JP2002166552A - Liquid ejection head, liquid ejection recorder, and liquid ejection recording method in the recorder mounted in moving body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid ejection head and a liquid ejection recorder in which recording can be carried out stably even when the liquid ejection recorder is used in a moving body subjected to impact or vibration inadvertently and convenience of the recorder can be enhanced. SOLUTION: A pressure sensor 43 for detecting a vibration from the outside of a head as a pressure vibration is provided on an element substrate 1 constituting a liquid ejection head. When a liquid ejection recorder employing that head is mounted on a moving body, e.g. an automobile, a swing caused by an impact or vibration from the outside of the recorder is detected by the pressure sensor 43 and recording operation is interrupted instantaneously. Recording is resumed eventually from an image position following to the interrupting position by a trigger signal generated in the head.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a liquid discharge head used in a printer as an output terminal of a copying machine, a facsimile, a word processor, a host computer or the like, a video printer, and a liquid discharge recording apparatus equipped with the head. More particularly, the present invention relates to a liquid ejection head having a base on which an electrothermal conversion element for generating thermal energy used as energy for recording is formed, and a recording apparatus. That is, the present invention relates to a liquid discharge head used in a liquid discharge recording apparatus that performs recording by discharging a recording liquid (such as ink) as a flying droplet from a discharge port (orifice) and attaching the recording liquid to a recording medium. Things.

[0002] The present invention also relates to an in-vehicle printer device that records information received by a wireless device mounted on a moving body such as a vehicle, and a recording method in the device.

[0003]

2. Description of the Related Art Liquid ejection recording apparatuses, particularly ink jet recording apparatuses, are widely used in modern business offices and other business processing departments.

A head provided in such a recording apparatus (referred to as an ink jet recording head) includes a plurality of fine holes (orifices) for discharging a recording liquid such as ink, a plurality of liquid flow paths respectively communicating with the respective orifices, and An ejection energy generating element is provided in each liquid flow path. By applying a drive signal corresponding to the recording information to the ejection energy generating element and applying ejection energy to the recording liquid in the liquid flow path where the ejection energy generating element is located, the recording liquid is ejected from the orifice as flying droplets. It is configured to perform recording.

As shown in FIG. 11, for example, this type of ink jet recording head includes an orifice plate 100 having orifices formed with high precision, a top plate 101 having a plurality of liquid flow grooves communicating with the orifices, respectively. S having a plurality of ejection energy generating elements 102 formed on the surface
and an element substrate 103 made of an i-substrate. Orifice 104 of orifice plate 100, top plate 101
And the discharge energy generating elements 102 on the element substrate 103 are positioned so as to correspond to each other, are joined by an urging means such as a spring or an adhesive, and are located at the ends of the electric wiring of the element substrate 103. And is fixed on the base plate 105 together with a wiring board (not shown) having pads for receiving electric signals such as drive signals from the main body device.

[0006]

Such an ink jet recording apparatus has been developed and studied to meet user demands such as good usability, relatively easy maintenance and inspection, and maintenance free. .

When the above-described recording apparatus is used in a moving body such as an automobile, vibrations caused by an engine, impacts and vibrations caused when the vehicle travels on an uneven road surface, and starting / moving of the automobile are considered.
Impact / vibration due to the inertia moment during acceleration / deceleration at the time of stop, and impact / vibration due to the inertia moment due to the lateral acceleration (G) when the car turns,
In the recording apparatus, the discharge direction of the recording liquid and the paper feed are greatly affected.

Accordingly, an object of the present invention is to perform stable recording even when using a liquid discharge recording apparatus in a moving body in which shock or vibration is suddenly generated, and to improve the convenience of the apparatus. An object of the present invention is to provide a liquid discharge head, a liquid discharge recording apparatus, and a liquid discharge recording method that are possible.

More specifically, an object of the present invention is to sense a shock or vibration received from the outside of a printing apparatus in a liquid ejection head, and to control a printing operation of the printing apparatus based on the sensed information. An object of the present invention is to provide a liquid discharge head, a liquid discharge recording apparatus, and a liquid discharge recording method capable of maintaining stable recording quality.

[0010]

In order to achieve the above-mentioned object, the present invention provides a method of forming a plurality of liquid passages, each of which is connected to a corresponding one of a plurality of discharge ports for discharging a liquid. In the substrate and the second substrate, a plurality of energy generating elements arranged in each of the liquid flow paths for generating discharge energy for discharging liquid from the discharge ports, and a driving condition of the energy generating elements. In a liquid discharge head including a plurality of elements or electric circuits having different functions for controlling, a pressure sensor for detecting vibration from outside the liquid discharge head as pressure vibration, and a pressure vibration detected by the pressure sensor. To an electric signal, and electrically connected to one end of each of the energy generating elements and based on image data corresponding to an image to be recorded. A drive circuit that can drive each of the raw elements, and an image data supply device that supplies the image data to each of the drive circuits for each of the discharge ports corresponding to the drive circuit, wherein the first substrate or the second substrate Are selectively provided.

The liquid discharge head is separated from the energy generating element by a predetermined distance so as to face the energy generating element, and the liquid discharge head corresponds to each of the plurality of energy generating elements with the discharge port side as a free end. Further, a plurality of movable members may be further provided.

Further, a liquid discharge recording apparatus according to the present invention is a liquid discharge recording apparatus for performing recording on a recording medium using the above liquid discharge head, wherein the liquid discharge recording apparatus performs the recording on the basis of the electric signal converted by the circuit section. It has a control means for controlling the recording operation of the liquid ejection head.

In the invention described above, the pressure sensor for detecting the vibration from the outside of the liquid discharge head as pressure vibration is provided in the liquid discharge head, so that the head is prevented from shaking due to an external shock or vibration. The recording operation by the liquid ejection head can be immediately stopped by detecting with the pressure sensor. Therefore, even when using the liquid discharge recording apparatus in a moving body where shocks and vibrations occur unexpectedly,
Stable recording can be performed while maintaining stable recording quality of the recorded image, and the convenience of the liquid discharge recording apparatus is improved. Further, by providing a pressure sensor as a signal input mechanism and a circuit portion having a function of reproducing a vibration signal in the liquid discharge head, a very small liquid discharge head,
A liquid discharge recording apparatus using the head can be manufactured. Further, in such a liquid ejection head,
By distributing a plurality of elements or electric circuits for controlling the driving of the energy generating element to a first substrate and a second substrate constituting the head according to their functions, the liquid discharge head is downsized. be able to. Also,
Since the functions are not concentrated on one substrate, the yield of the substrate is improved, and as a result, the manufacturing cost of the head can be reduced.

Further, a liquid ejection recording method of the present invention is a recording method for installing a liquid ejection recording apparatus using the above liquid ejection head on a moving body and performing recording with the installed liquid ejection recording apparatus. Then, the impact or vibration transmitted from the moving body to the liquid discharge head is detected by the pressure sensor of the liquid discharge head, and the recording of the liquid discharge head is stopped based on the electric signal converted by the circuit unit. Then, the recording of the liquid ejection head is started again from the stopped image position.

Further, according to the liquid discharge recording method of the present invention, a liquid discharge recording apparatus which discharges liquid from a liquid discharge head to record an image on a recording medium is mounted on a moving body, and the mounted liquid discharge recording apparatus is mounted. Detecting a shock or vibration transmitted from the moving body to the liquid ejection head by a pressure sensor provided in the liquid ejection head, and a pressure detected by the pressure sensor. Converting the vibration into an electric signal by a circuit unit provided in the liquid ejection head, stopping the recording of an image by the liquid ejection head based on the electric signal, and recording by the liquid ejection head. Restarting from the stopped image position.

In the liquid ejection recording method according to the present invention as described above, the liquid ejection recording apparatus mounted on the moving body includes:
Impact or vibration transmitted from the moving body to the liquid discharge head is detected as pressure vibration by a pressure sensor provided in the liquid discharge head, and recording of the liquid discharge head is performed based on an electric signal converted from the detected pressure vibration. By stopping, the recording operation by the liquid ejection head can be immediately stopped when an impact or vibration is applied to the recording apparatus. By restarting the recording from the stopped image position, recording can be performed only when there is almost no impact or vibration to the liquid ejection head or only when it is small, and a stable recording quality of the recorded image can be obtained. It is possible to keep. As a result, as described above, stable recording can be performed even when the liquid ejection recording apparatus is used in a moving body in which shock or vibration occurs unexpectedly, and the convenience of the liquid ejection recording apparatus is improved. I do.

The terms "upstream" and "downstream" used in the description of the present invention refer to the flow direction of a liquid from a liquid supply source to a discharge port through a bubble generation region (or a movable member), or in terms of this configuration. Is used as an expression for the direction of.

[0018]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view taken along the direction of a liquid flow path of a liquid discharge head according to an embodiment of the present invention.

As shown in FIG. 1, this liquid discharge head is provided with a plurality of (only one is shown in FIG. 1) heating elements 2 for providing thermal energy for generating bubbles in the liquid. A liquid composed of a substrate 1, a top plate 3 joined on the element substrate 1, an orifice plate 4 joined to the front ends of the element substrate 1 and the top plate 3, and a liquid composed of the element substrate 1 and the top plate 3. It has a movable member 6 installed in the flow path 7 and a pressure sensor (not shown) for sensing vibration from outside the liquid discharge head as pressure vibration.

The element substrate 1 is formed by forming a silicon oxide film or a silicon nitride film for insulation and heat storage on a substrate such as silicon, and further forming an electric resistance layer and a wiring constituting the heating element 2 thereon. It is patterned. The heating element 2 generates heat by applying a voltage from the wiring to the electric resistance layer and passing a current through the electric resistance layer.

The top plate 3 is for constituting a plurality of liquid flow paths 7 corresponding to the respective heating elements 2 and a common liquid chamber 8 for supplying a liquid to each liquid flow path 7. A flow path side wall 9 extending between the heating elements 2 is provided integrally.
The top plate 3 is made of a silicon-based material, and the patterns of the liquid flow path 7 and the common liquid chamber 9 are formed by etching, or silicon nitride, silicon oxide, or the like is formed on a silicon substrate by a known film forming method such as a CVD method. After depositing a material for forming the flow path side wall 9, the liquid flow path 7 can be formed by etching.

The orifice plate 4 is formed with a plurality of discharge ports 5 corresponding to the respective liquid flow paths 7 and communicating with the common liquid chamber 8 via the liquid flow paths 7. The orifice plate 4 is also made of a silicon-based material.
It is formed by cutting to a thickness of about m. The orifice plate 4 is not always necessary for the present invention. Instead of providing the orifice plate 4, the top plate 3
When the liquid flow path 7 is formed, a wall corresponding to the thickness of the orifice plate 4 is left on the tip end surface of the top plate 3, and the discharge port 5
Is formed, a top plate with a discharge port can be obtained.

The movable member 6 is provided on the heating element 2 such that the liquid path 7 is divided into a first liquid path 7 a communicating with the discharge port 5 and a second liquid path 7 b having the heating element 2. It is a cantilever-shaped thin film arranged facing each other, and is formed of a silicon-based material such as silicon nitride or silicon oxide.

The movable member 6 has a fulcrum 6a on the upstream side of a large flow flowing from the common liquid chamber 8 through the movable member 6 to the discharge port 5 by the liquid discharging operation, and has a fulcrum downstream from the fulcrum 6a. The heating element 2 is disposed at a position facing the heating element 2 at a predetermined distance from the heating element 2 so as to cover the heating element 2 so as to have the free end 6b. A space between the heating element 2 and the movable member 6 is a bubble generation area 10.

When the heating element 2 is caused to generate heat based on the above structure, heat acts on the liquid in the bubble generation region 10 between the movable member 6 and the heating element 2, thereby causing a film boiling phenomenon on the heating element 2. Based bubbles are generated and grow. The pressure caused by the bubble growth acts on the movable member 6 preferentially, and as shown by the broken line in FIG.
Displace so that it opens greatly to the side. By the displacement or the displaced state of the movable member 6, the propagation of the pressure based on the generation of bubbles and the growth of the bubbles themselves are guided to the ejection port 5 side, and the
The liquid is discharged from.

That is, the liquid flow path 7 is
By providing the movable member 6 having the fulcrum 6a on the upstream side (the common liquid chamber 8 side) and the free end 6b on the downstream side (the discharge port 5 side) of the flow of the liquid in the inside, the pressure propagation direction of the bubble is downstream. And the pressure of the bubbles directly and efficiently contributes to the ejection. Then, the growth direction of the bubble itself is guided in the downstream direction similarly to the pressure propagation direction, and the bubble grows larger downstream than upstream. As described above, by controlling the growth direction itself of the bubble by the movable member and controlling the pressure propagation direction of the bubble, fundamental discharge characteristics such as discharge efficiency, discharge force, or discharge speed can be improved.

On the other hand, when the bubble enters the defoaming step, the bubble rapidly disappears due to a synergistic effect with the elastic force of the movable member 6, and the movable member 6 is also finally moved to the initial position shown by the solid line in FIG. Return to. At this time, the liquid flows in from the upstream side, that is, the common liquid chamber 8 side, in order to supplement the contracted volume of the bubbles in the bubble generation region 10 and to supplement the volume of the discharged liquid,
The liquid flow path 7 is filled (refilled) with a liquid, and the liquid is refilled efficiently and rationally and stably with the return operation of the movable member 6.

The liquid discharge head according to the present embodiment has circuits and elements for driving the heating element 2 and controlling the driving thereof. These circuits and elements are assigned to the element substrate 1 or the top plate 3 according to their functions. Further, these circuits and elements can be easily and finely formed by using the semiconductor wafer process technology since the element substrate 1 and the top plate 3 are made of a silicon material.

The structure of the element substrate 1 formed by using the semiconductor wafer process technology will be described below.

FIG. 2 shows a liquid discharge head used in the liquid discharge head shown in FIG.
FIG. 2 is a cross-sectional view of an element substrate obtained. As shown in FIG.
In the element substrate 1 used for the liquid ejection head of the embodiment,
Represents a thermal acid as a heat storage layer on the surface of the silicon substrate 301.
The oxide film 302 and the interlayer film 303 also serving as a heat storage layer
They are stacked in order. As the interlayer film 303, SiO
^TwoFilm or Si^ThreeN^FourA membrane is used. Interlayer film 303
The resistance layer 304 is formed partially on the surface of the
The wiring 305 is partially formed on the surface of the wiring 4. wiring
As 305, Al or Al-Si, Al-Cu
Al alloy wiring is used. This wiring 30
5. The surface of the resistive layer 304 and the interlayer film 303 is coated with SiO
^TwoFilm or Si^ThreeN^FourA protective film 306 made of a film is formed.
ing. The surface of the protective film 306 corresponding to the resistance layer 304
And its surroundings are caused by the heat generated by the resistance layer 304.
To protect the protective film 306 from chemical and physical impact
The anti-cavitation film 307 is formed. resistance
A region where the wiring 305 is not formed on the surface of the layer 304
Is a heat acting portion 3 which is a portion where the heat of the resistance layer 304 acts
08.

The films on the element substrate 1 are sequentially formed on the surface of a silicon substrate 301 by a semiconductor manufacturing technique, and the silicon substrate 301 is provided with a heat acting portion 308.

FIG. 3 is a schematic cross-sectional view of the element substrate 1 shown in FIG.

As shown in FIG. 3, an N-type well region 422 and a P-type
The mold well region 423 is partially provided. Then, the P-Mos 420 is added to the N-type well region 422 by introducing and diffusing impurities such as ion plating using a general Mos process.
3 is provided with an N-Mos421. P-Mos4
Reference numeral 20 denotes a source region 425 and a drain region 426 in which an N-type or P-type impurity is partially introduced into a surface layer of the N-type well region 422, and an N-type well region 422.
It is composed of a gate wiring 435 and the like deposited on the surface of the portion excluding the source region 425 and the drain region 426 via a gate insulating film 428 having a thickness of several hundreds of mm. The N-Mos 421 includes a source region 425 and a drain region 426 in which an N-type or P-type impurity is partially introduced into the surface layer of the P-type well region 423, and a source region 425 and a P-type well region 423. The gate insulating film 4 having a thickness of several hundred Å is formed on the surface except for the drain region 426.
The gate wiring 435 and the like are deposited via the gate wiring 435. The gate wiring 435 is made of polysilicon having a thickness of 4000 to 5000 nm deposited by the CVD method. These P-Mos420 and NM
The os421 forms a C-Mos logic.

The N-Mos 42 of the P-type well region 423
The portion different from 1 is an N-Mo for driving the electrothermal transducer.
An s transistor 430 is provided. The N-Mos transistor 430 also has a source region 432 and a drain region 431 partially provided in a surface layer of the P-type well region 423 by processes such as impurity introduction and diffusion, and a source region 432 and a drain of the P-type well region 423. The gate wiring 433 and the like are deposited on the surface of the portion excluding the region 431 via the gate insulating film 428.

In this embodiment, the N-Mos transistor 430 is used as a transistor for driving the electrothermal transducer. However, the transistor has the ability to individually drive a plurality of electrothermal transducers and has the fine The transistor is not limited to this transistor as long as it can obtain a structure.

Between the P-Mos 420 and the N-Mos 421 and between the N-Mos 421 and the N-Mos transistor 43
5,000 to 10,000 between each element such as between 0 and
An oxide film isolation region 424 is formed by field oxidation having a thickness of Å.
Are formed, and each element is separated by the oxide film separation region 424. The portion of the oxide film isolation region 424 corresponding to the heat acting portion 308 plays a role as a first heat storage layer 434 when viewed from the surface side of the silicon substrate 301.

P-Mos 420, N-Mos 421 and
And the surface of each element of the N-Mos transistor 430,
From a PSG or BPSG film with a thickness of about 7000mm
Is formed by a CVD method.
You. After the interlayer insulating film 436 is planarized by heat treatment,
Penetrating through the interlayer insulating film 436 and the gate insulating film 428
Al electrode serving as first wiring layer via contact hole
The wiring is performed by 437. The interlayer insulating film 436
And the surface of the Al electrode 437 has a thickness of
5000Å of SiO^TwoThe interlayer insulating film 438 made of a film
It is formed by a plasma CVD method. Interlayer insulating film 43
8, the thermal action section 308 and the N-Mos transistor
The portion corresponding to the star 430 has a T
aN^{0.8, he x}The resistive layer 304 made of a film is formed by DC sputtering.
Is formed. The resistance layer 304 is formed of the interlayer insulating film 4
Through the through hole formed in the drain region 4
31 and is electrically connected to the Al electrode 437 near
You. The surface of the resistive layer 304 is
The Al wiring 305 as a second wiring layer serving as a wire is shaped.
Has been established.

The wire 305, the protective film 306 on the surface of the resistive layer 304 and the interlayer insulating film 438 is made of the Si ³ N ⁴ film having a thickness of 10000Å formed by a plasma CVD method. The anti-cavitation film 307 formed on the surface of the protective film 306 is made of a film such as Ta having a thickness of about 2500 °.

Next, with reference to FIGS. 4 and 5, an example of a step of forming the movable member and the flow path side wall when the element substrate 1 is provided with the movable member 6 and the flow path side wall 9 as shown in FIG. Will be explained. 4 and 5 show cross sections along a direction orthogonal to the liquid flow direction of the element substrate on which the movable member and the flow path side wall are formed.

First, in FIG. 4A, a first pad for protecting a connection pad portion for making an electrical connection with the heating element 2 is provided on the entire surface of the element substrate 1 on the heating element 2 side. As a protective layer, a TiW film (not shown) is formed to a thickness of about 5000 ° by a sputtering method. An Al film for forming the gap forming member 71 is formed to a thickness of about 4 μm on the surface of the element substrate 1 on the side of the heating element 2 by a sputtering method. The formed Al film is patterned by using a well-known photolithography process, and the element substrate 1 and the movable member are positioned at positions corresponding to the bubble generation region 10 between the heating element 2 and the movable member 6 shown in FIG. 6 to form a gap between
A plurality of gap forming members 71 made of a film are formed. Each of the gap forming members 71 is made of SiN which is a material film for forming the movable member 6 in a step of FIG.
The film 72 extends to the region to be etched.

The gap forming member 71 functions as an etching stop layer when the liquid flow path 7 and the movable member 6 are formed by dry etching as described later. this is,
A TiW layer as a pad protection layer on the element substrate 1,
This is because the Ta film as the anti-cavitation film and the SiN film as the protective layer on the resistor are etched by the etching gas used to form the liquid flow path 7, and these layers and films are etched. Is prevented by the gap forming member 71. Therefore, when the liquid flow path 7 is formed by dry etching, the heating element 2 of the element substrate 1 is formed.
The width of each gap forming member 71 in the direction perpendicular to the flow direction of the liquid flow path 7 is adjusted so that the TiW layer on the element substrate 1 and the TiW layer on the element substrate 1 are not exposed. Is wider than the width of the liquid flow path 7 formed by.

Further, at the time of dry etching, CF ⁴
Decomposition of the gas generates ionic species and radicals, which may damage the heating element 2 and the functional elements of the element substrate 1. The gap forming member 71 made of Al receives the ionic species and radicals, and This protects the heating element 2 and the functional element.

Next, in FIG. 4B, the gap forming member 71
A SiN film 72 having a thickness of about 4.5 μm, which is a material film for forming the movable member 6 by a plasma CVD method on the surface of
Is formed so as to cover the gap forming member 71.

Next, in FIG. 4C, an Al film having a thickness of about 6100 was formed on the surface of the SiN film 72 by a sputtering method.
After the formation, the formed Al film is patterned using a well-known photolithography process to form an SiN film 7.
2, a portion corresponding to the movable member 6, ie, SiN
The Al film 73 as a second protective layer is left in the movable member forming region on the surface of the film 72. The Al film 73 becomes a protective layer (etching stop layer) when the liquid flow path 7 is formed by dry etching.

Next, in FIG. 5A, the SN film for forming the channel side wall 9 is formed on the surface of the SiN film 72 and the Al film 73.
The iN film 74 is formed to a thickness of about 50 using a microwave CVD method.
μm is formed. Here, Si by microwave CVD is used.
As a gas used for forming the N film 74, monosilane (SiH ⁴ ), nitrogen (N ² ), and argon (Ar) were used. In addition to the above,
A combination with disilane (Si ² H ⁶ ) or ammonia (NH ³ ) or a mixed gas may be used. Further, the power of the microwave having a frequency of 2.45 [GHz] is set to 1.5 [k].
W] and the gas flow rate is 100 [scc
m], nitrogen 100 sccm, and argon 40 sccm
Then, the respective gases were supplied to form the SiN film 74 under a high vacuum at a pressure of 5 [mTorr]. Alternatively, the SiN film 74 may be formed by a microwave plasma CVD method using a component ratio other than that of the gas, a CVD method using an RF power supply, or the like.

After an Al film is formed on the entire surface of the SiN film 74, the formed Al film is patterned by using a well-known method such as photolithography.
An Al film 75 is formed on the surface of the N film 74 except for a portion corresponding to the liquid flow path 7. As described above, the width of each of the gap forming members 71 in the direction orthogonal to the flow direction of the liquid flow path 7 is wider than the width of the liquid flow path 7 formed in the next step of FIG. Therefore, the side of the Al film 75 is disposed above the side of the gap forming member 71.

Next, in FIG. 5B, the SiN film 74 and the S
The iN film 72 is patterned to simultaneously form the channel side wall 9 and the movable member 6. In the etching apparatus, CF
Using a mixed gas of ⁴ and O ² , using the Al films 73 and 75 and the gap forming member 71 as an etching stop layer or mask, the SiN film 74 has a trench structure.
The N film 74 and the SiN film 72 are etched. In the step of patterning the SiN film 72, unnecessary portions of the SiN film 72 are removed so that the supporting and fixing portion of the movable member 6 is directly fixed to the element substrate 1 as shown in FIG.
The constituent material of the contact portion between the supporting and fixing part of the movable member 6 and the element substrate 1 includes TiW which is a constituent material of the pad protection layer and Ta which is a constituent material of the anti-cavitation film of the element substrate 1.

After that, on the top plate side, which is the other element substrate 3, gold bumps and the like are formed on the surface on which the electrical connection pads are formed, thereby forming a convex electrode portion.

Then, although not shown, bonding using a metal eutectic was performed between the convex electrode on the top plate side and the concave electrode on the element substrate 1 side. At this time, when the same kind of metal is used as the metal species on both sides, the temperature and pressure at the time of joining can be reduced and the joining strength can be increased.

Next, the orifice 5 was formed using an excimer laser through a contact mask provided on the entire face.

Finally, in FIG. 5C, the Al films 73 and 75 are heated and etched using a mixed acid of acetic acid, phosphoric acid and nitric acid to form the Al films 73 and 75 and the gaps formed of the Al film. The member 71 is eluted and removed, and the movable member 6 and the channel side wall 9 are formed on the element substrate 1. Thereafter, portions of the TiW film as a pad protection layer formed on the element substrate 1 corresponding to the bubble generation region 10 and the pad are removed using hydrogen peroxide. Ti, which is a constituent material of the pad protection layer, is also provided on the contact portion between the element substrate 1 and the channel side wall 9.
W and Ta which is a constituent material of the anti-cavitation film of the element substrate 1 are included. As described above, FIG.
Was manufactured.

FIG. 6 shows an example of a circuit configuration of the element substrate 1 and the element substrate 3 for calculating the vibration signal detected by the pressure sensor and controlling the energy applied to the heating element.

In FIG. 6A, on the element substrate 1, heating elements 2 arranged in a line, a power transistor 41 functioning as a driver, an AND circuit 39 for controlling the driving of the power transistor 41, A drive timing control logic circuit 38 for controlling the drive timing of the power transistor 41 and an image data transfer circuit (image data supply device) 42 including a shift register and a latch circuit are formed. A drive circuit capable of driving the heating element 2 based on image data corresponding to an image to be recorded on a recording medium includes a power transistor 41, an AND circuit 39, a drive timing control logic circuit 38, and the like.

The drive timing control logic circuit 38
For the purpose of reducing the power supply capacity of the device, the heating timing is not supplied to all the heating elements 2 at the same time, but is supplied to the heating elements 2 in a divided drive so as to supply the power with a time lag. Are input from enable signal input terminals 45k to 45n which are external contact pads.

The external contact pads provided on the element substrate 31 include an enable signal input terminal 45 k
To 45n, the input terminal 45 of the driving power source of the heating element 2
a, a ground terminal 45b of the power transistor 41, input terminals 45c to 45e for signals required to control energy for driving the heating element 2, a drive power supply terminal 45f of a logic circuit, a ground terminal 45g, and an image data transfer circuit 42 And a serial clock signal input terminal 45h synchronized with the input terminal 45h, and a latch clock signal input terminal 45j input to the latch circuit.

On the other hand, as shown in FIG. 6B, a sensor drive for driving a pressure sensor 43 provided on the element substrate 1 and sensing external vibration is provided on the element substrate 3 as a top plate. A circuit 47 and a drive signal control circuit 46 for monitoring the output from the pressure sensor 43 and controlling (ON / OFF) the energy applied to the heating element 2 according to the result.
And a memory 49 that stores output value data detected by the sensor 43 as head information and outputs the data to the drive signal control circuit 46. Therefore, the drive signal control circuit 46 serves as control means for controlling the recording operation of the liquid ejection head based on the electric signal converted from the pressure vibration detected by the pressure sensor 43.

As connection contact pads, terminals 44 g, 44 h, 48 g, 48 for connecting the sensor 43 and the sensor drive circuit 47 are provided on the element substrate 1 and the top plate 3.
h, terminals 44b-44d, 48 for connecting input terminals 45c-45e for signals necessary for controlling the energy for driving the heating element 2 from the outside and the drive signal control circuit 46;
b to 48d, and a terminal 48a for inputting the output of the drive signal control circuit 46 to one input terminal of the AND circuit 39 are provided.

In the example shown in FIG. 6, the pressure sensor 4
3 is provided on the element substrate 1, but instead of this, FIG.
It may be provided on the element substrate 3 like the sensor 210 of (b). In any case, the position of the pressure sensor is effective for converting the sensed vibration into an electric signal, and is not particularly limited as long as the wiring for connecting each element can be efficiently formed.

FIG. 7 schematically shows a cross section of the pressure sensor in the above configuration. This sensor uses a silicon-based diaphragm 202, in which a piezoresistor (silicon strain gauge) 200 is formed in a part by a diffusion method, and an electric circuit constituting an operational amplifier (for example, a PNP transistor 201) is formed around the sensor. It is integrated. The circuit functions include functions such as output amplification adjustment, temperature characteristic (zero point, sensitivity) compensation, and zero point adjustment. In order to take these adjustments, thin-film resistors (not shown) are individually laser-trimmed. Function may be added.

FIG. 8 is a schematic configuration diagram of a pressure sensor using a silicon strain gauge 200 in the element substrate 3. Here, the adopted silicon strain gauge is used for the purpose of sensing vibration from the outside. In this pressure sensor, pressure oscillation can be detected with high sensitivity using the high piezoresistance effect of silicon. The circuit unit converts the distortion caused by the pressure vibration wave detected by the pressure sensor into an electric signal, and converts the formed electric signal into a drive signal control circuit 46 (FIG. 6B) installed in the element substrate (top plate) 3. ) Or to the image data transfer circuit 42 (see FIG. 6A) installed in the element substrate 1.
Then, using this electric signal as a trigger signal, (O) of the energy applied to the heating element 2 via the drive signal control circuit 46
(N / OFF) control, and the stop position of the image data can be stored by detecting the position of the trigger signal in the image data transfer circuit 42.

FIG. 8 shows a structure in which a strain gauge, which is an element for converting the strain of the silicon-based diaphragm 202 into a change in electric resistance, is firstly constructed. As shown in FIG. 8, two strain gauges are formed of thin polysilicon resistance wires, which are formed in the diaphragm. Then, lead electrodes are formed at both ends of the resistance wire.

Here, the basic principle of this strain gauge is as described below. First, assuming that the length of one bar resistance is L [m] and the cross-sectional area is S [m ² ], the resistivity ρ [Ω ·
m], the total resistance value R [Ω] is R = ρL / S. Here, when the resistor is pulled along with the deformation of the object to be measured, the resistance wire extends. Then, L = L + ΔL becomes longer, and the resistance increases. At this time, the sectional area is also S = S−ΔS
And the resistivity ρ also changes to ρ ′. The relationship between the increase ΔR in the resistance and the increase ΔL in the length is as follows.

R + ΔR = ρ ′ × (L + ΔL) / (S−ΔS) ≒ ρ × L / S + {ρ ′ / (S−ΔS)} × ΔL Therefore, ΔR / R = (ρ ′ / ρ) × ｛S / (S−ΔS)｝ × (ΔL / L) = Kg × (ΔL / L) Here, a constant coefficient K
It is represented by g. The coefficient Kg of the change in resistance with respect to strain is called a gauge factor.

FIG. 9 shows a bridge circuit for converting a resistance change rate into a voltage using the distortion factor.
As shown in FIG. 9, when each resistor is R, R1, R2 [Ω] and the input voltage is E1 [V], the output voltage E0 [V] is obtained.
Is as follows:

E0 = (R1 × R−R2 × R) / [(R1
+ R) × (R2 + R)] × E1 Since R1 and R2 use the same kind of resistance wiring, R1 = R2 = r, and R1 = r +
Δr, R2 = r−Δr. Therefore, E0 = [R × 2Δr / [(R + r) ² −Δr ² ]] × E1 Since the amount of distortion is very small and the rate of change in resistance is negligible compared to the initial resistance, E0 = [R × 2Δr / (R + r) ² ] × E1 Here, when approximating R ≒ r, E0 = (１ ／) × (Δr / r) × E1. The resistance change is proportional to Δr, and a voltage proportional to the strain (Δr / r) is obtained.

For example, using a polysilicon resistance wire having an initial resistance value of 10 [Ω] and this gauge factor being about 100 and the amount of distortion being 50 [μm], the resistance change Δr
Is Δr = 10 [Ω] × 50 × 10 ⁻⁶ × 100 = 50 [mΩ]. When an input voltage E1 = 10 [V] is applied, the output voltage E0 = 25 [mV].

As described above, the amount of distortion of the diaphragm 200 can be measured by detecting the output voltage E0. In particular, it is possible to quickly and accurately determine whether or not to apply the energy applied to the heating element 2 in accordance with the amount of distortion of the diaphragm due to a change in vibration from the outside.

As described above, the liquid discharge head according to the present embodiment is provided with the pressure sensor 43 for detecting vibration from outside the head as pressure vibration. Is detected by the pressure sensor 43, and the recording operation by the liquid ejection head is immediately stopped. Therefore, even when using the liquid discharge recording apparatus in a moving body such as an automobile in which shocks and vibrations occur unexpectedly, it is possible to perform stable recording while maintaining stable recording quality of a recorded image. The convenience of the ejection recording apparatus is improved. Further, since the pressure sensor 43 serving as a signal input mechanism and a circuit portion having a function of reproducing a vibration signal from the sensor are provided in the liquid discharge head, a very small liquid discharge head, A liquid discharge recording apparatus using the method can be manufactured.

Further, in such a liquid discharge head, a plurality of elements or electric circuits for controlling the driving of the energy generating element are provided on the element substrate 1 and the top plate 3 constituting the head according to the function. Due to the distribution, the size of the liquid discharge head can be reduced. Also,
Since the functions are not concentrated on one substrate, the yield of the substrate is improved, and as a result, the manufacturing cost of the head can be reduced.

Specifically, in a liquid discharge recording apparatus mounted on a moving body, an impact or vibration transmitted from the moving body to the liquid discharge head is detected as pressure vibration by a pressure sensor 43, and converted from the detected pressure vibration. The recording of the liquid ejection head is stopped based on the electric signal thus generated, and the recording is restarted from the stopped image position. Thereby, recording can be performed only when there is almost no shock or vibration to the liquid ejection head, or when it is small,
It is possible to maintain stable recording quality of the recorded image. As a result, as described above, stable recording can be performed even when the liquid ejection recording apparatus is used in a moving body in which shock or vibration occurs unexpectedly, and the convenience of the liquid ejection recording apparatus is improved. I do.

(Other Embodiments) FIG. 10 is a perspective view showing an ink jet recording apparatus which is an example of a liquid discharge recording apparatus to which the above-mentioned ink jet recording head is mounted. The head cartridge 601 mounted on the ink jet recording apparatus 600 shown in FIG. 10 has a liquid ejection head having the above-described pressure sensor and a liquid container for holding the liquid supplied to the liquid ejection head. Head cartridge 60
As shown in FIG. 10, a carriage 607 is engaged with a spiral groove 606 of a lead screw 605 which rotates via driving force transmission gears 603 and 604 in conjunction with forward and reverse rotation of a driving motor 602. It is installed. The head cartridge 60 is driven by the power of the drive motor 602.
1 is reciprocated with the carriage 607 along the guide 608 in the directions of arrows a and b. The inkjet recording apparatus 600 includes a recording medium transport unit (not shown) that transports a printing paper P as a recording medium that receives a liquid such as ink discharged from the head cartridge 601. The paper pressing plate 610 of the print paper P conveyed on the platen 609 by the recording medium conveying means presses the print paper P against the platen 609 in the moving direction of the carriage 607.

In the vicinity of one end of the lead screw 605, photocouplers 611 and 612 are provided. The photocouplers 611 and 612 are
07, the photocouplers 611 and 6
This is a home position detecting means for confirming the presence in the area No. 12 and switching the rotation direction of the drive motor 602. In the vicinity of one end of the platen 609, a support member 613 that supports a cap member 614 that covers the front surface of the head cartridge 601 having the discharge port is provided. In addition, an ink suction unit 615 that sucks ink that has been idly discharged from the head cartridge 601 and accumulated inside the cap member 614 is provided. The ink suction unit 615 performs suction recovery of the head cartridge 601 through the opening of the cap member 614.

The ink jet recording apparatus 600 is provided with a main body support 619. The moving member 618 is attached to the main body support 619 in the front-rear direction,
It is supported so as to be movable in a direction perpendicular to the direction of movement 07. The cleaning blade 617 is attached to the moving member 618. Cleaning blade 6
Reference numeral 17 is not limited to this form, and may be another form of a known cleaning blade. Further, the ink suction means 6
15 is provided with a lever 620 for starting suction in the suction recovery operation by the lever 15. The lever 620 moves with the movement of the cam 621 engaging with the carriage 607, and the driving force from the driving motor 602 switches the clutch. The movement is controlled by a known transmission means such as the like. An ink jet recording control unit for giving a signal to a heating element provided in the head cartridge 601 and controlling the driving of each mechanism described above is provided on the recording apparatus main body side.
It is not shown in FIG.

In the ink jet recording apparatus 600 having the above configuration, the head cartridge 601 reciprocates over the entire width of the print paper P with respect to the print paper P conveyed on the platen 609 by the recording medium conveyance means. Make a record.

When such a recording apparatus is mounted on a moving body (not shown) (not shown), vibrations due to external shocks and vibrations of the recording apparatus are applied to the liquid discharge head of the present invention incorporating a pressure sensor. And the recording operation could be stopped immediately.

Further, when printing is performed again, an electric signal (trigger signal) derived in the liquid discharge head is generated by
The image position at which the operation was performed was stored in a memory mounted in the liquid ejection head, and the recording was started from the image position after the recording was stopped.

[0078]

As described above, according to the liquid discharge head of the present invention, the liquid discharge head is provided with the pressure sensor for detecting vibration from outside the liquid discharge head as pressure vibration. , The recording operation can be stopped immediately, so that a stable recording quality can be maintained even in a moving body in which shock or vibration is suddenly generated, and there is an effect that the convenience of the liquid discharge recording apparatus is improved. Further, by providing a pressure sensor as a signal input mechanism and a circuit portion having a function of reproducing a vibration signal in the liquid discharge head, a very small liquid discharge head,
There is an effect that a liquid discharge recording apparatus using the head can be manufactured. Further, in such a liquid discharge head, a plurality of elements or electric circuits for controlling the driving of the energy generating element are allocated to a first substrate and a second substrate constituting the head according to the function. Therefore, the size of the liquid discharge head can be reduced. In addition, since the function is not concentrated on one substrate, the yield of the substrate is improved, and as a result, the manufacturing cost of the head can be reduced.

According to the liquid discharge recording method of the present invention, in a liquid discharge recording apparatus mounted on a moving body, the impact or vibration from the moving body is converted into pressure vibration by a pressure sensor provided in the liquid discharging head. Since the recording is stopped when detected and the recording is started again from the stopped image position, it is possible to perform recording while maintaining a stable recording quality of the recorded image, and the convenience of the liquid ejection recording apparatus is improved. There is an effect of doing.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view along a liquid flow direction for explaining a liquid discharge head structure according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of an element substrate used in the liquid discharge head shown in FIG.

FIG. 3 is a schematic cross-sectional view of the element substrate shown in FIG.

FIG. 4 is a view for explaining a method of forming a movable member and a channel side wall on the element substrate shown in FIG. 3;

FIG. 5 is a view for explaining a method for forming a movable member and a flow path side wall on the element substrate shown in FIG. 3;

6A and 6B are diagrams for explaining a circuit configuration of the liquid discharge head shown in FIG. 1, wherein FIG. 6A is a plan view of an element substrate,
FIG. 2B is a plan view of the top plate.

FIG. 7 is a cross-sectional view illustrating a configuration example of a sensor provided in the liquid ejection head of the present invention.

8 is a schematic configuration diagram when a voice input sensor using the silicon strain gauge shown in FIG. 7 is formed in an element substrate.

FIG. 9 is a diagram showing a bridge circuit for converting a resistance change rate of a strain gauge as a sensor into a voltage.

FIG. 10 is a schematic perspective view showing an example of a liquid discharge recording apparatus provided with the liquid discharge head of the present invention.

FIG. 11 is a perspective view of a conventional inkjet recording head with a part cut away.

[Description of Signs] 1 element substrate 2 heating element 3 top plate 4 orifice plate 5 discharge port 6 movable member 6a fulcrum 6b free end 7 liquid flow path 8 common liquid chamber 9 flow path side wall 10 bubble generation area 38 drive timing control logic circuit 39 AND circuit 41 Power transistor 42 Image data transfer circuit 43 Pressure sensor 44a to 44h, 45a to 45n Terminal 46 Drive signal control circuit 48a to 48d, 48g, 48h Terminal 47 Sensor drive circuit 49 Memory 71 Gap forming member 72, 74 SiN film 73, 75 Al film 200 Piezoresistance (strain gauge resistance) 201 Electric circuit unit (PNP transistor) 202 Diaphragm 210 Sensor 301 Silicon substrate 302 Thermal oxide film 303 Interlayer film 304 Resistance layer 305 Wiring 306 Protective layer 307 Anti-cavitation film 308 Heat action part R1, R2 Strain gauge

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroyuki Tamaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Atsuhiro Tsuchiya 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inside (72) Inventor Takashi Nojima 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Osamu 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. ( 72) Inventor Akihiro Kato 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Koichi Kuno 3-30-2 Shimomaruko 3-chome, Ota-ku, Tokyo F-term (reference) 2C056 EA24 EB03 EB29 EB34 EC03 EC28 EC67 FA10 HA05 HA16 HA17 KD06 2C057 AF93 AG12 AG83 AK07 AL03 AL40 AM03 AM30 AM40 AN01 AP02 AP23 AP32 AP33 AP52 AP53 AQ02 B A03 BA13 2C061 AQ05 HV01 HV39 HV44

Claims (5)

[Claims] 1. A liquid is supplied from a discharge port into a first substrate and a second substrate that are joined to each other to form a plurality of liquid flow paths that communicate with each of a plurality of discharge ports that discharge the liquid. A plurality of energy generating elements arranged in each of the liquid flow paths for generating discharge energy to be discharged, and a plurality of elements or electric circuits having different functions for controlling driving conditions of the energy generating elements. A liquid discharge head comprising: a pressure sensor that detects vibration from outside the liquid discharge head as pressure vibration; a circuit unit that converts the pressure vibration detected by the pressure sensor into an electric signal; and each of the energy generating element. A drive circuit that is electrically connected to one end of the device and that can drive each of the energy generating elements based on image data corresponding to an image to be recorded; and And an image data supply device for supplying the data to each of the drive circuits for each of the discharge ports corresponding thereto is selectively provided on the first substrate or the second substrate. Liquid ejection head. 2. A plurality of movable elements, each of which is provided at a predetermined distance from the energy generating element so as to face the energy generating element and has a discharge port side as a free end corresponding to each of the plurality of energy generating elements. The liquid discharge head according to claim 1, further comprising a member. 3. A liquid discharge recording apparatus that performs recording on a recording medium using the liquid discharge head according to claim 1 or 2, wherein the liquid discharge head is based on an electric signal converted by the circuit unit. And a control unit for controlling the recording operation of the liquid ejection recording apparatus. 4. A recording method for installing a liquid ejection recording apparatus using the liquid ejection head according to claim 1 on a moving body, and performing recording on a recording medium with the installed liquid ejection recording apparatus. Detecting a shock or vibration transmitted from the moving body to the liquid discharge head by the pressure sensor of the liquid discharge head, and stopping the recording of the liquid discharge head based on the electric signal converted by the circuit unit. And recording the liquid discharge head from the stopped image position again. 5. A recording method for mounting a liquid ejection recording apparatus for ejecting liquid from a liquid ejection head to record an image on a recording medium on a moving body and performing recording with the mounted liquid ejection recording apparatus. Detecting a shock or vibration transmitted from the moving body to the liquid discharge head by a pressure sensor provided in the liquid discharge head; and providing the liquid discharge head with pressure vibration detected by the pressure sensor. Converting the signal to an electric signal by the circuit unit, stopping the recording of the image by the liquid discharge head based on the electric signal, and restarting the recording by the liquid discharge head from the stopped image position. And a liquid discharging recording method.