JP2002178264A - Abrasive grain tool and its manufacturing method - Google Patents
Abrasive grain tool and its manufacturing methodInfo
- Publication number
- JP2002178264A JP2002178264A JP2000382498A JP2000382498A JP2002178264A JP 2002178264 A JP2002178264 A JP 2002178264A JP 2000382498 A JP2000382498 A JP 2000382498A JP 2000382498 A JP2000382498 A JP 2000382498A JP 2002178264 A JP2002178264 A JP 2002178264A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- abrasive
- tool
- working surface
- grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、砥粒工具及びその
製造方法に関する。さらに詳しくは、本発明は、砥粒分
布密度を制御することができ、しかも被削材表面に筋の
残らない、作用面に砥粒を単層に固着した砥粒工具及び
その製造方法に関する。[0001] The present invention relates to an abrasive tool and a method for manufacturing the same. More specifically, the present invention relates to an abrasive tool in which the distribution of abrasive grains can be controlled and which has no streaks on the surface of a work material, and in which abrasive grains are fixed in a single layer on a working surface, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来より、電着やロウ付けなどにより作
用面に砥粒を単層に固着した砥粒工具が知られている。
これらの砥粒工具における砥粒の配置は、大きく分け
て、ランダム配置と規則配置の２種類がある。砥粒がラ
ンダム配置された砥粒工具の製造方法として、例えば、
ばらまき法がある。ばらまき法は、作用面に一定量の砥
粒を文字通りばらまくもので、簡易的ではあるが、砥粒
分布密度の制御が難しく、密度の偏りが生じることが多
い。砥粒が規則配置された砥粒工具の製造方法は、個々
の砥粒の位置を制御するものである。例えば、特開平５
−２８５８４６号公報には、簡単な方法で台金表面に砥
粒を均一に分散させる方法として、台金の表面に非マス
キング部の穴径が電着する砥粒の径の１１０〜１６０％
であり、厚みが電着する砥粒の径の５０〜１５０％であ
る非マスキング部を有する絶縁物のマスキングを施し
て、非マスキング部に砥粒を電着する方法が提案され、
規則的なマスキングパターンを有するマスキングシート
が例示されている。また、特開平６−１１４７４１号公
報には、超砥粒の分布を１粒単位でコントロールする方
法として、台金表面にパターンシートを貼着して、パタ
ーンシートの各孔に対応する位置に超砥粒を１個ずつ配
置して電着する方法が提案されている。さらに、特開平
９−１９８６８号公報には、研削加工時に目詰まりがな
く、寿命の長い電着ホイールとして、超砥粒が研削面に
島状に分散して固着され、ひとつの島に超砥粒が２〜１
０個集合して固着され、島部分の全面積が研削面の全面
積の０.０２〜０.５倍である電着ホイールが提案され、
規則的な島の配列パターンが例示されている。砥粒がラ
ンダム配置された砥粒工具は、砥粒の分布密度の制御が
難しく、工具性能がばらつきやすいという問題がある。
また、砥粒が規則配置された砥粒工具は、同一線上に砥
粒が並ぶために、例えば、ホイールに適用した場合、同
一軌跡を砥粒が通り、被削材の表面に筋がつきやすいと
いう問題がある。被削材の表面の筋を防ぐために、砥粒
を配置する格子を回転方向に対してある角度に傾けると
いう方法があるが、角度を適切に選ばないと、依然とし
て筋が発生する場合がある。また、ストレートホイール
の外周に適用した場合、円周上の１か所で格子の継ぎ目
が残るという問題もある。2. Description of the Related Art Conventionally, there has been known an abrasive tool in which abrasive grains are fixed to a working surface in a single layer by electrodeposition or brazing.
The arrangement of abrasive grains in these abrasive tools is roughly classified into two types: random arrangement and regular arrangement. As a method of manufacturing an abrasive tool in which abrasive grains are randomly arranged, for example,
There is a dissemination method. The dispersing method literally disperses a certain amount of abrasive grains on the working surface. Although simple, it is difficult to control the abrasive grain distribution density, and the density tends to be uneven. The method of manufacturing an abrasive tool in which abrasive grains are regularly arranged controls the position of each abrasive grain. For example, Japanese Unexamined Patent Publication
JP-A-285846 discloses a simple method for uniformly dispersing abrasive grains on the surface of a base metal. The hole diameter of a non-masking portion on the surface of the base metal is 110 to 160% of the diameter of the abrasive particles to be electrodeposited.
A method of applying an insulating material having a non-masking portion having a thickness of 50 to 150% of the diameter of the abrasive particles to be electrodeposited, and electrodepositing the abrasive particles on the non-masking portion,
A masking sheet having a regular masking pattern is illustrated. Japanese Patent Application Laid-Open No. 6-114741 discloses a method of controlling the distribution of superabrasive grains in units of one grain by adhering a pattern sheet to the surface of a base metal, A method of arranging abrasive grains one by one and performing electrodeposition has been proposed. Furthermore, Japanese Patent Application Laid-Open No. Hei 9-19868 discloses that as a long-life electrodeposited wheel without clogging during grinding, super-abrasive grains are dispersed and fixed in an island shape on a ground surface, 2 to 1 grains
Electrodeposited wheels are proposed in which 0 pieces are fixed and fixed, and the total area of the island portion is 0.02 to 0.5 times the total area of the ground surface,
A regular island arrangement pattern is illustrated. Abrasive tools in which abrasive grains are randomly arranged have a problem that it is difficult to control the distribution density of abrasive grains and the tool performance tends to vary.
In addition, in the case of an abrasive tool in which abrasive grains are regularly arranged, since the abrasive grains are arranged on the same line, for example, when applied to a wheel, the abrasive grains pass through the same trajectory, and the surface of the workpiece is easily streaked There is a problem. In order to prevent streaks on the surface of the work material, there is a method in which the grid on which the abrasive grains are arranged is inclined at a certain angle with respect to the rotation direction. However, if the angle is not properly selected, streaks may still occur. Further, when applied to the outer periphery of a straight wheel, there is a problem that a grid joint remains at one place on the circumference.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、砥粒分布密
度を制御することができ、しかも被削材表面に筋の残ら
ない、作用面に砥粒を単層に固着した砥粒工具及びその
製造方法を提供することを目的としてなされたものであ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide an abrasive tool which can control the distribution density of abrasive grains, has no streaks on the surface of the work material, and has a single layer of abrasive grains fixed to the working surface. The purpose of the present invention is to provide a manufacturing method thereof.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、上記の課
題を解決すべく鋭意研究を重ねた結果、砥粒工具の作用
面に仮想的な格子を想定し、該格子の個々の交点をラン
ダムに変位させた位置に砥粒を配置することにより、砥
粒分布密度が精密に制御され、しかも被削材表面に筋が
残らない砥粒工具を製造し得ることを見いだし、この知
見に基づいて本発明を完成するに至った。すなわち、本
発明は、（１）作用面に砥粒を単層に固着した砥粒工具
であって、該工具の作用面に仮想的な格子を想定し、該
格子の個々の交点を、交差する２本の格子線方向又はＸ
方向とＹ方向に、それぞれ砥粒の平均粒径の３倍以下の
距離だけランダムに変位させた位置に砥粒が配置されて
なることを特徴とする砥粒工具、（２）作用面に砥粒を
単層に固着した砥粒工具において、該工具の作用面に仮
想的な格子を想定し、該格子の個々の交点を、交差する
２本の格子線方向又はＸ方向とＹ方向に、それぞれ砥粒
の平均粒径の３倍以下の距離だけランダムに変位させた
位置に砥粒を配置することを特徴とする砥粒工具の製造
方法、及び、（３）ランダムな変位が、乱数に基づいて
設定される第２項記載の砥粒工具の製造方法、を提供す
るものである。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, assumed a virtual grid on the working surface of the abrasive tool, and set individual intersections of the grid. By arranging abrasive grains at randomly displaced positions, the abrasive grain distribution density was precisely controlled, and it was found that it was possible to manufacture an abrasive tool that did not leave streaks on the surface of the work material. Based on this, the present invention has been completed. That is, the present invention provides (1) an abrasive tool in which abrasive grains are fixed in a single layer on the working surface, and a virtual grid is assumed on the working surface of the tool, and individual intersections of the grid are crossed. Two grid line directions or X
Abrasive tool characterized in that the abrasive grains are arranged at positions randomly displaced by a distance of not more than three times the average grain size of the abrasive grains in the direction and the Y direction, respectively. In an abrasive tool in which grains are fixed in a single layer, a virtual grid is assumed on the working surface of the tool, and individual intersections of the grid are defined in two grid line directions intersecting or in the X and Y directions, A method for manufacturing an abrasive tool characterized in that abrasive grains are arranged at positions randomly displaced by a distance equal to or less than three times the average grain size of the abrasive grains, and (3) the random displacement is a random number. 3. The method for manufacturing an abrasive tool according to the item 2, wherein the method is set on the basis of:
【０００５】[0005]
【発明の実施の形態】本発明の砥粒工具は、作用面に砥
粒を単層に固着した砥粒工具であって、該工具の作用面
に仮想的な格子を想定し、該格子の個々の交点を、交差
する２本の格子線方向又はＸ方向とＹ方向に、それぞれ
砥粒の平均粒径の３倍以下の距離だけランダムに変位さ
せた位置に砥粒が配置されてなる砥粒工具である。本発
明の砥粒工具の製造方法においては、作用面に砥粒を単
層に固着した砥粒工具において、該工具の作用面に仮想
的な格子を想定し、該格子の個々の交点を、交差する２
本の格子線方向又はＸ方向とＹ方向に、それぞれ砥粒の
平均粒径の３倍以下の距離だけランダムに変位させた位
置に砥粒を配置する。本発明において、作用面に想定す
る仮想的な格子の形状に特に制限はなく、例えば、図１
(ａ)に示す正方格子、図１(ｂ)に示す長方格子、図１
(ｃ)に示す斜方格子、図１(ｄ)に示す格子線の間隔が変
化する方格子、図１(ｅ)に示す平行線と放射線の組み合
わせからなる格子、図１(ｆ)に示す同心円と放射線の組
み合わせからなる格子、図１(ｇ)に示す同心円と平行線
の組み合わせからなる格子、これらの格子の格子線の間
隔が波状に増減する格子などを挙げることができる。BEST MODE FOR CARRYING OUT THE INVENTION An abrasive tool according to the present invention is an abrasive tool in which abrasive grains are fixed to a working surface in a single layer, and a virtual grid is assumed on the working surface of the tool. An abrasive in which abrasive grains are arranged at positions where individual intersections are randomly displaced in the direction of two intersecting grid lines or in the X and Y directions by a distance of not more than three times the average grain size of the abrasive grains. It is a grain tool. In the manufacturing method of the abrasive tool of the present invention, in the abrasive tool having a single layer of abrasive grains fixed to the working surface, assuming a virtual grid on the working surface of the tool, the individual intersections of the grid, Cross 2
Abrasive grains are arranged at positions randomly displaced in the direction of the lattice line or in the X and Y directions by a distance equal to or less than three times the average grain size of the abrasive grains. In the present invention, there is no particular limitation on the shape of the virtual grid assumed on the working surface.
FIG. 1A shows a square lattice, FIG. 1B shows a rectangular lattice, and FIG.
An oblique lattice shown in FIG. 1C, a rectangular lattice shown in FIG. 1D in which the interval between grid lines changes, a lattice shown in FIG. 1E composed of a combination of parallel lines and radiation, and shown in FIG. A grating composed of a combination of concentric circles and radiation, a lattice composed of a combination of concentric circles and parallel lines shown in FIG.
【０００６】本発明において、格子の個々の交点をラン
ダムに変位させる方法に特に制限はないが、ランダムな
変位を乱数に基づいて設定する方法は、市販されている
書籍に掲載された乱数表、電気的にパルスを発生させる
方法で作成した乱数列、市販されている表計算ソフトウ
ェアの乱数発生機能などを利用することができるので好
ましい。使用する乱数に特に制限はなく、一様乱数、疑
似乱数のいずれをも用いることができる。市販されてい
る表計算ソフトウェアの乱数発生機能としては、例え
ば、表計算ソフトウェア「エクセル」（マイクロソフト
社）の「ＲＡＮＤ」機能などを挙げることができ、この
機能を利用して、容易に乱数列を作成することができ
る。図２は、「ＲＡＮＤ」で作成した０〜１の範囲の乱
数列の一例である。本発明において、格子の個々の交点
を、交差する２本の格子線方向又はＸ方向とＹ方向に、
それぞれ変位させる距離は、砥粒の平均粒径の３倍以下
であり、好ましくは砥粒の平均粒径の０.５〜２倍であ
り、より好ましくは砥粒の平均粒径の０.８〜１.５倍で
ある。変位させる距離が砥粒の平均粒径の３倍を超える
と、砥粒分布密度に部分的に過度の粗密を生ずるおそれ
がある。In the present invention, there is no particular limitation on the method of randomly displacing the individual intersections of the lattice, but the method of setting the random displacement based on random numbers is based on a random number table published in a commercially available book. It is preferable because a random number sequence created by a method of electrically generating a pulse and a random number generation function of commercially available spreadsheet software can be used. There is no particular limitation on the random number used, and either a uniform random number or a pseudo random number can be used. Examples of the random number generation function of commercially available spreadsheet software include a “RAND” function of spreadsheet software “Excel” (Microsoft), and a random number sequence can be easily generated using this function. Can be created. FIG. 2 is an example of a random number sequence in the range of 0 to 1 created by “RAND”. In the present invention, each intersection point of the grid is defined by two intersecting grid line directions or X and Y directions.
The distance to be displaced is not more than three times the average particle diameter of the abrasive grains, preferably 0.5 to 2 times the average particle diameter of the abrasive grains, and more preferably 0.8 to the average particle diameter of the abrasive grains. ~ 1.5 times. If the distance to be displaced exceeds three times the average particle size of the abrasive grains, the density of the abrasive grains may be partially excessively dense.
【０００７】平均粒径２５０μｍの砥粒を、格子線の間
隔１,０００μｍの正方格子に配置し、図２に示す乱数
列を用いて、格子の個々の交点をＸ方向及びＹ方向に、
砥粒の平均粒径の１.２倍以下の距離、すなわち最大３
００μｍ変位させる場合を考える。図３は、交点のラン
ダム変位の計算例を示す説明図である。交点を変位させ
ない場合、正方格子上において、４個の砥粒、ａ、ｂ、
ｃ及びｄは、図３(ａ)に示す位置に配置される。図２に
示す乱数例の左上から順に、砥粒ａのＸ方向の変位距
離、Ｙ方向の変位距離、砥粒ｂのＸ方向の変位距離、Ｙ
方向の変位距離、砥粒ｃのＸ方向の変位距離、Ｙ方向の
変位距離、砥粒ｄのＸ方向の変位距離、Ｙ方向の変位距
離に対応させる。図２に示す乱数列は、０〜１の乱数列
なので、図２に示される数値から０.５を減じ、６００
μｍを乗ずることにより、交点を変位させる距離を求め
ることができる。なお、この数値が正のときは、Ｘ方向
は右方向、Ｙ方向は上方向、この数値が負のときは、Ｘ
方向は左方向、Ｙ方向は下方向と決めておく。Abrasive grains having an average particle size of 250 μm are arranged on a square lattice having a lattice line interval of 1,000 μm, and individual intersections of the lattice are arranged in the X and Y directions using a random number sequence shown in FIG.
Distance less than 1.2 times the average grain size of the abrasive grains, ie up to 3
Let us consider a case of displacing by 00 μm. FIG. 3 is an explanatory diagram illustrating an example of calculating a random displacement of an intersection. When the intersection is not displaced, four abrasive grains, a, b,
c and d are arranged at the positions shown in FIG. In order from the upper left of the random number example shown in FIG. 2, the displacement distance of the abrasive grains a in the X direction, the displacement distance in the Y direction, the displacement distance of the abrasive grains b in the X direction, and Y
The displacement distance in the direction, the displacement distance in the X direction of the abrasive grains c, the displacement distance in the Y direction, the displacement distance in the X direction of the abrasive grains d, and the displacement distance in the Y direction. The random number sequence shown in FIG. 2 is a random number sequence of 0 to 1, so 0.5 is subtracted from the numerical value shown in FIG.
By multiplying by μm, the distance for displacing the intersection can be obtained. If this value is positive, the X direction is rightward, the Y direction is upward, and if this value is negative, X
The direction is determined to be leftward, and the Y direction is determined to be downward.
【０００８】乱数列の最初の数値は０.１６７７８なの
で、砥粒ａのＸ方向の変位距離は、 (０.１６７７８−０.５)×６００ ＝ −１９９（μｍ） となり、乱数列の次の数値は０.９７８５９４なので、
砥粒ａのＹ方向の変位距離は、 (０.９７８５９４−０.５)×６００ ＝ ２８７（μｍ） となる。すなわち、砥粒ａは、Ｘ方向は左方向に１９９
μｍ、Ｙ方向は上方向に２８７μｍ変位する。砥粒ｂの
変位距離は、同様にして乱数列の０.９７９１５５と０.
４９５１０７を用いて、 Ｘ方向 (０.９７９１５５−０.５)×６００ ＝ ２８
７（μｍ） Ｙ方向 (０.４９５１０７−０.５)×６００ ＝ −３
（μｍ） となる。以下、同様にして、砥粒ｃの変位距離は、 Ｘ方向 (０.６５７８０７−０.５)×６００ ＝ ９５
（μｍ） Ｙ方向 (０.５３０７７７−０.５)×６００ ＝ １８
（μｍ） 砥粒ｄの変位距離は、 Ｘ方向 (０.５３３５８７−０.５)×６００ ＝ ２０
（μｍ） Ｙ方向 (０.５７７８９９−０.５)×６００ ＝ ４７
（μｍ） となる。このようにして設定したランダムな変位を、図
３に示す砥粒ａ、ｂ、ｃ及びｄに適用すると、砥粒ａ、
ｂ、ｃ及びｄは、図３(ｂ)に示す位置に配置される。Since the first numerical value of the random number sequence is 0.16787, the displacement distance of the abrasive grain a in the X direction is (0.1778-0.5) × 600 = −199 (μm). Since the numerical value is 0.978594,
The displacement distance of the abrasive grain a in the Y direction is (0.978594-0.5) × 600 = 287 (μm). That is, the abrasive grain a is 199 leftward in the X direction.
μm, the Y direction is displaced upward by 287 μm. Similarly, the displacement distance of the abrasive grain b is 0.997155 and 0.9 in the random number sequence.
Using 495107, the X direction (0.979155-0.5) × 600 = 28
7 (μm) Y direction (0.495107-0.5) × 600 = −3
(Μm). Hereinafter, similarly, the displacement distance of the abrasive grain c is: X direction (0.657807-0.5) × 600 = 95
(Μm) Y direction (0.530777-0.5) × 600 = 18
(Μm) The displacement distance of the abrasive grains d is X direction (0.533587-0.5) × 600 = 20.
(Μm) Y direction (0.577899−0.5) × 600 = 47
(Μm). When the random displacement set in this way is applied to the abrasive grains a, b, c, and d shown in FIG. 3, the abrasive grains a,
b, c and d are arranged at the positions shown in FIG.
【０００９】図４は、本発明方法に用いられる変位距離
の計算を示す模式図の一例である。本例においては、上
記の計算と同様に格子線間隔１,０００μｍの正方格子
の個々の交点をＸ方向及びＹ方向に、それそぞれ最大変
位距離３００μｍで変位させている。図５は、本発明方
法に用いられる変位距離の計算を示す模式図の他の例で
ある。本例においては、格子線間隔１,０００μｍの正
方格子の個々の交点をＸ方向及びＹ方向に、それそぞれ
最大変位距離２５０μｍで変位させている。図６は、本
発明方法に用いられる変位距離の計算を示す模式図の他
の例である。本例においては、格子線間隔１,０００μ
ｍの正方格子の個々の交点をＸ方向及びＹ方向に、それ
そぞれ最大変位距離２００μｍで変位させている。FIG. 4 is an example of a schematic diagram showing the calculation of the displacement distance used in the method of the present invention. In this example, as in the above calculation, each intersection of a square lattice with a lattice line spacing of 1,000 μm is displaced in the X and Y directions with a maximum displacement distance of 300 μm. FIG. 5 is another example of a schematic diagram showing the calculation of the displacement distance used in the method of the present invention. In this example, each intersection of a square lattice with a lattice line spacing of 1,000 μm is displaced in the X and Y directions with a maximum displacement distance of 250 μm each. FIG. 6 is another example of a schematic diagram showing the calculation of the displacement distance used in the method of the present invention. In this example, the grid line interval is 1,000 μm.
The respective intersections of the m square lattice are displaced in the X direction and the Y direction, respectively, with a maximum displacement distance of 200 μm.
【００１０】格子線がＸ方向又はＹ方向を向いていな
い、例えば、図１(ｃ)に示す斜方格子の場合は、上記の
ようにして計算した変位距離の数値が正の場合は斜め上
方に変位させ、負の場合は斜め下方に変位させると決め
ておくことにより、交点の変位の方向と距離を定めるこ
とができる。また、図１(ｆ)、図１(ｇ)に示す同心円状
の格子線を有する格子では、上記のようにして計算した
変位距離の数値が正の場合は時計回り方向に変位させ、
負の場合は反時計回り方向に変位させると決めておくこ
とにより、交点の変位の方向と距離を定めることができ
る。本発明において、格子線がＸ方向及びＹ方向を向い
ている場合は、交差する２本の格子線方向はＸ方向及び
Ｙ方向と一致するが、格子線がＸ方向又はＹ方向を向い
ていない場合は、格子の個々の交点を交差する２本の格
子線方向に変位させる代わりに、Ｘ方向及びＹ方向に変
位させることができる。ランダムな変位の方向及び距離
をコンピュータ処理により設定する場合は、Ｘ方向及び
Ｙ方向に変位させることにより、より容易に変位の設定
を行うことができる。When the grid lines are not oriented in the X direction or the Y direction, for example, in the case of the oblique grid shown in FIG. 1C, if the numerical value of the displacement distance calculated as described above is positive, The displacement direction and distance of the intersection can be determined by deciding that the displacement is made obliquely downward in the case of a negative displacement. Also, in the lattice having concentric lattice lines shown in FIGS. 1F and 1G, when the numerical value of the displacement distance calculated as described above is positive, the lattice is displaced clockwise.
In the case of a negative value, it is determined that the displacement is made in the counterclockwise direction, so that the direction and distance of the displacement at the intersection can be determined. In the present invention, when the grid lines are oriented in the X direction and the Y direction, the two intersecting grid line directions match the X direction and the Y direction, but the grid lines are not oriented in the X direction or the Y direction. In this case, instead of displacing each intersection point of the grid in the direction of two grid lines intersecting, the grid can be displaced in the X direction and the Y direction. When the direction and distance of the random displacement are set by computer processing, the displacement can be set more easily by displacing in the X and Y directions.
【００１１】本発明方法においては、板状のジグやマス
キングテープなどの、上記のようにして設定された位置
に、ドリルなどを用いて穴をあけ、この穴を通して砥粒
を工具の作用面に配置することができる。また、砥粒を
１個又は複数個ずつ、ＮＣ制御で作用面に固着すること
もでき、あるいは、設定された位置に接着剤又は粘着剤
をつけておき、砥粒を仮固定する方法を適用することも
できる。砥粒を固定する方法に特に制限はなく、電着、
ロウ付け、溶射などにより砥粒を固定することができ
る。本発明の砥粒工具の製造方法によれば、砥粒分布密
度を再現性よく制御して、性能が安定し、しかも被削材
表面に筋の残らない、作用面に砥粒を単層に固着した砥
粒工具を容易に製造し、眼鏡芯取り用ホイールなどの各
種材料の研削に用いる研削ホイールや、ＣＭＰコンディ
ショナなどの工具として効果的に使用することができ
る。In the method of the present invention, a hole is formed using a drill or the like at a position set as described above, such as a plate-shaped jig or masking tape, and abrasive grains are passed through the hole to the working surface of the tool. Can be arranged. Also, one or more abrasive grains can be fixed to the working surface by NC control, or a method of temporarily fixing the abrasive grains by applying an adhesive or a pressure-sensitive adhesive to a set position is applied. You can also. There is no particular limitation on the method of fixing the abrasive grains, electrodeposition,
The abrasive grains can be fixed by brazing, thermal spraying, or the like. According to the method of manufacturing an abrasive tool of the present invention, the abrasive grain distribution density is controlled with good reproducibility, the performance is stable, and there is no streak on the surface of the work material. The bonded abrasive tool can be easily manufactured and effectively used as a grinding wheel used for grinding various materials such as an eyeglass centering wheel and a tool such as a CMP conditioner.
【００１２】[0012]
【実施例】以下に、実施例を挙げて本発明をさらに詳細
に説明するが、本発明はこれらの実施例によりなんら限
定されるものではない。 実施例１ 寸法１００Ｄ−２０Ｔ−２０Ｈのダイヤモンドストレー
トホイールを製作し、眼鏡レンズの芯取りを行った。仮
想的な格子として、図７(ａ)に示すホイール回転方向の
格子線の間隔が９００μｍであり、ホイール回転方向の
格子線上に２,０００μｍおきに砥粒が配置される斜方
格子を想定した。砥粒として、平均粒径３５０μｍの人
造ダイヤモンド砥粒を用いた。図７(ａ)で○を付した交
点を、ＣＡＤを用いて乱数に基づき、回転方向に最大３
００μｍ、軸方向に最大１５０μｍランダムに変位させ
た。マスキングテープに、上記のＣＡＤで設定した砥粒
配列に基づき、直径４００μｍの穴をあけた。また、炭
素工具鋼Ｓ４５Ｃで、φ９９.３−２０Ｔ−２０Ｈの台
金を製作した。台金の外周作用面に、穴をあけたマスキ
ングテープを貼り付け、マスキングテープの穴部分に砥
粒を１個ずつ配置し、台金作用面に接着剤［セメダイン
(株)、工業用セメダイン］を用いて仮固定した。マスキ
ングテープを外したのち、仮固定した砥粒の間に平均粒
径約１００μｍのＮｉ−Ｃｒ系ロウ材粉末を充填し、外
周から三つ割の黒鉛製外型で固定し、真空炉中に載置し
て、５×１０-3Pa、１,０５０℃で１５分間保持して、
砥粒をロウ付けし、ホイールを完成した。このホイール
を眼鏡レンズ用玉刷り機に取り付け、乾式定圧切り込み
円筒研削方式により、直径７６.５mm、厚さ５.５mmのポ
リカーボネート製レンズの研削を行った。ホイール周速
を１,０５７ｍ／minとし、レンズ回転数６min-1で反転
を繰り返した。研削の結果は、バリが少なく、加工面の
凹凸が小さく、研削方向の筋は認められなかった。 比較例１ ダイヤモンド砥粒を配置する位置が仮想的な格子の交点
であって、ランダムに変位されていないダイヤモンドス
トレートホイールを製作し、眼鏡レンズの芯取りを行っ
た。仮想的な格子として、図７(ａ)に示すホイール回転
方向の格子線の間隔が９００μｍであり、ホイール回転
方向の格子線上に２,０００μｍおきに砥粒が配置され
る斜方格子を想定した。砥粒として、平均粒径３５０μ
ｍの人造ダイヤモンド砥粒を用いた。マスキングテープ
の図７(ａ)で○を付した交点の位置に、直径４００μｍ
の穴をあけた。また、炭素工具鋼Ｓ４５Ｃで、φ９９.
３−２０Ｔ−２０Ｈの台金を製作した。台金の外周作用
面に、穴をあけたマスキングテープを貼り付け、実施例
１と同様にして、マスキングテープの穴部分に砥粒を１
個ずつ仮固定したのち、砥粒をロウ付けし、ホイールを
完成した。このホイールを眼鏡レンズ用玉刷り機に取り
付け、実施例１と同様にしてポリカーボネート製レンズ
の研削を行った。レンズ外周の加工面に、深さ約０.１m
mの円周方向の溝が数本観察され、この溝がレンズの外
観を著しく悪化させた。 実施例２ 寸法１００Ｄ−４Ｔで、中心穴のないＣＭＰコンディシ
ョナを製作し、ポリッシングパッドのコンディショニン
グを行った。仮想的な格子として、図７(ｂ)に示す格子
線の間隔が１,０００μｍである正方格子を想定した。
砥粒として、平均粒径２５０μｍの人造ダイヤモンド砥
粒を用いた。正方格子の交点を、ＣＡＤを用いて乱数に
基づき、Ｘ方向及びＹ方向にそれぞれ最大３００μｍラ
ンダムに変位させた。マスキングテープに、上記のＣＡ
Ｄで設定した砥粒配列に基づき、直径２７０μｍの穴を
あけた。また、ステンレス鋼ＳＵＳ３０４で、１００Ｄ
−４Ｔの基板を製作した。基板の作用面に、穴をあけた
マスキングテープを貼り付け、マスキングテープの穴部
分に砥粒を１個ずつ配置し、基板の作用面に接着剤［セ
メダイン(株)、工業用セメダイン］を用いて仮固定し
た。マスキングテープを外したのち、ニッケルメッキに
より平均砥粒径の約７０％まで埋め込んで砥粒を固定
し、ＣＭＰコンディショナを完成した。このＣＭＰコン
ディショナを用いてポリッシングパッドをコンディショ
ニングしたのち、酸化膜付きシリコンウェーハのＣＭＰ
加工を行った。加工後のシリコンウェーハは、平坦度が
良好であり、スクラッチも認められなかった。EXAMPLES The present invention will be described in more detail with reference to the following Examples, which should not be construed as limiting the present invention. Example 1 A diamond straight wheel having dimensions of 100D-20T-20H was manufactured, and a spectacle lens was centered. As an imaginary grid, it is assumed that an interval between grid lines in the wheel rotation direction shown in FIG. 7A is 900 μm, and an orthorhombic grid in which abrasive grains are arranged every 2,000 μm on the grid lines in the wheel rotation direction. . As the abrasive, artificial diamond abrasive having an average particle diameter of 350 μm was used. In FIG. 7A, the intersections marked with a circle are identified by a maximum of 3 in the rotational direction based on random numbers using CAD.
It was displaced randomly at a maximum of 150 μm in the axial direction by 00 μm. A hole having a diameter of 400 μm was formed in the masking tape based on the abrasive grain arrangement set by the above CAD. In addition, a base metal of φ99.3-20T-20H was manufactured from carbon tool steel S45C. A masking tape with a hole is attached to the outer peripheral working surface of the base metal, abrasive grains are arranged one by one in the hole portion of the masking tape, and an adhesive [cemedine] is attached to the base metal working surface.
Co., Ltd., industrial mededine]. After removing the masking tape, Ni-Cr-based brazing filler metal powder having an average particle diameter of about 100 μm is filled between the temporarily fixed abrasive grains, and fixed with a 30% graphite outer mold from the outer periphery, and placed in a vacuum furnace. Place and hold at 5 × 10 −3 Pa, 1,050 ° C. for 15 minutes,
Abrasive grains were brazed to complete the wheel. The wheel was mounted on a spectacle lens balling machine, and a polycarbonate lens having a diameter of 76.5 mm and a thickness of 5.5 mm was ground by a dry constant-pressure incision cylindrical grinding method. Inversion was repeated at a wheel peripheral speed of 1,057 m / min and a lens rotation speed of 6 min -1 . As a result of grinding, there were few burrs, the unevenness of the processed surface was small, and no streak in the grinding direction was observed. Comparative Example 1 A diamond straight wheel was placed at the intersection of a virtual lattice where diamond abrasive grains were arranged and was not displaced at random, and the eyeglass lens was centered. As an imaginary grid, it is assumed that an interval between grid lines in the wheel rotation direction shown in FIG. . As abrasive grains, average particle size 350μ
m artificial diamond abrasive grains were used. At the intersection of the masking tape marked with a circle in FIG.
Drilled holes. In addition, carbon tool steel S45C, φ99.
A base metal of 3-20T-20H was manufactured. A masking tape with a hole is attached to the outer peripheral working surface of the base metal, and abrasive grains are applied to the hole of the masking tape in the same manner as in Example 1.
After being temporarily fixed individually, the abrasive grains were brazed to complete the wheel. The wheel was mounted on a spectacle lens ball-on press, and a polycarbonate lens was ground in the same manner as in Example 1. Approximately 0.1m depth on the processing surface of the lens periphery
Several grooves in the circumferential direction of m were observed, and these grooves markedly deteriorated the appearance of the lens. Example 2 A CMP conditioner having a size of 100D-4T and no center hole was manufactured, and conditioning of a polishing pad was performed. As a virtual grid, a square grid shown in FIG. 7B with grid line intervals of 1,000 μm was assumed.
As the abrasive grains, artificial diamond abrasive grains having an average particle size of 250 μm were used. The intersections of the square lattice were randomly displaced at a maximum of 300 μm in each of the X direction and the Y direction based on random numbers using CAD. Add the above CA to the masking tape
A hole having a diameter of 270 μm was formed based on the abrasive grain arrangement set in D. In addition, stainless steel SUS304, 100D
A -4T substrate was manufactured. A masking tape with a hole is attached to the working surface of the substrate, abrasive grains are arranged one by one in the hole portion of the masking tape, and an adhesive [Cemedine, industrial Cemedine] is used on the working surface of the substrate. Temporarily fixed. After removing the masking tape, the abrasive grains were fixed to about 70% of the average abrasive grain size by nickel plating to fix the abrasive grains, thereby completing a CMP conditioner. After conditioning the polishing pad using this CMP conditioner, the CMP of the silicon wafer with the oxide film is performed.
Processing was performed. The processed silicon wafer had good flatness and no scratch was observed.
【００１３】[0013]
【発明の効果】本発明の砥粒工具の製造方法によれば、
砥粒分布密度を制御することができ、しかも被削材表面
に筋の残らない、作用面に砥粒を単層に固着した砥粒工
具を容易に製造することができる。According to the method for producing an abrasive tool of the present invention,
The abrasive grain distribution density can be controlled, and an abrasive tool having no streaks on the surface of the work material and having abrasive grains fixed on the working surface in a single layer can be easily manufactured.
【図１】図１は、仮想的な格子の形状の例である。FIG. 1 is an example of a virtual grid shape.
【図２】図２は、０〜１の範囲の乱数列の一例である。FIG. 2 is an example of a random number sequence ranging from 0 to 1;
【図３】図３は、交点のランダム変位の計算例を示す説
明図である。FIG. 3 is an explanatory diagram illustrating an example of calculating a random displacement of an intersection.
【図４】図４は、本発明方法に用いられる変位距離の計
算を示す模式図の一例である。FIG. 4 is an example of a schematic view showing calculation of a displacement distance used in the method of the present invention.
【図５】図５は、本発明方法に用いられる変位距離の計
算を示す模式図の他の例である。FIG. 5 is another example of a schematic diagram showing the calculation of the displacement distance used in the method of the present invention.
【図６】図６は、本発明方法に用いられる変位距離の計
算を示す模式図の他の例である。FIG. 6 is another example of a schematic diagram showing calculation of a displacement distance used in the method of the present invention.
【図７】図７は、実施例において想定した仮想的な格子
である。FIG. 7 is a virtual grid assumed in the embodiment.
Claims (3)
あって、該工具の作用面に仮想的な格子を想定し、該格
子の個々の交点を、交差する２本の格子線方向又はＸ方
向とＹ方向に、それぞれ砥粒の平均粒径の３倍以下の距
離だけランダムに変位させた位置に砥粒が配置されてな
ることを特徴とする砥粒工具。An abrasive tool in which abrasive grains are fixed in a single layer on a working surface, wherein a virtual grid is assumed on the working face of the tool, and each intersection of the grid is defined by two intersecting points. An abrasive tool characterized in that abrasive grains are arranged at positions randomly displaced by a distance of not more than three times the average grain size of the abrasive grains in the grid line direction or the X direction and the Y direction, respectively.
おいて、該工具の作用面に仮想的な格子を想定し、該格
子の個々の交点を、交差する２本の格子線方向又はＸ方
向とＹ方向に、それぞれ砥粒の平均粒径の３倍以下の距
離だけランダムに変位させた位置に砥粒を配置すること
を特徴とする砥粒工具の製造方法。2. An abrasive tool in which abrasive grains are fixed in a single layer on the working surface, assuming a virtual grid on the working surface of the tool, and two grid lines intersecting each intersection of the grid. A method for manufacturing an abrasive tool, comprising: disposing abrasive grains at positions randomly displaced in the direction or the X direction and the Y direction by a distance equal to or less than three times the average particle size of the abrasive grains.
れる請求項２記載の砥粒工具の製造方法。3. The method according to claim 2, wherein the random displacement is set based on a random number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000382498A JP3947355B2 (en) | 2000-12-15 | 2000-12-15 | Abrasive tool and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000382498A JP3947355B2 (en) | 2000-12-15 | 2000-12-15 | Abrasive tool and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002178264A true JP2002178264A (en) | 2002-06-25 |
| JP3947355B2 JP3947355B2 (en) | 2007-07-18 |
Family
ID=18850308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000382498A Expired - Fee Related JP3947355B2 (en) | 2000-12-15 | 2000-12-15 | Abrasive tool and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3947355B2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007508153A (en) * | 2003-10-10 | 2007-04-05 | サンーゴバン アブレイシブズ，インコーポレイティド | Polishing tool made by self-avoiding abrasive grain arrangement |
| JP2007307701A (en) * | 2006-04-18 | 2007-11-29 | Nippon Steel Corp | Rotary grinding tool excellent in rust removal and base adjustment, its manufacturing method and rust removal and base adjustment method using it |
| JP2008062310A (en) * | 2006-09-05 | 2008-03-21 | Allied Material Corp | Metal bonded superabrasive wheel |
| JP2008302462A (en) * | 2007-06-07 | 2008-12-18 | Nikko Ootome Kk | Abrasive grain pasting device and abrasive grain pasting program |
| JP2009018415A (en) * | 2007-07-10 | 2009-01-29 | Oy Kwh Mirka Ab | Abrasive coating and manufacturing method of the same |
| JP2009136928A (en) * | 2007-12-03 | 2009-06-25 | Toyoda Van Moppes Ltd | Superabrasive grain setting method |
| US8342910B2 (en) | 2009-03-24 | 2013-01-01 | Saint-Gobain Abrasives, Inc. | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
| US8795036B2 (en) | 2006-07-10 | 2014-08-05 | Oy Kwh Mirka Ab | Method for manufacturing a flexible abrasive disc, and a flexible abrasive disc |
| US8905823B2 (en) | 2009-06-02 | 2014-12-09 | Saint-Gobain Abrasives, Inc. | Corrosion-resistant CMP conditioning tools and methods for making and using same |
| US8951099B2 (en) | 2009-09-01 | 2015-02-10 | Saint-Gobain Abrasives, Inc. | Chemical mechanical polishing conditioner |
-
2000
- 2000-12-15 JP JP2000382498A patent/JP3947355B2/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7993419B2 (en) | 2003-10-10 | 2011-08-09 | Saint-Gobain Abrasives Technology Company | Abrasive tools made with a self-avoiding abrasive grain array |
| JP2007508153A (en) * | 2003-10-10 | 2007-04-05 | サンーゴバン アブレイシブズ，インコーポレイティド | Polishing tool made by self-avoiding abrasive grain arrangement |
| US7507267B2 (en) | 2003-10-10 | 2009-03-24 | Saint-Gobain Abrasives Technology Company | Abrasive tools made with a self-avoiding abrasive grain array |
| JP2007307701A (en) * | 2006-04-18 | 2007-11-29 | Nippon Steel Corp | Rotary grinding tool excellent in rust removal and base adjustment, its manufacturing method and rust removal and base adjustment method using it |
| US8795036B2 (en) | 2006-07-10 | 2014-08-05 | Oy Kwh Mirka Ab | Method for manufacturing a flexible abrasive disc, and a flexible abrasive disc |
| JP2008062310A (en) * | 2006-09-05 | 2008-03-21 | Allied Material Corp | Metal bonded superabrasive wheel |
| JP2008302462A (en) * | 2007-06-07 | 2008-12-18 | Nikko Ootome Kk | Abrasive grain pasting device and abrasive grain pasting program |
| JP2009018415A (en) * | 2007-07-10 | 2009-01-29 | Oy Kwh Mirka Ab | Abrasive coating and manufacturing method of the same |
| JP2009136928A (en) * | 2007-12-03 | 2009-06-25 | Toyoda Van Moppes Ltd | Superabrasive grain setting method |
| US8342910B2 (en) | 2009-03-24 | 2013-01-01 | Saint-Gobain Abrasives, Inc. | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
| US9022840B2 (en) | 2009-03-24 | 2015-05-05 | Saint-Gobain Abrasives, Inc. | Abrasive tool for use as a chemical mechanical planarization pad conditioner |
| US8905823B2 (en) | 2009-06-02 | 2014-12-09 | Saint-Gobain Abrasives, Inc. | Corrosion-resistant CMP conditioning tools and methods for making and using same |
| US8951099B2 (en) | 2009-09-01 | 2015-02-10 | Saint-Gobain Abrasives, Inc. | Chemical mechanical polishing conditioner |
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| Publication number | Publication date |
|---|---|
| JP3947355B2 (en) | 2007-07-18 |
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