JP2002201437A - Adhesive composition, and connection method and connection structure of circuit terminal using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive composition for electrical/electronic purposes which enables low-resistance electrical connection to be obtained and does not cause the displacement of a flexible tape or the warp of a panel; and a connection method and connection structure of circuit terminals using the same. SOLUTION: This adhesive composition essentially contains (1) a curing agent generating free radicals under heating, (2) a free-radical-polymerizable substance, (3) a film-forming material, and (4) a colorant. The connection method for circuit terminals comprises arranging a first circuit member having a first connection terminal and a second circuit member having a second connection terminal so that the first and second connection terminals face each other, causing the adhesive composition to intervene between the first and second connection terminals facing each other, and pressing the circuit members to each other while simultaneously irradiating the composition with light, thus electrically connecting the first and second connection terminals to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an adhesive composition, a method for connecting circuit terminals using the same, and a structure for connecting circuit terminals. In particular, OUTER-LEAD-BONDING implementation (OLB
The present invention relates to a method of connecting circuit terminals and a connection structure of circuit terminals in CHIP-ON-GLASS mounting (hereinafter referred to as COG mounting).

[0002]

2. Description of the Related Art A liquid crystal driving IC is mounted on a liquid crystal display glass panel by connecting a flexible tape on which the liquid crystal driving IC is mounted and the glass panel with a circuit connecting member.
An LB mounting method or a COG mounting method in which a liquid crystal driving IC is directly joined to a glass panel with a circuit connecting member is used. For the bonding, a method of heating and pressing with a high-temperature heat tool from the flexible tape or the IC side is used.
At this time, a temperature gradient is generated in the bonding portion, and the difference in heat shrinkage between the flexible tape or IC and the glass causes an OL difference.
In the case of the B mounting, there is a problem that a displacement occurs between the flexible tape and the glass electrode, or in the case of the COG mounting, the panel is warped and the display becomes uneven. Therefore, in order to solve these problems, light is irradiated at the time of bonding to heat the circuit connecting member, and the OLB due to heat is heated.
A method has been developed to prevent a decrease in bonding quality in mounting and COG mounting (for example, Japanese Patent Application Laid-Open No. 3-070869).

[0003]

However, since the connection member uses colored particles, the conversion of irradiated light into heat energy is insufficient, and is not sufficient to obtain a stable connection resistance value. Further, since the colored particles are insulative, there is a problem that increasing the filling amount of the particles increases the electric resistance value of the circuit connection portion and lowers the connection reliability. The present invention provides an electric / electronic adhesive composition that can provide a low-resistance electrical connection to an OLB mounting or a COG mounting and does not cause displacement of a flexible tape or warpage of a panel, and a circuit terminal using the same. And a connection structure for circuit terminals.

[0004]

The adhesive composition of the present invention is interposed between opposing circuit electrodes, irradiates the opposing circuit electrodes with light while applying pressure, and electrically connects the electrodes in the pressing direction. An adhesive composition that can be electrically connected, and contains (1) a curing agent that generates free radicals by heating, (2) a radical polymerizable substance, (3) a film forming material, and (4) a dye as essential components. It is an adhesive composition. The maximum absorption wavelength of the dye is preferably from 300 nm to 2000 nm, and 6
More preferably, it is from 00 nm to 1600 nm. When the maximum absorption wavelength of the dye is less than 300 nm, the ratio of the irradiated light to the glass panel is large, and
If it is larger, the ratio of light of the wavelength included in the light source is low, so that the circuit connecting material cannot be sufficiently heated,
It is not preferable because the electrical resistance value of the connection portion increases. The light source used in the present invention is not particularly limited as long as it includes visible light to near infrared light, and a halogen lamp, a xenon lamp, a semiconductor laser, or the like can be used.
In the present invention, it is preferable that (1) a curing agent that generates free radicals upon heating, (2) a radical polymerizable substance, (3) a film forming material, and (4) an adhesive composition further containing conductive particles. It is. As the conductive particles, it is preferable to use particles whose surface is made of at least one selected from metals of gold, silver, and white metal. The method for connecting circuit terminals of the present invention includes a first circuit member having a first connection terminal, a second circuit member having a second connection terminal, a first connection terminal and a second connection terminal. Are disposed facing each other, and the adhesive composition is interposed between the first connection terminal and the second connection terminal disposed opposite to each other, for example, a transparent cradle that transmits light emitted from a light source. And a pressure head, and irradiates light with pressure to electrically connect the first connection terminal and the second connection terminal arranged opposite to each other. At this time, the pressure head may be heated. At least one surface of the connection terminal can be made of at least one selected from gold, silver, tin, a platinum group metal, and indium-tin oxide (ITO). At least one substrate supporting the connection terminals can be made of glass. At least one circuit member surface can be coated or adhered with at least one selected from silicon nitride, a silicone compound, and a polyimide resin. The connection structure of the circuit terminal of the present invention, the first circuit member having the first connection terminal, the second circuit member having the second connection terminal, the first connection terminal and the second The connection terminals are arranged to face each other, the adhesive composition is interposed between the first connection terminal and the second connection terminal arranged to face each other, and the first connection terminal arranged to face each other. And the second connection terminal are electrically connected.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the film-forming material used in the present invention include phenoxy resin, polyvinyl formal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin and the like. A film-forming material is a liquid material that is solidified, and when the constituent composition is formed into a film, the film is easy to handle and tears easily.
It imparts mechanical properties and the like that are not cracked or sticky, and can be handled as a film in a normal state. Phenoxy resins are preferred among the film-forming materials because of their excellent adhesiveness, compatibility, heat resistance, and mechanical strength. The phenoxy resin is obtained by reacting a bifunctional phenol and epihalohydrin to a high molecular weight, or
It is a resin obtained by polyaddition of a functional epoxy resin and a bifunctional phenol. Specifically, 1 mol of bifunctional phenol and epihalohydrin 0.985 to 1.85.
015 in an unreactive solvent at a temperature of 40 to 120 ° C. in the presence of an alkali metal hydroxide. In addition, from the viewpoint of the mechanical and thermal properties of the resin, in particular, the blending equivalent ratio of the bifunctional epoxy resin and the bifunctional phenol is set such that epoxy group / phenolic hydroxyl group = 1 / 0.9 to 1/1. 1, amides, ethers, and the like having a boiling point of 120 ° C. or more in the presence of a catalyst such as an alkali metal compound, an organic phosphorus compound, or a cyclic amine compound;
Those obtained by heating at 50 to 200 ° C. and performing a polyaddition reaction in an organic solvent such as a ketone, lactone, or alcohol solvent having a solid content of 50 parts by weight or less are preferable. Bifunctional epoxy resins include bisphenol A type epoxy resins,
Bisphenol F type epoxy resin, Bisphenol AD
Type epoxy resin and bisphenol S type epoxy resin. Bifunctional phenols have two phenolic hydroxyl groups and include, for example, hydroquinones, bisphenols such as bisphenol A, bisphenol F, bisphenol AD, and bisphenol S. The phenoxy resin may be modified with a radically polymerizable functional group. The phenoxy resins may be used alone or as a mixture of two or more.

The curing agent used in the present invention, which generates free radicals by heating, is a compound which decomposes upon heating of a peroxide compound, an azo compound or the like to generate free radicals. The temperature is appropriately selected depending on the time, pot life, etc., but from the viewpoint of high reactivity and pot life, the temperature at a half-life of 10 hours is 40 ° C. or higher, and
Organic peroxides having a half-life of 1 minute at a temperature of 180 ° C. or less are preferable, and organic peroxides having a temperature of a half-life of 10 hours of 60 ° C. or more and a temperature of a half-life of 1 minute of 170 ° C. or less are more preferable. When the connection time is 10 seconds or less, the amount of the curing agent is 0.1 to 3 with respect to 100 parts by weight of the total of the radical polymerizable substance and the film forming material in order to obtain a sufficient reaction rate.
It is preferably 0 parts by weight, more preferably 1 to 20 parts by weight. If the amount of the curing agent is less than 0.1 part by weight, a sufficient reaction rate cannot be obtained, and good adhesive strength and small connection resistance tend to be hardly obtained. When the amount exceeds 30 parts by weight, the fluidity of the adhesive composition is reduced,
The connection resistance tends to increase and the pot life of the adhesive composition tends to be short. The curing agent can be selected from diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide, and the like. Further, in order to suppress the corrosion of the connection terminal of the circuit member, the amount of chlorine ions and organic acids contained in the curing agent is preferably 5,000 ppm or less, and more preferably, the amount of organic acids generated after thermal decomposition is small. . Specifically, it is selected from peroxyesters, dialkyl peroxides, hydroperoxides, and silyl peroxides, and is more preferably selected from peroxyesters having high reactivity. The above-mentioned curing agents can be appropriately mixed and used.

The peroxyesters include cumyl peroxy neodecanoate, 1,1,3,3-tetramethylbutyl peroxy neodecanoate, 1-cyclohexyl-1-methylethyl peroxynodecanoate, t-hexylperoxy neodecanoate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanonate, 2,5-dimethyl-
2,5-di (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-
2-ethylhexanonate, t-hexylperoxy-2
-Ethylhexanonate, t-butylperoxy-2-ethylhexanonate, t-butylveroxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropyl Monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5
-Dimethyl-2,5-di (m-toluoylperoxy) hexane, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxyoxybenzoate, t
-Butyl peroxyacetate and the like.

As the dialkyl peroxide, α,
α'-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-
Examples thereof include 2,5-di (t-butylperoxy) hexane and t-butylcumyl peroxide.

As the hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide and the like can be mentioned.

Examples of the diacyl peroxide include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinyl peroxide, and succinyl peroxide. Nickel peroxide, benzoylperoxytoluene, benzoyl peroxide and the like can be mentioned.

As peroxydicarbonate, di-
n-propylperoxydicarbonate, diisopropylperoxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, di (2-ethylhexylperoxy) dicarbonate , Dimethoxybutyl peroxy dicarbonate, di (3-methyl-3-methoxybutyl peroxy) dicarbonate, and the like.

Examples of peroxyketals include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1-bis (t-butylperoxy)-
Examples include 3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (t-butylperoxy) decane, and the like.

Examples of the silyl peroxide include t-butyltrimethylsilyl peroxide, bis (t-butyl) dimethylsilyl peroxide, t-butyltrivinylsilyl peroxide, bis (t-butyl) divinylsilyl peroxide, tris (t -Butyl) vinylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, tris (t-butyl) allylsilyl peroxide and the like. These curing agents that generate free radicals by heating can be used alone or in combination, and may be used in combination with a decomposition accelerator, an inhibitor and the like. A microcapsule obtained by coating these curing agents with a polyurethane-based or polyester-based polymer substance or the like is preferable because the pot life is extended.

The radically polymerizable substance used in the present invention is a substance having a functional group that is polymerized by a radical, and includes acrylate, methacrylate, and maleimide compounds. The radical polymerizable substance can be used in any state of a monomer and an oligomer, and the monomer and the oligomer can be used in combination. Specific examples of acrylate (methacrylate) include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate,
Trimethylolpropane triacrylate, tetramethylolmethanetetraacrylate, 2-hydroxy-1,
3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4
-(Acryloxypolyethoxy) phenyl] propane,
Examples include dicyclopentynyl acrylate, tricyclodecanyl acrylate, tris (acryloyloxyethyl) isocyanurate, urethane acrylate, and methacrylates of acrylates corresponding thereto. These can be used alone or in combination,
If necessary, a polymerization inhibitor such as hadroquinone or methyl ether hydroquinone may be appropriately used. Also,
It is preferable to have a dicyclopentynyl group and / or a tricyclodecanyl group and / or a triazine ring because heat resistance is improved.

The maleimide compound is a compound containing at least two maleimide groups in the molecule, for example, 1-methyl-2,4-bismaleimidebenzene, N, N
-M-phenylenebismaleimide, N, N'-p-phenylenebismaleimide, N, Nm-toluylenebismaleimide, N, N-4,4-biphenylenebismaleimide, N,
N'-4,4- (3,3'-dimethyl-biphenylene) bismaleimide, N, N'-4,4- (3,3'-dimethyldiphenylmethane) bismaleimide, N, N'-4,4- (3, 3 '
-Diethyldiphenylmethane) bismaleimide, N, N '
-4,4-diphenylmethane bismaleimide, N, N'-
4,4-diphenylpropanebismaleimide, N, N'-
3,3'-diphenylsulfone bismaleimide, N, N'-
4,4-diphenyl ether bismaleimide, 2,2-bis (4- (4-maleimidophenoxy) phenyl) propane, 2,2-bis (3-s-butyl-4,8- (4-maleimidophenoxy) phenyl) Propane, 1,1-bis (4-
(4-maleimidophenoxy) phenyl) decane, 4,
4'-cyclohexylidene-bis (1- (4-maleimidophenoxy) -2-cyclohexylbenzene, 2,2-bis (4- (4-maleimidophenoxy) phenyl) hexafluoropropane and the like. These can be used alone or in combination.

The adhesive composition of the present invention contains acrylic acid,
A copolymer or a copolymer containing at least one of acrylic acid ester, methacrylic acid ester or acrylonitrile as a monomer component can be used, and a copolymer acrylic rubber containing glycidyl acrylate or glycidyl methacrylate containing a glycidyl ether group can be used. It is preferable because it is excellent in fusing and stress relaxation when used together. The molecular weight (weight average) of these acrylic rubbers is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive.

The dyes used in the present invention include cyanine dyes, merocyanine dyes, rhodocyanine dyes, oxonol dyes, styryl dyes, base styryl dyes, phthalocyanine dyes, naphthalocyanine dyes, and the like.
These can be used alone or in combination.

The adhesive composition of the present invention further comprises fillers, softeners, accelerators, antioxidants, flame retardants, thixotropic agents, coupling agents, phenolic resins, melamine resins, isocyanates, etc. Can also be contained. It is preferable because it can improve the merging and connection reliability including the filler. It can be used as long as the maximum diameter of the filler is smaller than the particle diameter of the conductive particles, and a range of 5 to 60 parts by volume (based on 100 parts by volume of the adhesive resin component) is preferable. If it exceeds 60 parts by volume, the effect of improving reliability may be lost,
If it is less than 5 parts by volume, the effect of addition is small. Ketimine, vinyl group, acrylic group, amino group,
Epoxy group- and isocyanate group-containing substances are preferred from the viewpoint of improving adhesiveness. Specifically, as a silane coupling agent having an amino group, N-β (aminoethyl) γ-
Aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ
-Aminopropyltriethoxysilane, N-phenyl-
γ-aminopropyltrimethoxysilane and the like. Examples of the silane coupling agent having a ketimine include those obtained by reacting a silane coupling agent having an amino group with a ketone compound such as acetone, methyl ethyl ketone, and methyl isobutyl ketone.

With the adhesive composition of the present invention, connection can be obtained by direct contact of opposing circuit electrodes at the time of connection, even if there is no conductive particle. can get. Au, A as the conductive particles
g, Ni, Cu, metal particles such as solder, carbon and the like. In order to obtain a sufficient pot life, the surface layer is Ni,
Precious metals such as Au, Ag and white metal are preferable, not Au and more preferably Au, not transition metals such as Cu. Further, the surface of a transition metal such as Ni may be coated with a noble metal such as Au. Also, when the above-described conductive layer is formed by coating or the like on non-conductive glass, ceramic, plastic, or the like, and the outermost layer is made of a noble metal or in the case of hot-melt metal particles, since it has deformability by heating and pressing, it is difficult to connect at the time of connection. This is preferable because the contact area with the electrode is increased, and variations in the thickness of the electrode and the substrate are absorbed to improve reliability. The thickness of the noble metal coating layer is preferably 100 Å or more in order to obtain good resistance. However, when a layer of a noble metal is formed on a transition metal such as Ni, free radicals are generated due to oxidation-reduction caused by the loss of the noble metal layer or the loss of the noble metal layer generated during mixing and dispersion of conductive particles. In order to cause deterioration in storage stability, the thickness is preferably 300 Å or more. When the thickness is increased, the effects thereof are lost. Therefore, it is preferable to set the thickness to 1 μm at the maximum, but there is no limitation. The conductive particles are properly used in a range of 0.1 to 30 parts by volume based on 100 parts by volume of the adhesive resin component.
In order to prevent a short circuit or the like in an adjacent circuit due to excessive conductive particles, the content is more preferably 0.1 to 10 parts by volume. When the adhesive composition of the present invention is formed into a film, the adhesive composition is divided into two or more layers, and divided into a layer containing a curing agent that generates free radicals by heating and a layer containing conductive particles. Thus, the pot life can be improved.

The adhesive composition of the present invention can be used for OLB mounting or C
It can also be used as a film adhesive for bonding a flexible tape or IC chip to a glass substrate in OG mounting. That is, a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged such that the first connection terminal and the second connection terminal are opposed to each other. The adhesive composition (film adhesive) of the present invention is interposed between the arranged first connection terminal and the second connection terminal, and is irradiated with light at the time of pressurization, and the opposed first connection terminal is arranged. And the second connection terminal can be electrically connected. These circuit members are usually provided with a large number of connection terminals (there may be a single terminal depending on the temperature), and at least one set of the circuit members is opposed to at least a part of the connection terminals provided on the circuit members. The adhesive of the present invention is interposed between the arranged and opposed connection terminals, and light is applied at the time of pressurization to electrically connect the opposedly arranged connection terminals to form a circuit board. By pressurizing and irradiating at least one set of circuit members, the opposed connection terminals can be electrically connected to each other by direct contact or via conductive particles in the adhesive composition.

In the method for connecting circuit terminals of the present invention, an adhesive composition having curability by radical polymerization is used. The surface of the connection terminal is made of gold, silver, tin, a platinum group metal, indium-tin oxide (ITO). After forming the connection terminal (electrode circuit) composed of at least one selected from the following, the other connection terminal (circuit electrode) can be aligned and connected by applying pressure and irradiating light. At this time, the pressurizing head may be heated and connected. In the present invention, the flexible tape is an organic insulating material such as a polyimide resin, the surface of a glass substrate is particularly good for a circuit member coated or adhered with at least one selected from silicon nitride, a silicone compound, a polyimide resin, and a silicone resin. It is possible to provide an electric / electronic adhesive composition that provides an adhesive strength.

[0022]

EXAMPLES (Example 1) A phenoxy resin having a glass transition temperature of 80 ° C was synthesized from bisphenol A type epoxy resin and bisphenol A. 50 g of this resin was mixed with toluene (boiling point 110.6 ° C.) / Ethyl acetate (boiling point 7
(7.1 ° C.) = 50/50 mixed solvent to obtain a solution having a solid content of 40% by weight. 50 g of a phenoxy resin in solid weight ratio as a film forming material, and dicyclopentenyl dialcohol diacrylate 49 as a radical polymerizable substance
g, phosphate ester type acrylate 1 g, t-hexylperoxy-2-ethylhexanonate 5 g as a curing agent that generates free radicals upon heating, 2-color as a dye
[7- (1,3-dihydro-1,3,3-trimethyl-2H-indole-2-ylidene) -1,3,5-heptatrienyl] -1,3,3-trimethyl-3H-indolium iodide ( An average particle in which a maximum absorption wavelength of 741 nm) is blended so as to be 1 g, and a conductive layer (a particle having polystyrene nucleus as a core and a nickel layer having a thickness of 0.2 μm on the surface and a gold layer having a thickness of 0.04 μm on the outside thereof). 5 μm particles)
Volume% was dispersed and applied to a PET (polyethylene terephthalate) film with a thickness of 80 μm, one surface of which was surface-treated, using a coating device, and dried with hot air at 70 ° C. for 10 minutes to form a 20 μm thick adhesive layer. An adhesive was obtained.

(Example 2) 8- [5- (6,7-dihydro-6-methyl-2,4-diphenyl-5H-1-pentazovilan-8-yl) -2,4-pentadienyl was added to the dye. Reden] -5,
6,7,8-tetrahydro-6-methyl-2,4-diphenyl-1-benzopyrium perchlorate (maximum absorption wavelength 1
060 nm) to obtain a film adhesive in the same manner as in Example 1.

Example 3 3-Ethyl-5- [3-
Ethyl-5- [2- (3-ethyl-4 (1H) -quinolinylidene) ethylidene] -4-oxo-2-thiazolidinylidene] -2-thioxo-4-thiazolidinone (maximum absorption wavelength 664 nm) was used. Otherwise in the same manner as in Example 1, a film adhesive was obtained.

Example 4 2-[[3-Allyl-5
-[2- (1-ethyl-4 (1H) -quinolinylidene) ethylidene] -4-oxo-2-thiazolidinylidene] methyl] -3-ethyl-4,5-diphenylthiazolium bromide (maximum absorption wavelength 668 nm) to obtain a film adhesive in the same manner as in Example 1.

Example 5 8- [5- (6,7-dihydro-2,4-diphenyl-5H-1-pentazopyran-8-yl) -2,4-pentadienylidene] -5 was used as a dye. A film adhesive was obtained in the same manner as in Example 1, except that 6,7,8-tetrahydro-2,4-diphenyl-1-benzopyrium perchlorate (maximum absorption wavelength: 1060 nm) was used.

Example 6 Bis [4- (dimethylamino) dithiobenzyl] nickel (maximum absorption wavelength 10
A film-like adhesive was obtained in the same manner as in Example 1 except that 68 nm) was used.

(Example 7) 3-ethyl-2-[[3
-[3- [3-[(3-ethylnaphtho [2,1-d] thiazol-2 (3H) -ylidene) methyl] -5,5-dimethyl-2-
Cyclohexene-1-ylidene] -1-propenyl]-
Adhesion in the form of a film in the same manner as in Example 1 except that 5,5-dimethyl-2-cyclohexene-1-ylidene] methyl] naphtho [2,1-d] thiazolium perchlorate (maximum absorption wavelength: 1010 nm) was used. Agent was obtained.

Comparative Example 1 A film adhesive was obtained in the same manner as in Example 1 except that no dye was used.

(Circuit connection) Bump area 50 μm × 50
An IC chip (surface coated with silicon nitride) on which gold bumps having a pitch of 100 μm and a height of 20 μm are arranged, and an indium-tin oxide (ITO) substrate formed by vapor deposition of indium-tin oxide (ITO) on a 1.1 mm thick glass Resistance <20Ω / □) using the above film adhesive, sandwiched between quartz glass and a pressure head, 80 ° C., 100M
A connection was made by irradiating a xenon lamp from the quartz glass side at the same time as heating and pressurizing for 10 seconds in Pa (bump area conversion). At this time, the adhesive on the film adhesive was previously placed on the ITO substrate at 70 ° C. and 0.5 MPa.
The film was adhered by applying heat and pressure for 5 seconds (in terms of bump area), and then the PET film was peeled off and connected to an IC chip. (Measurement of connection resistance) After connection of the circuit, the electric resistance value of the above-mentioned connection portion was initially kept, and after 500 cycles in a temperature cycle bath of −40 ° C./30 minutes and 100/30 minutes, a two-terminal measurement method was performed. It was measured with a multimeter. (Panel warpage) Use a surface roughness tester to measure 25
mm. There was no warpage within 1 μm. Table 1 shows the results of these measurements.

[0031]

[Table 1]

In the first to seventh embodiments of the present invention, the temperature was set to 80 ° C.
Despite the connection at a low temperature, the connection resistance is low and good. Further, the connection resistance value after the temperature cycle test for evaluating the connection reliability is low and good. Since the connection is made at a low temperature, there is no warpage of the panel and the panel is excellent.
On the other hand, Comparative Example 1, which does not use a dye, is not sufficiently cured, and has a large initial value and a large connection resistance after a temperature cycle.
In addition, panel warpage deformation is "none" due to insufficient curing
However, when cured, it was greatly deformed.

[0033]

According to the present invention, it is possible to obtain an electrical connection showing low connection resistance in OLB mounting or COG mounting, and to provide an adhesive composition for electric and electronic use without warpage of a panel. Becomes

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/36 H05K 3/36 A F term (Reference) 2H092 GA40 GA45 GA50 KB04 MA31 NA15 NA29 PA06 4J040 DB022 DD062 DD072 EB082 ED002 EE062 EF002 EG002 FA141 FA151 FA161 FA171 JB08 KA03 KA16 KA32 KA35 LA09 MA01 MA02 MA04 MA10 NA20 PA32 PA33 5E319 AC03 AC04 BB11 CC61 GG09 GG20 5E344 AA02 AA22 BB02 BB04 BB07 CB07 DD0206

Claims (9)

[Claims] An adhesive composition comprising (1) a curing agent that generates free radicals upon heating, (2) a radical polymerizable substance, (3) a film-forming material, and (4) a dye as essential components. 2. A dye having a maximum absorption wavelength of 300 nm to 20 nm.
The adhesive composition according to claim 1, which has a thickness of 00 nm. 3. The adhesive composition according to claim 1, further comprising conductive particles. 4. A first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged with the first connection terminal and the second connection terminal facing each other. The adhesive composition according to any one of claims 1 to 3, wherein the adhesive composition according to any one of claims 1 to 3 is interposed between the first connection terminal and the second connection terminal arranged opposite to each other, and the pressure is applied together with the pressure. 4. A method of connecting circuit terminals, wherein the adhesive composition according to any one of the above 3 is irradiated with light to electrically connect the first connection terminal and the second connection terminal arranged opposite to each other. 5. A first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged with the first connection terminal and the second connection terminal facing each other. The adhesive composition according to any one of claims 1 to 3, wherein the adhesive composition according to any one of claims 1 to 3 is interposed between the first connection terminal and the second connection terminal arranged opposite to each other, and the pressure is applied together with the pressure. 3. The connection of circuit terminals for irradiating the adhesive composition according to any one of the items 3 with light and further heating the pressurizing head to electrically connect the first connection terminal and the second connection terminal arranged opposite to each other. Method. 6. The method according to claim 4, wherein the substrate supporting at least one of the connection terminals is made of glass. 7. The surface of at least one connection terminal is gold,
Silver, tin, platinum group metals, indium-tin oxide (IT
5. The method according to claim 4, which is composed of at least one selected from O).
7. The method for connecting circuit terminals according to claim 6. 8. The method according to claim 4, wherein at least one surface of the circuit member is coated or adhered with at least one selected from silicon nitride, a silicone compound, and a polyimide resin. . 9. A circuit terminal connection structure obtained by the circuit terminal connection method according to any one of claims 4 to 8.