JP2002155136A - Cation curable composition containing oxetane compound as principal component - Google Patents

Cation curable composition containing oxetane compound as principal component

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Publication number
JP2002155136A
JP2002155136A JP2000355323A JP2000355323A JP2002155136A JP 2002155136 A JP2002155136 A JP 2002155136A JP 2000355323 A JP2000355323 A JP 2000355323A JP 2000355323 A JP2000355323 A JP 2000355323A JP 2002155136 A JP2002155136 A JP 2002155136A
Authority
JP
Japan
Prior art keywords
curable composition
oxetane
compound
oxetane compound
solubility parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000355323A
Other languages
Japanese (ja)
Other versions
JP4487412B2 (en
Inventor
Takashi Tsuda
隆 津田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Priority to JP2000355323A priority Critical patent/JP4487412B2/en
Publication of JP2002155136A publication Critical patent/JP2002155136A/en
Application granted granted Critical
Publication of JP4487412B2 publication Critical patent/JP4487412B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a cation curable composition which is a non-silicone type and has an excellent releasability. SOLUTION: The cation curable composition comprises an oxetane compound having a solubility parameter of 7.7-8.3, a light or a heat initiator, and according to demand, a cation curable compound other than the oxetane compound.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、オキセタン化合物
を主成分とするカチオン硬化性組成物に関する。さらに
詳しくは、カチオン硬化性に優れ、かつ得られる硬化物
の離型性に優れるカチオン硬化性組成物に関する。
TECHNICAL FIELD The present invention relates to a cationically curable composition containing an oxetane compound as a main component. More specifically, the present invention relates to a cationically curable composition having excellent cationic curability and excellent release properties of the obtained cured product.

【0002】[0002]

【従来の技術】離型剤はアクリル系やゴム系粘着剤のセ
パレーター等の用途に大量に使用され、離型剤としては
シリコーン系樹脂やステアリル基含有樹脂が一般に用い
られている。離型剤の使用方法としては、これらの樹脂
を含む溶剤やエマルジョン溶液または分散液を、基材で
あるフィルムや紙にコーティングした後、乾燥および熱
硬化させる方法が一般的である。しかしながら、最近は
環境問題の面から有機溶剤などのVOC成分を製造工程
から排除する動きが盛んであり、また、省エネルギー・
省スペース・生産性の点から、従来の含溶剤系樹脂の代
わりに、有機溶剤を必要としない紫外線などの活性エネ
ルギー線または熱硬化型の樹脂が注目されている。一
方、活性エネルギー線硬化型の離型剤としては、シリコ
ーンにエポキシ基を導入したカチオン硬化型のシリコー
ン系離型剤が開発されているが、シリコーン系離型剤は
優れた離型効果を有する反面、シリコーン成分の移行や
機器汚染の問題があり、電子材料などの用途では使用す
ることが困難である。従って、非シリコーン系であり、
かつシリコーン系に匹敵する離型作用を示し、かつ有機
溶剤を必要としない活性エネルギー線または熱で硬化す
る化合物があれば、優れた離型剤として工業的に広く使
用される。
2. Description of the Related Art Release agents are used in large quantities for applications such as separators of acrylic or rubber-based pressure-sensitive adhesives, and silicone-based resins and stearyl group-containing resins are generally used as release agents. As a method of using a release agent, a method of coating a solvent or an emulsion solution or dispersion containing these resins on a film or paper as a base material, followed by drying and heat curing is generally used. However, recently, there has been an increasing movement to eliminate VOC components such as organic solvents from the manufacturing process due to environmental problems.
From the viewpoint of space saving and productivity, active energy rays such as ultraviolet rays and thermosetting resins which do not require an organic solvent are attracting attention instead of conventional solvent-containing resins. On the other hand, as an active energy ray-curable release agent, a cationically-curable silicone release agent in which an epoxy group is introduced into silicone has been developed, but the silicone-based release agent has an excellent release effect. On the other hand, there is a problem of migration of silicone components and contamination of equipment, so that it is difficult to use in applications such as electronic materials. Therefore, it is non-silicone,
In addition, a compound which exhibits a releasing effect comparable to that of a silicone resin and which can be cured by an active energy ray or heat which does not require an organic solvent is widely used industrially as an excellent releasing agent.

【0003】[0003]

【本発明が解決しようとする課題】本発明の課題は、非
シリコーン系であり、かつ優れた離型性を有するカチオ
ン硬化性組成物を提供することである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a cationically curable composition which is non-silicone and has excellent release properties.

【0004】[0004]

【本発明が解決しようとする課題】本発明者らは前記課
題を解決するための鋭意検討した結果、特定の溶解度パ
ラメーターを有するオキセタン化合物を離型剤に適用し
た場合、その硬化物が優れた離型性を有することを見出
し、本発明を完成するに至った。すなわち本発明は溶解
性パラメーターが7.7〜8.3の範囲のオキセタン化
合物、光または熱カチオン開始剤、および所望により前
記オキセタン化合物以外のカチオン硬化性化合物からな
るカチオン硬化性組成物である。
The present inventors have conducted intensive studies to solve the above-mentioned problems. As a result, when an oxetane compound having a specific solubility parameter was applied to a release agent, the cured product was excellent. They have found that they have mold release properties, and have completed the present invention. That is, the present invention is a cationically curable composition comprising an oxetane compound having a solubility parameter in the range of 7.7 to 8.3, a light or thermal cationic initiator, and optionally a cationically curable compound other than the oxetane compound.

【0005】[0005]

【発明の実施の形態】1.溶解性パラメーター(δ) 本発明における溶解性パラメーターは、Smallらの
提唱した分子引力定数(molar attraction constants)
Fを用い、次式で計算する方法での計算値である。 δ = ΣF/V 式中、δ:溶解性パラメーター、F:分子引力定数、
V:分子容を示す。なお、本発明においては、官能基の
分子容Vと分子引力定数Fは、下記表1に示すColl
emanの求めた値を用いた。
BEST MODE FOR CARRYING OUT THE INVENTION Solubility parameter (δ) The solubility parameter in the present invention is the molecular attraction constants proposed by Small et al.
This is a calculated value obtained by using F and calculating by the following equation. δ = ΣF / V where δ: solubility parameter, F: molecular attraction constant,
V: Indicates molecular volume. In the present invention, the molecular volume V of the functional group and the molecular attractive constant F are as shown in Table 1 below.
The value obtained for eman was used.

【0006】[0006]

【表1】 [Table 1]

【0007】2.オキセタン化合物(A) 本発明におけるオキセタン化合物は、溶解性パラメータ
ーが7.7〜8.3の範囲のオキセタン化合物であり、
分子中に1個のオキセタン環を有する下記式(1)で表
される化合物が好ましく用いられる。
[0007] 2. Oxetane compound (A) The oxetane compound in the present invention is an oxetane compound having a solubility parameter in the range of 7.7 to 8.3,
A compound represented by the following formula (1) having one oxetane ring in the molecule is preferably used.

【0008】[0008]

【化2】 (式中、Xは炭素数1〜4の直鎖または分岐状アルキル
基、Yは炭素数4〜22の直鎖、分岐状または脂環式の
アルキル基を示す。)
Embedded image (In the formula, X represents a linear or branched alkyl group having 1 to 4 carbon atoms, and Y represents a linear, branched or alicyclic alkyl group having 4 to 22 carbon atoms.)

【0009】前記式(1)におけるXとしてはメチル基
またはエチル基が好ましく、Yとしては炭素数6〜18
の直鎖、分岐状または脂環式のアルキル基が好ましい。
特に好ましいXはエチル基であり、特に好ましいYは炭
素数8〜18の直鎖または分岐状アルキル基である。Y
が分岐構造であると溶解性パラメーターが下げるため、
離型性発現に極めて有効である。好ましいオキセタン化
合物の具体例としては、3―エチル―3−(ヘキシロキ
シメチル)オキセタン、3―エチル―3−(ヘプチルオ
キシメチル)オキセタン、3―エチル―3−(2−エチ
ルヘキシロキシメチル)オキセタン、3―エチル―3−
(オクチルオキシメチル)オキセタン、3―エチル―3
−(ドデシルオキシメチル)オキセタン等の各種の3―
エチル―3−(アルコキシメチル)オキセタン等が挙げ
られる。これらのうち、3―エチル―3−(2−エチル
ヘキシロキシメチル)オキセタンは、東亞合成(株)製
アロンオキセタンOXT−212(商品名)として市販
されている。
In the above formula (1), X is preferably a methyl group or an ethyl group, and Y is a group having 6 to 18 carbon atoms.
Is preferably a linear, branched or alicyclic alkyl group.
Particularly preferred X is an ethyl group, and particularly preferred Y is a linear or branched alkyl group having 8 to 18 carbon atoms. Y
Is a branched structure, so that the solubility parameter decreases.
It is extremely effective in expressing releasability. Specific examples of preferred oxetane compounds include 3-ethyl-3- (hexyloxymethyl) oxetane, 3-ethyl-3- (heptyloxymethyl) oxetane, and 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane 3-ethyl-3-
(Octyloxymethyl) oxetane, 3-ethyl-3
Various 3- such as-(dodecyloxymethyl) oxetane
Ethyl-3- (alkoxymethyl) oxetane and the like. Among them, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane is commercially available as Alonoxetane OXT-212 (trade name) manufactured by Toagosei Co., Ltd.

【0010】3.光または熱カチオン開始剤(B) 本発明における光または熱カチオン開始剤は、前記オキ
セタン化合物の重合開始剤であり、光カチオン重合開始
剤は、活性エネルギー線の作用によって開裂し強酸を放
出する化合物であり、熱カチオン重合開始剤は、熱の作
用即ち温度の上昇によって開裂し強酸を放出する化合物
である。光カチオン開始剤としては、例えば、UV・E
B硬化材料[(株)シーエムシー、1992年発行]の
3.1.5項63−65頁に記載されているような化合
物が挙げられ、これらの中でも、下記式(2)に代表さ
れるトリアリールスルホニウムヘキサフロロホスフェー
ト塩、リン原子をアンチモン原子で置換されたトリアリ
ールスルホニウムヘキサフロロアンチモネート塩、下記
式(3)で表される化合物に代表されるジアリールヨー
ドニウム塩が好ましく用いられる。
[0010] 3. Light or Thermal Cationic Initiator (B) The light or thermal cationic initiator in the present invention is a polymerization initiator of the oxetane compound, and the photocationic polymerization initiator is a compound that is cleaved by the action of active energy rays to release a strong acid. The thermal cationic polymerization initiator is a compound which is cleaved by the action of heat, that is, an increase in temperature, and releases a strong acid. Examples of the photocationic initiator include UV / E
Compounds described in 3.1.5, pages 63-65 of B-curing material [CMC Co., Ltd., issued in 1992], among which are represented by the following formula (2). A triarylsulfonium hexafluorophosphate salt, a triarylsulfonium hexafluoroantimonate salt in which a phosphorus atom is substituted with an antimony atom, and a diaryliodonium salt represented by a compound represented by the following formula (3) are preferably used.

【0011】[0011]

【化3】 Embedded image

【0012】[0012]

【化4】 Embedded image

【0013】熱カチオン開始剤としては、例えば、Sb
6、−SbF4、−AsF6、−PF6−などを陰イオン
成分とする窒素、イオウ、リンまたはヨードのオニウム
塩が挙げられる。具体的には、四級アンモニウム塩型化
合物、スルホニウム塩型化合物、ホスホニウム塩型化合
物、ヨードニウム塩型化合物などが有り、旭電化工業
(株)製アデカオプトンCP−66、CP−77(いず
れも商品名)、三新化学工業(株)製サンエイドSI−
60L、SI−80L、SI−100L(いずれも商品
名)などの市販品を使用することができる。
Examples of the thermal cation initiator include, for example, Sb
An onium salt of nitrogen, sulfur, phosphorus or iodine having F 6 , —SbF 4 , —AsF 6 , —PF 6 — or the like as an anion component can be used. Specifically, there are quaternary ammonium salt-type compounds, sulfonium salt-type compounds, phosphonium salt-type compounds, iodonium salt-type compounds, etc., and Adeka Opton CP-66 and CP-77 (trade names, manufactured by Asahi Denka Kogyo KK) ), Sun-Aid SI- manufactured by Sanshin Chemical Industry Co., Ltd.
Commercial products such as 60L, SI-80L, and SI-100L (all of which are trade names) can be used.

【0014】4.他のカチオン硬化性化合物(C) 本発明における前記オキセタン化合物(A)以外のカチ
オン硬化性化合物は、必須成分ではないが目的に応じて
使用するのが好ましい成分であり、例えば、エポキシ化
合物および(A)以外のオキセタン化合物が挙げられ
る。エポキシ化合物としては、分子内に少なくとも一個
のエポキシ基を有する公知の脂環式エポキシ化合物、芳
香族エポキシ化合物が使用でき、エポキシ基を2個以上
有する多官能エポキシ化合物が好ましくは挙げられる。
好ましい脂環式エポキシ化合物の例としては、3,4−
エポキシシクロヘキシルメチル−3,4−エポキシシク
ロヘキサンカルボキシレート、ビス−(3,4−エポキ
シシクロヘキシル)アジペートなどのエポキシ化シクロ
ヘキシル基を2つ以上有する化合物が挙げられる。これ
らの化合物は米国ユニオンカーバイド社製CYRACU
REレジンとして市販されているものを使用できる。芳
香族エポキシ化合物の具体例としては、ビスフェノール
Aジグリシジルエーテル、ビスフェノールAのジグリシ
ジルエーテル縮合物、ノボラック樹脂やクレゾール樹脂
のエピクロルヒドリン変性物などが挙げられる。これら
のエポキシ化合物は硬化物に必要とされる性能に応じ、
単独あるいは混合して使用することができる。
4. Other Cationic Curable Compound (C) The cationic curable compound other than the oxetane compound (A) in the present invention is a component that is not an essential component but is preferably used according to the purpose. For example, an epoxy compound and ( Oxetane compounds other than A) are mentioned. As the epoxy compound, a known alicyclic epoxy compound or aromatic epoxy compound having at least one epoxy group in a molecule can be used, and a polyfunctional epoxy compound having two or more epoxy groups is preferable.
Examples of preferred alicyclic epoxy compounds include 3,4-
Compounds having two or more epoxidized cyclohexyl groups, such as epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and bis- (3,4-epoxycyclohexyl) adipate, may be mentioned. These compounds are manufactured by Union Carbide Co., USA
A commercially available RE resin can be used. Specific examples of the aromatic epoxy compound include bisphenol A diglycidyl ether, diglycidyl ether condensate of bisphenol A, and epichlorohydrin modified novolak resin and cresol resin. These epoxy compounds, depending on the performance required for the cured product,
They can be used alone or as a mixture.

【0015】また、(A)以外のオキセタン化合物とし
ては、分子中に1個以上のオキセタン環を有する化合物
であれば特に制限なく使用できる。具体的には、特開平
8−85775号公報および特開平8−134405号
公報などに記載された各種のオキセタン化合物の中で、
前記(A)以外のオキセタン化合物が挙げられ、これら
の中でもオキセタニル基を1個または2個有する化合物
が好ましい。単官能オキセタンの例としては、3―エチ
ル―3−(ヒドロキシメチル)オキセタン、3―エチル
―3−[(フェノキシ)メチル]オキセタン、3―エチ
ル―3−(クロロメチル)オキセタン等が挙げられる。
2官能オキセタンの例としては、1,4−ビス[(3−
エチル−3−オキセタニルメトキシ)メチル]ベンゼ
ン、ビス{[1−エチル(3−オキセタニル)]メチ
ル}エーテル等が挙げられる。これらの化合物は、東亞
合成(株)製 アロンオキセタンOXT−101、OX
T−121、OXT−211、OXT−221(いずれ
も商品名)などの市販品として入手可能である。さら
に、本発明に用いる(A)以外のオキセタン化合物とし
ては、硬化物の架橋密度を上げることができる点で、2
官能オキセタン以上の多官能オキセタンが好ましく使用
される。
As the oxetane compound other than (A), any compound having one or more oxetane rings in the molecule can be used without any particular limitation. Specifically, among various oxetane compounds described in JP-A-8-85775 and JP-A-8-134405,
Oxetane compounds other than the above (A) are exemplified, and among these, compounds having one or two oxetanyl groups are preferable. Examples of the monofunctional oxetane include 3-ethyl-3- (hydroxymethyl) oxetane, 3-ethyl-3-[(phenoxy) methyl] oxetane, 3-ethyl-3- (chloromethyl) oxetane, and the like.
Examples of bifunctional oxetanes include 1,4-bis [(3-
Ethyl-3-oxetanylmethoxy) methyl] benzene, bis {[1-ethyl (3-oxetanyl)] methyl} ether and the like. These compounds are manufactured by Toagosei Co., Ltd. Aron oxetane OXT-101, OX
It is available as a commercial product such as T-121, OXT-211 and OXT-221 (all are trade names). Further, the oxetane compounds other than (A) used in the present invention include the following because they can increase the crosslink density of the cured product.
Polyfunctional oxetanes higher than functional oxetanes are preferably used.

【0016】5.カチオン硬化性組成物の配合 本発明におけるカチオン硬化性組成物は、既に述べた
(A)〜(C)から構成されることが好ましく、該組成
物の溶解性パラメーターが8.35以下であることが好
ましく、8.3以下であることがさらに好ましい。各成
分の好ましい重量比率は、(A)が75〜99質量%、
(B)が0.1〜10質量%、および(C)が1〜24
質量%である。更に好ましい質量比率は、(A)が80
〜96質量%、(B)が0.2〜5質量%、および
(C)が4〜20質量%である。(A)が75質量%未
満では硬化塗膜の離型性に劣り、99質量%を越えると
硬化性が低下する。(B)が0.1質量%未満では硬化
性が低く、10質量%を越えると硬化物の塗膜強度が低
下する。(C)が4質量%未満では硬化性が不足し、2
5質量%を越えると硬化塗膜の離型性が低下する。
5. Blending of cationically curable composition The cationically curable composition in the present invention is preferably composed of (A) to (C) described above, and the solubility parameter of the composition is 8.35 or less. Is preferred, and more preferably 8.3 or less. The preferred weight ratio of each component is (A) 75 to 99% by mass,
(B) is 0.1 to 10% by mass, and (C) is 1 to 24%.
% By mass. More preferable mass ratio is that (A) is 80%.
-96 mass%, (B) is 0.2-5 mass%, and (C) is 4-20 mass%. If (A) is less than 75% by mass, the releasability of the cured coating film is poor, and if it exceeds 99% by mass, the curability is reduced. If (B) is less than 0.1% by mass, the curability is low, and if it exceeds 10% by mass, the coating strength of the cured product decreases. If the content of (C) is less than 4% by mass, the curability is insufficient and 2
If it exceeds 5% by mass, the releasability of the cured coating film decreases.

【0017】さらに、カチオン硬化性組成物は必要に応
じ充填剤、カップリング剤、難燃剤、可塑剤、低収縮化
剤、潤滑剤、表面改質剤、染料・顔料等の添加剤を配合
することができる。また塗膜強度の調節や界面・表面の
改質、粘度の調節などを目的として、アクリル系を始め
とする各種の樹脂成分を混合することもできる。
The cationically curable composition further contains additives such as a filler, a coupling agent, a flame retardant, a plasticizer, a low-shrinkage agent, a lubricant, a surface modifier, and a dye / pigment as required. be able to. For the purpose of adjusting the strength of the coating film, modifying the interface / surface, adjusting the viscosity, etc., various resin components such as acrylic resins can be mixed.

【0018】[0018]

【実施例】以下、実施例および比較例を挙げて本発明を
さらに具体的に説明する。各例における成分配合の部は
全て質量部である。 実施例1〜4および比較例 紫外線硬化性組成
物の調整と硬化 下記表2に示す組成の紫外線硬化性組成物を配合した
後、厚さ50μmのPETフィルム上に、バーコータ#
3を用いて塗膜を形成した後、紫外線照射して硬化させ
た。80W/cmの高圧水銀ランプを設置したコンベア
タイプの紫外線照射装置(ランプ高さ=10cm、コン
ベアスピード=10m/min)を用いて2パス通し硬
化させた。照射後約1時間後に、下記に示した方法で粘
着テープを圧着し、塗膜の離型性を評価し、その結果を
表2に示した。
The present invention will be described more specifically below with reference to examples and comparative examples. All parts of the components in each example are parts by mass. Examples 1-4 and Comparative Example Preparation and Curing of UV Curable Composition After blending the UV curable composition having the composition shown in Table 2 below, a bar coater # was placed on a 50 μm thick PET film.
After forming a coating film using No. 3, it was cured by irradiating ultraviolet rays. Using a conveyor type ultraviolet irradiation device (lamp height = 10 cm, conveyor speed = 10 m / min) equipped with a high pressure mercury lamp of 80 W / cm, curing was performed through two passes. About 1 hour after the irradiation, the pressure-sensitive adhesive tape was pressed by the method shown below, and the releasability of the coating film was evaluated. The results are shown in Table 2.

【0019】粘着テープ剥離強度:19mm巾の市販の
アクリル系粘着テープ(ニットー31Bテープ)を塗膜
上に気泡が入らぬよう注意して張り付け、ゴムロールで
数回強く圧着した。接着したフィルムを室温または50
℃で1日放置後、テープの180゜剥離強度を、東洋測
定器(株)製テンシロンUTM−4Lを使用し5Kgの
ロードセルを用いて測定した。引張り速度は300mm
/minとした。表中の溶解性パラメーターの計算は、
前記方法で行なったが、添加量の低い開始剤(CD−1
012)については計算から除外した。
Adhesive tape peeling strength: A commercially available acrylic pressure-sensitive adhesive tape (Nitto 31B tape) having a width of 19 mm was adhered to the coating film so as to prevent air bubbles from entering the film, and was strongly pressed several times with a rubber roll. Attach the bonded film to room temperature or 50
After leaving the tape at 1 ° C. for one day, the 180 ° peel strength of the tape was measured using a 5 kg load cell using Tensilon UTM-4L manufactured by Toyo Keiki Co., Ltd. Pulling speed is 300mm
/ Min. The calculation of the solubility parameter in the table is
The above procedure was repeated, but the initiator (CD-1
012) was excluded from the calculation.

【0020】[0020]

【表2】 [Table 2]

【0021】表2において1)〜5)は以下の化合物を
示す。 1)EHOX:3―エチル―3−(2−エチルヘキシロ
キシメチル)オキセタン、東亞合成(株)製アロンオキ
セタンOXT−212(商品名) 2)DDOX:3―エチル―3−(ドデシルオキシメチ
ル)オキセタン 3)UVR−6110:3,4−エポキシシクロヘキシ
ルメチル−3,4−エポキシシクロヘキサンカルボキシ
レート、ユニオンカーバイド社製脂環式エポキシ化合物
(商品名) 4)DOX:ビス{[1−エチル(3−オキセタニ
ル)]メチル}エーテル、東亞合成(株)製アロンオキ
セタンOXT−221(商品名) 5)CD−1012:ジアリールヨードニウムヘキサフ
ロロアンチモネート、サルトマー社製 SarCat C
D−1012(商品名)
In Table 2, 1) to 5) show the following compounds. 1) EHOX: 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, Alonoxetane OXT-212 (trade name) manufactured by Toagosei Co., Ltd. 2) DDOX: 3-ethyl-3- (dodecyloxymethyl) Oxetane 3) UVR-6110: 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, alicyclic epoxy compound (trade name) manufactured by Union Carbide 4) DOX: bis {1-ethyl (3- Oxetanyl)] methyl} ether, Aron oxetane OXT-221 (trade name) manufactured by Toagosei Co., Ltd. 5) CD-1012: diaryliodonium hexafluoroantimonate, SarCat C manufactured by Saltomer Co.
D-1012 (product name)

【0022】参考データ 各化合物の単品の溶解性パラメーターの計算値を下記表
3に示す。
Reference Data The calculated values of the solubility parameters of each compound alone are shown in Table 3 below.

【0023】[0023]

【表3】 [Table 3]

【0024】[0024]

【発明の効果】本発明のカチオン硬化性組成物は、離型
性に優れた硬化塗膜を与え、溶解性パラメーターを調整
することにより、離型性の強弱を容易に調節できる。ま
た、配合液の粘度が低く安全性も高いため、塗工生産性
にも優れている。これらの特長を利用し、本発明のカチ
オン硬化性組成物は塗料・コーティング材料、光学用フ
ィルム・シート状材料、成形材料、電気絶縁材料等の広
範な用途に利用可能である。
The cationically curable composition of the present invention provides a cured coating film having excellent release properties, and the strength of the release properties can be easily adjusted by adjusting the solubility parameter. Further, since the viscosity of the blended liquid is low and the safety is high, the coating productivity is also excellent. Utilizing these features, the cationically curable composition of the present invention can be used for a wide range of applications such as paints and coating materials, optical film and sheet materials, molding materials, and electrical insulating materials.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】溶解性パラメーターが7.7〜8.3の範
囲のオキセタン化合物、光または熱カチオン開始剤、お
よび所望により前記オキセタン化合物以外のカチオン硬
化性化合物からなるカチオン硬化性組成物。
1. A cationically curable composition comprising an oxetane compound having a solubility parameter in the range of 7.7 to 8.3, a light or thermal cationic initiator, and optionally a cationically curable compound other than the oxetane compound.
【請求項2】以下の(A)〜(C)からなる組成物であ
り、該組成物の溶解性パラメーターが8.35以下であ
る請求項1記載のカチオン硬化性組成物。 (A)下記式(1)で表され、溶解性パラメーターが
7.7〜8.3の範囲のオキセタン化合物:75〜99
質量部 (B)光または熱カチオン開始剤:0.1〜10質量部 (C)(A)以外のカチオン硬化性化合物:1〜24質
量部 【化1】 (式中、Xは炭素数1〜4の直鎖または分岐状アルキル
基、Yは炭素数4〜22の直鎖、分岐状または脂環式の
アルキル基を示す。)
2. The cationically curable composition according to claim 1, which is a composition comprising the following (A) to (C), wherein the solubility parameter of the composition is 8.35 or less. (A) An oxetane compound represented by the following formula (1) and having a solubility parameter in the range of 7.7 to 8.3: 75 to 99.
(B) Light or thermal cation initiator: 0.1 to 10 parts by mass (C) Cationic curable compound other than (A): 1 to 24 parts by mass (In the formula, X represents a linear or branched alkyl group having 1 to 4 carbon atoms, and Y represents a linear, branched or alicyclic alkyl group having 4 to 22 carbon atoms.)
【請求項3】請求項1または請求項2記載のカチオン硬
化性組成物をフィルム上に塗布した後、該硬化性組成物
を硬化させて得られる離型性フィルム。
3. A release film obtained by applying the cationically curable composition according to claim 1 on a film and curing the curable composition.
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Cited By (8)

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Publication number Priority date Publication date Assignee Title
JP2005336349A (en) * 2004-05-27 2005-12-08 Toagosei Co Ltd Cationically polymerizable composition
WO2008035605A1 (en) * 2006-09-19 2008-03-27 Nippon Steel Chemical Co., Ltd. Thermally polymerizable resin composition
JP2018122578A (en) * 2017-02-03 2018-08-09 リンテック株式会社 Peeling sheet and method for producing peeling sheet
JP2019072848A (en) * 2017-10-12 2019-05-16 東洋紡株式会社 Release film for ceramic green sheet production
JP2019166656A (en) * 2018-03-22 2019-10-03 東洋紡株式会社 Release film for ceramic green sheet production
JP2022079525A (en) * 2018-03-22 2022-05-26 東洋紡株式会社 Release film for ceramic green sheet production
JP2022079524A (en) * 2018-03-22 2022-05-26 東洋紡株式会社 Release film for ceramic green sheet production
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005336349A (en) * 2004-05-27 2005-12-08 Toagosei Co Ltd Cationically polymerizable composition
WO2008035605A1 (en) * 2006-09-19 2008-03-27 Nippon Steel Chemical Co., Ltd. Thermally polymerizable resin composition
US9051422B2 (en) 2006-09-19 2015-06-09 Nippon Steel & Sumikin Chemical Co., Ltd. Thermally polymerizable resin composition
JP2018122578A (en) * 2017-02-03 2018-08-09 リンテック株式会社 Peeling sheet and method for producing peeling sheet
JP7285619B2 (en) 2017-02-03 2023-06-02 リンテック株式会社 RELEASE SHEET AND METHOD FOR MANUFACTURING RELEASE SHEET
JP7035441B2 (en) 2017-10-12 2022-03-15 東洋紡株式会社 Release film for manufacturing ceramic green sheets
JP2019072848A (en) * 2017-10-12 2019-05-16 東洋紡株式会社 Release film for ceramic green sheet production
JP2019166656A (en) * 2018-03-22 2019-10-03 東洋紡株式会社 Release film for ceramic green sheet production
JP2022079525A (en) * 2018-03-22 2022-05-26 東洋紡株式会社 Release film for ceramic green sheet production
JP2022079524A (en) * 2018-03-22 2022-05-26 東洋紡株式会社 Release film for ceramic green sheet production
JP2022082601A (en) * 2018-03-22 2022-06-02 東洋紡株式会社 Release film for producing ceramic green sheet
JP7106912B2 (en) 2018-03-22 2022-07-27 東洋紡株式会社 Release film for manufacturing ceramic green sheets
JP7306514B2 (en) 2018-03-22 2023-07-11 東洋紡株式会社 Release film for manufacturing ceramic green sheets
JP7306516B2 (en) 2018-03-22 2023-07-11 東洋紡株式会社 Release film for manufacturing ceramic green sheets
JP7306515B2 (en) 2018-03-22 2023-07-11 東洋紡株式会社 Release film for manufacturing ceramic green sheets

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