JP2002180249A - Film forming apparatus and carrying apparatus for substrate for film forming - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film forming apparatus to conduct film forming while continuously carrying a plurality of substrates for film forming. SOLUTION: The film forming apparatus is provided with an electrode 8, which is arranged in a vacuum container 2 and generates a high frequency electric field in the vacuum container 2, a crucible 11 to accommodate a film material M arranged in the vacuum container 2, a substrate supply chamber 16 to supplies a substrate W for film forming, which is arranged so as to respectively separate or communicate with the vacuum container 2 and is evacuated, into the vacuum container, a substrate delivery chamber 17 to discharge the substrate W, a carrying apparatus 9 to carry the substrate W from the substrate supply chamber 16 through the vacuum container 2 to the substrate delivery chamber 17, a film material filling chamber 16, which is arranged so as to respectively separate or communicate with the vacuum container 2 and is evacuated, and a crucible carrying apparatus 28 to move the crucible 11 to both the vacuum container 2 and the film material filling chamber 26.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a film forming apparatus and a transfer apparatus for a substrate to be formed. More specifically, a film is formed on a substrate by ion plating or the like (film formation)
The present invention relates to a film forming apparatus for performing the above.

[0002]

2. Description of the Related Art Heretofore, a so-called batch-type apparatus has been known as an apparatus for ion plating, in which a substrate to be film-formed is replaced for each processing. For example, Tokuho 1
This is an apparatus described in US Pat. This apparatus includes a substrate holder for holding a substrate to be formed in a vacuum chamber and an evaporation source for evaporating a film material, and the substrate holder constitutes an electrode. A high-frequency power supply and a DC power supply for applying high-frequency power and DC voltage between the substrate holder and the inner wall of the chamber or between the substrate holder and the evaporation source are provided.

[0003] The film material is evaporated by applying high frequency power and DC voltage between the substrate holder and the inner wall of the chamber or between the substrate holder and the evaporation source while evaporating the film material. Is ionized and excited to adhere to the substrate.

[0004]

However, the productivity is low because the ion plating apparatus is of a batch type. Efforts have been made to mount as many substrates as possible in a vacuum chamber in order to form a plurality of substrates in one process, but there are limitations, and the volume of the chamber must be increased. There must be. For example, when forming a film on a large substrate such as a plasma display panel,
It is almost impossible to form a film on a plurality of substrates in one process.

Therefore, an apparatus for continuously forming a film on a large number of substrates by an in-line system is desired. However, in order to form a film having a uniform and dense structure, the configuration and arrangement of electrodes are important.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a film forming apparatus for forming a film while continuously transporting a plurality of substrates to be formed, and a film forming apparatus applied to the apparatus. An object of the present invention is to provide a device for transporting a target base material.

[0007]

SUMMARY OF THE INVENTION According to the present invention, there is provided an apparatus for transporting a substrate to be film-formed, which is provided in a vacuum chamber for film formation in which a high-frequency electric field may be generated. , A moving device for moving the holding device to pass through the film forming space, and a power supply device for supplying high-frequency power to the holding device.

If such a transfer device is installed in a vacuum chamber for film formation, a high-frequency electric field is generated by supplying power to the hold device when the support device passes the substrate to be formed through the film formation space. Since the holding device functions as an electrode), an in-line type ion plating device that sequentially forms films on equipment is realized.

In the above transport apparatus, when the holding device has an electrode plate and a clamp on the lower surface of the electrode plate for holding the substrate on which the film is to be formed, Plasma can be generated in a range suitable for, and a high-quality film can be formed.

Alternatively, the holding device is a device for holding a conductive base material or a base material on which an electrode is formed on a surface, and has a frame-shaped electrode member having an opening at a central portion. In a transfer device in which this opening is at least a range to be formed on the base material to be formed, the base material itself is used as an electrode and a film is formed in a necessary range of the base material. be able to.

[0011] As the moving device, a plurality of rollers on which the holding device is mounted can be employed. It is preferable that at least a part of the rollers is configured as a rotary drive roller that rotates in a direction in which the holding device is transported.

[0012] Alternatively, it is preferable that the moving device comprises a rail on which the holding device is movably engaged, and a wire connected to the holding device engaged with the rail to move the holding device.

[0013] In the transfer device in which the power supply device is configured to supply power to the holding device through the moving device, the holding device serves as an electrode, so that the plasma is supplied to a range suitable for the base material for film formation. And a high quality film can be formed.

[0014] Among the above-mentioned transporting devices which are supplied with power to the holding device through the moving device, the above-mentioned moving device is constituted by a moving device using the above-mentioned roller. It can be configured so that power is supplied to all the rollers or a part of them.
Alternatively, among the transfer devices that are supplied with power to the holding device through the transfer device, the transfer device configured as a transfer device using a rail and a wire includes a power supply to a range of a film formation space among the rails. It can be configured to be. For example, a conductive material may be formed only in the film forming space within the entire length of the rail. In any case, when the substrate reaches the range of the film formation space, plasma can be generated in a suitable range, and a high-quality film can be formed.

The film forming apparatus according to the present invention comprises: a film forming vacuum vessel in which a high-frequency electric field can be generated; an open vessel such as a crucible for accommodating a film material disposed in the film forming vacuum vessel;
Vacuumable deposition target substrate supply chamber and deposition target substrate delivery chamber, each of which is disposed so as to be able to isolate and communicate with the deposition vacuum container, and supply the deposition target substrate to the deposition target substrate And a transfer device for transferring the film from the chamber through a film formation vacuum container to a film formation target substrate delivery chamber.

According to this film forming apparatus, the base material can be sequentially sent from the base material supply chamber to the base material delivery chamber while forming the film through the vacuum chamber for film formation. A so-called in-line type film forming apparatus is realized.

Another film forming apparatus of the present invention comprises: a film forming vacuum container in which a high-frequency electric field can be generated; an open container containing a film material disposed in the film forming vacuum container; A vacuum-equipped film material filling chamber disposed so as to be separable and communicable with the container, and an open container transfer device for moving the open container to the film forming vacuum container and the film material filling chamber, As the film material in the open container inside the film forming vacuum container decreases, the open container transfer device sequentially transfers the open container to the film material filling chamber, fills the film material, and transfers it to the film forming vacuum container. It is configured to be.

According to the film forming apparatus, even if the film material in the open container is reduced by use, the film container is sequentially replaced with the open container filled with the film material in the film material filling chamber. It is possible to perform the film forming process continuously without opening the film. The film forming apparatus is not limited to the in-line type, and can be applied to a batch type apparatus.

The film forming apparatus of the present invention (the apparatus having a film-forming substrate supply chamber and the film-forming substrate feeding chamber) and another film forming apparatus of the present invention (an apparatus having a film material filling chamber) According to the film forming apparatus having both of the features described above, it is possible to continuously form a film on many substrates by one apparatus.

In the above-described film forming apparatus, particularly, the one provided with one of the above-described transfer devices as the transfer device, it is necessary to continuously form a high-quality film on many substrates. Can be.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a film forming apparatus of the present invention and a device for transporting a substrate to be formed will be described with reference to the accompanying drawings.

FIG. 1 shows a so-called in-line type for continuously forming a film on the surface of each substrate W while sequentially transporting a plurality of substrates W (hereinafter simply referred to as substrates). It is a film forming apparatus 1.

The film forming apparatus 1 includes a vacuum vessel 2 in which a lower plasma generation space 3 and an upper substrate transport space 4 are formed. Both spaces 3 and 4 are configured to be evacuated to a vacuum. At the boundary between the plasma generation space 3 and the substrate transport space 4, an earth shield portion 6 is formed to close the other area while leaving the film forming opening 5 communicating the spaces 3 and 4. The film forming opening 5 is a film forming space, so to speak, evaporates in the plasma generating space 3,
The plasma-formed ion of the film material M is opened so as to reach a predetermined film formation planned range of the substrate W moving in the substrate transport space 4. The ground shield portion 6 thus formed can prevent unnecessary bombardment of the substrate W by ions.

The plasma generation space 3 is provided with an evaporation source 7 and an electrode 8, and the base material transfer space 4 is provided with a base material W transfer device 9 and base material heating heaters 10a, 10b,
10c are provided. The evaporation source 7 includes a film material M, an open container (hereinafter, referred to as a crucible) 11 for mounting the film material M, and an electron gun 12 for heating and evaporating the film material M on the crucible 11. Be composed. Reference numeral 40 denotes a gas supply device for supplying a reaction gas, a plasma generation gas, and the like to the inside of the vacuum vessel 2 as necessary. Reference numeral 41 denotes an exhaust device for evacuating the inside of the container 2.

The electrode 8 is disposed immediately below the earth shield 6. The electrode 8 is connected to a high frequency power supply 13, a matching circuit 14, and a DC power supply 15. Thereby, a high frequency power and a DC bias voltage for generating plasma are applied between the electrode 8 and the inner wall of the vacuum vessel 2. The film material ionized in the plasma is accelerated by the bias voltage and adheres to the substrate surface.

A base material supply chamber 16 and a base material delivery chamber 17 are provided outside both sides of the base material transfer space 4 so as to face each other with the base material transfer space 4 interposed therebetween. Opening / closing doors 18a and 18b having an insulating function are provided at respective boundaries between the two chambers 16 and 17 and the substrate transport space 4. Both chambers 16 and 17 are connected to an exhaust device 41 so as to be individually evacuated to a vacuum. With this configuration, the base material supply chamber 16 is evacuated after the base material W is loaded therein, the door 18a is opened, and the base material W is loaded into the base material transport space 4. The base material W on which the film formation has been completed is carried into the base material delivery chamber 17 after the door 18b between the base material delivery chamber 17 which is already in a vacuum state is opened. Thereafter, the base material W is carried out of the base material delivery chamber 17 after the door 18b is closed. Such an operation is performed continuously.

The transfer of the substrate W is performed by the transfer device 9. FIG. 2 shows an example of the transfer device. First,
A large number of rollers 19 are arranged in the substrate transport space 4 along the traveling direction of the substrate W. Of these rollers 19, only the rollers 19b arranged in the range of the film forming opening 5 are arranged on both left and right sides with an interval therebetween. An endless belt 20 is wound around each row of the rollers 19. One or both of the rollers 19a at both ends of the roller row are drive rollers that are rotationally driven. The same transporting rollers 19 and belts 20 are also provided in the base material supply chamber 16 and the base material delivery chamber 17. With this configuration, the base material W is conveyed by the belt 20 rotating from the base material supply chamber 16 side to the base material delivery chamber 17 side after the left and right sides thereof are placed on the belts 20 on both sides. .
The space between the belts 20 on both sides and the space between the rollers 19 in the range of the film forming opening 5 are sized so that a predetermined film forming range of the base material W is secured. Note that all the rollers 19 may be arranged on the left and right sides with an interval therebetween. Further, the base material W may be transported without using the belt 20 by using all the rollers 19 or every other or every other roller as a driving roller.

In the present invention, the belt 20 and the roller 19
It is not limited to. For example, as shown in FIG.
May be used in which a frame-shaped tray 22 for mounting the sheet is movably engaged with the rail 21. This tray 2
An opening 23 covers a predetermined film forming range of the substrate W.
Are formed. The tray 22 is provided in the substrate supply chamber 1.
6 and a wire 25 wrapped around a drive roller (not shown) disposed on the base material delivery chamber 17 side.
The substrate is reciprocated between the substrate supply chamber 16 and the substrate delivery chamber 17. The above-described transport roller 19 and belt 20 may be disposed in the substrate supply chamber 16 and the substrate delivery chamber 17.

As shown in FIG. 1, two film material filling chambers 26 are provided on both sides of the plasma generation space 3 so as to face each other with the plasma generation space 3 interposed therebetween. A membrane material supply device 24 is provided in each membrane material filling chamber 26. Also,
Opening and closing doors 27a and 27b are provided at the boundary between each film material filling chamber 26 and the substrate transport space 4. Each of the film material filling chambers 26 is configured to be individually evacuated to a vacuum.
Further, a crucible transfer device 2 for transferring the crucible 11 between the plasma generation space 3 and each of the film material filling chambers 26.
8 are provided. As the crucible transfer device 28, a transfer mechanism such as the above-described belt and roller, or rail and wire may be used. Or chain drive,
A gear drive or the like may be employed.

With this configuration, when the film material M in the crucible 11a in the plasma generation space 3 is reduced to a predetermined amount by use, the crucible 11a is transferred by the transfer device 28 into one of the film material filling chambers 26, and at the same time, Then, another crucible 11b which has been filled with the film material in the other film material filling chamber 26 and is on standby reaches a predetermined position in the plasma generation space 3. At this time, the opening and closing doors 27a and 27b are of course opened and closed after each of the film material filling chambers 26 is evacuated to a vacuum. The fact that the film material M in the crucible has decreased to a predetermined amount can be determined based on the elapsed time. When the film material in the crucible decreases, the electron emission current of the electron gun is automatically increased in accordance with the decrease in the film material in order to keep the film formation rate constant. It can also be determined by a value or the like. Then, after the ongoing deposition of the substrate is completed, the substrate is automatically replaced with another crucible filled with the film material. When the crucible is replaced, the transport of the base material W is temporarily stopped.

In FIG. 1, reference numerals 10a, 10b, 10
c is a heater for heating the substrate W. In addition, a heater protection member 30 is provided near the lower surface of the heater 10a above the film forming opening 5 so as to cover the heater 10a. The heater protection member 30 is made of a grounded mesh, and cuts off the plasma to prevent the heater 10a.
It protects. The heater 10c adjacent to the film forming opening 5 is protected by the above-mentioned earth shield 6.

In the above embodiment, the electrode 8 is fixed in the vacuum vessel 2. However, the present invention is not limited to such a configuration. The electrodes are arranged so that a high-frequency electric field is generated so that effective plasma is generated on the film forming surface side of the substrate W on which the film is to be formed, and the ionized film material is accelerated toward the film forming surface. Are preferably arranged so as to generate a direct-current electric field which collides and promotes diffusion on the film forming surface.

FIG. 4, viewed obliquely from below, shows the electrodes 31 well constructed and arranged from this point of view. That is, it is not an electrode fixed in the vacuum vessel.
The apparatus includes the following transfer device instead of the electrode 8 and the transfer device 9 in the film forming apparatus 1 of FIG. This electrode 31
Has a function as a holding device for holding the base material W, and has an electrode plate portion 32 and a clip portion 33 for gripping the base material W on the lower surface thereof. The base material is automatically gripped by the clip part 33. The gripping portion of the base material W by the clip portion 33 is set to be outside the film formation target range. The electrodes 31 are mounted and transported on a number of rollers 19 arranged along the traveling direction of the substrate W. The arrangement of the rollers 19 is arranged at intervals on both the left and right sides in the traveling direction of the base material W in order to avoid interference with the clip portion 33, but the interval between the left and right rollers is the same as in FIG. It is. All the rollers 19, or every other or every second roller 19 are configured to transport the substrate W as a driving roller.

As shown in FIG. 5, all of the rollers 19b arranged on both sides of the film forming opening 5 or any one of them (for example, the upstream end of the film forming opening 5 range and / or
Or, at the downstream end), a power supply shoe (power supply shoe) 34
Are disposed in a state of elastically pressing. The high-frequency power supply 13, the matching circuit 14, and the DC power supply 15 are connected to the power supply shoe 34. Thus, power is supplied to the electrode 31 through the roller 19b.
According to this configuration, when the substrate W reaches the film forming opening 5, the high-frequency power and the DC voltage are applied between the electrode plate portion 32 above the substrate W and the inner wall (or crucible) of the vacuum vessel 2. Applied.

In the present invention, the device for transporting the electrode 31 is not limited to the roller 19. For example, as shown in FIG. 3, rails 21 may be laid on both left and right sides instead of the rollers, and the electrodes 31 may be movably engaged with the rails 21. Then, a wire 25 wrapped around a drive roller (not shown) disposed on the base material supply chamber 16 side and the base material delivery chamber 17 side is connected to the electrode 31, and the base material supply chamber 16 side and the base material delivery chamber are connected. What is necessary is just to make it reciprocate between 17 side. Power may be supplied through the rail 21 or the wire 25. When power is supplied through the rail 21, if the rail 21 is formed of a conductive material only in the range of the film forming opening 5, the electrode plate portion 32 and the vacuum vessel 2 are formed when the base material W reaches the film forming opening 5. High-frequency power and a DC voltage are applied to the inner wall (or crucible) of the battery.

FIG. 6 shows a transport device 35 for transporting a substrate having electrodes formed thereon, for example, a front plate (hereinafter simply referred to as a substrate) P of a plasma display panel. . The base material P is a comb-shaped display electrode (transparent electrode) T on both sides of the surface of the glass substrate Pa.
a and Tb are formed so as to mesh with each other. Metal electrodes (not shown) as bus electrodes are formed on the upper surfaces of the transparent electrodes Ta and Tb. The transfer device 35 applies high-frequency power and DC voltage using the electrodes Ta and Tb of the base material P.

The transport device 35 is composed of a frame-shaped tray 36 on which the base material P is placed, and a number of rollers 19 arranged along the direction in which the base material P moves. Of the rollers 19, only the rollers 19b arranged in the range of the film formation opening 5 are arranged on both left and right sides with an interval therebetween. The tray 36 is transported with its left and right sides placed on the rollers 19 on both sides. An opening 37 is formed in the tray 36 to cover a predetermined film forming range of the base material P placed thereon. The distance between the left and right rollers 19b is the same as in FIGS. All the rollers 19, or every other or every second roller 19 are configured to transport the substrate W as a driving roller. The rollers 1 arranged on both sides of the film forming opening 5
The above-described power supply shoe 34 (FIG. 5) is disposed on all or any of 9b in a state of being elastically pressed. The power supply shoe 34 includes the above-described power supplies 1 and the like.
3, 14, and 15 are connected. Therefore, the tray 36 becomes an electrode member if it comes into contact with the supplied roller.

Therefore, when the base material P is placed on the tray 36, the electrodes Ta and Tb of the base material P are in contact with the tray 36, so that the tray 36 reaches the film forming opening 5 and is supplied with power. When it reaches the roller 19b, the substrate P and the vacuum container 2
High-frequency power and a DC voltage are applied between the inner wall (or crucible).

The present invention is not limited to the rollers 19 described above.

For example, as shown in FIG. 7, instead of rollers, rails 21 may be laid on both left and right sides, and a clamp member or a mounting member 38 may be movably disposed on each rail 21. FIG. 7 shows an example in which the base material P is transported in the short direction. The base material P is placed so that the electrodes Ta and Tb on both sides thereof come into contact with the placement member 38. The two mounting members 38 are connected to the wires 25 wrapped around driving rollers (not shown) disposed on the base material supply chamber 16 side and the base material delivery chamber 17 side, and the base material supply chamber 16 side and the base material delivery chamber 17 are connected to each other. It is reciprocated between the chamber 17 side.

In any case, the electrodes of the substrate P can be used effectively.

[0042]

According to the present invention, it is possible to form a high quality film on the surface of a plurality of substrates to be formed while continuously transporting the substrates.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a film forming apparatus of the present invention.

FIG. 2 is a perspective view showing one embodiment of a transfer device in another embodiment of the film forming apparatus of the present invention.

FIG. 3 is a perspective view showing another embodiment of the transport device of the present invention.

FIG. 4 is a perspective view showing a still another embodiment of the transport device of the present invention, as viewed obliquely from below.

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is a plan view showing still another embodiment of the transfer device of the present invention.

FIG. 7 is a plan view showing still another embodiment of the transfer device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Film-forming apparatus 2 Vacuum container 3 Plasma generation space 4 Substrate transport space 5 Film-forming opening 6 Earth shield part 7 Evaporation source 8 Electrode 9 Transport device 10a, 10b, 10c Heater for substrate heating 11 Crucible 12 Electron gun 13 High frequency Power supply 14 Matching circuit 15 High-frequency power supply 16 Substrate supply chamber 17 Substrate delivery chamber 18a, 18b Door 19 Roller 19a Drive roller 19b Both-sided roller 20 Belt 21 Rail 22 Tray 23 Opening 24 Film material supply device 25 Wire 26 Film material filling room 27a , 27b Door 28 Crucible transfer device 30 Heater protection member 31 Electrode 32 Electrode plate 33 Clip portion 34 Power supply shoe 35 Transfer device 36 Tray 37 Opening 38 Mounting member 40 Gas supply device 41 Exhaust device P, W Base material

Claims (12)

[Claims] 1. A holding device provided in a film forming vacuum vessel in which a high-frequency electric field can be generated for holding a substrate to be formed, and the holding device is moved to pass through a film forming space. And a power supply device for supplying high-frequency power to the holding device. 2. The apparatus according to claim 1, wherein the holding device has an electrode plate and a clamp on a lower surface of the electrode plate for holding the substrate. . 3. The holding device according to claim 1, wherein the holding device is a device for holding a conductive base material or a film formation target base material having an electrode formed on a surface thereof, and has a frame-shaped electrode member having an opening in a central portion. The apparatus according to claim 1, wherein the opening is at least a film formation target area of the film formation target base material. 4. The moving device has a plurality of rollers on which the holding device is placed, and at least a part of the rollers is configured as a rotary driving roller that rotates in a direction in which the holding device is transported. The apparatus for transporting a substrate to be deposited according to claim 1, wherein: 5. The moving device according to claim 1, further comprising a rail on which the holding device is movably engaged, and a wire connected to the holding device engaged with the rail to move the holding device. The apparatus for transporting a substrate to be formed according to the above. 6. The apparatus according to claim 1, wherein the power supply device is configured to supply power to the holding device through a moving device. 7. The moving device according to claim 4, wherein the power is supplied to all of the rollers arranged in the range of the film forming space or a part of the rollers. The apparatus for transporting a substrate to be deposited according to claim 6, wherein the apparatus is configured. 8. The film forming object according to claim 6, wherein the moving device comprises the moving device according to claim 5, and is configured to supply power to a range of a film forming space among the rails. Substrate transfer device. 9. A vacuum container for film formation in which a high-frequency electric field can be generated, and an open container for accommodating a film material provided in the vacuum container for film formation, each being isolated from the vacuum container for film formation. And a vacuum-depositable substrate supply chamber and a substrate supply chamber which can be evacuated, and a substrate to be deposited is formed from the substrate supply chamber through a film-forming vacuum vessel. A film forming apparatus comprising: a transfer device for transferring the film to the film target substrate delivery chamber. 10. A vacuum container for film formation in which a high-frequency electric field can be generated, an open container for accommodating a film material provided in the vacuum container for film formation, and isolation and communication with the vacuum container for film formation. A vacuum-equipped film material filling chamber disposed so as to be capable of being provided, and an open container transport device for moving the open container to the film forming vacuum container and the film material filling chamber. According to the decrease of the film material in the open container inside, the open container transfer device is configured to sequentially transfer the open container to the film material filling chamber, fill the film material, and transfer to the film forming vacuum container. Film forming equipment. 11. A vacuum-equipped film material charging chamber disposed so as to be separable and communicable with a film-forming vacuum container, and an opening for moving the open container to the film-forming vacuum container and the film material charging chamber. A container transport device is provided, and the open container transport device sequentially transports the open containers to the film material filling chamber and fills the film material according to a decrease in the film material in the open container in the film forming vacuum container. The film forming apparatus according to claim 9, wherein the apparatus is configured to be transported to a film forming vacuum vessel. 12. A film forming apparatus according to claim 9, wherein said transfer device comprises the transfer device according to any one of claims 1 to 8.