JP2002155230A - Photo-setting moistureproof and insulating coating and moistureproofed and insulated electronic part - Google Patents
Photo-setting moistureproof and insulating coating and moistureproofed and insulated electronic partInfo
- Publication number
- JP2002155230A JP2002155230A JP2000353068A JP2000353068A JP2002155230A JP 2002155230 A JP2002155230 A JP 2002155230A JP 2000353068 A JP2000353068 A JP 2000353068A JP 2000353068 A JP2000353068 A JP 2000353068A JP 2002155230 A JP2002155230 A JP 2002155230A
- Authority
- JP
- Japan
- Prior art keywords
- photo
- electronic part
- moistureproofed
- coating
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title abstract description 14
- 239000011248 coating agent Substances 0.000 title abstract description 12
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 10
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 5
- 239000003999 initiator Substances 0.000 claims abstract description 5
- 239000011810 insulating material Substances 0.000 claims abstract description 3
- 239000003973 paint Substances 0.000 claims description 15
- -1 acryloxy Chemical group 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 238000005984 hydrogenation reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- AXYQEGMSGMXGGK-UHFFFAOYSA-N 2-phenoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(C=1C=CC=CC=1)OC1=CC=CC=C1 AXYQEGMSGMXGGK-UHFFFAOYSA-N 0.000 description 1
- BJEMXPVDXFSROA-UHFFFAOYSA-N 3-butylbenzene-1,2-diol Chemical group CCCCC1=CC=CC(O)=C1O BJEMXPVDXFSROA-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 102100022749 Aminopeptidase N Human genes 0.000 description 1
- 102100022005 B-lymphocyte antigen CD20 Human genes 0.000 description 1
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 101000757160 Homo sapiens Aminopeptidase N Proteins 0.000 description 1
- 101000897405 Homo sapiens B-lymphocyte antigen CD20 Proteins 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229940072282 cardura Drugs 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- RUZYUOTYCVRMRZ-UHFFFAOYSA-N doxazosin Chemical compound C1OC2=CC=CC=C2OC1C(=O)N(CC1)CCN1C1=NC(N)=C(C=C(C(OC)=C2)OC)C2=N1 RUZYUOTYCVRMRZ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- MIJRFWVFNKQQDK-UHFFFAOYSA-N furoin Chemical compound C=1C=COC=1C(O)C(=O)C1=CC=CO1 MIJRFWVFNKQQDK-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品の防湿、
絶縁等に適した難燃性を付与した光硬化性防湿絶縁塗
料、およびこれを用いて防湿絶縁された電子部品に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to moisture-proof electronic components,
The present invention relates to a light-curable moisture-proof insulating paint having flame retardancy suitable for insulation and the like, and to a moisture-proof and insulated electronic component using the same.
【０００２】[0002]
【従来の技術】従来、実装回路板およびハイブリッドＩ
Ｃ（integrated circuit）等の電子部品には、ガラスエ
ポキシ、紙フェノール、アルミナセラミック等の基板に
配線図が印刷されてマイコン、抵抗体、コンデンサなど
の各種部品が搭載されており、それらを湿気、ほこりな
どから保護する目的で絶縁処理が行われている。この絶
縁処理方法には、アクリル樹脂、シリコーン樹脂、フェ
ノール樹脂、エポキシ樹脂などの塗料による保護コーテ
ィング処理が広く採用されている。このような実装回路
板およびハイブリッドＩＣは、過酷な環境下、特に高湿
度下で使用され、例えば自動車、洗濯機などの機器に搭
載されて使用されている。2. Description of the Related Art Conventionally, mounted circuit boards and hybrid I
Electronic components such as C (integrated circuit) are printed with wiring diagrams on substrates such as glass epoxy, paper phenol, and alumina ceramic, and mounted with various components such as microcomputers, resistors, and capacitors. Insulation processing is performed for the purpose of protecting from dust and the like. As this insulation treatment method, a protective coating treatment with a paint such as an acrylic resin, a silicone resin, a phenol resin, or an epoxy resin is widely adopted. Such mounted circuit boards and hybrid ICs are used under severe environments, particularly under high humidity, and are used by being mounted on, for example, devices such as automobiles and washing machines.
【０００３】しかしながら、前記塗料は加熱硬化性であ
るため、塗料を完全に硬化させて絶縁効果を得るために
は高温度処理、また長時間処理が必要であった。一方、
短時間処理、例えば数秒〜数分での硬化が可能な紫外線
硬化性樹脂塗料が開発されているが、まだ充分な可とう
性及び耐湿性を有し、かつ塗料自体の難燃性を持つもの
が得られていない。However, since the paint is heat-curable, high-temperature treatment and long-time treatment are required to completely cure the paint and obtain an insulating effect. on the other hand,
UV curable resin coatings that can be cured in a short time, for example, in a few seconds to a few minutes, have been developed. Is not obtained.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、このような
従来技術の問題点を解決し、短時間処理が可能で、可と
う性、耐湿性及び難燃性に優れた光硬化性防湿絶縁塗料
並びにこれを塗布、硬化して得られる防湿絶縁された電
子部品を提供するものである。SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and can be processed in a short time, and has excellent flexibility, moisture resistance and flame retardancy. An object of the present invention is to provide a paint and a moisture-proof and insulated electronic component obtained by applying and curing the paint.
【０００５】[0005]
【課題を解決するための手段】本発明は、（Ａ）光硬化
性の末端アクリロキシポリブタジエン又は末端メタクリ
ロキシポリブタジエン、（Ｂ）光重合開始剤、（Ｃ）シ
ランカップリング剤及び（Ｄ）水和アルミナを含有して
なる光硬化性防湿絶縁塗料に関する。また本発明は、前
記光硬化性防湿絶縁材料を塗布、硬化して防湿絶縁され
た電子部品に関する。The present invention provides (A) a photocurable terminal acryloxy polybutadiene or methacryloxy polybutadiene, (B) a photopolymerization initiator, (C) a silane coupling agent, and (D) water. The present invention relates to a photo-curable moisture-proof insulating paint containing humid alumina. The present invention also relates to a moisture-proof and insulated electronic component obtained by applying and curing the photocurable moisture-proof insulating material.
【０００６】[0006]
【発明の実施の形態】本発明に用いられる光硬化性の末
端アクリロキシポリブタジエン又は末端メタアクリロキ
シポリブタジエン（Ａ）とは、末端にアクリロキシ基又
はメタクリロキシ基を有するものであれば特に制限はな
く、例えば、末端ヒドロキシポリブタジエンを、ポリイ
ソシアネートと反応させ、その後にヒドロキシエチルア
クリレートまたはヒドロキシエチルメタクリレートを反
応させて得ることができる。この（Ａ）成分は数平均分
子量が３００〜１０，０００であることが好ましく、５
００〜５，０００であることがより好ましい。またポリ
ブタジエンの水素添加率は９０％以上が好ましく、９５
％以上がより好ましい。数平均分子量が３００未満では
造膜性が悪くなる傾向にあり、１０，０００を超えると
粘度が高く、作業性に劣る傾向にある。また水素添加率
が９０％未満では得られる塗膜の加熱劣化後の可とう性
が低下し、耐熱性が劣る傾向にある。BEST MODE FOR CARRYING OUT THE INVENTION The photocurable terminal acryloxypolybutadiene or methacryloxypolybutadiene (A) used in the present invention is not particularly limited as long as it has an acryloxy group or a methacryloxy group at a terminal. For example, it can be obtained by reacting a terminal hydroxy polybutadiene with a polyisocyanate, followed by reacting with hydroxyethyl acrylate or hydroxyethyl methacrylate. The component (A) preferably has a number average molecular weight of 300 to 10,000,
It is more preferable that it is 00 to 5,000. The hydrogenation rate of polybutadiene is preferably 90% or more.
% Or more is more preferable. If the number average molecular weight is less than 300, the film-forming properties tend to be poor, and if it exceeds 10,000, the viscosity tends to be high and the workability tends to be poor. If the hydrogenation rate is less than 90%, the flexibility of the resulting coating film after heat deterioration is reduced, and the heat resistance tends to be poor.
【０００７】このような特性を有する光硬化性の末端ア
クリロキシポリブタジエン又は末端メタアクリロキシポ
リブタジエンの市販品としては、日本曹達(株)製の商品
名ＴＥＡＩ−１０００、ＴＥＡＩ−３０００等が挙げら
れる。これらは単独でまたは２種以上を組み合わせて使
用できる。Commercially available photocurable terminal acryloxypolybutadiene or terminal methacryloxypolybutadiene having such characteristics include TEAI-1000 and TEAI-3000 (trade names) manufactured by Nippon Soda Co., Ltd. These can be used alone or in combination of two or more.
【０００８】本発明に用いられる光重合開始剤は、ベン
ジルジメチルケタール、ベンゾイン、ベンゾインエチル
エーテル、ベンゾインプロピルエーテル、ベンゾインフ
ェニルエーテルなどのベンゾインエーテル類、ベンゾイ
ンチオエーテル類、ベンゾフェノン、アセトフェノン、
２−エチルアントラキノンフロイン、ベンゾインエーテ
ルミヒラーケトン系、塩化デシルノチオキサントン類な
どが挙げられ、これらは単独で又は２種以上を組み合わ
せて使用できる。これら光重合開始剤の配合割合は、硬
化速度と造膜性の点から前記（Ａ）成分１００重量部に
対して０．０１〜１０重量部の範囲が好ましく、０．１
〜５重量部の範囲がより好ましい。The photopolymerization initiator used in the present invention includes benzoin ethers such as benzyldimethyl ketal, benzoin, benzoin ethyl ether, benzoin propyl ether and benzoin phenyl ether, benzoin thioethers, benzophenone, acetophenone,
Examples thereof include 2-ethylanthraquinone furoin, benzoin ether Michler's ketone, and decylnothioxanthone chloride, and these can be used alone or in combination of two or more. The mixing ratio of these photopolymerization initiators is preferably in the range of 0.01 to 10 parts by weight with respect to 100 parts by weight of the component (A) from the viewpoint of curing speed and film forming properties.
A range of from 5 to 5 parts by weight is more preferable.
【０００９】本発明に用いられる（Ｃ）シランカップリ
ング剤は種々のものが用いられるが、中でもγ−メタク
リロキシプロピルトリエトキシシランが好ましい。シラ
ンカップリング剤の配合割合は、ガラス基板との接着性
から前記（Ａ）成分１００重量部に対して１〜２０重量
部の範囲が好ましく、５〜１０重量部の範囲がより好ま
しい。Various (C) silane coupling agents can be used in the present invention, and among them, γ-methacryloxypropyltriethoxysilane is preferable. The mixing ratio of the silane coupling agent is preferably in the range of 1 to 20 parts by weight, more preferably in the range of 5 to 10 parts by weight, based on 100 parts by weight of the component (A) from the viewpoint of adhesion to the glass substrate.
【００１０】本発明に用いられる（Ｄ）水和アルミナは
充てん剤であり、難燃性に効果のあるものであるこれら
水和アルミナの配合割合は、ＵＬ９４試験（１／８イン
チ）において９４Ｖ−０という高難燃性を有することか
ら、前記（Ａ）成分１００重量部に対して１００〜２５
０重量部の範囲が好ましく、１５０〜２００重量部の範
囲がより好ましい。The hydrated alumina (D) used in the present invention is a filler and has an effect on flame retardancy. The proportion of these hydrated aluminas is 94 V- in the UL94 test (1/8 inch). 0 to 100 to 25 parts by weight based on 100 parts by weight of the component (A).
A range of 0 parts by weight is preferable, and a range of 150 to 200 parts by weight is more preferable.
【００１１】本発明の光硬化性防湿絶縁塗料は、前記
（Ａ）、（Ｂ）、（Ｃ）及び（Ｄ）成分を配合し、加熱
溶解することによって得られる。また、本発明になる光
硬化性防湿絶縁塗料には、必要に応じて架橋性単量体、
重合禁止剤などを添加することができる。The photocurable moisture-proof insulating coating of the present invention is obtained by blending the above-mentioned components (A), (B), (C) and (D), and heating and dissolving. In addition, the photocurable moisture-proof insulating coating according to the present invention includes, as necessary, a crosslinkable monomer,
A polymerization inhibitor or the like can be added.
【００１２】架橋性単量体としては、スチレン、ビニル
トルエン、α−メチルスチレン、ｐ−タ−シャリーブチ
ルスチレン、クロルスチレン、ジビニルベンゼン、ジア
リルフタレート、２−ヒドロオキシエチルメタクリレー
ト、２−ヒドロオキシプロピルメタクリレート、メチル
メタクリレート、エチルメタクリレート、ラウリルメタ
クリレート、メタクリル酸とカージュラＥ−１０（シェ
ル化学(株)製、高級脂肪酸のグリシジルエステルの商品
名）の反応物などの１官能性のメタクリル酸エステル、
エチレングリコールジメタクリレート、ジエチレングリ
コールジメタクリレート、１，６−ヘキサンジオールジ
メタクリレートなどの２官能性のメタクリル酸エステ
ル、トリメチロールプロパントリメタクリレートなどの
３官能性のメタクリル酸エステル、メチルアクリレー
ト、エチルアクリレート、ラウリルアクリレート、２−
ヒドロオキシエチルアクリレート、２−ヒドロオキシプ
ロピルアクリレート、アクリル酸とカージュラＥ−１０
の反応物などの１官能性のアクリル酸エステル、エチレ
ングリコールジアクリレート、ジエチレングリコールジ
アクリレート、１，６−ヘキサンジオールジアクリレー
トなどの２官能のアクリル酸エステル、トリメチロール
プロパントリアクリレートなどの３官能性のアクリル酸
エステルなどが用いられ、これらは単独で又は２種以上
を組み合わせて使用できる。Examples of the crosslinking monomer include styrene, vinyltoluene, α-methylstyrene, p-tert-butylstyrene, chlorostyrene, divinylbenzene, diallyl phthalate, 2-hydroxyethyl methacrylate, and 2-hydroxypropyl. Monofunctional methacrylates such as methacrylate, methyl methacrylate, ethyl methacrylate, lauryl methacrylate, a reaction product of methacrylic acid and Khadura E-10 (trade name of glycidyl ester of higher fatty acid, manufactured by Shell Chemical Co., Ltd.),
Bifunctional methacrylates such as ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 1,6-hexanediol dimethacrylate, trifunctional methacrylates such as trimethylolpropane trimethacrylate, methyl acrylate, ethyl acrylate, lauryl acrylate , 2-
Hydroxyethyl acrylate, 2-hydroxypropyl acrylate, acrylic acid and Cardura E-10
Monofunctional acrylates such as reaction products of above, bifunctional acrylates such as ethylene glycol diacrylate, diethylene glycol diacrylate and 1,6-hexanediol diacrylate, and trifunctional acrylates such as trimethylolpropane triacrylate Acrylic esters and the like are used, and these can be used alone or in combination of two or more.
【００１３】重合禁止剤としては、ハイドロキノン、パ
ラターシャリーブチルカテコール、ピロガロール等のキ
ノン類、その他一般に使用されているものが用いられ
る。As the polymerization inhibitor, quinones such as hydroquinone, paratertiary butyl catechol and pyrogallol, and other commonly used ones are used.
【００１４】本発明になる光硬化性防湿絶縁塗料を用い
て防湿絶縁された実装回路板、ハイブリッドＩＣ等の電
子部品が製造されるが、その製法としては、一般に知ら
れているハケ塗り法、浸漬法（ディップ法）、スプレー
法などによってこの塗料を電子部品に塗布、硬化すれば
よい。塗布後の塗膜の硬化は紫外線照射によって行うこ
とができる。Electronic parts, such as mounted circuit boards and hybrid ICs, which are moisture-proof and insulated using the photocurable moisture-proof insulating paint according to the present invention, are manufactured by a generally known brush coating method. The paint may be applied to the electronic component by an immersion method (dip method), a spray method, or the like, and cured. Curing of the coating film after application can be performed by ultraviolet irradiation.
【００１５】[0015]
【実施例】次に本発明を実施例及び比較例により説明す
る。「部」として表したものは重量部を示す。Next, the present invention will be described with reference to examples and comparative examples. Those expressed as "parts" indicate parts by weight.
【００１６】実施例１ ＴＥＡＩ−１０００（日本曹達株式会社製、アクリル変
性水素添加ポリブタジエン樹脂、平均分子量：約１００
０、水素添加率：９７％）１００部、ベンジルジメチル
ケタール２．５部、γ−メタクリロキシプロピルトリエ
トキシシラン５部及び水和アルミナ（住友化学工業株式
会社製、商品名ＣＬ−３１０）１８０部を混合攪拌して
塗料Ａを得た。Example 1 TEAI-1000 (manufactured by Nippon Soda Co., Ltd., acrylic-modified hydrogenated polybutadiene resin, average molecular weight: about 100)
0, hydrogenation rate: 97%) 100 parts, benzyl dimethyl ketal 2.5 parts, γ-methacryloxypropyl triethoxysilane 5 parts and hydrated alumina (manufactured by Sumitomo Chemical Co., Ltd., trade name CL-310) 180 parts Was mixed and stirred to obtain a coating material A.
【００１７】比較例１ ＴＥＡＩ−１０００（日本曹達株式会社製、アクリル変
性水素添加ポリブタジエン樹脂、平均分子量：約１００
０、水素添加率：９７％）１００部、ベンジルジメチル
ケタール２．５部及びγ−メタクリロキシプロピルトリ
エトキシシラン５部を混合攪拌して塗料Ｂを得た。Comparative Example 1 TEAI-1000 (manufactured by Nippon Soda Co., Ltd., acrylic-modified hydrogenated polybutadiene resin, average molecular weight: about 100)
(0, hydrogenation rate: 97%) 100 parts, benzyldimethyl ketal 2.5 parts and γ-methacryloxypropyltriethoxysilane 5 parts were mixed and stirred to obtain coating material B.
【００１８】以上で得た塗料Ａ〜Ｂをガラス板に厚み１
００μｍ厚みになるように塗布し、日本電池株式会社製
ＵＶ照射装置で、照射出力１２０mW/cm2で総照射量が２
４００mJ/cm2になるように照射して接着性評価用試験片
を作成し、接着性評価（基盤目試験）を実施した。ま
た、これらの塗料をガラス板に１／８インチ（＝３．２
mm）厚みになるように塗布し、前記の硬化条件で硬化さ
せ、ＵＬ９４に従って難燃性試験を実施した。The paints A and B obtained above are applied to a glass plate with a thickness of 1
It was applied to a thickness of 00 μm, and the total irradiation amount was 2 m with an irradiation output of 120 mW / cm 2 using a UV irradiation device manufactured by Nippon Battery Co., Ltd.
Irradiation was performed at 400 mJ / cm 2 to prepare a test piece for evaluating adhesiveness, and the adhesiveness was evaluated (base test). Further, these paints are applied to a glass plate by １ ／ inch (= 3.2 inches).
mm) It was applied to a thickness, cured under the above-mentioned curing conditions, and subjected to a flame retardancy test according to UL94.
【００１９】[0019]
【表１】 [Table 1]
【００２０】＊１ 基盤目試験方法：基盤目の格子の寸
法１mm角で切り目を入れて、テープにより剥離の度合を
評価した。その判定は［残存数／格子数］の数値とし
た。* 1 Base line test method: A cut was made at a grid size of 1 mm square of the base line, and the degree of peeling was evaluated with a tape. The judgment was made as the numerical value of [remaining number / grid number].
【００２１】表１から明らかなとおり、水和アルミナ
（住友化学工業株式会社製、商品名ＣＬ−３１０）を１
８０部配合した組成物（実施例１）は、水和アルミナを
配合していない組成物（比較例１）に比較して、難燃性
試験において１／８インチでＵＬ９４Ｖ−０を達成して
いることが示される。As is clear from Table 1, hydrated alumina (manufactured by Sumitomo Chemical Co., Ltd., trade name CL-310) was added to 1
The composition (Example 1) in which 80 parts were blended achieved UL94V-0 at 1/8 inch in the flame retardancy test, as compared with the composition without the hydrated alumina (Comparative Example 1). Is shown.
【００２２】[0022]
【発明の効果】本発明になる光硬化性防湿絶縁塗料は、
優れた難燃性を有し、かつガラスとの接着性に優れ、こ
れにより耐湿性評価においても優れた特性を示す塗料で
あり、この塗料によって信頼性の向上された電子部品を
製造することができる。The photo-curable moisture-proof insulating paint according to the present invention comprises:
It is a paint that has excellent flame retardancy and excellent adhesion to glass, and thus exhibits excellent properties in moisture resistance evaluation. With this paint, it is possible to manufacture electronic components with improved reliability. it can.
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｂ 3/30 Ｈ０１Ｂ 3/30 Ｍ 3/44 3/44 Ｎ Ｐ Ｆターム(参考） 4J038 FA231 HA216 JA29 JA33 JB07 JC02 JC18 JC32 KA03 NA04 NA11 NA15 NA21 PA17 5G303 AA07 AA08 AB20 BA12 CA09 CA11 CD03 CD04 5G305 AA07 AA11 AB25 AB26 AB34 BA09 BA15 CA07 CA08 CA51 CB07 CB09 CC03 CD06 CD13 CD20 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) H01B 3/30 H01B 3/30 M 3/44 3/44 NPF term (Reference) 4J038 FA231 HA216 JA29 JA33 JB07 JC02 JC18 JC32 KA03 NA04 NA11 NA15 NA21 PA17 5G303 AA07 AA08 AB20 BA12 CA09 CA11 CD03 CD04 5G305 AA07 AA11 AB25 AB26 AB34 BA09 BA15 CA07 CA08 CA51 CB07 CB09 CC03 CD06 CD13 CD20
Claims (2)
ブタジエン又は末端メタクリロキシポリブタジエン、
（Ｂ）光重合開始剤、（Ｃ）シランカップリング剤及び
（Ｄ）水和アルミナを含有してなる光硬化性防湿絶縁塗
料。1. A photocurable terminal acryloxy polybutadiene or terminal methacryloxy polybutadiene,
A photocurable moisture-proof insulating paint containing (B) a photopolymerization initiator, (C) a silane coupling agent, and (D) hydrated alumina.
塗布、硬化して防湿絶縁された電子部品。2. An electronic component having the moisture-proof insulation by applying and curing the photo-curable moisture-proof insulating material according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000353068A JP2002155230A (en) | 2000-11-20 | 2000-11-20 | Photo-setting moistureproof and insulating coating and moistureproofed and insulated electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000353068A JP2002155230A (en) | 2000-11-20 | 2000-11-20 | Photo-setting moistureproof and insulating coating and moistureproofed and insulated electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002155230A true JP2002155230A (en) | 2002-05-28 |
Family
ID=18825886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000353068A Pending JP2002155230A (en) | 2000-11-20 | 2000-11-20 | Photo-setting moistureproof and insulating coating and moistureproofed and insulated electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002155230A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007080936A1 (en) * | 2006-01-13 | 2007-07-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Curable resin composition, surface protection method, temporary fixation method, and separation method |
| JP2008095039A (en) * | 2006-10-16 | 2008-04-24 | Denki Kagaku Kogyo Kk | Curable composition for surface protection |
-
2000
- 2000-11-20 JP JP2000353068A patent/JP2002155230A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007080936A1 (en) * | 2006-01-13 | 2007-07-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Curable resin composition, surface protection method, temporary fixation method, and separation method |
| JP2008095039A (en) * | 2006-10-16 | 2008-04-24 | Denki Kagaku Kogyo Kk | Curable composition for surface protection |
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