JP2002160212A - Method for manufacturing package for storing electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for storing electronic parts wherein minute ceramic debris is not generated inside, and the electronic parts to be stored inside can be always made to normally function. SOLUTION: Punching is applied to a ceramic green sheet 13. A solvent 14 for dissolving the ceramic green sheet 13 is applied to a punching surface B of the ceramic green sheet 13 to smooth the punching surface by dissolving, and then the ceramic green sheet is fired.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device for accommodating an electronic component, such as a digital micromirror device used for projecting a digital image, which dislikes the attachment of minute dust to its surface. The present invention relates to a method for manufacturing a component storage package.

[0002]

2. Description of the Related Art In recent years, for example, digital micromirror devices have been used as electronic components for projecting digital images. This digital micromirror device consists of a large number of micromirrors spread on a semiconductor substrate, irradiating these micromirrors with light from a light source such as a xenon lamp, and changing the angle of each micromirror digitally. By doing so, the reflected light from each minute mirror is projected on the screen, thereby projecting a digital image.

Conventionally, an electronic component housing package for housing the digital micromirror device has a mounting portion for mounting the digital micromirror device at the center of the upper surface and a plurality of packages extending from the periphery of the mounting portion to the lower surface. A package body formed by laminating a ceramic sealing frame surrounding a mounting portion on an outer peripheral portion of an upper surface of a ceramic flat insulating substrate having a metallized wiring conductor of And a translucent lid to be joined.

In this conventional package for accommodating an electronic component for accommodating a digital micromirror device, the digital micromirror device is mounted and fixed on a mounting portion of an insulating base, and each electrode of the digital micromirror device is connected to a bonding wire or the like. After connecting to the metallized wiring conductor via the electrical connection means, a digital micromirror is internally formed by joining a light-transmitting lid to the upper surface of the sealing frame via a sealing material such as a resin sealing material. The device is hermetically sealed.

If the package body is made of, for example, an aluminum oxide sintered body, an appropriate organic binder and solvent are added to and mixed with raw material powders of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide and the like. A plurality of ceramic green sheets are obtained by forming the sheet into a sheet by employing a conventionally known doctor blade method, and thereafter, these ceramic green sheets are subjected to appropriate punching and metallization. It is manufactured by printing and applying a metal paste to be a wiring conductor, and finally stacking them on top and bottom and firing at a temperature of about 1600 ° C. in a reducing atmosphere.

[0006]

However, according to this conventional electronic component housing package for housing a digital micromirror device, a plurality of punched ceramic green sheets are laminated and fired. As a result, a package body is manufactured. At the time of punching, a fractured surface is formed on the punched surface of the ceramic green sheet, so that the inner peripheral surface of the sealing frame has a small ridge. Then, after the digital micromirror device is housed inside, if heat or vibration is applied to the device, minute burrs on the inner peripheral surface of the sealing frame may fall off and generate minute ceramic dust, If such ceramic debris falls onto the digital micromirror device, the ceramic debris will interfere with the normal operation of the digital micromirror device, resulting in missing pixels and shadows due to the ceramic debris in the resulting image. Therefore, it is impossible to obtain an accurate image.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to prevent fine ceramic dust from being generated from the inner peripheral surface of the package main body, thereby accommodating the package inside. An object of the present invention is to provide an electronic component storage package that can always normally operate electronic components such as a digital micromirror device.

[0008]

According to the present invention, there is provided a method of manufacturing a package for housing electronic parts, comprising the steps of: punching a ceramic green sheet; and dissolving the ceramic green sheet on a punched surface of the ceramic green sheet. And a step of melting and smoothing the punched surface of the ceramic green sheet, and then firing the ceramic green sheet.

According to the method for manufacturing a package for housing electronic parts of the present invention, a solvent for dissolving the ceramic green sheet is applied to the punched surface of the ceramic green sheet, and the punched surface of the ceramic green sheet is melted and smoothed. Next, since this is fired, fine sprinkles are not formed on the inner surface of the obtained package body, and as a result, there is no generation of ceramic dust due to the fine sprinkles inside the package. .

[0010]

Next, the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package manufactured by the manufacturing method of the present invention. In FIG. 1, reference numeral 1 denotes a package body, and 2 denotes a light-transmitting lid. These constitute a container for accommodating the digital micromirror device 3 as an electronic component.

The package body 1 is formed on the outer periphery of the upper surface of a substantially rectangular flat insulating substrate 1a mainly made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic. Similarly, a substantially rectangular frame-shaped sealing frame 1 mainly made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and a glass-ceramic.
b.

An insulating base 1a constituting the package body 1
Functions as a support for supporting the digital micromirror device 3 as an electronic component, and has a mounting portion A for mounting the digital micromirror device 3 in the center of the upper surface thereof. The digital micromirror device 3 is adhered and fixed thereon via an adhesive such as an epoxy resin.

Further, from the peripheral portion of the mounting portion A of the insulating base 1a to the lower surface, tungsten, molybdenum, copper,
A plurality of metallized wiring conductors 4 made of metal powder of silver or the like are adhered and formed. Metallized wiring conductor 4
Functions as a conductive path for electrically connecting each electrode of the digital micromirror device 3 mounted on the mounting portion A to an external electric circuit. The electrodes are electrically connected via the bonding wires 5, and the portion led out to the lower surface of the insulating base 1a is electrically connected to the wiring conductor of the external electric circuit board.

The metallized wiring conductor 4 has a nickel plating layer having a thickness of about 1 to 10 μm
When a gold plating layer having a thickness of about μm is sequentially applied, the metallized wiring conductor 4 can be effectively prevented from being oxidized and corroded, and the metallized wiring conductor 4 and the bonding wires 5 and the external electric circuit board can be effectively prevented. Connection with the wiring conductor can be improved. Therefore, it is preferable that a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially applied to the surface of the metallized wiring conductor 4.

The sealing frame 1b is laminated on the upper surface of the insulating substrate 1a so as to surround the mounting portion A and the metallized wiring conductor 4 around the mounting portion A. The digital micromirror device 3 is mounted on the insulating substrate 1a. It functions as a joining base member for joining the translucent lid 2 on the package body 1 while forming a space for accommodation. Then, on this sealing frame 1b, a translucent lid 2 is adhered and fixed via an adhesive such as an epoxy resin, so that the inside of a container composed of the package body 1 and the translucent lid 2 is formed. The digital micromirror device 3 is housed in an airtight manner.

The upper surface of the sealing frame 1b is warped.
If it is polished by a mechanical polishing method so as to have a thickness of 50 μm or less, when the translucent lid 2 is bonded and fixed on the sealing frame 1b, the sealing frame 1b and the translucent lid 2 It can be fixed with high airtight reliability without forming a large gap between them. Therefore, the upper surface of the sealing frame 1b has a warp of 50%.
It is preferable that the surface is polished and flattened by a mechanical polishing method so as to have a thickness of μm or less.

The light-transmitting lid 2 adhered and fixed on the sealing frame 1b is a substantially rectangular flat plate made of a light-transmitting material such as glass or sapphire, and is made of an adhesive such as epoxy resin. The digital micromirror device 3 is hermetically sealed between the package main body 1 and the package body 1 by being adhered and fixed on the sealing frame 1b through the light-transmitting lid 2 to the digital micromirror device 3 from the light source. And the image light reflected by the digital micromirror device 3 can be projected onto a screen.

The light-transmitting lid 2 is formed in a predetermined flat shape by appropriately cutting and polishing a plate-shaped or rod-shaped light-transmitting material made of glass, sapphire, or the like.

Next, a manufacturing method of the present invention for manufacturing the package body 1 of the above-mentioned electronic component storage package will be described by taking as an example a case where four package bodies 1 are manufactured at the same time.

First, as shown in a perspective view in FIG. 2, ceramic green sheets 11 and 12 for an insulating substrate 1a and a ceramic green sheet 13 for a sealing frame 1b are prepared. For example, when the insulating base 1a and the sealing frame 1b are made of an aluminum oxide sintered body, the ceramic green sheets 11, 12, 13 are made of aluminum oxide as a main raw material and silicon oxide as a sintering aid. An organic binder such as acrylic acid methacrylate, a solvent such as toluene, and a suitable plasticizer and dispersant are added to a ceramic raw material powder containing calcium oxide and magnesium oxide to form a slurry, which is then mixed with a known doctor blade method. It is manufactured by forming into a sheet shape by employing the above method.

Next, as shown in a perspective view in FIG. 3, via holes serving as lead-out paths for leading the metallized wiring conductors 4 from the upper surface to the lower surface of the insulating base 1a are formed in the ceramic green sheets 11 and 12 for the insulating base 1a. A known punching method or a laser processing method is used to pierce the holes 11a and 12a, and through holes 13 for forming the inner peripheral surface of the sealing frame 1b in the ceramic green sheet 13 for the sealing frame 1b.
a and a through hole 13b for forming a part of the outer peripheral surface of the sealing frame 1b is formed by a known punching method. At this time, as shown in the main part enlarged cross-sectional view in FIG. 4, the punched surface B of the through-holes 13a and 13b formed in the ceramic green sheet 13 has a fractured surface formed by punching, and a fine ridge is formed. It is in a state of being left.

Next, as shown in an enlarged sectional view of a main part in FIG. 5 (a), the punched surface B of the through holes 13a and 13b formed in the ceramic green sheet 13 has a ceramic green sheet such as butyl carbitol acetate. An organic solvent 14 that dissolves 13 is applied. Then, when left as it is for a while, as shown in an enlarged sectional view of a main part in FIG.
The punched surfaces B of the through holes 13a and 13b are dissolved by the organic solvent 14, so that the burrs disappear and are smoothed. At this time, a part of the solvent 14 permeates the ceramic green sheet 13 and a part of the solvent 14 volatilizes.

Next, as shown in a perspective view in FIG. 6, metallizing pastes 11b and 12b for the metallized wiring conductor 4 are screened on the upper and lower surfaces of the ceramic green sheets 11 and 12 for the insulating substrate 1a and in the via holes 11a and 12a. It is applied in a predetermined pattern using a printing method. For example, when the metallized wiring conductor 4 is made of tungsten metallized, such metallized pastes 11b and 12b are prepared by adding a cellulose-based or acrylic-based organic binder and an appropriate solvent / dispersant / plasticizer to tungsten powder. It is manufactured by mixing to form a paste.

Next, as shown in the perspective view of FIG. 7, the ceramic green sheets 11 and 12 for the insulating base 1a and the ceramic green sheet 13 for the sealing frame 1b are laminated and pressure-bonded. As shown in the figure, the raw ceramic molded body 10 for the package body 1 is obtained by cutting into a predetermined size using a cutting blade. At this time, since the cut surface of the green ceramic molded body 10 is cut by the cutting blade, it is an extremely smooth surface.

Finally, the above-mentioned green ceramic molded body
By firing 10 at a temperature of about 1600 ° C., a package body 1 as shown in FIG. 1 is manufactured. At this time, the inner peripheral surface of the sealing frame 1b is flat because the punched surface B of the ceramic green sheet 13 for the sealing frame 1b is melted and flattened by applying a solvent 14. There is no formation of scabs, and therefore, no fine ceramic dust is generated from the inner peripheral surface of the sealing frame 1b.

Thus, according to the manufacturing method of the present invention, there is no generation of minute ceramic debris inside the package, and the electronic component housing package can always normally operate the electronic components housed therein. Can be provided.

The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention. In one example, the present invention is applied to an electronic component housing package for housing a digital micromirror device as an electronic component. However, the present invention is not limited to an electronic component housing package for housing a digital micromirror device. Alternatively, the present invention may be applied to an electronic component housing package for housing other types of electronic components such as a solid-state imaging device and a crystal unit.

[0029]

According to the method of manufacturing the electronic component housing package of the present invention, a solvent for dissolving the ceramic green sheet is applied to the punched surface of the ceramic green sheet, and the punched surface of the ceramic green sheet is melted to be smooth. And then baking it, no minute sprinkles are formed on the inner surface of the resulting package body, resulting in the generation of ceramic debris due to the fine sprinkles inside the package. There is no. Therefore, according to the method for manufacturing an electronic component housing package of the present invention, it is possible to provide an electronic component housing package that can always normally operate the electronic components housed therein.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component housing package manufactured by a manufacturing method of the present invention.

FIG. 2 is a perspective view illustrating a method for manufacturing an electronic component storage package according to the present invention.

FIG. 3 is a perspective view illustrating a method for manufacturing an electronic component storage package according to the present invention.

FIG. 4 is an enlarged sectional view of a main part for describing a method for manufacturing an electronic component storage package according to the present invention.

FIGS. 5A and 5B are enlarged cross-sectional views of a main part for describing a method of manufacturing a package for housing electronic components according to the present invention.

FIG. 6 is a perspective view illustrating a method for manufacturing an electronic component storage package according to the present invention.

FIG. 7 is a perspective view illustrating a method for manufacturing an electronic component storage package according to the present invention.

FIG. 8 is a perspective view illustrating a method for manufacturing an electronic component storage package according to the present invention.

[Explanation of symbols]

 13 ・ ・ ・ ・ ・ ・ ・ Ceramic green sheet 14 ・ ・ ・ ・ ・ ・ ・ Solvent that dissolves ceramic green sheet B

Claims (1)

[Claims] 1. A step of punching a ceramic green sheet, and a step of applying a solvent for dissolving the ceramic green sheet to a punched surface of the ceramic green sheet and dissolving and smoothing the punched surface. Baking the ceramic green sheet, and then baking the ceramic green sheet.