JP2002158256A - Packaging method of semiconductor device, packaging structure thereof, and optoelectronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive and reliable packaging structure of a tape carrier, and to provide an optoelectronic device. SOLUTION: In the electric connection between the tape carrier and a circuit board, solder coating is applied to the outer lead of the tape carrier, thus performing the thermocompression bonding between the tape carrier and the circuit board. After the thermocompression bonding, the central section of the solder coating of the outer lead section is recessed so that the soldered quality can be confirmed easily and surely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a tape carrier, a mounting method thereof, and an electro-optical device and an electronic printing device using the same.

[0002]

2. Description of the Related Art FIG. 9 shows an example of a conventional mounting structure of a tape carrier.

[0003] A conventional tape carrier mounting method is a chip-on-flexible printed circuit (hereinafter referred to as C).
The outer lead 2 of the COF 1 is not coated with the solder coating 11 in advance on the outer lead 2 of the
And soldering land 4 of circuit board 3 by hand, or soldering outer lead 2 of COF 1 to circuit board 3 without prior solder coating 11 on outer lead 2 of COF 1. The land 4 was thermocompression-bonded with a heating tool 12 or the like and soldered. Therefore, the mounting structure of the conventional tape carrier is, as shown in FIG.
No recess was present.

[0004]

However, in the above-mentioned prior art, the soldering is performed manually, so that a considerable amount of processing time is required and the quality is not stable, or automatic soldering is performed using a heating tool or the like. However, it is difficult to control the quality of the connection between the outer leads of the tape carrier and the solder lands of the circuit board, and the connection strength is low and the reliability is very low.

In order to solve the above-mentioned drawbacks, the present invention is to coat the outer leads of the tape carrier with solder and then press the outer leads of the tape carrier and the soldering lands of the circuit board by thermocompression bonding using a heating tool or the like. The mounting method of the tape carrier is used. It is an object of the present invention to provide an inexpensive and highly reliable mounting structure of a tape carrier, an electro-optical device using the same, and an electronic printing device using the same.

[0006]

According to the method of mounting a tape carrier of the present invention, the outer leads of the tape carrier are first coated with solder, and then the outer leads and the solder lands of the circuit board are heated by a heating tool or the like. It is characterized by being connected by soldering by crimping.

According to the tape carrier mounting structure of the present invention, when the tape carrier is mounted on a circuit board, the outer leads of the tape carrier are first coated with solder, and then the outer leads are soldered to the solder lands of the circuit board. The tape carrier is formed by using a method characterized in that it is connected by soldering by thermocompression bonding with a heating tool or the like, and the tape carrier after mounting has a recess at the center of the outer lead.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

[Embodiment 1] FIGS. 1 and 2 show an embodiment of a mounting method of a tape carrier according to the present invention. In FIG. 1, terminals on three sides of the liquid crystal display element 6
1 is mounted with an anisotropic conductive film or the like. Where COF1
A single semiconductor device in which the semiconductor element 11 is mounted on a tape carrier, and the semiconductor element 11 is separated into single parts including a wiring pattern necessary for the function around the semiconductor element 11. In FIG. 1A, the liquid crystal display element 6 in which COF1 is mounted on each terminal (hereinafter referred to as an LCD unit) is held by a vacuum suction pad or the like attached to the tip of a manipulator or the like. Can change direction freely. Here, the LCD unit is first positioned so that the lower side thereof is substantially parallel to the flux 7 surface. Next, the LCD unit is lowered and its L
The outer lead 2 of the COF 1 on the lower side of the CD unit is dipped in the flux 7 to apply the flux, and the LCD unit is pulled up. By performing this operation for each side of the LCD unit, the liquid crystal display element 6
The flux 7 is applied to the outer leads 2 of all the COFs 1 mounted on the COF 1. Next, as shown in FIG.
The operation similar to that of FIG.
The outer leads 2 coated with the flux 7 are soldered 9
The outer lead 2 can be coated with the solder coating 11 by dipping in the inside. Also in this case, the same operation is performed for each side, so that the solder coating 1 is applied to all the outer leads 2 of the COF 1 of the LCD unit.
1 can be applied. The immersion time of the outer lead 2 of the COF 1 in the flux 7 and the solder 9 is set to 0.1. It is several seconds to ten and several seconds.

FIG. 2 is a sectional view showing an embodiment of a method of mounting a tape carrier according to the present invention, and shows a step following FIG. In FIG. 2A, the outer leads 2 of the COF 1 mounted on the liquid crystal display element 6 and coated with the solder coating 11 are aligned and disposed on the soldering lands 4 of the circuit board 3. A heating tool 12 for soldering is on standby on the lead 2. FIG.
In FIG. 2B, the heating tool 12 waiting in FIG.
Then, the outer leads 2 are pressed against the soldering lands 4 and simultaneously heated to melt the solder of the solder coating 11, and the outer leads 2 and the soldering lands 4 are soldered. At this time, the heating method of the heating tool 12 is an instantaneous heating method using a pulse current, but may be an instantaneous heating method using a laser beam, a heating wire, or the like, or another general constant heating method. In FIG. 2C, FIG.
The heating tool 12 that has completed the soldering of the outer leads 2 and the solder lands 4 in (b) is lifted upward away from the soldering portion. After the heating tool 2 is lifted, the solder coating 11 of the outer lead 2 has a concave portion 13 which is a mark of the heating tool 12 left. Examples of specifications of the COF 1, the circuit board 3, the flux 7, and the solder 9 used in the present embodiment are as follows.

<Specifications of COF1> Base film: 25-75 μm thick polyimide resin, polyester resin, etc.

Copper foil (outer lead material): Electrolytic copper foil having a thickness of several to 50 μm.

Plating of copper foil: Sn plating, Au plating, etc. of several μm.

<Specifications of the circuit board 3>-Board material: glass epoxy resin, epoxy composite material, paper phenol resin, bakelite, etc.

Copper foil (soldering land 4): Electrolytic copper foil having a thickness of several to 50 μm.

Plating of copper foil: solder plating of about several μm to several tens, Au plating or the like.

Surface: Insulating agent application and the like.

<Specifications of Flux 7> Standards: RF-35M RMA flux from Nippon Almit.

<Solder 9>: Solder having a Pb / Sn ratio = 60/40 or the like.

[Embodiment 2] FIG. 3 is a view showing an embodiment of a method of mounting a tape carrier according to the present invention. As compared with Embodiment 1, application of flux 7 to outer leads 2 of COF 1 and solder coating are performed. 11 is performed not in the LCD unit state but in the tape carrier 5 state. From FIG. 3, it can be seen that when the tape carrier 5 is partially immersed in the flux 7 and the solder 9 and moved, the solder coating 11 is applied to the outer lead 2 of the COF 1 on the tape carrier.

[Embodiment 3] FIG. 4 is a cross-sectional view showing an embodiment of a mounting structure of a tape carrier according to the present invention, which is an example used for a liquid crystal display device as an example of an electro-optical device. This embodiment is formed by using the tape carrier mounting method of the first embodiment. As shown in FIG. 4, the outer lead 2 has a recess 13 at the center of the solder coating 11. By observing the appearance of the recess 13, the outer lead 2
In addition, it is possible to accurately and easily determine whether or not the soldering lands 4 of the circuit board 3 are securely soldered.

Embodiment 4 FIG. 5 is a sectional view showing an embodiment of a mounting structure of a tape carrier according to the present invention. In the present embodiment, the liquid crystal display element 6 is opposite to the front and rear sides of the liquid crystal display element 6 according to the third embodiment, and accordingly, the direction of the COF 1 is also opposite, and the semiconductor element 14 comes to the circuit board 3 side. A feature is that a semiconductor element escape hole 15 is provided in the substrate 3 to allow the outer shape of the semiconductor element 14 to escape.
An electronic display element such as a liquid crystal display element 6 or an electronic printing element;
There are many combinations of the front side and the back side of the OF 1 and the circuit board 3, but it is possible to realize them by only slightly changing the mounting structure.

Embodiment 5 FIG. 6 is a sectional view showing an embodiment of a mounting structure of a tape carrier according to the present invention. This embodiment is characterized in that the COF 1 is bent by 90 ° with respect to the third embodiment. Although the lead slit 16 is provided in the bent portion of the COF 1 in FIG. 6, the lead slit 16 may not be provided. The bending angle of COF1 is 180
You may bend up to ゜.

[Embodiment 6] FIG. 7 is a cross-sectional view showing an embodiment in which the mounting structure of the tape carrier of the present invention is used in a liquid crystal display device which is a kind of an electro-optical device. FIG.
In the above, there is a liquid crystal display element 6 on a backlight 18,
A COF 1 is mounted on a terminal of the liquid crystal display element 6, and a solder coating 11 is applied to an outer lead 2 of the COF 1 and thermocompression-bonded by a heating tool 12 to form a recess 13. The liquid crystal display element 6 is fixed to the backlight 18 by a frame 19, a pressing rubber 20, and the like, thereby forming a liquid crystal display device.

[Embodiment 7] FIG. 8 is a sectional view showing an embodiment in which the tape carrier mounting structure of the present invention is used in an electronic printing apparatus such as a thermal head of a thermal printer. In this embodiment, the mounting structure of the third embodiment is used for an electronic printing apparatus.

[0026]

As described above, the method of mounting a tape carrier according to the present invention uses COF before soldering to a circuit board.
By applying a solder coating to the outer leads of the COF, the COF outer leads can be automatically soldered with stable quality to the soldering lands of the circuit board, making it very easy to check the soldered parts. It is possible to provide a mounting structure of the tape carrier of the present invention, which can be reliably performed. By using the mounting method and the mounting structure, it is possible to provide an inexpensive and highly reliable electro-optical device and an electronic printing device.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of the present invention.

FIG. 2 is a diagram showing one embodiment of the present invention.

FIG. 3 is a diagram showing one embodiment of the present invention.

FIG. 4 is a diagram showing one embodiment of the present invention.

FIG. 5 is a diagram showing one embodiment of the present invention.

FIG. 6 is a diagram showing one embodiment of the present invention.

FIG. 7 is a diagram showing one embodiment of the present invention.

FIG. 8 is a diagram showing one embodiment of the present invention.

FIG. 9 is a diagram showing a conventional technology example.

[Explanation of symbols]

 1. COF 2. Outer lead 3. Circuit board 4. Soldering land 5. Tape carrier 6. 6. Liquid crystal display device (LCD) Flux 8. Flux tank 9. Solder 10. Solder tank 11. Solder coating 12. Heating tool 13. Recess 14. Semiconductor device 15. Semiconductor element relief hole 16. Lead slit 17. Electronic printing element 18. Backlight 19. Frame 20. Presser rubber

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[Procedure amendment]

[Submission date] December 10, 2001 (2001.12.
10)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Name of invention

[Correction method] Change

[Correction contents]

Patent application title: Semiconductor device mounting method, semiconductor device mounting structure and electro-optical device

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

The present invention relates to a semiconductor device mounting method, a semiconductor device mounting structure, and an electro-optical device.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

According to the present invention, there is provided a method of mounting a semiconductor device, comprising the steps of: applying a solder coating to an outer lead of the semiconductor device; and thermocompression bonding the outer lead to a circuit board. Wherein, in the step of thermocompression bonding, thermocompression bonding is performed so that a recess is provided in the solder coating after the thermocompression bonding. Further, it is preferable that the concave portion is provided in a portion corresponding to a connection portion between the outer lead and the circuit board in the solder coating. Further, it is preferable that the concave portion is provided locally at a portion corresponding to a connection portion between the outer lead and the circuit board of the solder coating. The mounting structure of the semiconductor device of the present invention is a mounting structure of a semiconductor device,
A semiconductor device having outer leads, a solder coating applied on the outer leads, and a circuit board connected to the outer leads by the solder coating, wherein the solder coating has a recess. Features. Further, it is preferable that the recess is provided in a portion corresponding to a connection portion between the outer lead and the circuit board in the solder coating. Further, it is preferable that the concave portion is provided locally in a portion corresponding to a connection portion between the outer lead and the circuit board in the solder coating.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

An electronic optical device according to the present invention is an electronic optical device, comprising: an electronic display element; a semiconductor device mounted on the electronic display element and having outer leads; a solder coating provided on the outer leads; And a circuit board connected to the outer leads by solder coating, wherein the solder coating is provided with a concave portion. Further, it is preferable that the recess is provided in a portion corresponding to a connection portion between the outer lead and the circuit board in the solder coating. Further, it is preferable that the concave portion is provided locally in a portion corresponding to a connection portion between the outer lead and the circuit board in the solder coating. Further, the electronic display device includes a liquid crystal display device.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction contents]

[0026]

As described above, according to the semiconductor device mounting method and the semiconductor device mounting structure of the present invention, the soldered portion can be confirmed very easily and reliably. By using the mounting method and the mounting structure, an inexpensive and highly reliable electro-optical device can be provided.

Claims (4)

[Claims] First, the outer lead of the tape carrier is first
A method for mounting a tape carrier, comprising: applying a solder coating; and thereafter, connecting the outer leads and soldering lands of a circuit board by thermocompression bonding using a heating tool or the like. 2. A tape carrier mounting structure formed by using the tape carrier mounting method according to claim 1, wherein the tape carrier after mounting has a concave portion in the center of the outer lead. 3. An electro-optical device using the tape carrier mounting structure according to claim 2. 4. An electronic printing apparatus using the tape carrier mounting structure according to claim 2.