JP2002211682A - Packaging method for metal base circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packaging method for a metal base circuit board which can supply a metal base circuit board of high qualities. SOLUTION: In the packaging method for a metal base circuit board wherein a neutral paper is interposed between metal base circuit boards, a side surface is preferably oppositely oriented to an earthing surface of a packaging container.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packing a metal-based circuit board, and more particularly to a metal-based circuit for reducing scratches, rust, dents and the like on a circuit during storage and / or transportation to maintain high quality. The present invention relates to a method for packing a substrate.

[0002]

2. Description of the Related Art A metal-based circuit board having good heat conductivity has been used as a circuit board for mounting electronic components having high heat generation. The metal base circuit board uses a metal plate such as aluminum as a base material, provides an insulating layer made of an inorganic filler-containing resin having a thickness of about several tens of μm on the metal plate, and further provides a circuit on the insulating layer. It has a structure.

[0003] The metal-based circuit board is mounted on an electronic device and used for assembling into an electric device. Therefore, the metal-based circuit board is sent to a process of mounting the electronic component. And pack them together.
However, since the circuit surfaces of the metal base circuit boards are packaged such that the circuit surfaces face each other, or the base surfaces face each other, or the circuit surface and the base surface face each other, if there is a foreign substance such as dust between the metal base circuit boards, the circuit surfaces and Or the base surface may be damaged, and the commercial value may decrease for the reasons described below.

[0004] Therefore, when packing a plurality of metal base circuit boards into one, it is common practice to prevent scratches by inserting paper between the metal base circuit boards. However, the paper to be inserted (interleaf) has not been sufficiently studied in the past.

However, according to the results of the study by the present inventors, it has been found that some papers inserted between the metal base circuit boards generate rust due to corrosion on the conductor surface and the base metal surface of the metal base circuit board. did.

Further, a plurality of metal-based circuit boards are usually transported as a single package in a packaging container such as a cardboard box. However, there has been no sufficient study on how to put the metal-based circuit substrate into the packaging container. .

According to the results of studies by the present inventor, the cause of the above-mentioned loss of commercial value is, in addition to simply causing a defect in appearance, scratches on the circuit surface and / or the base surface.
If there is rust, indentation, etc., for example, wire bonding is not attached, solder wettability is reduced, heat dissipation is reduced,
Insufficient characteristics such as a decrease in insulation performance also occur.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to store and transport a metal-based circuit board even under final use conditions.
No cracks in the insulating layer, scratches on the circuit surface and base surface,
An object of the present invention is to provide a method for packing a metal-based circuit board, which can supply a high-quality metal-based circuit board without rust and indentation.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a method of packing a plurality of metal base circuit boards, each having a circuit provided on a metal plate via an insulating layer, comprising: A method for packing a metal-based circuit board, wherein a neutral paper is interposed in the metal base circuit board.

Further, the present invention is the above-mentioned method for packing a metal-based circuit board, wherein the packing is performed such that one side surface of the metal-based circuit board is in contact with the ground plane of the packing container.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, it is essential that neutral paper is interposed between metal base circuit boards. If the paper to be inserted between the metal base circuit boards is not neutral paper, for example, acid paper, it absorbs moisture in the air, rusts the conductor circuit surface and / or the metal base surface, and reduces solder wettability. , Resulting in reduced wire bonding properties and reduced heat radiation characteristics. In the present invention, since the neutral paper is used, it is possible to prevent the above problem from occurring. However, since acidic paper uses aluminum sulfate or the like as a fixing agent for the sizing agent added when paper is made,
If this is used for a long time, it gradually becomes acidic due to sulfuric acid released from aluminum sulfate, whereas neutral paper uses calcium carbonate or the like that does not release sulfuric acid as the fixing agent, This is because even if it is used for a long time, it does not adversely affect the metal-based circuit board.

Further, according to the present invention, since one side surface of the metal base circuit board is packed so as to be in contact with the ground surface of the packing container, a large and uneven force does not act on any metal base circuit board. It is more effective in preventing problems from occurring.

Hereinafter, the present invention will be described with reference to the drawings.
FIG. 1 is an example in which a plurality of metal-based circuit boards of the present invention are packed in one. The metal-based circuit board of the present invention,
A circuit 3 is provided on a metal plate 1 via an insulating layer 2. Although not shown, another circuit board may be provided on the entire surface or a part of the metal-based circuit board. In FIG. 1, the metal base circuit boards are stacked and packaged so that the circuit surfaces of the metal base circuit boards and the surface of the metal plate face each other. The metal base circuit boards are packed with neutral paper 4 therebetween.

Although not particularly specified, the metal plate 1 of the present invention is made of aluminum, iron, silicon steel plate, copper or the like.

As the insulating layer 2, any material having an insulating property can be used. For example, an epoxy resin, a phenol resin, an unsaturated polyester resin, a polyimide resin or the like or a material obtained by impregnating them with a glass cloth or the like is used. For example, a material filled with a resin or an inorganic filler, a material formed of only a resin layer coated with the resin, and a material obtained by bonding the resin in a film shape are used.

The circuit 3 is formed by forming a circuit from a copper foil, an aluminum foil, or a composite foil of aluminum and copper, and a solder resist, a resin substrate, or the like is formed on the insulating layer 2 and the circuit 3. It may be mounted on a part.
Further, the circuit may be plated. The circuit may be formed into a desired shape in advance by bonding it to a metal plate 1 via an insulating layer 2, or by bonding a metal foil on the metal plate 1 via the insulating layer 2 and then etching it. The circuit may have a desired shape by the above method.

Paper is used between the metal base circuit boards to prevent scratches and the like. If paper is not sandwiched between the circuit boards, scratches and dents will occur on the metal plate surface and the circuit surface during transportation, causing a decrease in heat dissipation, a decrease in wire bonding properties, a decrease in insulation performance, and the like.

In the present invention, neutral paper is used as the paper sandwiched between the metal base circuit boards. When an acidic paper is used, it is absorbed by the metal plate 1 or the circuit 3 and corroded by the acid released from the paper to generate rust, which causes a decrease in heat radiation, a decrease in wire bonding, and a decrease in solder wettability. The use of neutral paper can prevent the above problem from occurring. Further, as the neutral paper of the present invention, for example, printing paper, wrapping paper and the like are preferable (because of strong paper strength), and among them, uncoated paper and bleached wrapping paper are preferable (because they are white and have little attached matter). More preferred.

Further, as described above, a plurality of stacked metal base circuit boards are packed by banding or plastics and packed in a packing container such as a box. When packing the metal circuit board in the packing container, it is preferable to pack the metal base circuit board so that one side thereof is in contact with the ground surface of the packing container (see FIG. 1) based on the experimental study results of the inventor. . If the metal plate surface and the circuit surface of the metal base circuit board are set to the ground surface of the packaging container, scratches and indentations may occur due to vibration during transportation, but by arranging them as described above, Problems can be prevented from occurring.

Hereinafter, the present invention will be described in more detail with reference to Examples.

[0021]

EXAMPLES Example 1 Bisphenol A type epoxy resin ("Epicoat 828" manufactured by Yuka Epoxy Co., Ltd.) containing 50% by volume of aluminum oxide was formed on an aluminum plate having a thickness of 3.0 mm. Is 80 μm, and aluminum (thickness 40 μm) / copper (thickness 10
μm) was laminated and etched to produce a metal-based circuit board.

The metal base circuit board was packaged in a PP band using a neutral paper slip sheet as a package of 25 sheets.

Next, the packed metal base circuit board is packed with a packing material (“MINAPACK” manufactured by Kanto Minacell Co., Ltd.).
Into a double carton cardboard box
A drop test and a reliability test of ISZ0202 were performed.
The results are shown in Table 1.

[0024]

[Table 1]

Example 2 and Comparative Examples 1 and 2 As shown in Table 1, various types of interleaving paper (paper interposed between the metal base circuit boards) and different directions of the metal base circuit board with respect to the packing container were used. A metal-based circuit board was packed by a simple method, and a test was performed in the same manner as in Example 1. The results are shown in Table 1.

[0026]

Industrial Applicability The method for packing a metal-based circuit board according to the present invention is characterized in that it can provide a highly reliable metal-based circuit board in which generation of scratches, dents and rust is suppressed. Above is very useful.

[Brief description of the drawings]

FIG. 1 is a schematic view (cross-sectional view) showing an example of a method for packing a metal-based circuit board according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal plate 2 Insulating layer 3 Circuit 4 Insert paper 5 PP band 6 Packing container

Claims (2)

[Claims] 1. A method of packing a plurality of metal base circuit boards, each having a circuit provided on a metal plate via an insulating layer, wherein neutral paper is interposed between the metal base circuit boards. A method for packing a metal-based circuit board, comprising: 2. The method of packing a metal-based circuit board according to claim 1, wherein the packing is performed so that one side surface of the metal-based circuit board is in contact with the ground surface of the packing container.