JP2002217253A - Method and device for inspecting solid-state image pickup element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for inspecting solid-state image pickup element by which inspection efficiency can be improved far by increasing the number of inspections while an inspection time is shortened at the time of inspecting a composite element. SOLUTION: The chip 11 to be measured of a CMOS sensor is composed of two chips (A and B) arranged in the longitudinal and probes 14 for inspection are put on the chips A and B, respectively. For the chip A on the other side, the probes 14 are arranged so that the sensor section 12 of the chip A is irradiated with light, and the probes 14 does not cover any area above the sensor section 12 in the vertical direction. When the probes 14 are arranged in this way, the image processing section 15 of the chip B can be inspected while the sensor section 12 of the chip A is inspected by irradiating the chip A with the light. Therefore, the inspection efficiency can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for inspecting a solid-state image sensor which can be used for a video camera or the like.

[0002]

2. Description of the Related Art In recent years, the performance of solid-state imaging devices has advanced with the advancement of semiconductor technology, and solid-state imaging devices have penetrated various fields of society as key devices for image input.
Together with the trend of digitalization, it has supported today's multimedia society. The application fields of solid-state imaging devices are not limited to video cameras, video movies, and the like that have been conventionally used, but also cover a wide variety of fields, such as fingerprint detectors, medical devices, and videophones. Conventional solid-state imaging devices mainly have an imaging function of faithfully converting an image into an electric signal. However, in recent years, with the development of C-MOS design and process technology, an imaging function and a signal processing function have been integrated into one silicon sheet. Attention is focused on those integrated and fused on a chip.

Hereinafter, a method of inspecting a CMOS sensor, which is a typical example of such a solid-state imaging device, will be described with reference to the accompanying drawings. FIG. 6 is a block diagram functionally illustrating an example of the CMOS sensor. In FIG. 6, 31 is an imaging unit, 32 is a noise removing unit, 33 is a DC clamp unit, and 34 is a driving unit. Hereinafter, these units 31 to 34 will be collectively referred to as a sensor unit 41. Then, a synchronization signal input terminal 45 is connected to the drive unit 34 of the sensor unit 41,
A sensor section output terminal 43 is connected to the clamp section 33.

Reference numeral 35 denotes an A / D converter, 36 denotes a signal processor, and 37 denotes a synchronization signal generator. Hereinafter, these units 35 to 37 are collectively referred to as an image processing unit 42.
I will call it. The A / D of the image processing unit 42
An A / D input terminal 44 is connected to the converter 35. The signal processing unit 36 has a final video signal output terminal 4
7 is connected, and a synchronization signal output terminal 46 and an oscillator 38 are connected to the synchronization signal generator 37.

Next, the operation of the CMOS sensor will be described. In this CMOS sensor, when light is incident on the imaging unit 31, a video signal is output from the imaging unit 31.
Then, the video signal output from the imaging unit 31 is subjected to DC reproduction by the DC clamp unit 33 after noise is removed by the noise removal unit 32, and is output as an analog signal from the sensor unit output terminal 43. Here, the sensor unit output terminal 43 and the A / D input terminal 44 are usually connected outside the CMOS sensor. Then, the DC-reproduced video signal is supplied to the A / D input terminal 44 via the A / D input terminal 44.
It is input to the converter 35. This video signal is converted into a digital signal by the A / D converter 35 and then converted into a digital signal.
6 and subjected to necessary signal processing there, and output from the final video signal output terminal 47 as a final video signal.

When the basic clock generated by the oscillator 38 is input to the synchronizing signal generator 37, a synchronizing signal is generated by the synchronizing signal generator 37, and the synchronizing signal is supplied to the A / D converter 35 and the signal processor. It is supplied to the unit 36 and the like. Here, the fundamental frequency synchronizing signal output terminal 46 and the synchronizing signal input terminal 45 are usually connected outside the CMOS sensor. Therefore, the synchronization signal generated by the synchronization signal generation unit 37 is sent to the drive unit 34, the noise removal unit 32, and the DC clamp unit 33. Then, the driving unit 34 generates a driving pulse, and supplies the driving pulse to the imaging unit 31 to operate the imaging unit 31.

When a CMOS sensor is inspected, a synchronization signal is input from the synchronization signal input terminal 45 to the sensor unit 41, and a predetermined amount of light is incident on the image pickup unit 31. An image signal is output from the device 43, and the sensor unit 41 is inspected by inputting the image signal to a tester. Also, a prescribed test signal is input to the image processing unit 42 from the A / D input terminal 44, and the video signal output from the final video signal output terminal 47, the synchronization signal output from the synchronization signal output terminal 46, and the like are tested. , The image processing unit 42 is inspected.

As described above, since the CMOS sensor is an optical sensor, it is necessary to irradiate the imaging unit 31 with light at the time of inspection. Hereinafter, a CMOS sensor inspection apparatus will be described with reference to the drawings. FIG.
1 is a schematic view of a conventional CMOS sensor inspection device. In FIG. 8, 11 is a chip to be measured of a CMOS sensor, 14 is an inspection probe, 21 is a light source, 22 is a lens, 23 is a diaphragm device,
Reference numeral 25 denotes a probe card on which a probe is fixed.

FIG. 7 is a view for explaining a state in which a probe is applied (contacted) to a chip to be measured of a CMOS sensor. In FIG. 7, reference numeral 11 denotes a chip to be measured of a CMOS sensor formed on a silicon substrate,
12 is a sensor unit, 13 is an input / output pad,
14 is an inspection probe, and 15 is an image processing unit.

Hereinafter, referring to FIG. 7 and FIG.
The operation of the inspection device for the MOS sensor will be described. Light source 21
Is controlled by the lens 22 and the aperture device 23 so as to have a prescribed light amount.
1 is input to the sensor unit 12 above. Then, the video signal output from the sensor unit 12 is extracted from the input / output pad 13 to the outside via the probe 14. By inputting this video signal to the tester, the sensor unit 12
Inspection. The inspection is similarly performed for the image processing unit 15.

Here, the timing of the inspection will be described with reference to the drawings. FIG. 9 is a diagram for explaining the inspection timing of the CMOS sensor inspection. As described above, in the CMOS sensor, since the sensor unit and the image processing unit are combined and formed on one silicon chip, it is necessary to perform the inspection of the sensor unit and the inspection of the image processing unit. The inspection is performed in the order of storing image data for inspection of the sensor unit, and then inspecting the sensor unit. Thereafter, the inspection of the image processing unit is performed, the inspection of one chip is completed, and the inspection proceeds to the next chip. In the example shown in FIG. 9, the order of each processing when the inspection is performed in the order of chip A, chip B, chip C,...

[0012]

As described above, in the conventional inspection of the solid-state imaging device having both the imaging function and the signal processing function, the inspection of the sensor unit and the inspection of the image processing unit of the same chip are performed by a conventional method. It goes in time series. In this case, the test in the tester is stopped while the image data is stored, so that the tester cannot exhibit 100% of its capabilities. For this reason, there is a problem that the inspection time becomes extremely long.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and in a CMOS sensor inspection, a solid-state image sensor capable of increasing the number of inspections while shortening the inspection time and dramatically improving the inspection efficiency. It is an object of the present invention to provide an inspection method and an inspection apparatus.

[0014]

Means for Solving the Problems A method for inspecting a solid-state image pickup device according to the present invention, which has been made to solve the above problems, comprises:
(I) A solid-state imaging device including, on the same semiconductor chip, a sensor unit having an imaging unit and a driving pulse generation unit that drives the imaging unit, and an image processing unit that processes image data output from the sensor unit Is a method of inspecting a solid-state imaging device in a solid-state imaging device assembly in which a plurality of two-dimensionally (planarly) are arranged on a semiconductor wafer, and (ii)
First and second adjacent (or adjacent) to each other
After selecting the solid-state imaging device (arbitrarily), the first solid-state imaging device inspection probe is arranged so as not to cover a vertically upper region of the sensor unit of the first solid-state imaging device, A second solid-state imaging device inspection probe,
Arranged without the restriction as in the first solid-state imaging device,
(Iii) While irradiating light to the sensor section of the first solid-state imaging device, the sensor section is operated to determine its performance, and in synchronization with (in parallel with) the image processing section of the second solid-state imaging element Is operated to determine the performance.

In this method of inspecting a solid-state imaging device, the inspection can be performed while irradiating the sensor section of the first solid-state imaging element with light, and at the same time, the inspection of the image processing section of the second solid-state imaging element can be performed. So two solid-state imaging devices (chips)
Can be inspected simultaneously.

Another method for inspecting a solid-state image pickup device according to the present invention comprises: (i) a sensor unit having an image pickup unit and a drive pulse generating unit for driving the image pickup unit; and processing image data output from the sensor unit. For inspecting a solid-state imaging device in a solid-state imaging device assembly in which a plurality of solid-state imaging devices having an image processing unit on a single semiconductor chip are two-dimensionally (planarly) arranged on a semiconductor wafer. (Ii) After selecting (arbitrarily) the first to fourth solid-state imaging devices adjacent (or adjacent) in a cross shape, the periphery (outer periphery) of these four solid-state imaging devices is selected. )), The first and third solid-state imaging devices located in one diagonal direction of the square,
While the first and third solid-state imaging devices are arranged so as not to cover the upper region in the vertical direction of each sensor unit, the second and fourth solid-state imaging devices located in the other diagonal direction of the quadrangle are arranged in the same manner. (Iii) irradiating light to each sensor unit of the first and third solid-state imaging devices while irradiating light to the sensor units of the first and third solid-state imaging devices. While the performance of the sensor unit is determined by operating the sensor unit, the image processing units of the second and fourth solid-state imaging devices are operated and the performance determination is performed in synchronization (parallel) with the sensor unit. It is.

In this method of inspecting a solid-state imaging device, the inspection is performed while irradiating light to each sensor section of the first solid-state imaging device and the third solid-state imaging device, and at the same time, the second solid-state imaging device and the third solid-state imaging device are inspected. Since the image processing units of the four solid-state imaging devices can be inspected, the four solid-state imaging devices (chips) can be inspected simultaneously.

An inspection apparatus for a solid-state imaging device according to the present invention comprises: (i) a sensor unit having an imaging unit and a driving pulse generating unit for driving the imaging unit; and an image processing unit for processing image data output from the sensor unit. A solid-state imaging device for a solid-state imaging device assembly in which a plurality of solid-state imaging devices each having a unit on the same semiconductor chip are arranged two-dimensionally (in a plane) on a semiconductor wafer. And (ii)
First and second adjacent (or adjacent) to each other
(Iii) a first solid-state imaging device inspection probe, which is arranged so as not to cover a vertically upper region of the sensor unit of the first solid-state imaging device.
The second arrangement, which is provided without any restrictions as in the solid-state imaging device of
And (iv) storing (holding) image data output from the sensor unit of the first solid-state imaging device irradiated with light during each unit inspection period (one unit period). And (v) during the unit inspection period, the second solid-state image data of the sensor unit of the second solid-state imaging device stored in the storage device during the previous unit inspection period. A determination unit that determines the performance of the sensor unit of the imaging device while operating the image processing unit of the second solid-state imaging device in synchronization with (in parallel with) the performance determination of the sensor unit of the imaging device. Is what you do. The inspection apparatus includes a fixed imaging device moving unit that moves each fixed imaging device from the first fixed imaging device side to the second fixed imaging device side by one device each time each unit inspection period ends. Is preferred. Note that each fixed imaging element may be fixed and the probe may be moved.

In this inspection apparatus for a solid-state imaging device, the output signal is stored while irradiating the sensor section of the first solid-state imaging element with predetermined light. Then, the current sensor unit is inspected using the image data stored between the unit inspection bases one time before the current unit inspection period. In synchronization with (in parallel with) this, the inspection of the image processing unit of the second solid-state imaging device is performed. As a result, it is possible to perform the image data fetching process, which has conventionally taken a long time, in parallel with the inspection process.

Another inspection apparatus for a solid-state image pickup device according to the present invention comprises: (i) a sensor unit having an image pickup unit and a drive pulse generating unit for driving the image pickup unit, and processing image data output from the sensor unit. Inspection of a solid-state imaging device for a solid-state imaging device assembly in which a plurality of solid-state imaging devices having an image processing unit to be mounted on the same semiconductor chip are arranged two-dimensionally (in a plane) on a semiconductor wafer. Device (ii) adjacent (or adjacent) in a cross-shaped
Of the first to fourth solid-state imaging devices, the vertical direction of each sensor unit of the first and third solid-state imaging devices located in one diagonal direction of one of the quadrangles forming the periphery (outer periphery) of these four solid-state imaging devices. First and third solid-state imaging device inspection probes arranged so as not to cover the upper region in the direction,
(Iii) second and fourth probes for inspecting the solid-state imaging device, which are arranged without restrictions as in the first or third solid-state imaging device and are located in the other diagonal direction of the square, iv) A storage device that stores (holds and accumulates) image data output from each sensor unit of the first and third solid-state imaging elements to which light is irradiated during each unit inspection period (one unit period). And (v) using the image data of the second and fourth solid-state imaging devices stored in the storage device during the previous unit inspection period during the unit inspection period, While the performance of each sensor section is determined, the second and fourth sections are synchronized (in parallel) with this.
And a judgment means for operating each image processing unit of the solid-state imaging device to judge its performance. The inspection apparatus is configured to move each fixed imaging device from the first or second fixed imaging device side to the third or fourth fixed imaging device side by one device each time each unit inspection period ends. It is preferable that an image pickup device moving means is provided.

In this inspection apparatus for a solid-state imaging device, the output signal is stored while irradiating each sensor section of the first and third solid-state imaging elements with predetermined light. Then, the current sensor unit is inspected using the image data stored between the unit inspection bases one time before the current unit inspection period.
In synchronization with (in parallel with) this, inspection of the image processing units of the second and fourth solid-state imaging devices is performed. As a result, it is possible to perform the image data fetching process, which has conventionally taken a long time, in parallel with the inspection process. In any of the above cases, a plurality of chips can be inspected at the same time, and the number of measurements per unit time can be increased to greatly increase the inspection efficiency.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below. (First Embodiment) First, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a state in which probes are applied to chips to be measured of a plurality of CMOS sensors according to the first embodiment of the present invention. In FIG. 1, reference numeral 11 denotes a chip to be measured of a CMOS sensor formed on a silicon substrate, 12 denotes a sensor unit, 13 denotes an input / output pad, 14 denotes an inspection probe, and 15 denotes an image processing unit. It is. These members 11 to 15 perform the same operation as in the conventional example shown in FIG.

FIG. 1 shows that two chips 11 to be measured of a CMOS sensor are arranged side by side in a vertical direction (a direction orthogonal to the horizontal direction in FIG. 1) (chip A, chip B). Inspection probe 14 for each
(Probe 1, Probe 2) is shown. For the chip A on the other side, the sensor unit 12
The inspection probe 14 (probe 1) is arranged so as not to cover the area above the sensor unit 12 (vertical direction upper side) so that light can be irradiated to the light. In addition, with respect to the chip B on this side, the inspection probe 14 (probe 2) is arranged without providing a restriction as in the case of the chip A. By arranging the inspection probe 14 in this way, it is possible to inspect the image processing unit 15 of the chip B while irradiating the chip A with light for measurement and inspecting the sensor unit 12. In addition, the inspection efficiency can be improved.

FIG. 2 shows two chips 1 to be measured shown in FIG.
FIG. 2 is a block diagram showing a schematic configuration of a CMOS sensor inspection system connected to the first (chip A, chip B).
In FIG. 2, reference numeral 51 denotes a sensor unit (12) of one chip under test 11 (chip A); 52, an image processing unit (15) of the other chip under test 11 (chip B);
53 is an image capturing device, 54 is a changeover switch, 55 is a tester, 61 is a video signal output from the sensor unit 51 of the chip A, and 62 is an output signal of the image processing unit 52 of the chip B. It is.

Next, the operation of the inspection system will be described. The video signal 61 output from the sensor unit 51 of the chip A is temporarily stored in the image capturing device 53. Then, the output signal 62 of the image processing unit 52 of the chip B
Various tests are performed by inputting the output signal of the image capturing device 53 to the tester 55 via the changeover switch 54.

Hereinafter, the inspection timing of the CMOS sensor will be described with reference to the drawings. FIG. 3 (a)
Is the inspection timing of the conventional CMOS sensor inspection (CMOS sensor test), which has the same contents as FIG. FIG. 3B shows the inspection timing of the solid-state imaging device inspection according to the first embodiment of the present invention. In FIG. 3B, the upper diagram shows the inspection timing of the chip A inspected by the probe 1, and the image data is accumulated. The lower diagram shows the timing of the chip B inspected by the probe 2, and the sensor unit inspection and the image processing unit inspection are processed in series.

Here, the accumulation (storage) of image data of a certain chip (for example, chip B) via the probe 1 is performed by the sensor unit via the probe 2 of the chip (for example, chip B). The inspection is performed one chip before the inspection and the image processing inspection (for example, at the time of the sensor unit inspection of the chip A), and is performed in parallel with the sensor unit inspection and the image processing unit inspection. This makes it possible to previously store image data, which has been a major factor in extending the inspection time, and it is possible to apparently delete the time for storing image data. For this reason, the entire inspection time can be significantly reduced.

(Second Embodiment) Hereinafter, a second embodiment of the present invention will be described.
Will be described in detail with reference to the drawings.
FIG. 4 is a diagram for explaining a state in which a probe is applied to a chip to be measured of the CMOS sensor according to the second embodiment of the present invention. In FIG. 4, reference numeral 11 denotes a chip to be measured of a CMOS sensor formed on a silicon substrate,
12 is a sensor unit, 13 is an input / output pad,
14 is an inspection probe, and 15 is an image processing unit. These members 11 to 15 perform the same operations as the members 11 to 15 in the first embodiment, respectively.

FIG. 4 shows that four chips 11 to be measured of a CMOS sensor are arranged side by side in the shape of a "field" (chips A to A).
D) shows a state in which the inspection probe 14 is applied to each of the chips A to D. For the chip A located on the left side in the vertical direction (the direction orthogonal to the horizontal direction in FIG. 4) and the chip D located on the right side in the vertical direction, the sensor unit 1
2 so that the light can be irradiated to the inspection probe 14.
Are arranged so as not to cover the region above the sensor unit 12 in the vertical direction. In addition, chip B and chip C
With respect to the inspection probe 14, the chip A,
They are arranged without any restrictions as in the case of D. In addition,
In FIG. 4, the probes applied to the chips B and C are not described, but the probes are actually applied in the same manner as the chips A and D (but not limited to the above). ing.

FIG. 5 is a block diagram showing an inspection system for a composite device connected to the chips A to D shown in FIG.
In FIG. 5, reference numeral 71 denotes a sensor section of the chip A;
2 is a sensor unit of the chip D, 73 is an image processing unit of the chip B, 74 is an image processing unit of the chip C,
75 is a first image capturing device, 76 is a second image capturing device, 77 is a changeover switch, and 7
8 is a tester, 81 is a sensor part 71 of chip A
Is an image signal output from the sensor unit 72 of the chip D, 83 is an output signal of the image processing unit 73 of the chip B, and 84 is an image signal of the image processing unit 74 of the chip C. Is the output signal.

Next, the operation of the inspection system will be described. The video signal 81 output from the sensor unit 71 of the chip A is temporarily stored in the first image capturing device 75. Further, the video signal 82 output from the sensor unit 72 of the chip D is also temporarily stored in the second image capturing device 76.
Is stored. Then, an output signal 83 from the image processing unit 73 of the chip B, an output signal 84 from the image processing unit 74 of the chip C, an output signal from the first image capturing device 75, and a signal from the second image capturing device 76. Output signal
Various inspections are performed by inputting to the tester 78 via the changeover switch 77.

By using the inspection system shown in FIG. 5, as shown in FIG.
It is possible to perform a simultaneous inspection of a composite device in which four D) are arranged side by side in a cross. That is, the inspection probe 14 is applied to each of the chips A to D, and the chips A and D are vertically positioned above the sensor unit 12 so that light can be emitted to the sensor units 12 (71, 72). It is possible to perform a simultaneous inspection of the composite device arranged so that the inspection probe 14 does not cover the region. As a result, the inspection time of the composite device can be significantly reduced. Therefore,
The second embodiment is industrially very useful from the viewpoint of cost reduction.

In the first and second embodiments, a CMOS sensor has been described as an example of a solid-state imaging device to which the inspection method according to the present invention is applied. However, the solid-state imaging device is limited to a CMOS sensor. Not something. For example, it is needless to say that the same effect can be obtained even in an image pickup device such as a CCD by separating a DC inspection such as a leak tester of an input / output pad and an imaging inspection. The image sensor to which the inspection method of the present invention is applied may be a two-dimensional image sensor or a one-dimensional image sensor.

[0034]

As described above, according to the present invention, a plurality of solid-state imaging devices can be inspected at the same time, and the speed and efficiency of the inspection can be increased.

[Brief description of the drawings]

FIG. 1 is a diagram showing an arrangement of an inspection probe when inspecting a solid-state imaging device according to a first embodiment of the present invention.

FIG. 2 is a block diagram illustrating a configuration of a solid-state imaging device inspection system according to the first embodiment of the present invention.

FIG. 3A is a diagram showing a procedure for testing a conventional solid-state imaging device, and FIG. 3B is a diagram showing a procedure for testing the solid-state imaging device shown in FIG.

FIG. 4 is a diagram illustrating an arrangement of an inspection probe when inspecting a solid-state imaging device according to a second embodiment of the present invention.

FIG. 5 is a block diagram illustrating a configuration of a solid-state imaging device inspection system according to a second embodiment of the present invention.

FIG. 6 shows a conventional example and an embodiment of the present invention.
It is a block diagram explaining the system configuration of a CMOS sensor.

FIG. 7 is a diagram showing an arrangement of test probes when testing a CMOS sensor in a conventional example.

FIG. 8 shows a conventional example and an embodiment of the present invention.
It is a figure which shows the arrangement form of a probe, a chip, and a light source when testing a CMOS sensor.

FIG. 9 is a diagram showing a procedure for testing a conventional CMOS sensor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... Measurement chip, 12 ... Sensor part, 13 ... Input / output pad, 14 ... Inspection probe, 15 ... Image processing part, 2
DESCRIPTION OF SYMBOLS 1 ... Light source, 22 ... Lens, 23 ... Diaphragm device, 25 ... Probe card, 31 ... Imaging part, 32 ... Noise removal part, 33
... DC clamp section, 34 ... drive section, 35 ... A / D conversion section, 36 ... signal processing section, 37 ... sync signal generation section, 38 ...
Oscillator 41 sensor unit 42 image processing unit 43
Sensor output terminal, 44 A / D input terminal, 45 Synchronization signal input terminal, 46 Synchronization signal output terminal, 47 Final video signal output terminal, 51 Sensor part, 52 Image processing part, 53 Image capture Device, 54, changeover switch, 55, tester, 61, video signal, 62, output signal, 71, sensor unit, 72, sensor unit, 73, image processing unit, 74, image processing unit, 75, first image capturing device , 76: second image capturing device, 77: switch, 78: tester, 81: video signal, 82: video signal, 83: output signal, 84: output signal.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 27/146 G01R 31/28 K 5C061 H04N 5/335 H01L 27/14 Z 17/00 A F-term (Reference) ) 2G003 AA09 AF02 AF03 AG03 AH01 AH04 2G132 AF14 AG08 AL09 AL25 4M106 AA01 AA02 AA07 AB09 BA01 BA04 BA14 CA70 DD13 DD30 DJ04 DJ21 4M118 AA09 AA10 AB01 BA14 FA06 FA50 5C024 CY44 GY31 HX23 HX50 5C06

Claims (6)

[Claims] 1. A semiconductor device comprising: a sensor unit having an image pickup unit and a drive pulse generating unit for driving the image pickup unit; and an image processing unit for processing image data output from the sensor unit on the same semiconductor chip. A method for testing a solid-state imaging device in a solid-state imaging device assembly in which a plurality of solid-state imaging devices are two-dimensionally arranged on a semiconductor wafer, wherein a first and a second solid-state imaging device adjacent to each other are selected. Above, the first solid-state imaging device inspection probe is arranged so as not to cover the vertically upper region of the sensor section of the first solid-state imaging device, while the second solid-state imaging device inspection probe is The first solid-state imaging device is arranged without any limitation, and the performance of the first solid-state imaging device is determined by operating the sensor unit while irradiating the sensor unit with light. Inspection method of a solid-state imaging device and performing the second performance determination image processing unit by operation of the solid-state imaging device with. 2. A semiconductor device comprising: a sensor unit having an imaging unit and a driving pulse generation unit that drives the imaging unit; and an image processing unit that processes image data output from the sensor unit on the same semiconductor chip. A method for inspecting a solid-state imaging device in a solid-state imaging device assembly in which a plurality of solid-state imaging devices are two-dimensionally arranged on a semiconductor wafer, comprising: first to fourth solid-state imaging devices adjacent in a cross shape After selecting the devices, the first and third solid-state imaging devices located in one diagonal direction of one of the squares forming the periphery of the four solid-state imaging devices are connected to the first and third solid-state imaging devices by the first and third solid-state imaging devices, respectively.
And the third solid-state imaging device is arranged so as not to cover the vertically upper region of each sensor unit, while the second and fourth solid-state imaging devices located in the other diagonal direction of the square are arranged in the same manner. An inspection probe is arranged without any restrictions such as the first or third solid-state imaging device, and the sensor unit is operated while irradiating light to each sensor unit of the first and third solid-state imaging devices. A method for inspecting a solid-state imaging device, wherein the performance is determined by operating each image processing unit of the second and fourth solid-state imaging devices in synchronization with the performance determination. 3. A sensor unit having an imaging unit and a driving pulse generating unit for driving the imaging unit, and an image processing unit for processing image data output from the sensor unit are provided on the same semiconductor chip. An apparatus for inspecting a solid-state image sensor for a solid-state image sensor assembly in which a plurality of solid-state image sensors are two-dimensionally arranged on a semiconductor wafer, wherein the first and second solid-state image sensors are adjacent to each other. ,
A first solid-state imaging device inspection probe that is arranged so as not to extend over a vertically upper region of the sensor unit of the first solid-state imaging device; and a first solid-state imaging device that is arranged without restrictions as in the first solid-state imaging device. A second solid-state imaging device inspection probe, a storage device for storing image data output from a sensor unit of the first solid-state imaging device irradiated with light during each unit inspection period, During the inspection period, the performance of the sensor unit of the second solid-state imaging device is determined using the image data of the sensor unit of the second solid-state imaging device stored in the storage device during the previous unit inspection period. A device for operating the image processing unit of the second solid-state imaging device in synchronization with the determination unit to determine the performance of the second solid-state imaging device. 4. A fixed image pickup device moving means for moving each fixed image pickup device by one element from the first fixed image pickup device side to the second fixed image pickup device side each time each unit inspection period ends. The inspection apparatus for a solid-state imaging device according to claim 3, wherein: 5. A sensor unit having an imaging unit and a driving pulse generating unit for driving the imaging unit, and an image processing unit for processing image data output from the sensor unit are provided on the same semiconductor chip. An inspection apparatus for a solid-state imaging device for a solid-state imaging device assembly comprising a plurality of solid-state imaging devices arranged two-dimensionally on a semiconductor wafer, comprising: first to fourth solids adjacent in a cross shape Of the image sensor,
The first and third solid-state imaging devices are arranged so as not to extend over the vertically upper regions of the sensor units of the first and third solid-state imaging devices located in one diagonal direction of one of the quadrangles forming the periphery of the four solid-state imaging devices. A third solid-state imaging device inspection probe, and second and fourth solid-state imaging devices which are arranged without providing restrictions such as the first or third solid-state imaging device and are located in the other diagonal direction of the square. A probe for element inspection, a storage device for storing image data output from each sensor unit of the first and third solid-state imaging elements irradiated with light during each unit inspection period, and the unit inspection During the period, the performance determination of each sensor unit of the second and fourth solid-state imaging devices is performed using the image data of the second and fourth solid-state imaging devices stored in the storage device during the previous unit inspection period. Cormorants On the other hand, the second in synchronization with this 2
And a determination means for operating each image processing unit of the fourth solid-state imaging device to determine the performance thereof, the inspection apparatus for a solid-state imaging device. 6. A fixed device in which each fixed imaging device is moved from the first or second fixed imaging device to the third or fourth fixed imaging device by one device each time each unit inspection period is completed. The inspection apparatus for a solid-state imaging device according to claim 5, further comprising an imaging device moving unit.