JP2002200633A - Method for manufacturing composite laminate plate - Google Patents

Method for manufacturing composite laminate plate

Info

Publication number
JP2002200633A
JP2002200633A JP2000399659A JP2000399659A JP2002200633A JP 2002200633 A JP2002200633 A JP 2002200633A JP 2000399659 A JP2000399659 A JP 2000399659A JP 2000399659 A JP2000399659 A JP 2000399659A JP 2002200633 A JP2002200633 A JP 2002200633A
Authority
JP
Japan
Prior art keywords
resin
prepreg
pressure
mpa
surface layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000399659A
Other languages
Japanese (ja)
Other versions
JP3951601B2 (en
Inventor
Tatsu Sakaguchi
達 坂口
Takahiro Uchiyama
隆尋 内山
Katsuhiko Yoshida
勝彦 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP2000399659A priority Critical patent/JP3951601B2/en
Publication of JP2002200633A publication Critical patent/JP2002200633A/en
Application granted granted Critical
Publication of JP3951601B2 publication Critical patent/JP3951601B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To enhance a dimensional stability of a composite laminate plate or a metal foil-clad composite laminate plate (restrain a dimensional shrinkage thereof due to heating) by decreasing warp and twist thereof. SOLUTION: A surface layer pre-preg has a resin content of 40 to 50 mass % and its resin cure degree is adjusted so that a gel time in stroke cure at 160 deg.C is 90 to 150 sec. A core layer pre-preg has a resin content (including a compounded inorganic filler) of 87 to 93 mass % and its resin cure degree is adjusted so that a resin flow is 15 to 40 mass % when a 100 mm square pre-preg is heated and pressed under 5 MPa at 160 deg.C. A heat and press forming of the surface layer pre-preg and the core layer pre-preg is conducted by increasing the heating pressure from a first pressure of 2 to 4 MPa to a second pressure of 5 to 10 MPa. This pressure increase is conducted at a stage when the resin initiates curing after passing through a molten state. A pressure during cooling after forming is reduced from the second pressure to 0 to 1 MPa.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、そり・ねじれが小
さく寸法安定性に優れたコンポジット積層板を製造する
方法に関する。この製造法は、表面に銅箔等の金属箔を
一体化する金属箔張りコンポジット積層板の製造法をそ
の概念に含む。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a composite laminate having a small warp and twist and excellent dimensional stability. This manufacturing method includes in its concept a method of manufacturing a metal-foil-clad composite laminate in which a metal foil such as a copper foil is integrated on the surface.

【0002】[0002]

【従来の技術】近年、電気・電子機器の発達は目覚まし
く、金属箔張りコンポジット積層板を加工したプリント
配線板が、産業用、民生用のいずれの分野においても、
高級機器に採用されるようになってきた。このため、コ
ンポジット積層板に対して品質・性能のさらなる向上が
求められている。
2. Description of the Related Art In recent years, the development of electric and electronic devices has been remarkable, and printed wiring boards processed from metal foil-clad composite laminates have been used in both industrial and consumer fields.
It has been adopted for high-end equipment. For this reason, further improvement in quality and performance is required for the composite laminate.

【0003】コンポジット積層板は、エポキシ樹脂をガ
ラス繊維織布に含浸し加熱乾燥したプリプレグを表面層
とし、無機充填材配合エポキシ樹脂をガラス繊維不織布
に含浸し加熱乾燥したプリプレグを前記表面層の芯層と
し、これらをプレス熱盤間で加熱加圧成形したものであ
る。必要に応じて表面に銅箔等の金属箔を一体に成形す
る。前記コンポジット積層板は、芯層にガラス繊維不織
布を使用しているので、全層にガラス繊維織布を使用す
るエポキシ樹脂積層板と比較すると、ドリル加工、打抜
き加工等の機械加工性が優れる。そして、プリント配線
板としての電気絶縁特性およびスルーホール信頼性は、
ガラス繊維織布エポキシ樹脂積層板と同等であることか
ら、近時、生産量が急激に増大した。
[0003] A composite laminate is made by impregnating an epoxy resin into a glass fiber woven fabric and heating and drying the prepreg as a surface layer, impregnating an epoxy resin containing an inorganic filler into a glass fiber nonwoven fabric and heating and drying the prepreg to the core of the surface layer. These layers were formed by heating and pressing between press hot plates. If necessary, a metal foil such as a copper foil is integrally formed on the surface. Since the composite laminate uses a glass fiber nonwoven fabric for the core layer, the composite laminate has excellent machinability such as drilling and punching as compared with an epoxy resin laminate using a glass fiber woven fabric for all layers. And the electrical insulation characteristics and through-hole reliability as a printed wiring board,
Since it is equivalent to a glass fiber woven epoxy resin laminate, production has recently increased sharply.

【0004】しかし、コンポジット積層板は、芯層にガ
ラス繊維不織布を使用しているため、ガラス繊維織布エ
ポキシ樹脂積層板と比較すると、そり・ねじれが発生し
やすく寸法安定性も劣る。芯層にガラス繊維不織布を使
用することが、良い方にも悪い方にも作用している。
However, since the composite laminate uses a glass fiber non-woven fabric for the core layer, warpage and torsion easily occur and the dimensional stability is inferior as compared with the glass fiber woven epoxy resin laminate. The use of glass fiber non-woven fabric for the core layer works for both good and bad.

【0005】[0005]

【発明が解決しようとする課題】本発明が解決しようと
する課題は、コンポジット積層板ないしは金属箔張りコ
ンポジット積層板のそり・ねじれを小さくし寸法安定性
(特に加熱による寸法収縮の抑制)を向上させることで
ある。
An object of the present invention is to reduce the warpage and twist of a composite laminate or a metal foil-clad composite laminate and improve dimensional stability (particularly, suppression of dimensional shrinkage due to heating). It is to make it.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
に、本発明に係るコンポジット積層板の製造法は、表面
層に用いるガラス繊維織布プリプレグと前記表面層の芯
層に用いるガラス繊維不織布プリプレグをそれぞれ特定
の指標に基づいて調整し、これらの加熱加圧成形につい
ても特定の制御を行なう。
In order to solve the above-mentioned problems, a method for producing a composite laminate according to the present invention comprises a glass fiber woven prepreg used for a surface layer and a glass fiber nonwoven fabric used for a core layer of the surface layer. The prepregs are adjusted based on specific indices, respectively, and specific control is also performed for these heat-press molding.

【0007】表面層プリプレグはガラス繊維織布にエポ
キシ樹脂を含浸し加熱乾燥し、芯層プリプレグはガラス
繊維不織布に無機充填材配合エポキシ樹脂を含浸し加熱
乾燥して製造するが、特定の指標に基づく調整とは次の
とおりである。まず、表面層プリプレグは、樹脂含有量
を40〜50質量%とし、樹脂硬化度の調整を、160
℃ストロークキュアにおけるゲル化時間が90〜150
秒となるように行なう。他方、芯層プリプレグは、樹脂
(配合した無機充填材を含む)含有量を87〜93質量
%とし、樹脂硬化度の調整を、100mm角の当該プリプ
レグを160℃,5MPaの条件で加熱加圧成形したとき
の樹脂流れが15〜40質量%となるように行なう。
The surface layer prepreg is produced by impregnating a glass fiber woven fabric with an epoxy resin and drying by heating, and the core layer prepreg is produced by impregnating a glass fiber nonwoven fabric with an epoxy resin containing an inorganic filler and drying by heating. The adjustment based on this is as follows. First, for the surface layer prepreg, the resin content was set to 40 to 50% by mass, and the adjustment of the resin curing degree was adjusted to 160%.
Gel time in stroke cure is 90-150
Do so in seconds. On the other hand, the core layer prepreg has a resin (including the blended inorganic filler) content of 87 to 93% by mass, and adjusts the degree of curing of the resin by heating and pressing the 100 mm square prepreg at 160 ° C. and 5 MPa. The molding is performed so that the resin flow at the time of molding becomes 15 to 40% by mass.

【0008】また、これら表面層プリプレグと芯層プリ
プレグの加熱加圧成形における特定の制御とは次のとお
りである。加熱時の圧力は、2〜4MPaの第1次圧力か
ら5〜10MPaの第2次圧力へ上げる制御を行なう。こ
の制御は、プリプレグの樹脂が溶融状態を経て硬化開始
に至る段階に行なう。加熱加圧成形後の冷却時の圧力
は、前記第2次圧力から0〜1MPaへ下げる制御を行な
う。
[0008] The specific control in the heat and pressure molding of the surface layer prepreg and the core layer prepreg is as follows. The pressure at the time of heating is controlled to increase from a primary pressure of 2 to 4 MPa to a secondary pressure of 5 to 10 MPa. This control is performed at the stage where the resin of the prepreg reaches the start of curing through the molten state. The pressure at the time of cooling after the heat and pressure molding is controlled to decrease from the secondary pressure to 0 to 1 MPa.

【0009】上記のプリプレグの調整と成形制御によっ
てコンポジット積層板のそり・ねじれが小さくなり寸法
安定性が良好になる理由は、以下のように推測される。
本発明に係る製造法では、表面層プリプレグは、通常よ
り、樹脂含有量を多くし樹脂硬化度を低くしている。芯
層プリプレグは、通常より、樹脂含有量を多くし樹脂硬
化度を高くしている。芯層プリプレグの樹脂硬化度を高
めておくと、加熱加圧成形時の樹脂流れが少なくなる。
このことが、ガラス繊維不織布が樹脂流れに伴って切れ
たり伸びたりするのを防ぎ、樹脂流れに起因する内部応
力の残留も少なくして、積層板のそり・ねじれ抑制に寄
与する。前記内部応力の残留はそり・ねじれの大きな原
因であるので、これを少なくできることは有効である。
また、表面層プリプレグの樹脂含有量を多くし硬化度を
低くしておくことは、積層成形時に表面層プリプレグの
樹脂が芯層プリプレグに多大な応力を与えることなく芯
層プリプレグの有孔部分(空隙部分)に含浸され、芯層プ
リプレグの空隙を完全に充填することができる。硬化度
を低くしておくと、その樹脂流れが芯層プリプレグに多
大な応力を与えないので、積層板のそり・ねじれ抑制に
寄与する。また、表面層プリプレグの樹脂含有量を多く
した理由は、芯層プリプレグの空隙を表面層プリプレグ
の樹脂で確実に充填し、ボイドを残さないために十分な
樹脂量を確保するためである。尚、芯層プリプレグの樹
脂含有量を多くしておく理由も同様であり、芯層プリプ
レグの有孔部分(空隙部分)をプリプレグの段階から少な
くしておくためである。
The reason why the above-mentioned prepreg adjustment and molding control reduce the warpage and twist of the composite laminate and improve the dimensional stability is presumed as follows.
In the production method according to the present invention, the surface layer prepreg has a higher resin content and lower resin curing degree than usual. The core layer prepreg has a higher resin content and a higher resin curing degree than usual. If the degree of resin curing of the core layer prepreg is increased, the resin flow at the time of heat and pressure molding is reduced.
This prevents the glass fiber nonwoven fabric from being cut or stretched due to the resin flow, reduces the residual internal stress caused by the resin flow, and contributes to the suppression of warpage and twisting of the laminate. Since the residual internal stress is a major cause of warpage and torsion, it is effective to reduce it.
In addition, increasing the resin content of the surface layer prepreg and lowering the degree of curing is advantageous in that the resin of the surface layer prepreg does not exert a large stress on the core layer prepreg during lamination molding, and the perforated portion of the core layer prepreg ( Voids) to completely fill the voids of the core layer prepreg. If the degree of curing is set low, the resin flow does not give a great stress to the core layer prepreg, which contributes to the suppression of warpage and twist of the laminate. The reason for increasing the resin content of the surface layer prepreg is to ensure that the voids of the core layer prepreg are filled with the resin of the surface layer prepreg and that a sufficient amount of resin is secured so as not to leave voids. Note that the reason for increasing the resin content of the core layer prepreg is the same, in order to reduce the perforated portion (void portion) of the core layer prepreg from the stage of prepreg.

【0010】また、本発明係る製造法における加熱加圧
成形の制御は、積層板のそり・ねじれの抑制に加えて寸
法安定性の顕著な向上に寄与している。第1次圧力を第
2次圧力より低くすることにより、表面層プリプレグと
芯層プリプレグの樹脂が溶融したときの流れが大きくな
らず、樹脂溶融時の流れが著しくならないことが、積層
板のそり・ねじれの抑制につながる。前記樹脂が溶融状
態を経て硬化開始に至る段階で第1次圧力から第2次圧
力へ上げ、積層板中のボイド残留を抑制しプリプレグ層
間や金属箔と表面層プリプレグ間の接着強度を確保す
る。この段階では、圧力を上げても樹脂の流動は少な
く、そり・ねじれへの影響はない。加熱加圧成形後の冷
却時の圧力を前記第2次圧力から0〜1MPaの圧力へ下
げることにより、成形時に積層板内部に残留した応力を
解放することができ、積層板に応力が残留しないことが
積層板のそり・ねじれの抑制につながる。また、この冷
却時に積層板は収縮しようとするが、前記低い圧力へ下
げることにより、積層板が収縮しようとするときにその
障害がとなるものが少なくなり、積層板は残留応力を解
放するまで十分に収縮するので、その後の積層板の寸法
安定性が著しく良好になる。
[0010] The control of the heat and pressure forming in the production method according to the present invention contributes to remarkable improvement of dimensional stability in addition to suppression of warpage and twist of the laminated plate. By making the primary pressure lower than the secondary pressure, the flow of the resin in the surface layer prepreg and the core layer prepreg when the resin melts does not increase, and the flow during the resin melting does not become significant.・ It leads to suppression of torsion. The resin is raised from the primary pressure to the secondary pressure at a stage from the molten state to the start of curing to suppress the residual voids in the laminate and to secure the adhesive strength between the prepreg layers or between the metal foil and the surface layer prepreg. . At this stage, even if the pressure is increased, the flow of the resin is small, and there is no effect on warpage and twist. By lowering the pressure at the time of cooling after the heat and pressure molding from the secondary pressure to a pressure of 0 to 1 MPa, the stress remaining inside the laminate at the time of molding can be released, and no stress remains in the laminate. This leads to suppression of warpage and twist of the laminate. Also, during this cooling, the laminate tends to shrink, but by lowering to the low pressure, there are fewer obstacles when the laminate is about to shrink, and the laminate is released until the residual stress is released. Due to the sufficient shrinkage, the subsequent dimensional stability of the laminate is significantly improved.

【0011】このように、本発明に係る製造法において
は、表面層に用いるガラス繊維織布プリプレグと前記表
面層の芯層に用いるガラス繊維不織布プリプレグをそれ
ぞれ特定の指標に基づいて調整することと、これらを加
熱加圧成形し冷却するときの特定の制御の組合せによ
り、コンポジット積層板のそり・ねじれ抑制と良好な寸
法安定性の確保を達成することができる。
As described above, in the production method according to the present invention, the prepreg used for the glass fiber woven fabric used for the surface layer and the prepreg used for the glass fiber nonwoven fabric used for the core layer of the surface layer are adjusted based on specific indices. The combination of the specific controls when these are heated and pressed and then cooled can suppress the warpage and twist of the composite laminate and ensure good dimensional stability.

【0012】[0012]

【発明の実施の形態】本発明に係る方法を実施するに当
たり、ガラス繊維織布、ガラス繊維不織布はコンポジッ
ト積層板に通常使用されているものをそのまま使用でき
る。これらに含浸するエポキシ樹脂は、二官能エポキシ
樹脂(ビスフェノールA型エポキシ樹脂など)、三官能
エポキシ樹脂(フェニルグリシジルエーテル付加ビスフ
ェノールA型エポキシ樹脂など)、多官能エポキシ樹脂
(フェノールノボラック型エポキシ樹脂など)、その他
のエポキシ樹脂を単独で又は組合せて適宜選択すること
ができる。硬化剤は、フェノール類ノボラック樹脂、ア
ミン系化合物などを適宜選択することができる。ガラス
繊維不織布に含浸するエポキシ樹脂には、水酸化アルミ
ニウム、水酸化マグネシウム、タルクなどの無機充填材
を増量材として配合する。ガラス繊維織布に含浸するエ
ポキシ樹脂にも必要に応じて無機充填材を配合してもよ
い。また、エポキシ樹脂には、積層板を難燃化するため
にブロム化合物、三酸化アンチモン、五酸化アンチモ
ン、リン化合物などの難燃剤、難燃助剤を配合してもよ
い。水酸化アルミニウム、水酸化マグネシウムは増量材
としてだけでなく難燃作用も併せ有する。コンポジット
積層板の製造では、必要に応じて表面に金属箔を一体成
形するが、金属箔は、銅箔、ニッケル箔、アルミニウム
箔などプリント配線板の配線形成に適したものであれば
特に限定しない。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In carrying out the method according to the present invention, the glass fiber woven fabric and the glass fiber non-woven fabric can be those which are commonly used for composite laminates. The epoxy resin to be impregnated into these is a bifunctional epoxy resin (such as bisphenol A epoxy resin), a trifunctional epoxy resin (such as bisphenol A epoxy resin with phenylglycidyl ether), and a polyfunctional epoxy resin (such as phenol novolac epoxy resin). And other epoxy resins can be appropriately selected alone or in combination. As the curing agent, a phenolic novolak resin, an amine compound or the like can be appropriately selected. Inorganic fillers such as aluminum hydroxide, magnesium hydroxide, and talc are added to the epoxy resin impregnated in the glass fiber nonwoven fabric as a filler. If necessary, an inorganic filler may be added to the epoxy resin impregnated in the glass fiber woven fabric. The epoxy resin may be blended with a flame retardant such as a bromo compound, antimony trioxide, antimony pentoxide, or a phosphorus compound, or a flame retardant aid to make the laminate flame-retardant. Aluminum hydroxide and magnesium hydroxide have not only a filler but also a flame retardant action. In the production of a composite laminate, a metal foil is integrally formed on the surface as necessary, but the metal foil is not particularly limited as long as it is suitable for wiring formation of a printed wiring board such as a copper foil, a nickel foil, and an aluminum foil. .

【0013】表面層プリプレグ、芯層プリプレグは、そ
れぞれ、長尺のガラス繊維織布、ガラス繊維不織布を移
送しながら、これに、溶剤希釈したエポキシ樹脂組成物
のワニスを含浸し加熱乾燥して製造する。樹脂含有量の
調整は、前記含浸後のガラス繊維織布、ガラス繊維不織
布へスクイズロールを当接して行なう。プリプレグ樹脂
の硬化度(半硬化状態、いわゆるBステージ)の調整
は、加熱乾燥の温度と時間により行なう。芯層プリプレ
グの樹脂含有量は、配合した無機充填材も樹脂分として
含め計算したものである。表面層プリプレグについて
も、無機充填材を含む場合には、その樹脂含有量を芯層
プリプレグと同様の考え方で計算する。
The surface layer prepreg and the core layer prepreg are each manufactured by impregnating a varnish of an epoxy resin composition diluted with a solvent into a long glass fiber woven fabric or a glass fiber nonwoven fabric while transferring the same, and drying by heating. I do. The adjustment of the resin content is performed by bringing a squeeze roll into contact with the impregnated glass fiber woven fabric or glass fiber nonwoven fabric. Adjustment of the degree of curing (semi-cured state, so-called B stage) of the prepreg resin is performed by the temperature and time of heating and drying. The resin content of the core layer prepreg is calculated by including the blended inorganic filler as a resin component. When the inorganic filler is included in the surface layer prepreg, the resin content is calculated in the same manner as in the core layer prepreg.

【0014】コンポジット積層板の製造は、上記芯層プ
リプレグ1枚ないし積層した複数枚の両側に表面層プリ
プレグを重ね、さらに必要に応じて両面または片面に金
属箔を載置し、これをプレス熱盤間で加熱加圧成形して
行なう。第1次圧力から第2次圧力へ上げる制御は、プ
リプレグの樹脂が溶融状態を経て硬化開始に至る段階に
行なうが、成形作業中にその状態を直接知ることは難し
いので、成形中のプリプレグの温度を検知して、前記状
態を間接的に把握する。圧力を上げる時期は、好ましく
はプレス熱盤の段内中央に位置するプリプレグの温度が
100〜140℃の範囲にあるときである。
In the production of a composite laminate, a surface layer prepreg is laminated on both sides of one or more of the above core layer prepregs, and a metal foil is placed on both sides or one side if necessary. It is performed by heating and pressing between boards. The control for raising the primary pressure to the secondary pressure is performed at a stage where the resin of the prepreg reaches the start of curing through the molten state. However, it is difficult to directly know the state during the molding operation. By detecting the temperature, the state is indirectly grasped. The time when the pressure is increased is preferably when the temperature of the prepreg located in the center of the step of the press hot platen is in the range of 100 to 140 ° C.

【0015】[0015]

【実施例】本発明に係る実施例を比較例ならびに従来例
と共に詳細に説明する。 実施例1〜13、比較例1〜8、従来例 ビスフェノールA型臭素化エポキシ樹脂(東都化成製
「YDB−400」)80質量部、フェノールノボラッ
ク型エポキシ樹脂(東都化成製「YDPN−638」)
20質量部、硬化剤としてジシアンジアミド3質量部、
硬化促進剤として2−エチル−4−メチルイミダゾール
0.15質量部を、メチルエチルケトンで希釈しワニス
(A)を調製した。また、常温で液状のビスフェノール
A型エポキシ樹脂(油化シェルエポキシ製「Ep−82
8」)66質量部、テトラブロモビスフェノールA20
質量部、硬化剤としてフェノールノボラック樹脂(大日
本インキ化学製「TD−2093」)14質量部、水酸
化アルミニウム100質量部、硬化促進剤として2−エ
チル−4−メチルイミダゾール0.2質量部を配合し、
ワニス(B)を調製した。上記ワニス(A)をガラス繊
維織布(旭シュエーベル製「GC−7628」,単位質
量210g/m2)に含浸し、加熱乾燥して表面層プリ
プレグを得た。また、上記ワニス(B)を、ガラス繊維
不織布(日本バイリーン製「EPM−4090」,単位
質量90g/m2)に含浸し、加熱乾燥して芯層プリプ
レグを得た。
EXAMPLES Examples according to the present invention will be described in detail along with comparative examples and conventional examples. Examples 1 to 13, Comparative Examples 1 to 8 and Conventional Examples 80 parts by mass of bisphenol A type brominated epoxy resin ("YDB-400" manufactured by Toto Kasei), phenol novolak type epoxy resin ("YDPN-638" manufactured by Toto Kasei)
20 parts by mass, 3 parts by mass of dicyandiamide as a curing agent,
A varnish (A) was prepared by diluting 0.15 parts by mass of 2-ethyl-4-methylimidazole as a curing accelerator with methyl ethyl ketone. Further, a bisphenol A type epoxy resin which is liquid at room temperature ("Ep-82" manufactured by Yuka Shell Epoxy Co., Ltd.)
8 ") 66 parts by mass, tetrabromobisphenol A20
Parts by mass, 14 parts by mass of a phenol novolak resin ("TD-2093" manufactured by Dainippon Ink and Chemicals, Inc.) as a curing agent, 100 parts by mass of aluminum hydroxide, and 0.2 parts by mass of 2-ethyl-4-methylimidazole as a curing accelerator. Mix,
Varnish (B) was prepared. The varnish (A) Glass fiber woven fabric (Asahi Schwebel Ltd. "GC-7628", unit weight 210g / m 2) was impregnated with, to obtain a surface layer prepreg by heating and drying. Further, the varnish (B) was impregnated into a glass fiber nonwoven fabric (“EPM-4090” manufactured by Japan Vilene, unit mass 90 g / m 2 ) and dried by heating to obtain a core layer prepreg.

【0016】上記で準備した表面層プリプレグ、芯層プ
リプレグの特性は表1に示すとおりである。表中に示し
たゲル化時間と樹脂流れは以下に説明するように測定す
る。 ゲル化時間:表面層プリプレグを所定寸法に切断し揉み
ほぐして樹脂粉150mgを採取する。この樹脂粉をゲル
化試験機の熱板(表面温度160℃に設定)上でテフロ
ン(登録商標)棒を使用してストロークキュアさせる。
樹脂粉を熱板上に落とすと同時にストロークを開始しそ
の時点から、溶融した樹脂の粘度が急上昇しゲル化する
までの時間を測定する。 樹脂流れ:芯層プリプレグから、100mm角試験片2枚
を切り出す。この試験片2枚の質量を測定しておく(初
期質量)。前記2枚を重ねてその両面に離型性フィルム
を配置し、樹脂流れ測定用プレスで約10分間加熱加圧
を行なう。加熱加圧は、温度160℃、圧力5MPaの条
件とする。加熱加圧後に、試験片周囲に流れ出た樹脂を
除去し試験片の重量を測定する(最終質量)。樹脂流れ
を次式で求める。 樹脂流れ(%)=((初期質量−最終質量)/初期質量)
×100
The properties of the surface layer prepreg and the core layer prepreg prepared as described above are as shown in Table 1. The gel time and resin flow shown in the table are measured as described below. Gelation time: The surface layer prepreg is cut into a predetermined size, rubbed, and 150 mg of resin powder is collected. This resin powder is stroke-cured on a hot plate (set at a surface temperature of 160 ° C.) of a gelling tester using a Teflon (registered trademark) rod.
The stroke is started at the same time as the resin powder is dropped on the hot plate, and the time from the time when the viscosity of the molten resin rises sharply to gelation is measured. Resin flow: Two 100 mm square test pieces are cut out from the core layer prepreg. The mass of the two test pieces is measured (initial mass). The two sheets are stacked, and release films are arranged on both sides thereof, and heated and pressed by a resin flow measuring press for about 10 minutes. The heating and pressurizing are performed at a temperature of 160 ° C. and a pressure of 5 MPa. After heating and pressing, the resin flowing around the test piece is removed, and the weight of the test piece is measured (final mass). The resin flow is determined by the following equation. Resin flow (%) = ((initial mass-final mass) / initial mass)
× 100

【0017】[0017]

【表1】 [Table 1]

【0018】上記芯層プリプレグ2枚を重ねた両側に表
面層プリプレグを1枚ずつ重ね、さらに両面に銅箔(1
8μm厚)を載置し、これをプレス熱盤間に投入して所
定の条件により加熱加圧成形を行ない、板厚1.6mmの
コンポジット銅張り積層板を製造した。加熱加圧成形の
制御は、表2に示した成形条件1〜10より選択する。
第1次圧力から第2次圧力への昇圧時期は、成形中のプ
リプレグの温度で決定することとし、プレス熱盤の段内
中央に位置するプリプレグの温度が表2の各成形条件に
示す温度に達したときとする。表2に示した成形条件4
は、プリプレグの樹脂が溶融する前に、第1次圧力から
第2次圧力に昇圧する場合である。成形条件10は、プ
リプレグの樹脂が溶融を経て硬化した後に、第1次圧力
から第2次圧力に昇圧する場合である。
One surface layer prepreg is stacked on each side of the two core layer prepregs, and copper foil (1
(8 μm thick) was placed between the hot plates, and heated and pressed under predetermined conditions to produce a 1.6 mm-thick composite copper-clad laminate. The control of the heat and pressure molding is selected from the molding conditions 1 to 10 shown in Table 2.
The time for raising the pressure from the primary pressure to the secondary pressure is determined by the temperature of the prepreg during molding, and the temperature of the prepreg located in the center of the stage of the press hot platen is the temperature shown in each molding condition in Table 2. Is reached. Molding condition 4 shown in Table 2
Is the case where the pressure is increased from the primary pressure to the secondary pressure before the resin of the prepreg is melted. The molding condition 10 is a case where the pressure of the prepreg is increased from the primary pressure to the secondary pressure after the resin of the prepreg is cured through melting.

【0019】[0019]

【表2】 [Table 2]

【0020】各実施例、比較例、従来例は、プリプレグ
種類と成形条件の組合せを表3に示すとおりにして実施
した。
In each of the examples, comparative examples, and conventional examples, the combinations of prepreg types and molding conditions were performed as shown in Table 3.

【0021】表3には、各例で製造したコンポジット銅
張り積層板の特性評価結果を併せて示す。各特性の評価
方法は次のとおりである。 そり量:製造したコンポジット銅張り積層板から、34
0×250mmサイズ試験片を切り出す。試験片両面の銅
箔を塩化第二鉄水溶液でエッチングして全面除去する。
しかる後、150℃で30分間、平置きで気中加熱処理
を行なう。室温まで自然冷却した試験片を定盤上に平置
きし、試験片の四辺と四隅の定盤からの浮き上がり量を
隙間ゲージで測定しその最大値を求める。表3に示した
そり量は、試料数100について測定した前記最大値の
平均値である。 寸法変化率:製造したコンポジット銅張り積層板から、
340×250mmサイズ試験片を切り出す。試験片四隅
に各辺から10mm内側に入った箇所にφ1.0mmの穴を
開け、穴間距離を測定して常態の寸法(L1)とする。
次に、試験片両面の銅箔を塩化第二鉄水溶液でエッチン
グして全面除去する。しかる後、150℃で30分間、
平置きで気中加熱処理を行なう。室温まで自然冷却した
試験片の前記穴間寸法を測定して加熱処理後の寸法(L
2)とする。寸法変化率を次式で求める。表3に示した
寸法変化率は、試料数10についての平均値である。 寸法変化率(%)=((L1−L2)/L1)×100 エッチング後外観:製造したコンポジット銅張り積層板
から、340×250mmサイズ試験片を切り出す。試験
片両面の銅箔を塩化第二鉄水溶液でエッチングして全面
除去する。しかる後、積層板表面と切断面を観察する。 板厚較差:製造した1000×1000mmサイズのコ
ンポジット銅張り積層板の板厚を測定し、その最大値と
最小値の差を求めて板厚較差とする。表3に示した板厚
較差は、試料数10についての平均値である。
Table 3 also shows the results of evaluating the properties of the composite copper-clad laminates manufactured in the respective examples. The evaluation method of each characteristic is as follows. Warpage: 34 from the composite copper clad laminate
Cut out a 0 × 250 mm size test piece. The copper foil on both surfaces of the test piece is etched with a ferric chloride aqueous solution to remove the entire surface.
Thereafter, an air heating treatment is performed at 150 ° C. for 30 minutes in a flat place. The test piece naturally cooled to room temperature is placed flat on a surface plate, and the lifting amount of the test piece at the four sides and four corners from the surface plate is measured with a gap gauge to determine the maximum value. The warpage amounts shown in Table 3 are average values of the maximum values measured for 100 samples. Dimensional change rate: From the manufactured composite copper-clad laminate,
A 340 × 250 mm size test piece is cut out. A hole having a diameter of 1.0 mm is formed in each of the four corners of the test piece at a position 10 mm inside from each side, and a distance between the holes is measured to obtain a normal dimension (L1).
Next, the copper foil on both surfaces of the test piece is etched with a ferric chloride aqueous solution to remove the entire surface. Then, at 150 ° C for 30 minutes,
Aerial heat treatment is performed on a flat surface. The dimension between the holes of the test piece naturally cooled to room temperature was measured, and the dimension after heat treatment (L
2). The dimensional change is calculated by the following equation. The dimensional change rates shown in Table 3 are average values for 10 samples. Dimensional change rate (%) = ((L1−L2) / L1) × 100 Appearance after etching: A 340 × 250 mm size test piece is cut out from the manufactured composite copper-clad laminate. The copper foil on both surfaces of the test piece is etched with a ferric chloride aqueous solution to remove the entire surface. Thereafter, the laminate surface and the cut surface are observed. Thickness difference: The thickness of the manufactured composite copper-clad laminate having a size of 1000 × 1000 mm is measured, and the difference between the maximum value and the minimum value is determined as the thickness difference. The thickness difference shown in Table 3 is an average value for 10 samples.

【0022】[0022]

【表3】 [Table 3]

【0023】比較例1は、表面層プリプレグの樹脂含有
量が少なすぎる場合を示しており、比較例2は、逆に表
面層プリプレグの樹脂含有量が多すぎる場合を示してい
る。比較例3は、芯層プリプレグの樹脂流れが少なすぎ
る場合を示しており、比較例4は、逆に芯層プリプレグ
の樹脂流れが多すぎる場合を示している。比較例5は、
プリプレグ樹脂が溶融する前に第1次圧力から第2次圧
力へ昇圧する場合(昇圧時期が早すぎる)を示してお
り、比較例6は、プリプレグ樹脂が溶融を経て硬化した
後に第1次圧力から第2次圧力へ昇圧する場合(昇圧時
期が遅すぎる)を示している。比較例7は第1次圧力が
小さすぎる場合を、比較例8は第1次圧力と第2次圧力
が大きすぎる場合を、比較例9は冷却時圧力が大きすぎ
る場合をそれぞれ示している。
Comparative Example 1 shows a case where the resin content of the surface layer prepreg is too small, and Comparative Example 2 shows a case where the resin content of the surface layer prepreg is too large. Comparative Example 3 shows a case where the resin flow of the core layer prepreg is too small, and Comparative Example 4 shows a case where the resin flow of the core layer prepreg is too large. Comparative Example 5
The case where the pressure is increased from the primary pressure to the secondary pressure before the prepreg resin is melted (the pressure increase timing is too early) is shown. In Comparative Example 6, the primary pressure is increased after the prepreg resin is cured through melting. From the pressure to the secondary pressure (the pressure rising timing is too late). Comparative Example 7 shows a case where the primary pressure is too small, Comparative Example 8 shows a case where the primary pressure and the secondary pressure are too large, and Comparative Example 9 shows a case where the cooling pressure is too large.

【0024】[0024]

【発明の効果】表3から明らかなように、本発明に係る
方法により製造したコンポジット積層板は、そり・ねじ
れが抑制され、寸法安定性も良い。そして、基材切れ、
かすれ、ボイドの発生等の不具合もなく、板厚精度も良
好である。このようなコンポジット積層板をプリント配
線板の製造に供することにより、そり・ねじれの発生と
寸法安定性が十分でないことが原因で問題となっていた
プリント配線板加工工程でのトラブルが減少し、大幅な
歩留まり向上とコスト低減が可能となる。
As is clear from Table 3, the composite laminate manufactured by the method according to the present invention has reduced warpage and twist and good dimensional stability. And the base material runs out,
There are no defects such as blurring and voids, and the thickness accuracy is good. By providing such a composite laminate for the manufacture of printed wiring boards, troubles in the printed wiring board processing process, which had been a problem due to the occurrence of warpage and torsion and insufficient dimensional stability, were reduced, The yield and cost can be greatly improved.

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08J 5/24 CFC C08J 5/24 CFC H05K 3/00 H05K 3/00 R // H05K 3/46 H05K 3/46 G B29K 63:00 B29K 63:00 105:08 105:08 105:16 105:16 B29L 9:00 B29L 9:00 C08L 63:00 C08L 63:00 Fターム(参考) 4F072 AA04 AA05 AA07 AA09 AB09 AB28 AD23 AD27 AD28 AE02 AE06 AF03 AF27 AG03 AH02 AH25 AJ04 AK05 AK14 AL09 AL12 4F100 AA01B AG00A AG00B AG00C AK53A AK53B AK53C BA03 BA06 BA10A BA10C CA23B DG12A DG12C DG15B DH01A DH01B DH01C EJ42A EJ42B EJ42C EJ82A EJ82B EJ82C EJ86A EJ86B EJ86C GB43 JL04 4F204 AA39 AB11 AD16 AG03 AR03 AR06 AR11 FB01 FG09 FN15 5E346 AA02 AA12 AA51 CC01 CC09 DD02 EE01 EE09 EE13 EE18 GG28 HH11 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) C08J 5/24 CFC C08J 5/24 CFC H05K 3/00 H05K 3/00 R // H05K 3/46 H05K 3/46 G B29K 63:00 B29K 63:00 105: 08 105: 08 105: 16 105: 16 B29L 9:00 B29L 9:00 C08L 63:00 C08L 63:00 F term (reference) 4F072 AA04 AA05 AA07 AA09 AB09 AB28 AD23 AD27 AD28 AE02 AE06 AF03 AF27 AG03 AH02 AH25 AJ04 AK05 AK14 AL09 AL12 4F100 AA01B AG00A AG00B AG00C AK53A AK53B AK53C BA03 BA06 BA10A BA10C CA23B DG12A DG12C DG15B DH01A DH01B DH01C EJ42A EJ42B EJ42C EJ82A EJ82B EJ82C EJ86A EJ86B EJ86C GB43 JL04 4F204 AA39 AB11 AD16 AG03 AR03 AR06 AR11 FB01 FG09 FN15 5E346 AA02 AA12 AA51 CC01 CC09 DD02 EE01 EE09 EE13 EE18 GG28 HH11

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】エポキシ樹脂をガラス繊維織布に含浸し加
熱乾燥したプリプレグを表面層とし、無機充填材配合エ
ポキシ樹脂をガラス繊維不織布に含浸し加熱乾燥したプ
リプレグを前記表面層の芯層とし、これらをプレス熱盤
間で加熱加圧成形するコンポジット積層板の製造におい
て、 表面層プリプレグは、樹脂含有量を40〜50質量%と
し、樹脂硬化度の調整を、160℃ストロークキュアに
おけるゲル化時間が90〜150秒となるように行な
い、 芯層プリプレグは、樹脂(配合した無機充填材を含む)
含有量を87〜93質量%とし、樹脂硬化度の調整を、
100mm角の当該プリプレグを160℃,5MPaの条件
で加熱加圧成形したときの樹脂流れが15〜40%とな
るように行ない、 上記表面層プリプレグと芯層プリプレグの加熱加圧成形
は、加熱時の圧力を2〜4MPaの第1次圧力から5〜1
0MPaの第2次圧力へ上げる制御と、加熱加圧成形後の
冷却時の圧力を前記第2次圧力から0〜1MPaへ下げる
制御を行ない、 上記第1次圧力から第2次圧力へ上げる制御を、プリプ
レグの樹脂が溶融状態を経て硬化開始に至る段階に行な
うことを特徴とするコンポジット積層板の製造法。
1. A prepreg impregnated with an epoxy resin in a glass fiber woven fabric and heated and dried as a surface layer, and a prepreg impregnated with an epoxy resin containing an inorganic filler in a glass fiber nonwoven fabric and heated and dried as a core layer of the surface layer, In the production of a composite laminate in which these are heated and pressed between press hot plates, the surface layer prepreg has a resin content of 40 to 50% by mass, and the degree of resin curing is adjusted by a gelation time at 160 ° C. stroke cure. The core layer prepreg is made of a resin (including a blended inorganic filler).
The content is set to 87 to 93% by mass, and the adjustment of the resin curing degree is performed.
The 100 mm square prepreg is heated and pressed at 160 ° C. and 5 MPa so that the resin flow is 15 to 40%. The heat and pressure forming of the surface layer prepreg and the core layer prepreg is performed during heating. From a primary pressure of 2-4 MPa to 5-1
Control to increase the secondary pressure to 0 MPa and control to reduce the pressure at the time of cooling after heating and pressing from the secondary pressure to 0 to 1 MPa, and control to increase the primary pressure to the secondary pressure At a stage where the resin of the prepreg passes through a molten state and starts to cure.
【請求項2】第1次圧力から第2次圧力へ上げる制御
を、プレス熱盤中央のプリプレグ温度が100〜140
℃にあるときに行なうことを特徴とする請求項1記載の
コンポジット積層板の製造法。
2. The control for increasing the primary pressure to the secondary pressure by adjusting the prepreg temperature at the center of the press hot platen to 100-140.
The method for producing a composite laminate according to claim 1, wherein the method is carried out when the temperature is at ° C.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124312A (en) * 2006-11-14 2008-05-29 Hitachi Chem Co Ltd Manufacturing methods of double-sided substrate, and multilayer substrate
WO2014088099A1 (en) * 2012-12-06 2014-06-12 三菱瓦斯化学株式会社 Method for producing metal-foil-clad laminate
CN112969288A (en) * 2021-02-03 2021-06-15 湖南好易佳电路板有限公司 Improved method for glue overflow of laminated circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124312A (en) * 2006-11-14 2008-05-29 Hitachi Chem Co Ltd Manufacturing methods of double-sided substrate, and multilayer substrate
WO2014088099A1 (en) * 2012-12-06 2014-06-12 三菱瓦斯化学株式会社 Method for producing metal-foil-clad laminate
JPWO2014088099A1 (en) * 2012-12-06 2017-01-05 三菱瓦斯化学株式会社 Method for producing metal foil-clad laminate
CN112969288A (en) * 2021-02-03 2021-06-15 湖南好易佳电路板有限公司 Improved method for glue overflow of laminated circuit board

Also Published As

Publication number Publication date
JP3951601B2 (en) 2007-08-01

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