JP2002184931A - Composite module component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite module component to be used in a high-frequency power amplifier, etc., especially to efficiently dissipate heat from a bare chip mounted on the module. SOLUTION: A heat sink is mounted on the back face of a bare chip via an electroconductive resin. Heat is dissipated from a motherboard by implementing a module on the motherboard.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite module component used for a high-frequency power amplifier or the like.

[0002]

2. Description of the Related Art FIG. 8 shows the structure of a conventional composite module component. (A) is a sectional view, and (b) is an exploded perspective view of each layer. In FIG. 8, reference numeral 801 denotes a dielectric layer, on which mounting components 802 such as inductors, capacitors, and resistors are mounted, and a bare chip 803 is flip-chip mounted. An adhesive is applied to the upper surface of the bare chip 803 by potting or the like, and
04 is connected. Various end face electrodes are provided on the side surface of the dielectric layer 801, the first end face electrode 806 is grounded, and the second end face electrode is formed as a signal input / output terminal. The metal case 805 is a metal case provided so as to shield the entire dielectric layer 801, and the protrusion 805 a is grounded to the first end face electrode 806.

[0003] With the above configuration, heat generated in the bare chip 803 is radiated to the radiator 804.

[0004]

However, the composite module component having the above-mentioned structure has a problem in that the shape is increased by the radiator 804.

Accordingly, an object of the present invention is to reduce the size of a composite module component by eliminating the radiator 804 in heat radiation of a bare chip mounted on a flip chip.

[0006]

According to the present invention, a bare chip is buried in a space provided in a dielectric layer, and the heat generated from the bare chip when the composite module component is mounted on the motherboard is efficiently radiated to the motherboard. This makes it possible to reduce the size of the composite module component by eliminating the radiator 804.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to a first aspect of the present invention is directed to a laminated substrate comprising at least a first dielectric layer and a second dielectric layer, and mounted on a surface of the second dielectric layer. And a first component mounted on the back surface of the second dielectric layer.
A bare chip buried in the space of the dielectric layer, a heat sink connected to the back surface of the bare chip via a conductive resin and provided so as to be in contact with the bottom surface of the first dielectric layer, An end face electrode provided on a side surface of the laminated board, and a metal case provided so as to cover the mounted component, when mounted on a motherboard, heat generated by the bare chip is transmitted through the heat sink. Thus, heat is easily dissipated by being radiated to the motherboard, and the radiator is eliminated to enable downsizing of the composite module component.

According to a second aspect of the present invention, there is provided a laminated substrate comprising at least first to third dielectric layers, a mounting component mounted on a surface of the third dielectric layer, 3
A bare chip mounted on the back surface of the dielectric layer and having a conductive resin layer formed on the back surface and embedded in the space of the second dielectric layer; and a first dielectric layer directly under the conductive resin layer and the conductive resin layer. A GND electrode provided on a bottom surface of the first dielectric layer so as to be connected via a thermal via provided on a body layer, an end face electrode provided on a side surface of the laminated substrate,
A metal case provided so as to cover the mounting components, and when mounted on a motherboard, heat generated by the bare chip is radiated to the motherboard via the radiator plate to facilitate heat radiation. By eliminating the radiator, the size of the composite module component can be reduced.

According to a third aspect of the present invention, there is provided a laminated substrate comprising at least a first dielectric layer and a second dielectric layer, wherein the laminated substrate is mounted on a surface of the first dielectric layer, and A mounting component embedded in a second dielectric layer;
A bare chip which is mounted on the back surface of the dielectric layer and has a conductive resin layer and a thermal via formed and embedded on the back surface in the second dielectric layer, and via the conductive resin layer and the thermal via A GND electrode that is connected and provided so as to cover the entire top surface of the second dielectric layer;
An end face electrode provided on a side surface of the laminated substrate, wherein heat generated in the bare chip is radiated to the entire laminated substrate and the GND electrode via the thermal via to facilitate heat radiation, The radiator can be eliminated to reduce the size of the composite module component.

According to a fourth aspect of the present invention, there is provided a laminated substrate including at least a first dielectric layer and a second dielectric layer, wherein the laminated substrate is mounted on a surface of the first dielectric layer, and A mounting component embedded in a second dielectric layer;
A bare chip mounted on the front surface of the dielectric layer via the conductive resin layer and embedded in the second dielectric layer, the conductive resin layer and the first dielectric layer immediately below the bare chip. A GND electrode connected via a thermal via provided on the back surface of the first dielectric layer,
An end surface electrode provided on a side surface of the laminated substrate, and when mounted on a motherboard, heat generated in the bare chip is radiated to the entire laminated substrate and the motherboard via the GND electrode. This facilitates heat dissipation, and allows the miniaturization of the composite module component by eliminating the heat sink.

According to a fifth aspect of the present invention, there is provided a laminated substrate comprising at least a first dielectric layer and a second dielectric layer, and a mounting component mounted on a surface of the second dielectric layer. A bare chip mounted on the surface of the first dielectric layer and having a conductive resin layer formed on the back surface thereof and embedded in a space of the second dielectric layer; and A GND electrode provided on the bottom surface of the first dielectric layer so as to be connected via a thermal via provided on the first dielectric layer immediately below the first dielectric layer, and a GND electrode provided on a side surface of the laminated substrate. An end face electrode; and a metal case provided so as to cover the mounted component, wherein the first dielectric layer is a sintered substrate and heat generated by the bare chip when mounted on a motherboard. Is connected to the entire laminated substrate via the GND electrode. To facilitate heat dissipation by being radiated to the serial motherboard, remove the radiator to allow the size of the composite module component.

According to a sixth aspect of the present invention, there is provided a laminated substrate comprising at least first to third dielectric layers, a mounting component mounted on a surface of the third dielectric layer, 1
A bare chip, which is mounted on the surface of the dielectric layer and has a conductive resin layer formed on the back surface and is embedded in the space of the second dielectric layer, and a first chip directly under the conductive resin layer and G provided on the bottom surface of the first dielectric layer so as to be connected via a thermal via provided on the dielectric layer of
An ND electrode, an end face electrode provided on a side surface of the laminated substrate, and a metal case provided so as to cover the mounted component, wherein the first dielectric layer is a sintered substrate and a motherboard When mounted on the composite module, heat generated in the bare chip is radiated to the entire laminated substrate and to the motherboard through the GND electrode, thereby facilitating heat radiation, and removing the radiator to remove the heat sink. Enables downsizing of parts.

[0013] According to a seventh aspect of the present invention, a space portion larger than the space portion of the second dielectric layer is provided in the third dielectric layer, and the second and the second are covered so as to cover the bare chip. 7. The resin according to claim 6, wherein the space portion of the dielectric layer is filled with resin.
The composite module component according to any one of the preceding claims, wherein the mounting range of the mounting component mounted on the surface of the third dielectric layer can be further expanded, and the size can be reduced.

According to an eighth aspect of the present invention, there is provided a laminated substrate comprising at least a first dielectric layer and a second dielectric layer, and a mounting component mounted on a surface of the second dielectric layer. And a bare chip mounted on the back surface of the second dielectric layer and embedded with the conductive resin layer and the thermal via formed in the first dielectric layer, and the conductive resin layer and the thermal via. And a GND electrode provided on the bottom surface of the first dielectric layer and an end surface electrode provided on a side surface of the laminated substrate. The generated heat is radiated to the mother board and the entire laminated substrate through the thermal via and the GND electrode, thereby facilitating heat radiation, and eliminating the radiator to reduce the size of the composite module component. That.

(Embodiment 1) FIG. 1 shows a composite module component according to Embodiment 1 of the present invention, and particularly shows a high-frequency power amplifier as an example. (A) is a sectional view, (b)
FIG. 3 is an exploded perspective view of each layer. In FIG. 1, 112
Is a laminated substrate formed of a first dielectric layer 105 and a second dielectric layer 106, and a first dielectric layer 1
05 is provided with a space portion 104. A mounting component 107 such as an inductor or a capacitor resistor is mounted on the surface of the second dielectric layer 106, and the space 1
The bare chip 103 is flip-chip mounted via the chip 04.

Although not shown, a wiring pattern and electrodes are formed on the surface of the first dielectric layer 105 to constitute a part of the circuit. Further, in the present embodiment, the laminated substrate is composed of the first dielectric layer 105 and the second dielectric layer 106.
Although it is a layer, the first dielectric layer 105 may be formed in a plurality of layers to have a space 104 on the lowermost surface.

A conductive resin 102 containing Ag as a main component is formed on the back surface of the bare chip 103 by printing or potting, and a heat radiating plate 101 made of a metal plate or a conductive resin is formed via the conductive resin 102. It is formed so as to be connected to the bottom surface of one dielectric layer 105. Here, by adjusting the amount of the conductive resin 102,
The connection with the heat radiating plate 101 can be made more reliable.

Various types of end electrodes are provided on the side surfaces of the laminated substrate 112, and GND electrodes 110 are provided on the bottom surface of the laminated substrate 112. The first end face electrode 109 is G
While being connected to the ND electrode 110, the second end face electrode 111 is formed as a signal input / output terminal. 10
Reference numeral 8 denotes a metal case provided so as to shield the entire laminated substrate 112, and the protrusion 108 a is provided so as to be connected to the first end face electrode 109.

When the high-frequency power amplifier as shown in FIG. 1 is mounted on a motherboard (not shown) according to the above configuration, the heat generated in the bare chip 103 is efficiently transferred to the motherboard via the conductive resin 102 and the heat radiation plate 101. Since heat can be dissipated, the thermal stress of the bare chip 103 can be significantly reduced. Further, heat generated in the bare chip 103 can be radiated to the metal case via the conductive resin 102, the GND electrode 110, and the end face electrode 109, so that the thermal stress of the bare chip 103 can be further reduced.

(Embodiment 2) FIG. 2 shows a composite module component according to Embodiment 2 and particularly shows a high-frequency power amplifier as an example. (A) is a sectional view, and (b) is a structural view in which each layer is disassembled. In FIG. 2, reference numeral 201 denotes a laminated substrate, which includes a first dielectric layer 212 and a second dielectric layer 20.
5 and a third dielectric layer 206, a first dielectric layer 212 is provided with a thermal via 213 filled with an Ag paste, and a second dielectric layer 205 is formed.
Is provided with a space portion 204. Third dielectric layer 2
06, a mounting component 207 such as an inductor, a capacitor, or a resistor is mounted on the surface of the third dielectric layer 20.
6 includes a space portion 204 provided in the second dielectric layer 205.
, A bare chip 203 is flip-chip mounted.

Although not shown, wiring patterns and electrodes are formed on the surfaces of the first dielectric layer 212 and the second dielectric layer 205 to constitute a part of the circuit. In the present embodiment, the laminated substrate is formed of the first dielectric layer 212 and the second dielectric layer 212.
However, the second dielectric layer 205 may be formed in a plurality of layers and the space 204 may be formed on the lowermost surface.

A conductive resin 202 containing Ag as a main component is formed on the back surface of the bare chip 203 by printing or potting.
Is formed so as to be connected to the thermal via 213 formed in the dielectric layer 212 of FIG. Here, by adjusting the amount of the conductive resin 202, the connection with the thermal via 213 can be made more reliable.

Various end electrodes are provided on the side surface of the laminated substrate 201, and the GND electrode 21 formed to be connected to the thermal via 213 is provided on the bottom surface of the laminated substrate 201.
0 is provided. The first end face electrode 209 is connected to the GND electrode 210 and the second end face electrode 211
Are formed as signal input / output. Metal case 20
Reference numeral 8 denotes a metal case provided so as to shield the entire laminated substrate 201, and a projection 208a thereof is connected to the first end face electrode 209 and grounded.

When the high-frequency power amplifier as shown in FIG. 2 is mounted on a motherboard (not shown) according to the above configuration, heat generated in the bare chip 203 is efficiently transferred to the motherboard via the conductive resin 202 and the thermal via 213. Since heat can be dissipated, the thermal stress of the bare chip 203 can be significantly reduced. In addition, bare chip 2
03 is generated by the conductive resin 202 and the thermal via 2
Since the heat is radiated to the laminated substrate 201 through the substrate 13, the thermal stress of the motherboard can be reduced. Further, the bare chip 203 is made of a conductive resin 202 and a GND electrode 210.
In addition, since heat can be dissipated to the metal case via the end face electrode 209, the thermal stress of the bare chip 203 can be further reduced.

(Embodiment 3) FIG. 3 shows a composite module part according to Embodiment 3 of the present invention, and particularly shows a high-frequency power amplifier as an example. (A) is a sectional view, (b)
FIG. 3 is an exploded perspective view of each layer. In FIG. 3, 306
Is a laminated substrate, which is formed of a first dielectric layer 301 and a second dielectric layer 305. A wiring pattern 302 constituting a part of the circuit is formed on the first dielectric layer, mounting parts 303 such as inductors, capacitors, and resistors are mounted, and a bare chip 304 is flip-chip mounted. . On the upper surface of the second dielectric layer 305 made of a composite sheet, a GND electrode 309 provided so as to cover the entire second dielectric layer 305 is formed, and the back surface of the bare chip 304 and the GND electrode 309 are electrically conductive. A thermal via 310 filled with a paste having a high thermal conductivity such as an Ag paste is formed so as to be connected via the conductive resin 311.

In the present embodiment, the laminated substrate 306 has two layers, the first dielectric layer 301 and the second dielectric layer 305. However, the first dielectric layer 301 is formed in a plurality of layers. The bare chip 304 may be mounted on the upper surface. Second
Since the dielectric layer 305 is soft, the first dielectric layer 3
When the laminated substrate 306 is formed by pressure bonding to the first component 01, the unevenness of the mounted component 303 and the bare chip 304 on the first dielectric layer 301 is absorbed, and the mounted component 303 and the bare chip 304 are absorbed.
And adhere to. The first end face electrode 307 is the GND electrode 30
9 and grounded, and the second end face electrode 3
08 is formed as a signal input / output terminal.

With the above configuration, the heat generated in the bare chip 304 can be efficiently radiated to the GND electrode 309 through the conductive resin 311 and the thermal via 310, so that the thermal stress of the bare chip 304 can be reduced. Further, the second dielectric layer 305 is a soft composite sheet, and is in close contact with the upper surface and the side surface of the bare chip 304 when the laminated substrate 306 is formed by pressing.
The heat generated by the bare chip 304 can be efficiently radiated to the laminated substrate 306. Further, according to this configuration, since the mounting component 303 and the bare chip 304 are built in the laminated substrate 306, the upper surface of the laminated substrate 306 becomes flat. Therefore, the metal case 805 as shown in FIG. 8 becomes unnecessary, and the cost can be reduced.

(Embodiment 4) FIG. 4 shows a composite module component according to Embodiment 4 of the present invention, and particularly shows a high-frequency power amplifier as an example. (A) is a sectional view, (b)
FIG. 3 is an exploded perspective view of each layer. In FIG.
Is a laminated substrate, which is formed from a first dielectric layer 401 and a second dielectric layer 405. A mounting component 403 such as an inductor, a capacitor, or a resistor is mounted on the first dielectric layer, and the bare chip 404 is formed of a conductive resin 411.
And the first dielectric layer 40 with the wire 413
1, the entire bare chip 404 and the wire 413 are protected by a chip coat 410 applied by potting.

Further, the lower surface of the first dielectric layer 401 is connected to the back surface of the bare chip 404 via a conductive resin 411 and a thermal via 402 filled with a paste having a high thermal conductivity such as Ag paste. Second GND electrode 4
12 are provided. On the upper surface of the second dielectric layer 405 made of a composite sheet, a first GND electrode 409 provided so as to cover the whole of the second dielectric layer 405 is formed.

In the present embodiment, the laminated substrate 406 has two layers, the first dielectric layer 401 and the second dielectric layer 405, but the first dielectric layer 401 is formed in a plurality of layers. The bare chip 404 may be mounted on the upper surface. Second
Since the dielectric layer 405 is soft, the first dielectric layer 4
When the laminated substrate 406 is formed by press-bonding to the first conductive layer 411, the unevenness of the mounting component 403 and the bare chip 404 on the first dielectric layer 401 is absorbed, and the mounting component 403 and the conductive resin 411 are absorbed.
And closely adhere to the bare chip 404. The first end face electrode 407 is connected to the first GND electrode 409 and grounded, and the second end face electrode 408 is formed as a signal input / output terminal.

When the high-frequency power amplifier as shown in FIG. 4 is mounted on a motherboard (not shown) by the above configuration, the heat generated in the bare chip 404 is efficiently transmitted through the conductive resin 411 and the second GND electrode 412. Since heat can be well radiated to the motherboard, the thermal stress of the bare chip 404 can be significantly reduced. In addition, the first dielectric layer 401 is a soft composite sheet, and adheres to the entire conductive resin 411 when the laminated substrate 406 is formed by pressing, so that the heat generated by the bare chip 404 is applied to the conductive resin 411. The heat can be efficiently radiated to the laminated substrate 406 through the intermediary. Furthermore, according to this configuration, the mounting component 4
03 and the bare chip 404 are built in the laminated substrate 406, so that the upper surface of the laminated substrate 406 becomes flat. Therefore, the metal case 805 as shown in FIG. 8 becomes unnecessary, and the cost can be reduced.

(Fifth Embodiment) FIG. 5 shows a composite module component according to a fifth embodiment, and particularly shows a high-frequency power amplifier as an example. (A) is a sectional view, and (b) is an exploded perspective view of each layer. In FIG. 5, reference numeral 501 denotes a laminated substrate, which is formed of a first dielectric layer 502 which is a sintered substrate and a second dielectric layer 503 made of a green sheet, and the first dielectric layer 502 has through holes. A
The thermal via 505 filled with the g paste is formed,
A space 508 is provided in the second dielectric layer 503.

A mounting component 509 such as an inductor, a capacitor, or a resistor is mounted on the second dielectric layer 503, and a bare chip 507 is provided on the first dielectric layer 502 with a thermal via via a conductive resin 506. It is mounted so as to be embedded in the space 508 so as to be connected to 505, and is connected to an electrode (not shown) formed on the second dielectric layer 503 using a wire 514. The entire bare chip 507 and the wire 514 are protected by a chip coat 513 applied by potting.

Although not shown, a wiring pattern and electrodes are formed on the first dielectric layer 502 to form a part of a circuit. Various end electrodes are provided on the side surface of the laminated substrate 501, and the GND electrode 5 formed to be connected to the thermal via 505 is provided on the bottom surface of the laminated substrate 501.
04 is provided. The first end face electrode 510 is GND
The second end face electrode 51 is connected to the electrode 504.
1 is formed as a signal input / output terminal. The metal case 512 is provided so as to shield the entire laminated substrate 501, and the protruding portion 512a is connected to the first end face electrode 510 and grounded.

When the high-frequency power amplifier as shown in FIG. 5 is mounted on a motherboard (not shown) according to the above configuration, heat generated in bare chip 507 is efficiently transmitted through conductive resin 506 and thermal via 505 to the motherboard. Since heat can be radiated to the laminated substrate, the bare chip 5
07 can be greatly reduced. Further, since the bare chip 507 can radiate heat to the metal case via the conductive resin 506, the GND electrode 504, and the end face electrode 510, the thermal stress of the bare chip 507 can be further reduced. Also, the first dielectric layer 5
By using a substrate having high thermal conductivity such as alumina for 02, the thermal stress of the bare chip 507 can be further reduced. Further, since the first dielectric layer 502 is a sintered substrate, when the first dielectric layer 502 and the second dielectric layer 503 are stacked, the first dielectric layer 502 has a bare chip 507 mounting portion. The flatness is not lost, and the bare chip 507 is not broken when the bare chip 507 is mounted.

(Embodiment 6) FIG. 6 shows a composite module component according to Embodiment 5 of the present invention, and particularly shows a high-frequency power amplifier as an example. (A) is a sectional view, and (b) is an exploded perspective view of each layer. In FIG. 6, reference numeral 601 denotes a laminated substrate, which is formed of a first dielectric layer 602, which is a sintered substrate, a second dielectric layer 603 and a third dielectric layer 615 made of a green sheet. In the first dielectric layer 602, a thermal via 605 in which an Ag paste is filled in a through hole is formed, and a second dielectric layer 603 is formed.
Is provided with a space 608, and the third dielectric layer 615 is provided with a second space 608 larger than the first space 608.
a is provided.

A mounting component 609 such as an inductor, a capacitor or a resistor is mounted on the third dielectric layer 615, and a bare chip 607 is mounted on the first dielectric layer 602 via a conductive resin 606 via a thermal via. The first space 608 and the second space 608 a are mounted so as to be buried so as to be connected to the second space 605, and the wires 614 are used for electrodes (not shown) formed on the second dielectric layer 603. Connected. First space 608 and second space 608a
Is coated with a chip coat 613 so as to cover the bare chip 607.
Is filled.

Although not shown, wiring patterns and electrodes are formed on the first dielectric layer 602 and the second dielectric layer 603 to constitute a part of the circuit. Laminated substrate 6
01 are provided with various end surface electrodes, and a GND electrode 604 formed to be connected to the thermal via 605 is provided on the bottom surface of the laminated substrate 601. The first end face electrode 610 is connected to the GND electrode 604, and the second end face electrode 611 is formed as a signal input / output terminal. The metal case 612 is a laminated substrate 601
The projection 612a is provided so as to shield the whole, and is connected to the first end face electrode 610 and grounded.

With the above configuration, the high-frequency power amplifier as shown in FIG. 6 is replaced by the high-frequency power amplifier on the motherboard (not shown).
When mounted on the motherboard, the heat generated in the bare chip 607 can be efficiently radiated to the mother board and the laminated substrate 601 through the conductive resin 606 and the thermal via 605, so that the thermal stress of the bare chip 607 can be significantly reduced. Can be done. Further, since the bare chip 607 can radiate heat to the metal case via the conductive resin 606, the GND electrode 604, and the end face electrode 610, the thermal stress of the bare chip 607 can be further reduced.
Further, by using a substrate having high thermal conductivity such as alumina for the first dielectric layer 602, the bare chip 607 can be further improved.
Thermal stress can be reduced.

Further, since the first dielectric layer 602 is a sintered substrate, the first dielectric layer 602 and the second dielectric layer 6
03 and the third dielectric layer 615 are stacked, the flatness of the bare chip 607 mounting portion of the first dielectric layer 602 is not lost, and the bare chip 607 is not broken when the bare chip 607 is mounted. . Further, the electrode on the second dielectric layer 603 and the bare chip 607 are connected to the wire 6.
14 and a third dielectric layer 615 having a second space 608 a larger than the first space 608 is laminated, so that the entire bare chip 607 and the wire 614 are formed.
When the chip coat 613 is filled so as to cover the third dielectric layer 615, the chip coat 613 does not spread on the upper surface of the third dielectric layer 615.
Can be further expanded, and downsizing can be achieved.

(Embodiment 7) FIG. 7 shows a composite module component according to Embodiment 7 of the present invention, and particularly shows a high-frequency power amplifier as an example. (A) is a sectional view, (b)
FIG. 3 is an exploded perspective view of each layer. In FIG.
Is a laminated substrate, which is formed from a first dielectric layer 705 and a second dielectric layer 706. A mounting component 707 such as an inductor, a capacitor, or a resistor is mounted on the first dielectric layer, and a bare chip 703 is flip-chip mounted on the back surface. A GND electrode 710 is formed on the first dielectric layer 705 made of a composite sheet, and a heat conductive material such as an Ag paste is connected so that the back surface of the bare chip 703 and the GND electrode 710 are connected via the conductive resin 702. Thermal via 7 filled with high-concentration paste
04 is formed.

In the present embodiment, the laminated substrate 701 has two layers, the first dielectric layer 705 and the second dielectric layer 706, but the first dielectric layer 705 is formed in a plurality of layers. A configuration in which the bare chip 703 is mounted on the lower surface may be adopted. Second
Since the dielectric layer 706 is soft, the first dielectric layer 7
When the laminated substrate 701 is formed by pressure bonding to the substrate chip 05, the unevenness due to the bare chip 703 on the bottom surface of the first dielectric layer 705 is absorbed and adheres to the bare chip 703. First end face electrode 7
09 is connected to the GND electrode 710 and grounded, and the second end face electrode 711 is formed as a signal input / output terminal.

With the above configuration, when a high-frequency power amplifier as shown in FIG. 8 is mounted on a motherboard (not shown),
The heat generated in the bare chip 703 can be efficiently radiated to the motherboard and the laminated substrate 701 through the conductive resin 702 and the GND electrode 710 through the thermal via 704, so that the thermal stress of the bare chip 703 can be reduced. In addition, the first dielectric layer 705 is a soft composite sheet, and is in close contact with the bottom surface and side surfaces of the bare chip 703 when pressed to form the laminated substrate 701. Heat can be dissipated efficiently.

[0044]

As described above, according to the present invention, a bare chip is buried in a space provided in a dielectric layer or in a dielectric layer, and heat generated from the bare chip when a composite module component is mounted on a motherboard. By efficiently dissipating the heat to the motherboard, the radiator can be eliminated and the size of the composite module component can be reduced.

[Brief description of the drawings]

FIG. 1A is a sectional view of a composite module component according to a first embodiment of the present invention. FIG.

FIG. 2A is a cross-sectional view of a composite module component according to a second embodiment of the present invention. FIG.

FIG. 3A is a sectional view of a composite module component according to a third embodiment of the present invention.

FIG. 4A is a sectional view of a composite module component according to a fourth embodiment of the present invention. FIG.

5A is a sectional view of a composite module component according to a fifth embodiment of the present invention, and FIG.

6A is a sectional view of a composite module component according to a sixth embodiment of the present invention. FIG. 6B is an exploded perspective view of the same.

7A is a sectional view of a composite module component according to a seventh embodiment of the present invention. FIG.

FIG. 8A is a sectional view of a conventional composite module part, and FIG.

[Explanation of symbols]

 Reference Signs List 101 heat sink 102 conductive resin 103 bare chip 104 space 105 first dielectric layer 106 second dielectric layer 107 mounted component 108 metal case 108a protrusion 109 first end face electrode 110 GND electrode 111 second end face electrode 112 laminated substrate

Claims (8)

[Claims] 1. A laminated substrate comprising at least a first dielectric layer and a second dielectric layer, a component mounted on a surface of the second dielectric layer, and a A bare chip mounted on the back surface and buried in the space of the first dielectric layer, provided so as to be connected to the back surface of the bare chip via a conductive resin and to be in contact with the bottom surface of the first dielectric layer; A heat sink, an end face electrode provided on the side surface of the laminated substrate, and a metal case provided so as to cover the mounted component, when mounted on a motherboard,
A composite module component, wherein heat generated in the bare chip is radiated to the motherboard via the radiator plate. 2. A laminated substrate comprising at least first to third dielectric layers, a component mounted on a surface of the third dielectric layer, and a component mounted on a back surface of the third dielectric layer A bare chip in which a conductive resin layer is formed on the back surface and buried in the space of the second dielectric layer, and a thermal via provided in the conductive resin layer and the first dielectric layer immediately below the bare chip. A GND electrode provided on the bottom surface of the first dielectric layer so as to be connected through an end surface electrode provided on a side surface of the laminated substrate; and a metal case provided so as to cover the mounted component. Wherein the heat generated by the bare chip is radiated to the motherboard via the radiator plate when mounted on a motherboard. 3. A laminated substrate comprising at least a first dielectric layer and a second dielectric layer, and mounted on a surface of the first dielectric layer and embedded in the second dielectric layer. A bare chip mounted on the surface of the first dielectric layer and embedded with a conductive resin layer and thermal vias formed on the back surface in the second dielectric layer;
A GND electrode connected to the conductive resin layer via a thermal via and provided so as to cover the entire top surface of the second dielectric layer; and an end face electrode provided on a side surface of the laminated substrate. The heat generated in the bare chip is transferred to the entire laminated substrate and the GND via the thermal via.
A composite module component characterized by radiating heat to the electrodes. 4. A laminated substrate comprising at least a first dielectric layer and a second dielectric layer, and mounted on the surface of the first dielectric layer and embedded in the second dielectric layer. A mounted chip, a bare chip mounted on the front surface of the first dielectric layer via a conductive resin layer and a back surface embedded in the second dielectric layer, and the conductive resin layer and the A GND electrode provided via a thermal via provided in a first dielectric layer immediately below and provided on a back surface of the first dielectric layer, and an end face electrode provided on a side surface of the laminated substrate; When mounted on the motherboard,
A composite module component, wherein heat generated in the bare chip is radiated to the motherboard via the entire laminated substrate and the GND electrode. 5. A laminated substrate comprising at least a first dielectric layer and a second dielectric layer, a component mounted on a surface of the second dielectric layer, and A bare chip which is mounted on the front surface and has a conductive resin layer formed on its back surface and is buried in the space of the second dielectric layer, and the conductive resin layer and the first dielectric layer immediately below the bare chip. A GND electrode provided on the bottom surface of the first dielectric layer so as to be connected via the provided thermal via, an end surface electrode provided on a side surface of the multilayer substrate, and the mounting component. And a metal case provided in
The dielectric layer is a sintered substrate, and when mounted on a motherboard, the heat generated in the bare chip is radiated to the entire motherboard via the GND electrode and the motherboard. Composite module parts. 6. A laminated substrate comprising at least first to third dielectric layers, a component mounted on the surface of the third dielectric layer, and a component mounted on the surface of the first dielectric layer A bare chip having a conductive resin layer formed on its back surface and embedded in the space of the second dielectric layer; and a thermal chip provided on the first dielectric layer immediately below the conductive resin layer and the conductive resin layer. A GND electrode provided on a bottom surface of the first dielectric layer so as to be connected via a via, an end surface electrode provided on a side surface of the laminated substrate, and a cover provided to cover the mounted component. A metal case, wherein the first dielectric layer is a sintered substrate, and when mounted on a motherboard, heat generated in the bare chip is generated by the entire laminated substrate and the GND electrode. It is characterized by heat radiation to the motherboard Composite module parts. 7. A space portion, which is larger than the space portion of the second dielectric layer, is provided in the third dielectric layer, and a resin is formed in the space portions of the second and third dielectric layers so as to cover the bare chip. 7. The composite module component according to claim 6, wherein the component is filled. 8. A laminated substrate comprising at least a first dielectric layer and a second dielectric layer, a component mounted on a surface of the second dielectric layer, and A bare chip mounted on the back surface and embedded with a conductive resin layer and a thermal via formed in the first dielectric layer, and connected to the conductive resin layer via the thermal via and the first chip; GN provided on the bottom surface of the dielectric layer
D electrode, comprising an end face electrode provided on the side surface of the laminated substrate, when mounted on a motherboard, the heat generated in the bare chip, the motherboard via the thermal via and the GND electrode, the motherboard, A composite module component characterized in that heat is radiated to the entire laminated substrate.