JP2001121427A - Rotary disk cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve cut surface accuracy by suppressing heat generation caused by contact with a material to be cut during cutting, and by preventing distortion and vibration of a baseplate, in a rotary disk cutter having an abrasive grain layer where super abrasive grains, e.g. diamond abrasive grains, CBN abrasive grains, or the like, are electrodeposited on the outer periphery and the side surfaces of the baseplate. SOLUTION: On the peripheral part 13 including the peripheral surface and the adjacent edge part of the baseplate 10, abrasive grains D are densely fixed so that most of the abrasive grains D come in contact with each other. In the intermediate area 14 between the peripheral part 13 and a tightening part 12, groups each containing three abrasive grains D or less are uniformly arranged at intervals so that he abrasive grains are arranged and fixed in proportions of 20-60% against the number of abrasive grains when densely arranged in the same area.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary disk cutter used for cutting construction materials, tiles, castings and the like.

[0002]

2. Description of the Related Art A rotating disk cutter used for cutting construction materials, tiles, castings, etc. forms a layer of super-abrasive grains such as diamond abrasive grains or CBN abrasive grains on the outer peripheral edge and both side faces of a disk-shaped substrate. The basic configuration is to cut the work material by performing the cutting. In the formation of the abrasive grain layer, an abrasive grain layer forming method by electrodeposition is adopted because the abrasive grains are less likely to fall off and dust is less generated.

[0003] In this kind of cutting using a rotating disk cutter, there are many manual operations using an electric tool. In the case of manual operation, the posture of the cutter becomes unstable, and the substrate of the cutter is attached to the material to be cut at the time of processing. Are easily contacted. When the substrate of the cutter comes into contact with the material to be cut while rotating at a high speed, heat or vibration is generated due to friction. Such heat and vibrations have a great effect on the accuracy of the cut surface and cause thermal distortion of the substrate.Therefore, it is necessary to suppress such phenomena as much as possible. Conventionally, various proposals have been made.

[0004] For example, Japanese Patent Publication No. 6-77901, Japanese Patent Application Laid-Open No. 8-168969, and Japanese Patent Application Laid-Open No. 9-300225
Japanese Patent Application Laid-Open Publication No. H11-139,009 discloses a rotating disk cutter in which abrasive layers which are electrodeposited on a side surface of a substrate are dispersed and arranged, and the particle diameter of abrasive grains is set to specific conditions. Japanese Patent Application Laid-Open No. 9-66468 describes a rotating disk cutter in which a number of fine electrodeposition patterns are formed on the side surface of a substrate by screen printing using insulating ink. According to these rotary disk cutters, it is said that the effects of reducing heat generation and vibration during cutting and improving durability are obtained.

Also, the present applicant has disclosed a rotating disk cutter in which the area ratio of superabrasive grains in the electrodeposited region on the side surface of the substrate is 40 to 60% in Japanese Patent Application Laid-Open No. Hei 9-123064. By setting the distribution of the superabrasive grains on the side surface of the substrate to a specific range in this manner, it is possible to improve the sharpness and the durability and to prevent the substrate surface from being damaged.

[0006]

However, in the rotating disk cutter described in each of the above publications, the abrasive grain layers electrodeposited on the side surface of the substrate are dispersed and arranged. Dozens or more abrasive grains are fixed, and this abrasive layer will intermittently come into contact with the workpiece during cutting, causing vibration and noise to occur, causing damage to the substrate, There is a problem that the accuracy of the cut surface is also adversely affected.

Further, since the abrasive grains are densely fixed to each abrasive grain layer, the cutting depth of the abrasive grains during the cutting process becomes shallow, so that the abrasive grains easily slide upward. Problem.

[0008] The problem to be solved by the present invention is to improve the arrangement of abrasive grains, particularly on the side face of the substrate, in a rotating disk cutter having an abrasive grain layer formed on the outer peripheral edge and both side faces of the substrate. The object of the present invention is to suppress the heat generated by the contact with the workpiece and to prevent the substrate from being distorted or vibrated, thereby improving the cut surface accuracy.

[0009]

Means for Solving the Problems The inventors of the present invention have developed a mode of denseness of abrasive grains in an abrasive layer on the side surface of a substrate formed by electrodeposition, and an individual dispersion of the abrasive layer and a coating during cutting. Through extensive research on the relationship between the heat generated by contact with the cutting material and the distortion and vibration of the substrate, by reducing the number of abrasive grains that converge at one location of the abrasive layer formed on the side surface of the substrate to three or less It has been found that the above problems can be solved.

That is, the present invention relates to a rotary disk cutter in which an abrasive layer formed by electrodepositing superabrasives such as diamond abrasives or CBN abrasives is formed on the outer peripheral edge and both side surfaces of the substrate. An abrasive grain layer in which the number of abrasive grains in a group is 3 or less is uniformly arranged on both side faces at intervals, and abrasive grains are densely arranged on an outer peripheral edge of the substrate. I do.

[0011] Here, "arranging the abrasive layers with the number of abrasive grains in one group equal to or less than 3 uniformly at intervals" means that:
The arrangement of the abrasive layer on the side surface of the substrate is such that the abrasive particles are individually arranged one by one, or two or three adjacent abrasive particles are grouped as a group, and are uniformly arranged on both side surfaces of the substrate at an interval from each other. To do. From the viewpoint of uniformity in the side surface portion of the substrate, it is desirable to make the number of abrasive grains in one group of the abrasive layer the same, but a group in which the number of abrasive grains in one group is different can also be arranged.

In the above-mentioned conventional rotary disk cutter, although several abrasive grains are electrodeposited on the side surface of the substrate, several tens or more grains are densely fixed in each abrasive grain layer. Therefore, the cutting depth of the abrasive grains at the time of the cutting process is shallow, and it is easy to slip upward, and heat generation increases due to the slip. On the other hand, in the rotating disk cutter according to the present invention, three or less abrasive layers per group are uniformly arranged at intervals, so that the cutting depth of the abrasive grains can be increased, thereby increasing the slipperiness. Is prevented, and heat generation is suppressed.

In the conventional rotary disk cutter described above, the dispersed electrodeposited abrasive layer is intermittently brought into contact with the material to be cut during the cutting process, so that vibration and noise are easily generated, and Although there was a problem of causing breakage and adversely affecting the cut surface accuracy, in the rotating disk cutter of the present invention, three or less abrasive layers per group are uniformly arranged at intervals. In addition, heat, vibration and noise during the cutting process are reduced, and breakage of the substrate is prevented, so that good cut surface accuracy can be obtained.

In the rotating disk cutter according to the present invention, the number of abrasive grains on both side surfaces of the substrate is preferably set to 20 to 60% of the number of abrasive grains when the abrasive grains are densely arranged in the same area. desirable. If this ratio is less than 20%, the number of abrasive grains is too small, resulting in poor protection and abrasion resistance of the substrate. If it exceeds 60%, the number of abrasive grains in contact increases, the cutting depth of the abrasive grains becomes shallow, and slippage occurs. This makes it easier to generate heat.

[0015]

FIG. 1 is a front view showing a rotary disk cutter according to an embodiment of the present invention, and FIG. 2 is a view showing a sectional structure thereof.

In the drawing, a mounting hole 11 for passing a rotating main shaft of a cutting device is provided at the center of a steel disk-shaped substrate 10, and a periphery of the mounting hole 11 is a fastening portion 12.
The dimensions of the substrate 10 are an outer diameter of 100 mm, a thickness of 0.5 mm,
The inner diameter of the mounting hole 11 is 20 mm, and the width of the fastening portion 12 in the radial direction is 15 mm.

In the present embodiment, the peripheral surface 13 including the peripheral surface of the substrate 10 and the edge following the peripheral surface is substantially formed as shown in FIGS. All the diamond abrasive grains D are fixed in a dense state so as to be in contact with each other. In the intermediate region 14 between the peripheral portion 13 and the fastening portion 12, as shown in FIGS. 1 and 2 and a partially enlarged view of FIG. They are arranged uniformly. The average diameter of the diamond abrasive grains D is 500 μm.

Assuming that the density of the abrasive grains in the peripheral portion 13 and the intermediate region 14 is 100, the density of the abrasive particles in the intermediate region 14 is about 40, assuming that the density of the abrasive particles in the peripheral portion 13 is 100. In this way, by arranging the abrasive grains D one by one in the intermediate region 14 independently and uniformly, heat generation, vibration and noise during cutting are reduced, and good cutting surface accuracy is obtained. be able to.

FIG. 3B is a view showing another example of the arrangement of the abrasive grains in the intermediate area 14. In this example, three adjacent
This is an example in which three abrasive grains D are grouped as one group, and three abrasive grain layers per group are uniformly arranged in the intermediate region 14 at intervals. In this case, the density of abrasive grains is also about 40, and the same effect as in the case of one group can be obtained.

[Test Example] The density of the abrasive grains in the intermediate region 22 of the substrate 20 having the outer peripheral slit 21 shown in FIG. As shown in FIG. 4B, the cutters (cutter numbers 1 to 6) changed variously in the range and the peripheral edge 33 of the substrate 30 having the outer peripheral slit 31 and the intermediate region 32 formed radially have abrasive grains. A cutting test was performed under the following conditions using a cutter (cutter number 7) provided with an abrasive layer having a density of 100%. Cutting process conditions Machine used: Hand-held electric cutting machine 100V 6A, rotation speed 900rpm Material to be cut: Ceramic outer wall material 300mm x 300mm x 5mm Cutting method: Dry manual feed cutting

Table 1 shows the specifications of the cutter.

[Table 1]

FIGS. 5 and 6 show the test results. FIG.
Indicates the number of cuts until a spark is generated from the side surface of the substrate in the cutting by each cutter. FIG. 6 shows the average value of the chipping magnitude T (see FIG. 7) of the material to be cut at the tenth cut by each cutter. As shown in FIG. 7, the measurement of chipping is performed by measuring the magnitude T of chipping in a direction perpendicular to the cut surface F of the cut material S after cutting at 14 points at intervals of 20 mm in the cutting direction C. The average value is shown in FIG.

As can be seen from FIGS. 5 and 6, the cutters Nos. 1 and 2 have too high abrasive grain densities, so that the cutting depth of the abrasive grains becomes shallow. Also became large.
On the other hand, in cutter number 6, since the number of abrasive grains was too small, the substrate came into contact with the material to be cut, generating heat, and the number of cuts was extremely reduced. Cutter No. 7 has a small heat generation during cutting because the abrasive grain layer region is partial, but has a large chipping because the abrasive grain layer intermittently contacts the workpiece.
On the other hand, the cutter numbers 3, 4, and 5 of the product of the present invention have an appropriate abrasive grain density, so that the abrasive grains do not slip and the substrate does not contact the workpiece, and the uniform arrangement of the abrasive grains. Since there is no intermittent contact with the material to be cut, the number of cuts before sparks are generated is large, and chipping is small.

[0024]

According to the present invention, the following effects can be obtained.

(1) By arranging the abrasive layers in which the number of abrasive grains in one group is 3 or less uniformly on both side surfaces of the substrate at intervals, the cutting depth of the abrasive grains can be increased. This prevents an upward slip and suppresses heat generation. Also,
Since three or less abrasive layers per group are uniformly spaced on both sides of the substrate, vibration and noise due to intermittent contact during the cutting process are reduced, and breakage of the substrate is prevented, resulting in good cutting. Surface accuracy can be obtained.

(2) By setting the number of abrasive grains arranged on both side surfaces of the substrate in a specific range, the above-mentioned effects can be surely exerted while maintaining the protection and wear resistance of the substrate. .

[Brief description of the drawings]

FIG. 1 is a front view showing a rotating disk cutter according to an embodiment.

FIG. 2 is a view showing a sectional structure of the rotating disk cutter of FIG. 1;

FIG. 3 is a view showing an arrangement state of abrasive grains.

FIG. 4 is a view showing an abrasive layer of a cutter used in a cutting test.

FIG. 5 is a graph showing test results.

FIG. 6 is a graph showing test results.

FIG. 7 is an explanatory diagram of a chipping measurement method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 11 Mounting hole 12 Tightening part 13 Peripheral edge 14 Intermediate area 20, 30 Substrate 21, 31 Outer peripheral slit 22, 32 Intermediate area 23, 33 Peripheral edge D Diamond abrasive grain T Chipping

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C058 AA03 AA09 CA01 CB01 CB10 3C063 AA02 AB03 BA12 BB02 BB21 BC02 BG07 CC12 EE31 FF03 FF11 FF30

Claims (2)

[Claims] 1. A rotating disk cutter having an abrasive grain layer formed by electrodepositing superabrasive grains such as diamond abrasive grains or CBN abrasive grains on an outer peripheral edge and both side faces of a substrate, wherein the both sides of the substrate are provided. A rotating disk cutter in which a group of abrasive grains in which the number of abrasive grains in a group is 3 or less is uniformly arranged at intervals, and the abrasive grains are densely arranged on an outer peripheral portion of the substrate; 2. The number of abrasive grains on both sides of the substrate is 20 to 6 with respect to the number of abrasive grains when the abrasive grains are densely arranged in the same area.
2. The rotating disk cutter according to claim 1, wherein the ratio is 0%.