JP2002170749A - Method for manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component by which handling is made easy and breakage, cracking, adhesion of contamination, etc., hardly occur in a series of manufacturing steps from dicing to film formation of a substrate. SOLUTION: A dicing sheet is adhered to the rear surface of a ceramic substrate, and dicing grooves are formed on the front surface of the ceramic substrate and the ceramic substrate is divided into a plurality of works. Next, while dicing sheets are still adhered to one main surfaces of the works, film formation sheets are adhered to the other main surfaces of the works, and then the dicing sheets are peeled off, thereby shifting the works from the dicing sheets to the film formation sheets. Finally, while the film formation sheets are still adhered to the works, a thin film is formed on the main surface and side surface of the respective work by using the thin film formation method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component having a conductive film formed on its surface, and more particularly to a method for manufacturing a chip-type electronic component such as a capacitor, an actuator, and an inductor.

[0002]

2. Description of the Related Art In general, a multilayer chip electronic component is obtained by dividing a ceramic substrate, which is a parent substrate obtained by alternately laminating and firing ceramic green sheets and internal electrodes, into a plurality of works, and then applying external electrodes to the surface of each work. It is manufactured through a process of forming a conductive film that becomes

[0003] In the step of dividing the ceramic substrate into a plurality of works in the above manufacturing process, an adhesive sheet is attached to the back surface of the substrate to facilitate the work, and dicing grooves are formed from the surface of the substrate in that state. A method of forming and dividing into a plurality of strip-shaped or chip-shaped works may be used. By using this method, the divided works are in a state of being adhered to the pressure-sensitive adhesive sheet, so that there is no fear that the respective works are dispersed and the work efficiency is improved.

[0004] When the substrate is divided into a plurality of works using the above-described method, in the step of forming a conductive film serving as an external electrode on the surface of each work, the work adhered to the adhesive sheet in a dicing cut state is used. Is removed from the adhesive sheet, and once transferred to a tray, the work is packed in a metal mask, and steps such as washing, drying, and film formation are performed.

[0005]

However, when a conductive film is formed on a work by the above-described method, there are the following problems. That is, when the work is small, such as a chip-type electronic component, there is a problem that it is extremely difficult to transfer the work to a tray or pack the mask.
In addition, when a work is transferred to a tray or packed with a mask, cracks, chips, stains, and the like are likely to be generated on the work, which causes deterioration of characteristics of the electronic component. In order to prevent cracking and chipping when filling the mask, it is necessary to increase the dimension of inserting the work, but on the other hand, there is a problem that the position accuracy of the work is not obtained. Similarly, in the case of a work having a small thickness, there is a problem that cracks and chips are easily generated when the work is put in a mask and flows due to warpage and thinness during firing.

Accordingly, the present invention provides easy handling, cracking, chipping,
Provided is a method for manufacturing an electronic component that is unlikely to cause stains or the like.

[0007]

A method of manufacturing an electronic component according to the present invention comprises the steps of: adhering the back surface of a ceramic substrate to a dicing sheet; and forming a dicing groove from the surface of the ceramic substrate to form a plurality of workpieces on the ceramic substrate. Dividing the dicing sheet from the plurality of works, fixing one main surface of the plurality of works to the film-forming sheet, and forming one main surface of the plurality of works into the film-forming sheet. Forming a thin film on at least a part of the other main surface and the side surface of each work in a fixed state by using a thin film forming method.

As described above, after the ceramic substrate is divided into a plurality of works, the work is transferred from the dicing sheet to the film forming sheet, and the film is formed while being adhered to the film forming sheet. There is no need to pack the work in a mask. Therefore, handling of the work becomes easy,
It is possible to reduce the occurrence of cracks, chips, and stains on the work.

Further, by transferring from the dicing sheet to the film-forming sheet, the cut debris generated during dicing and adhering to the dicing sheet is not carried into the film-forming process, and the film-forming defect due to the adhered substance is eliminated. Can be prevented.

In the method of manufacturing an electronic component according to the present invention, a step of adhering the back surface of the ceramic substrate to a dicing sheet and a step of forming a dicing groove from the surface of the ceramic substrate to divide the ceramic substrate into a plurality of works. When,
With multiple workpieces adhered to the dicing sheet,
A step of fixing one main surface of the plurality of works to the film-forming sheet, a step of separating the dicing sheet from the plurality of works, and a step of fixing one main surface of the plurality of works to the film-forming sheet. Forming a thin film on at least a part of the other main surface and the side surface of the work by using a thin film forming method.

As described above, since the work is fixed to the film-forming sheet while the work is adhered to the dicing sheet, the transfer operation becomes very easy. In addition, it is possible to reduce the occurrence of cracks, chips, and stains on the work when the work is transferred to the tray.

Further, after the step of dividing the ceramic substrate into a plurality of works, a step of extending the dicing sheet to increase the distance between the works may be performed.

In order to minimize the loss of material due to dicing, it is desirable to divide the work using a narrow dicing cutter. In this case, each work is used for dicing with a very narrow space between the works. This means that the sheet is adhered. Therefore, if the film is transferred to the film-forming sheet in this state and the film is formed, the interval between the works is narrow, and there is a possibility that a thin film may not be formed sufficiently to the side surface of the work. Therefore, if the dicing sheet is stretched after the work is divided to expand the interval between the works, a film can be sufficiently formed on the side surface of the work, and the film forming accuracy can be improved.

The dicing sheet is desirably a sheet having a base material surface coated with an adhesive, and particularly desirably a sheet having heat resistance. For example, when using a base material made of polyimide, when forming an electronic component that requires high precision, it is necessary to form a dicing groove up to a position reaching the base material, but polyimide is a thermosetting resin. Since it has heat resistance at a relatively high temperature, heat generation at the time of dicing does not cause the base material to melt and adhere to the dicing blade, thereby preventing chipping.

The film-forming sheet is desirably a sheet in which a pressure-sensitive adhesive is applied to a substrate, and particularly desirably has heat resistance. For example, when a sheet in which a silicone-based adhesive is applied on a substrate made of polyimide is used, both polyimide and the silicone-based adhesive have relatively high heat resistance, and are formed by a rise in temperature in a film forming process. Outgassing from the film sheet can be suppressed as much as possible.

Further, before the step of fixing one main surface of the plurality of works to the film-forming sheet, a step of heat-treating the film-forming sheet may be performed in advance. If the temperature of the pressure-sensitive adhesive sheet rises significantly in the subsequent film-forming process, outgassing occurs due to evaporation of the film-forming sheet, which leads to deterioration of the film quality such as reduced crystallinity and density of the formed thin film, inclusion of impurities, and discoloration. May be invited. Therefore, deterioration of the film quality of the thin film can be prevented by performing a heat treatment on the film-forming sheet in advance and generating outgas from the adhesive.

Further, before the step of forming a thin film using the thin film forming method, a step of irradiating the pressure-sensitive adhesive-coated surface of the film-forming sheet with ultraviolet rays may be performed in advance. In this way, by irradiating the ultraviolet light, the dirt on the work surface is decomposed and removed, and at the same time, the adhesive strength of the portion of the film formation sheet where the work is not adhered is lost, and the handling of the film formation sheet in the subsequent process is performed. Can be facilitated.

The ceramic substrate may be composed of a ceramic layer and an electrode layer alternately laminated. In the step of dividing the ceramic substrate into a plurality of works, a part of the electrode layer It is desirable to form a dicing groove so as to be exposed on the side surface of the substrate. Further, it is preferable that the thin film formed in the step of forming the thin film by using the thin film forming method be a thin film having conductivity.

The method of manufacturing an electronic component according to the present invention is particularly suitable for manufacturing a small and difficult-to-handle electronic component such as a chip-type electronic component. Further, according to the present invention, since it is possible to sufficiently form a film on the side surface of the work, a dicing groove is formed so that a part of the internal electrode layer of the multilayer chip component is exposed, and By forming a conductive thin film, an external electrode that is electrically connected to the internal electrode can be easily formed.

Further, by cutting a part of the thin film on the main surface portion of the work, conduction between the thin films formed on the opposite side surfaces of the work can be cut off, and a pair of external electrodes can be formed.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] In this embodiment, a method of manufacturing a laminated piezoelectric actuator using the present invention will be described with reference to FIG.
This will be described with reference to FIGS.

First, a ceramic multilayer substrate 1 and a pressure-sensitive adhesive sheet 2 having a size of 50 mm square and a thickness of 0.52 mm were prepared, and one main surface of the ceramic multilayer substrate 1 was adhered to the pressure-sensitive adhesive sheet 2 as shown in FIG.

The multilayer substrate 1 is formed by alternately stacking piezoelectric ceramic layers and internal electrode layers.
The ceramic layer has upper and lower outer layers having a thickness of 0.06 mm and 20 inner layers having a thickness of 0.02 mm. The internal electrodes are
It is formed at a position exposed every other side of the work by a later dicing process.

As the dicing sheet 2, a sheet obtained by applying a silicone-based adhesive on a substrate made of polyimide was used. However, the dicing sheet only needs to be capable of holding the substrate by adhesive, and is not limited to the configuration in which the adhesive is applied to the surface of the base material. In the case of sticking, in order to maintain the stretched state of the dicing sheet, the dicing sheet may be stuck so as to cover the hole of the donut-shaped metal ring, and the ceramic multilayer substrate may be stuck thereon.

Subsequently, as shown in FIG.
Ceramic dicing board 1 using a dicing blade
Was diced from the surface opposite to the surface to be bonded to the dicing sheet 2 and divided into a plurality of works 3. Each work 3
Is a strip having a width of 5.2 mm and a length of 50 mm.
In this state, the internal electrodes 7 are exposed every other side in the longitudinal direction. FIG. 3 shows an enlarged view of the work.

Since a workpiece for an actuator is required to have particularly high shape accuracy, it is necessary to form a dicing groove extending from the surface of the substrate of the dicing sheet 2 to several tens μm or more inside. Here, since the polyimide substrate used in the present example is a thermosetting resin and has a relatively high temperature heat resistance, the substrate does not melt due to heat generated during dicing and does not adhere to the dicing blade. , The occurrence of chipping can be prevented. In addition, since polyimide is a hard resin, debris shaved by dicing rarely adheres to the work, and it is possible to prevent a film formation defect due to an adhered substance in a later film formation step.

The material of the base material is not limited thereto, and epoxy resin, Teflon (registered trademark), bakelite, or the like can be used. However, in terms of heat resistance, ease of processing into a thin sheet, hardness, and the like. Therefore, polyimide is considered to be most preferable.

Next, the work 3 is placed on the dicing sheet 2.
After being washed in a state where is adhered, it was dried by heating. At this time, since the dicing sheet 2 is formed of a polyimide resin having heat resistance, it can be dried at a higher temperature and the processing time can be reduced. Therefore, the possibility that dust adheres to the work surface during drying is low, and it is possible to prevent the occurrence of film formation failure due to the adhered matter in the subsequent film formation process.

Next, as shown in FIG. 4, in a state where one main surface of the work 3 is adhered to the dicing sheet 2,
A film-forming sheet 10 was attached to the other main surface of the work 3. Subsequently, by peeling the dicing sheet 2 from the work 3, the work 3 could be transferred from the dicing sheet 2 to the film-forming sheet 10 very easily.

The film-forming sheet 10 used was a polyimide base material coated with a silicone-based adhesive. Because these materials have heat resistance up to relatively high temperatures,
This is because deformation and alteration are unlikely to occur even when the temperature rises in a later film forming step. The material of the film-forming sheet 10 is not limited to this, and a heat-resistant base material such as Teflon or PPS can be used for the base material, and a heat-resistant adhesive material such as acrylic can be used for the adhesive. However, the film-forming sheet may be any as long as it can fix and hold the work, and is not limited to the configuration in which the adhesive is applied to the surface of the base material. Alternatively, the film-forming sheet may be adhered after the adhesive is applied to the work side.

Next, in a state where the work 3 is adhered to the film-forming sheet 10, ultraviolet light is irradiated from the side of the pressure-sensitive adhesive applied side of the film-forming sheet 10, and the surface of the work 3 is decomposed and removed for cleaning. At the same time, the adhesive strength of the portion of the film-forming sheet 10 where the work 3 was not adhered was eliminated. The silicone-based or acrylic-based adhesive used in the present invention loses its adhesive strength by being irradiated with ultraviolet rays, and in order to enhance the cleaning effect, it is necessary to irradiate with ultraviolet rays of a low wavelength capable of generating heat and generating ozone. Is considered desirable. In this embodiment,
Irradiation was performed for 10 minutes while heating to 150 ° C. in the air using an ultraviolet irradiator using a low-pressure mercury lamp of 100 W.

Subsequently, a film was formed in a state where the work 3 was adhered to the film forming sheet 10. In this embodiment, (Cr / Ni
/ Au) to form an electrode film having a laminated structure. FIG. 5 is a simplified diagram of a film forming apparatus. The film forming apparatus includes a vapor deposition source 6 and a sample fixing plate 4 arranged at a position 500 mm above the evaporation source 6, and the fixing plate 4 is attached so as to be rotatable about a central axis 5 fixed in a horizontal direction. . The film forming sheet 10 to which the work 3 was adhered was fixed to the sample fixing plate 4 such that the longitudinal direction of the work 3 was parallel to the central axis 5.

The thickness of the electrode film is Cr / Ni / Au = 0.
2 / 0.4 / 0.2 μm, pressure 2 × 10 ⁻³ Pa, deposition rate 0.5 to 1.0 nm / s, substrate heating temperature 100
Film formation was performed while rotating the sample fixing plate 4 under the condition of ° C. In this embodiment, the temperature of the substrate rises to about 150 ° C. due to heat generation during film formation. However, since a film formation sheet having a high temperature resistance is used, deformation and deterioration of the film formation sheet are prevented. Can be prevented. In addition, since the film-forming atoms can be made incident on the main surface of the work obliquely by rotating the sample fixing plate, the cross section of the dicing groove as shown in FIG. A film could also be formed. The electrode film thus formed is connected to the internal electrode 7 exposed on the side surface in the longitudinal direction of the work.

In this embodiment, the film is formed by using the vapor deposition method. However, the film is not limited to this method, but may be formed by using other thin film forming methods such as an ion plating method, a sputtering method, and a PVD method. it can. Further, the present invention is not limited to the electrode film as in the present embodiment, but may be a protective film such as SiO ₂ , Al ₂ O ₃ ,
A functional film such as nO can be formed using the same method.

Finally, as shown in FIG. 7, by cutting a part of the electrode film on the main surface portion of the work on which the electrode film is formed on the main surface and the longitudinal side surface, the opposing longitudinal side surface is cut. The electrical continuity between the formed electrode films is cut off. Through the above steps, a laminated piezoelectric actuator 9 having the internal electrode 7 and the external electrode 8 electrically connected to the internal electrode 7 is completed.

As described above, in this embodiment, after the ceramic substrate is divided into a plurality of works, the work is transferred from the dicing sheet to the film-forming sheet, and the work is adhered to the film-forming sheet. Since there is no need to transfer the work to the tray or pack the work in a mask, it is easy to handle the work, and cracks, chips and dirt on the work, cracks and chips on the external electrode, etc. Could be prevented.

Although the input and output of electric signals of the laminated piezoelectric actuator are normally performed from external electrodes located on the main surface of the work, the laminated piezoelectric actuator of the present embodiment has a reduced external electrode chipping particularly at the edge portion. Therefore, a highly reliable laminated piezoelectric actuator with good electrical conduction between the external electrodes located on the main surface portion of the work and the external electrodes located on the side surface portions could be formed.

[Second Embodiment] A second embodiment of the present invention is characterized in that a heat treatment is applied to the film-forming sheet 10 in advance. For example, when connection is made to a completed laminated piezoelectric actuator element by using wire bonding, the external electrodes of the element are Cr / Ni / Au = 0.2 / 0.8 / 1.
A thickness of about 0 μm is required. If the film thickness is increased while the film formation rate is kept constant, the film formation time becomes longer. As a result, there is a problem that the temperature rise of the substrate due to heat generation during the film formation becomes large. However, when the substrate temperature rises excessively, it is difficult to prevent outgassing even when a film-forming sheet made of a heat-resistant polyimide base material or a silicon-based adhesive is used. Therefore, in this embodiment, the heat treatment is performed on the film-forming sheet in advance before the film formation, thereby preventing the characteristic deterioration of the formed thin film.

In this embodiment, a laminated piezoelectric actuator is formed in the same process as in the first embodiment, except that a heat treatment is performed on a film-forming sheet in advance and that a conductive film to be formed is thick. did. Heat treatment of the film forming sheet is performed in a vacuum oven at various temperatures between 150 and 280 ° C.
The film was formed using a vapor deposition method under the conditions of a pressure of 2 × 10 ⁻³ Pa, a film formation rate of 0.5 to 1.0 nm / s, and a substrate heating temperature of 100 ° C., with Cr / Ni / Au = 0.2 / 0. 0.8 / 1.0 μm
Was formed. At this time, the temperature of the substrate rose to about 180 ° C.

Table 1 shows the relationship between the heat treatment temperature of the film-forming sheet, the film quality of the formed electrode film, and the adhesive strength of the film-forming sheet.

[0041]

[Table 1]

In the column of the adhesive strength of the film-forming sheet in Table 1, ◎ indicates that the work is strongly adhered to the film-forming sheet, and ○ indicates that the work is slightly adhered to the film-forming sheet although the adhesive strength is slightly reduced. A state where the adhesive is sufficiently adhered, a state where the adhesive force is reduced and the work cannot be sufficiently held, and a case where the adhesive force is lost are shown.

As shown in Table 1, when the film-forming sheet heat-treated at 150 ° C. or lower was used, the electrode film was discolored.
Although discoloration was observed in a part of the electrode film, no discoloration was observed when heat treatment was performed at a higher temperature. That is, when the heat treatment is performed at 180 ° C. or more, the effect of suppressing outgas during film formation is observed. By performing the heat treatment at 180 ° C. or more in advance, the low molecular components and the solvent containing the outgas are caused. Can be removed from the adhesive by evaporation, and the characteristics of the formed electrode film can be maintained.

Next, from the column of adhesive strength of the film-forming sheet in Table 1, it can be seen that the adhesive strength of the film-forming sheet decreases as the heat treatment temperature increases. This can be confirmed from the amount of the adhesive adhered to the work when the work is removed from the film-forming sheet. As described above, it is considered that the reason why the adhesive strength decreases with the increase in the heat treatment temperature is that the low molecular components are evaporated and removed by the heat treatment.

From the above results, if the heat treatment temperature is low, there arises a problem that the quality of the electrode film is deteriorated due to the generation of outgas during film formation, and if the heat treatment temperature is high, the adhesive force is reduced by removing low molecular components. Problems arise.
In this embodiment, it is most appropriate to perform the heat treatment in a temperature range of 200 to 220 ° C. as a condition of the heat treatment that causes little deterioration of the film quality of the electrode film and has sufficient adhesive force to hold the work. it is conceivable that.

In this embodiment, the heat treatment of the film-forming sheet is performed in a vacuum oven, but it is considered that the same effect can be obtained in the air. The sheet for film formation during heat treatment is
There is no difference depending on the shape such as a roll shape and a sheet shape, and there is no influence by the presence or absence of the separator. Further, it is considered that the optimum temperature for the heat treatment differs depending on the material of the film-forming sheet.

[Third Embodiment] A third embodiment of the present invention relates to a process of dividing a ceramic substrate into a plurality of works.
It is characterized in that a dicing cutter having a small width is used, and further, after the work dividing step, a dicing sheet is stretched to extend a work interval. The other steps are the same as in the case of the first embodiment, and a description thereof will be omitted.

That is, in this embodiment, the width is 0.05 mm.
After the ceramic substrate is divided into a plurality of works 13 using a dicing cutter, the dicing sheet 12 is stretched using an expander in a state where the work 13 is adhered to the dicing sheet 12, and the interval between the works 13 is expanded. I let it.

The distance between the works divided by dicing is very narrow, about the width of a dicing cutter (0.05 mm) (FIG. 8). (Fig. 9). In this state, after the film forming sheet 20 is adhered to the other main surface of the work 3 and the dicing sheet 12 is peeled off from the work 13, the film forming sheet 20 in which the works 13 are arranged at wide intervals is formed. Obtained.

In this state, a film was formed by rotating the sample fixing plate in the same manner as in the first embodiment. In the present example, the workpieces were arranged widely, so that the film could be more sufficiently formed on the side surfaces in the longitudinal direction of the workpiece.

In order to obtain a wide work interval, it is necessary to divide the substrate using a wide dicing cutter, which causes a problem that the material loss is large. Therefore,
By performing the process of stretching for dicing after dividing the substrate as in the present embodiment, the substrate can be divided by a narrow dicing cutter, thereby reducing material loss and cost.

The method of stretching the dicing sheet is not limited to using an expander, but any method may be used as long as the dicing sheet can be stretched. Further, instead of stretching the dicing sheet, the work may be transferred to a film-forming sheet, and then the film-forming sheet may be stretched to increase the interval between the works.

[Fourth Embodiment] In a fourth embodiment of the present invention, after a step of dividing a ceramic substrate into a plurality of works, a dicing sheet is once separated from the works and aligned, and then the works are formed into a film. The feature is that the steps are performed in the order of fixing to the sheet. For other steps,
The description is omitted because it is the same as in the first embodiment.

That is, in this embodiment, after the ceramic substrate is divided into a plurality of works, the dicing sheet is once peeled off from the works to align the works. On this occasion,
The distance between the works was arranged so as to be wider than when the work was adhered to the dicing sheet, and the work was fixed to the film forming sheet in that state.

As described above, in this embodiment, since the workpieces are widely arranged on the film-forming sheet, the film can be more sufficiently formed on the side surfaces in the longitudinal direction of the workpiece as in the third embodiment. Was.

In the above embodiment, the case where a multilayer piezoelectric actuator is manufactured has been described as an example. However, the present invention can be applied to the manufacture of other chip-type multilayer components such as a multilayer capacitor and a multilayer inductor. Furthermore, the present invention is not limited to the manufacture of chip-type laminated components, but can be applied to the manufacture of any chip-type electronic components.

[0057]

As described above, according to the present invention, after the ceramic substrate is divided into a plurality of works, the work is transferred from the dicing sheet to the film-forming sheet, and then formed in a state of being adhered to the film-forming sheet. Since the film is formed, there is no need for a step of transferring a work to a tray or a step of packing the work in a mask. Therefore, handling of the work was facilitated, and cracking, chipping, and adhesion of the work could be prevented.

Further, after the step of dividing the ceramic substrate into a plurality of works, if a step of extending the dicing sheet to extend the interval between the works is performed, the dicing may be performed with a narrow dicing cutter. However, it was possible to sufficiently form a film on the side surface of the work, and to reduce material loss due to dicing.

Further, prior to the step of attaching the film-forming sheet to the back surface of the ceramic substrate, a step of subjecting the film-forming sheet to a heat treatment was performed in advance, and outgassing was generated from the adhesive. Even in the case where the temperature of the film-forming sheet greatly increases in the process, deterioration of the film quality such as decrease in crystallinity and density of the formed thin film, inclusion of impurities, and discoloration could be prevented.

In addition, after the step of transferring the work to the film-forming sheet, a step of irradiating the pressure-sensitive adhesive applied surface of the film-forming sheet with ultraviolet rays is performed. Thus, the adhesive strength of the portion of the sheet for which the work was not adhered was eliminated, and the handling of the film-forming sheet in the subsequent steps could be facilitated.

[Brief description of the drawings]

FIG. 1 is a view showing one step of a method for manufacturing an electronic component according to a first embodiment of the present invention.

FIG. 2 is a view showing one step of a method of manufacturing an electronic component according to the first embodiment of the present invention.

FIG. 3 is an enlarged view showing a work in a process shown in FIG. 2;

FIG. 4 is a view showing one step of a method for manufacturing an electronic component according to the first embodiment of the present invention.

FIG. 5 is a view illustrating a film forming step of the method for manufacturing an electronic component according to the first embodiment of the present invention.

FIG. 6 is a sectional view showing the step of FIG. 5;

FIG. 7 is a view showing an electronic component manufactured in the first embodiment of the present invention.

FIG. 8 is a view illustrating a film forming step of a method of manufacturing an electronic component according to a third embodiment of the present invention.

FIG. 9 is a sectional view showing the step of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic substrate 2 Dicing sheet 3 Work 4 Sample fixing plate 5 Center axis 6 Evaporation source 8 Internal electrode 9 External electrode 10 Film forming sheet

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Junichi Hashimoto 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Inside Murata Manufacturing Co., Ltd. F-term in Murata Manufacturing Co., Ltd. (reference) 5E001 AB03 AH03 AH04 AH06 AJ03 5E082 AA01 AB03 BC39 FF05 FG06 FG26 GG10 GG11 GG21 GG25 JJ03 JJ21 LL01 MM13 MM21

Claims (11)

[Claims] A step of adhering the back surface of the ceramic substrate to the dicing sheet; a step of forming a dicing groove from the surface of the ceramic substrate to divide the ceramic substrate into a plurality of works; A step of peeling, a step of fixing one main surface of the plurality of works to the film-forming sheet, and a step of fixing the other main surface and side surfaces of each work in a state where the one main surface of the plurality of works is fixed to the film-forming sheet. Forming a thin film using a thin film forming method at least in part. A step of forming a dicing groove from the surface of the ceramic substrate to divide the ceramic substrate into a plurality of workpieces; a step of forming a dicing groove from the surface of the ceramic substrate; With sticky,
A step of fixing one main surface of the plurality of works to the film-forming sheet, a step of peeling the dicing sheet from the plurality of works, and a step of fixing one main surface of the plurality of works to the film-forming sheet. Forming a thin film on at least a part of the other main surface and the side surface of the work by using a thin film forming method. 3. The electronic component according to claim 2, further comprising, after the step of dividing the ceramic substrate into a plurality of works, a step of further extending a dicing sheet to increase a distance between the works. Manufacturing method. 4. The dicing sheet used in the step of adhering the back surface of the ceramic substrate to the dicing sheet comprises a base material and an adhesive applied to the surface thereof. A method for manufacturing an electronic component according to claim 3. 5. The film-forming sheet used in the step of fixing one main surface of the plurality of works to the film-forming sheet comprises a base material and an adhesive applied to the surface thereof. The method for manufacturing an electronic component according to claim 1, wherein 6. The film-forming sheet used in the step of fixing one main surface of the plurality of works to the film-forming sheet has heat resistance. A method for manufacturing the electronic component according to any one of the above. 7. The method according to claim 5, further comprising a step of performing a heat treatment on the film-forming sheet in advance before the step of fixing one main surface of the plurality of works to the film-forming sheet. The method for manufacturing an electronic component according to any one of the above. 8. The method according to claim 5, further comprising, before the step of forming a thin film using the thin film forming method, a step of irradiating an ultraviolet ray to a surface of the film-forming sheet on which the adhesive is applied.
A method for manufacturing an electronic component according to claim 7. 9. A step of dividing the ceramic substrate into a plurality of works, using a ceramic substrate composed of alternately laminated ceramic layers and electrode layers, and partially exposing the electrode layers to the side surfaces of the work. 9. The method for manufacturing an electronic component according to claim 1, wherein a dicing groove is formed so as to perform the dicing. 10. The electronic component according to claim 1, wherein the thin film formed in the step of forming a thin film by using the thin film forming method is a thin film having conductivity. Manufacturing method. 11. After the step of forming a thin film by using the thin film forming method, by cutting a part of the thin film on a main surface portion of the work, conduction between the thin films formed on opposite side surfaces of the work is achieved. 2. The method according to claim 1, further comprising a cutting step.
0. The method for manufacturing an electronic component according to item 0.