JP2002206200A5 - - Google Patents

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Publication number
JP2002206200A5
JP2002206200A5 JP2001322350A JP2001322350A JP2002206200A5 JP 2002206200 A5 JP2002206200 A5 JP 2002206200A5 JP 2001322350 A JP2001322350 A JP 2001322350A JP 2001322350 A JP2001322350 A JP 2001322350A JP 2002206200 A5 JP2002206200 A5 JP 2002206200A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2001322350A
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JP2002206200A (ja
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Priority claimed from US09/742,135 external-priority patent/US6569307B2/en
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Publication of JP2002206200A publication Critical patent/JP2002206200A/ja
Publication of JP2002206200A5 publication Critical patent/JP2002206200A5/ja
Pending legal-status Critical Current

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JP2001322350A 2000-10-20 2001-10-19 物体めっき方法およびシステム Pending JP2002206200A (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US24175400P 2000-10-20 2000-10-20
US25436100P 2000-12-11 2000-12-11
US09/742135 2000-12-22
US09/742,135 US6569307B2 (en) 2000-10-20 2000-12-22 Object plating method and system
US60/241754 2000-12-22
US60/254361 2000-12-22

Publications (2)

Publication Number Publication Date
JP2002206200A JP2002206200A (ja) 2002-07-26
JP2002206200A5 true JP2002206200A5 (ja) 2005-06-30

Family

ID=27399514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001322350A Pending JP2002206200A (ja) 2000-10-20 2001-10-19 物体めっき方法およびシステム

Country Status (6)

Country Link
US (2) US6569307B2 (ja)
EP (1) EP1199386A3 (ja)
JP (1) JP2002206200A (ja)
KR (1) KR20020031043A (ja)
CN (1) CN1361312A (ja)
TW (1) TWI232895B (ja)

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US6569307B2 (en) * 2000-10-20 2003-05-27 The Boc Group, Inc. Object plating method and system
US20030150734A1 (en) * 2002-02-11 2003-08-14 Applied Materials, Inc. Electroplating solution composition control
US20050202660A1 (en) * 2002-05-07 2005-09-15 Microfabrica Inc. Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions
US20040118694A1 (en) * 2002-12-19 2004-06-24 Applied Materials, Inc. Multi-chemistry electrochemical processing system
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US6790364B2 (en) * 2002-09-27 2004-09-14 The Boc Group, Inc. Process for stripping amine borane complex from an electroless plating solution
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US10297421B1 (en) 2003-05-07 2019-05-21 Microfabrica Inc. Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures
US7678258B2 (en) * 2003-07-10 2010-03-16 International Business Machines Corporation Void-free damascene copper deposition process and means of monitoring thereof
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050077182A1 (en) * 2003-10-10 2005-04-14 Applied Materials, Inc. Volume measurement apparatus and method
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
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US6984299B2 (en) 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
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US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US20070261963A1 (en) * 2006-02-02 2007-11-15 Advanced Technology Materials, Inc. Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions
JP2009242941A (ja) * 2008-03-11 2009-10-22 Panasonic Corp 半導体装置の製造方法および半導体製造装置
US20110315554A1 (en) * 2010-06-28 2011-12-29 Guardian Industries Corp Satin nickel electroplating techniques that include homogenization units
WO2016174705A1 (ja) * 2015-04-27 2016-11-03 株式会社Ｊｃｕ 硫酸銅めっき液の管理方法
EP3147388A1 (en) 2015-09-25 2017-03-29 Enthone, Incorporated Flexible color adjustment for dark cr(iii)-platings
US10590561B2 (en) * 2016-10-26 2020-03-17 International Business Machines Corporation Continuous modification of organics in chemical baths
TWI612180B (zh) * 2017-07-19 2018-01-21 Triumphant Gate Ltd 化學置換鍍金溶液及雜質鎳及雜質銅的連續純化系統
CN109280908B (zh) * 2017-07-19 2021-03-02 昊鼎环保科技(湖北)有限公司 一种化学置换含有杂质镍、铜的镀金溶液的连续纯化系统
US10711366B2 (en) * 2017-12-28 2020-07-14 Lam Research Corporation Removal of electroplating bath additives

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