晶化ガラス製の上蓋を被
せて棚組みした。加熱手段として上部と下部とに電気ヒ
ーターを備える加熱室が連続的に区画形成された連続炉
内にて、前記のように棚組みしたPDP用ガラス基板を
搬送させて焼成を行った。なお、各加熱室は、セッター
上のPDP用ガラス基板が炉の入口から出口まで搬送さ
れる間に、所定のヒートカーブ(最高焼成温度:580
℃)で焼成されるように温度設定を行った。1段目及び
2段目のセッターに載置された各PDP用ガラス基板の
表面には、図3に示すように〜の9箇所に熱電対を
設置し、焼成開始から60分後、65分後、70分後、
75分後の基板内の温度分布を調べた。その結果を表1
に示す。
(Embodiment) A setter made of Si-impregnated SiC on which a 60-inch glass substrate for PDP is placed,
The sheets were stacked in two stages via a spacer, and the upper set made of crystallized glass was put on the setter of the second stage via a spacer to form a shelf. The PDP glass substrates assembled as described above were transported and fired in a continuous furnace in which heating chambers having electric heaters at the top and bottom as heating means were continuously formed. Each heating chamber has a predetermined heat curve (maximum firing temperature: 580) while the glass substrate for PDP on the setter is transported from the inlet to the outlet of the furnace.
(° C.). On the surface of each PDP glass substrate placed on the first-stage and second-stage setters, thermocouples were installed at nine locations as shown in FIG. 3 as shown in FIG. 70 minutes later,
After 75 minutes, the temperature distribution in the substrate was examined. Table 1 shows the results.
Shown in

【0017】(比較例)Si含浸SiC製の上蓋を用い
た以外は、前記実施例と同様に棚組みして、PDP用ガ
ラス基板を焼成し、基板内の温度分布を調べた。その結
果を表2に示す。
(Comparative Example) A PDP glass substrate was fired, and the temperature distribution in the substrate was examined in the same manner as in the above-described embodiment except that an upper lid made of Si-impregnated SiC was used. Table 2 shows the results.

【0018】[0018]

【表1】 [Table 1]

【0019】[0019]

【表2】 [Table 2]

【0020】 上記表1及び表2に示す結果より、光透
過性材料である結晶化ガラス製の上蓋を用いて棚組みを
行った実施例は、光非透過性材料であるSi含浸SiC
製の上蓋を用いて棚組みを行った比較例に比して、2段
目のセッターに載置した基板の加熱速度が速く、1段目
のセッターに載置した基板とほぼ同等の速度で加熱が進
行していたことが確認された。
From the results shown in Tables 1 and 2, the embodiment in which shelves are assembled using the crystallized glass upper lid, which is a light-transmitting material, shows that Si-impregnated SiC, which is a light-impermeable material, is used.
The heating speed of the substrate placed on the second-stage setter is faster than that of the comparative example in which shelves are assembled using the upper lid made of It was confirmed that heating had progressed.

【0021】[0021]

【発明の効果】 以上説明したように、本発明によれ
ば、PDP用ガラス基板のような膜形成素材が塗布され
た基板を2段積みで焼成する際に、2段目のセッターに
載置した基板の加熱速度を、1段目のセッターに載置し
た基板の加熱速度と同程度とすることができる。
As described above, according to the present invention, when a substrate coated with a film forming material such as a glass substrate for a PDP is fired in a two-stage stack, the substrate is placed on the second-stage setter. The heating rate of the substrate thus set can be made substantially equal to the heating rate of the substrate placed on the first stage setter.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の棚組方法を用いた2段積み焼成の状
態を示す説明図である。
FIG. 1 is an explanatory diagram showing a state of two-stage stacking firing using the shelf assembly method of the present invention.

【図2】 従来の棚組方法を用いた2段積み焼成の状態
を示す説明図である。
FIG. 2 is an explanatory view showing a state of two-stage firing using a conventional shelf assembly method.

【図3】 実施例において用いたPDP用ガラス基板の
熱電対設置位置を示す説明図である。
FIG. 3 is an explanatory diagram showing a thermocouple installation position of a PDP glass substrate used in an example.

【図4】 PDPの製造工程を示す工程図である。FIG. 4 is a process chart showing a PDP manufacturing process.

【符号の説明】 1a…基板、1b…基板、3…1段目のセッター、5…
2段目のセッター、7…上蓋、9a…スペーサー、9b
…スペーサー、11a…加熱手段、11b…加熱手段、
13a…導入孔、13b…導入孔、15…搬送手段、2
3…1段目のセッター、25…2段目のセッター、27
…上蓋。
[Description of Signs] 1a: substrate, 1b: substrate, 3: first-stage setter, 5 ...
Second-stage setter, 7 ... top lid, 9a ... spacer, 9b
... spacer, 11a ... heating means, 11b ... heating means,
13a: introduction hole, 13b: introduction hole, 15: conveying means, 2
3 ... first setter, 25 ... second setter, 27
… Top lid.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 膜形成素材が塗布された基板を載置した
セッターを、スペーサーを介して2段に積み上げ、更に
2段目のセッター上にスペーサーを介して板状の上蓋を
被せる棚組方法であって、 前記上蓋を光透過性材料からなるものとするとともに、
前記セッターを高熱伝導性材料からなるものとしたこと
を特徴とする棚組方法。
1. A shelf assembly method in which a setter on which a substrate on which a film forming material is applied is placed in two stages via a spacer, and a plate-like upper lid is further placed on the second stage setter via a spacer. And the upper lid is made of a light transmissive material,
A shelf assembly method, wherein the setter is made of a material having high thermal conductivity.
【請求項2】 前記光透過性材料が結晶化ガラスであ
り、前記高熱伝導性材料がSi含浸SiCである請求項
1記載の棚組方法。
2. The shelving method according to claim 1, wherein the light-transmitting material is crystallized glass, and the highly heat-conductive material is Si-impregnated SiC.
【請求項3】 2段目のセッターの幅方向と長手方向の
少なくとも一方の長さを、1段目のセッター及び上蓋よ
りも長くなるようにした請求項1又は2に記載の棚組方
法。
3. The shelf assembly method according to claim 1, wherein the length of at least one of the width direction and the longitudinal direction of the second setter is longer than that of the first setter and the upper lid.
JP2001012895A 2001-01-22 2001-01-22 Shelf assembly method Expired - Fee Related JP4266073B2 (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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JP2002220245A true JP2002220245A (en) 2002-08-09
JP4266073B2 JP4266073B2 (en) 2009-05-20

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007032918A (en) * 2005-07-26 2007-02-08 Showa Mfg Co Ltd Heating furnace
KR100768421B1 (en) 2006-09-26 2007-10-18 아프로시스템 주식회사 Metal mixed liquid and pdp furnace setter by using the mixed liquid coating thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7111643B2 (en) 2019-03-18 2022-08-02 株式会社東芝 Semiconductor device and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007032918A (en) * 2005-07-26 2007-02-08 Showa Mfg Co Ltd Heating furnace
KR100768421B1 (en) 2006-09-26 2007-10-18 아프로시스템 주식회사 Metal mixed liquid and pdp furnace setter by using the mixed liquid coating thereof

Also Published As

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