JP2002146584A - Microshape structure, nozzle parts, optical parts, display device, electroforming archetype and method of manufacturing for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a structure provided with inclined holes having extremely small apertures which are not heretofore achieved and to provide the structure provided with the inclined holes having good dimensional accuracy and high reliability and a method of manufacturing for the same. SOLUTION: The shapes of the apertures of the microholes of the microshape structure obliquely bored with the microholes are shapes exclusive of an elliptic shape and the angle of inclination is an angle exclusive of 90 deg. when the angle formed by the central axis of the microholes and the surface bored with the microhole is defined as the angle of inclination.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro-shaped structure in which a micro shape is formed to be inclined at a predetermined angle, and a method of manufacturing the same. Further, the present invention relates to a nozzle component in which a nozzle hole for ejecting a fluid is inclined at a predetermined inclination angle and a method for manufacturing the same. Further, the present invention relates to an optical component in which minute holes are formed at a predetermined inclination angle and a method of manufacturing the same. Further, the present invention relates to a display device for displaying an image by transmitted light. Further, the present invention relates to an electroforming mold in which a minute shape is formed at a predetermined angle.

[0002]

2. Description of the Related Art Many processing methods have been proposed as methods for forming a structure having minute holes. The main processing methods are a mechanical processing method in which a hole is formed by a drill, an etching method in which a part of a metal plate is partially dissolved by an acidic solution to form a hole, and a plate-shaped member having a desired shape. There is a press working method of punching out with a die.

[0003] Among these processing methods, there has been no processing method capable of forming a hole inclined at a certain angle with respect to a processing surface other than drilling. Hereinafter, a method of forming a hole inclined by a drill will be described.

FIG. 16 is a perspective view of a structure having inclined holes manufactured by machining with a drill. FIG. 17 is a diagram showing a state in which an inclined hole is machined by a drill. Conventionally, as shown in FIG. 17, drilling is performed by inclining a drill 2000 at a predetermined inclination angle θ on a hole processing surface f of a structure 1000. As a result, the hole 1100 inclined at the inclination angle θ could be formed in the structure 1000. At this time, assuming that processing is performed using a drill 2000 having an outer diameter of D, the opening of the hole 1100 that appears on the hole processing surface f has an elliptical shape having a major axis of D / sin θ and a minor axis of D (FIG. 1).
6).

In the case of machining with a drill, a drill 20 is used.
Since the rotation is performed by rotating 00, the structure 1
If the hole 1100 is machined perpendicularly to the hole machining surface f (θ = 90 degrees), the opening of the hole 1100 becomes circular and the structure 100
If the hole is machined with a slope of 0 (θ 度 90 degrees),
As a matter of course, the opening of the hole 1100 has an elliptical shape.

[0006]

As described above, conventionally,
The only processing method for manufacturing a structure having an inclined hole was cutting by a drill. In this cutting method using a drill, the processing size that can be drilled, that is, the size of the opening of the hole is determined by the size (diameter) of the drill. Therefore, when trying to machine a minute hole having a minute opening, a drill having a small diameter is required. However, if the diameter of the drill is reduced to a certain degree or less, the strength of the drill itself is reduced, and the drill is broken or bent during the cutting, so that the drilling cannot be performed. With the conventional drill machining method, the size of the opening of the hole cannot be made smaller than φ60 μm for the above-described reason, and it is not suitable for processing a minute hole.

Further, when the inclined hole is formed by a cutting method using a drill, the shape of the opening of the inclined hole is limited to an elliptical shape. This is because, as described above, drilling is performed by rotating the drill.

Further, when the inclined holes are machined by the conventional drilling method, each inclined hole is machined individually. Therefore, when trying to manufacture a structure having a large number of inclined holes, the inclined holes at the initial stage of machining with a drill in a new state and the inclined holes at the end of machining with a drill deteriorated by machining, In many cases, the dimensions of the hole openings were different, and the reliability of the processing accuracy was poor.

[0009] Further, as described above, since each inclined hole is individually processed, when a structure having a large number of inclined holes is manufactured, a very long production time is required and productivity is poor.

An object of the present invention is to provide a structure having an inclined hole having a very small opening and a method of manufacturing the same, and furthermore, an inclined hole having good dimensional accuracy of the inclined hole and high reliability. An object of the present invention is to provide a structure having holes and a method of manufacturing the same.

[0011]

In order to solve the above-mentioned problems, a micro-shaped structure of the present invention is a micro-shaped structure provided with micro holes manufactured by an electroforming method, wherein the micro holes are formed by the electro-forming method. The micro-structured structure is characterized in that the micro-structure is inclined at an angle other than 90 degrees with respect to the surface of the micro-hole formed.

Further, it is preferable that the angle of inclination of the micropore is not less than 45 ° and not more than 135 °.

[0013] Further, there is provided a micro-shaped structure having micro holes manufactured by an electroforming method, wherein a plurality of the micro holes are formed, and at least one or more of the plurality of micro holes is connected to another micro hole. It is characterized by being formed at different angles.

[0014] Furthermore, it is preferable that the micro-shaped structure is manufactured by electroforming and has micro holes, and the opening of the micro holes has a micro size that cannot be cut by cutting.

The size of the opening of the micropore is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is preferably 50 μm or less.

It is preferable that the shape of the opening of the minute hole is a shape other than the elliptical shape.

Further, it is preferable that the micro-shaped structure is provided with a plurality of micro holes, and has both penetrating micro holes and non-piercing micro holes.

Ni, Cu, Co, Sn, Zn, Au, P
It is preferable to use a material containing at least one of t, Ag, and Pb.

Also, the present invention is a micro-shaped structure having a micro-shape inclined at a predetermined angle, comprising: a transparent substrate that transmits light; and a first opaque pattern formed on one surface of the transparent substrate by patterning. A transparent layer, a second opaque layer formed by patterning on the other surface of the transparent substrate, and a patterned photosensitive material layer, wherein the photosensitive material layer The first opaque layer is disposed in the non-deposition part, and the light is transmitted through the non-deposition part of the second opaque layer and the non-deposition part of the first opaque layer. It is characterized by being formed toward.

Alternatively, a transparent substrate in which a patterned first opaque layer and a second opaque layer are respectively formed on predetermined surfaces, and a photosensitive material layer is formed on the first opaque layer Is arranged at a position that can be irradiated from the light source, and by changing the relative position between the transparent substrate and the light source, the photosensitive material layer is formed in a shape corresponding to the pattern of the first opaque layer and the second opaque layer. It is characterized by being exposed and patterned.

Further, it is preferable that at least one non-film-forming portion is patterned in the first opaque layer and the second opaque layer, and each has a different shape.

Further, the present invention provides a method for manufacturing a micro-shaped structure having micro holes, wherein the opaque conductive layer is formed on a transparent substrate formed by patterning the opaque conductive layer in a desired shape. Forming a photosensitive material layer on one side of the transparent substrate, the other side of the transparent substrate on which the opaque conductive layer is not formed, and at an angle other than 90 degrees with respect to the plane of the transparent substrate. Exposing the photosensitive material layer by irradiating light at a predetermined inclination angle, developing and patterning the photosensitive material layer, and forming a micro-shaped structure on the opaque conductive layer by electroforming. And a step of separating the microscopic structure from the transparent substrate and the photosensitive material layer.

Also, the present invention is a method for manufacturing a micro-shaped structure having micro holes, wherein the opaque conductive layer is formed of a transparent substrate formed by patterning an opaque conductive layer in a desired shape. A step of forming a photosensitive material layer on one surface; and a step of forming a light from a surface of the transparent substrate on which the opaque conductive layer is not formed and at a predetermined angle with respect to a plane of the transparent substrate. A first exposure step of exposing a predetermined portion of the photosensitive material layer in a desired shape, and the other side of the transparent substrate on which the opaque conductive layer is not formed, and the transparent substrate A second exposure step of irradiating the plane of the substrate with light at an angle different from that of the first exposure step, and exposing an unexposed portion of the photosensitive material layer in a desired shape in the first exposure step Developing and patterning the photosensitive material layer Forming a micro-shaped structure on the opaque conductive layer by electroforming, and separating the micro-shaped structure from the transparent substrate and the photosensitive material layer. .

Further, the present invention is a method for manufacturing a micro-shaped structure having micro holes, wherein the opaque conductive layer is formed on a transparent substrate formed by patterning an opaque conductive layer in a desired shape. Forming a first photosensitive material layer on one surface; and forming a first photosensitive material layer on the other surface of the transparent substrate, on which the opaque conductive layer is not formed, and with respect to a plane of the transparent substrate. A first exposure step of irradiating light at an angle to expose a predetermined portion of the first photosensitive material layer in a desired shape; and a transparent substrate formed by patterning an opaque conductive layer in a desired shape. On the first photosensitive material layer,
Forming a second photosensitive material layer; and irradiating light from the other surface of the transparent substrate on which the opaque conductive layer is not formed, and at a predetermined angle to the plane of the transparent substrate. A second exposing step of exposing the second photosensitive material layer in a desired shape, and developing the first photosensitive material layer and the second photosensitive material layer to form a first photosensitive material. Forming a first pattern composed of a layer, a second pattern composed of a first photosensitive unnecessary material layer and a second insoluble material layer, and performing an electroforming method on the opaque conductive layer; The first pattern composed of the first photosensitive material layer is completely covered, and the second pattern composed of the first photosensitive unnecessary material layer and the second insoluble material layer is not covered and has a minute shape. An electroforming step of forming a structure, the transparent substrate, the photosensitive material, It is characterized by a step of separating from.

Also, the present invention provides a method for manufacturing a micro-shaped structure having a micro-shape inclined at a predetermined angle, wherein a patterned first opaque layer and a second opaque layer are formed on predetermined surfaces, respectively. And a transparent substrate having a photosensitive material layer formed on the first opaque layer is disposed at a position that can be irradiated from a light source, and by changing the relative position between the transparent substrate and the light source, the photosensitive The method is characterized by including a step of exposing the material layer in a shape corresponding to the patterns of the first opaque layer and the second opaque layer.

Alternatively, there is provided a method for manufacturing a micro-shaped structure having a shape inclined at a predetermined angle, wherein a first opaque layer having conductivity is provided on one surface of a transparent substrate that transmits light. And a second opaque layer is formed on the other surface of the transparent substrate in a different pattern from the first opaque layer, and a photosensitive layer is formed on the first opaque layer. Forming a transparent material layer, the first opaque layer, the transparent substrate on which the second opaque layer and the photosensitive material layer are formed, and moving at least one of the light sources at a predetermined relative speed. While exposing from the side where the second opaque layer was formed, a step of partially exposing the photosensitive material layer, and a step of developing and patterning the partially exposed photosensitive material layer The electrode on the conductive first opaque layer. It is forming a micro-shaped structures, the micro shaped structure of the patterned photosensitive material layer, and a step of separating the transparent substrate by law.

Further, it is preferable that the pattern shape of the first opaque layer and the second opaque layer is a pattern shape having at least one non-film-forming portion.

Further, the present invention is directed to a nozzle component manufactured by an electroforming method and having a nozzle hole for ejecting a fluid, wherein the nozzle hole is formed on a surface of the nozzle component where the nozzle hole is formed. It is characterized by being inclined at an angle other than 90 degrees.

A nozzle component manufactured by an electroforming method and having a nozzle hole for ejecting a fluid, wherein a plurality of the nozzles are formed, and at least one of the plurality of nozzle holes has another nozzle hole. Is formed at an angle different from that of the micropores.

Furthermore, the present invention is a nozzle component manufactured by an electroforming method and having a nozzle hole for ejecting a fluid, wherein the opening of the nozzle hole has a minute size that cannot be cut by cutting. Preferably, there is.

The size of the opening of the nozzle hole is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is preferably 50 μm or less.

It is preferable that the shape of the opening of the nozzle hole is a shape other than the elliptical shape.

Ni, Cu, Co, Sn, Zn, Au, P
It is preferable to use a material containing at least one of t, Ag, and Pb.

Further, the present invention relates to a method of manufacturing a nozzle component having a nozzle hole for ejecting a fluid, wherein the opaque conductive layer is patterned in a desired shape. Forming a photosensitive material layer on one surface on which the layer is formed, and from the other surface of the transparent substrate where the opaque conductive layer is not formed, and with respect to the plane of the transparent substrate. Exposing the photosensitive material layer by irradiating light at a predetermined inclination angle other than 90 degrees, developing the photosensitive material layer to form a pattern, and electroforming on the opaque conductive layer. Forming a nozzle component, and separating the nozzle component from the transparent substrate, the opaque conductive layer, and the photosensitive material layer.

The present invention also relates to a method of manufacturing a nozzle component having a nozzle hole for ejecting a fluid, wherein the opaque conductive layer is formed by patterning the opaque conductive layer in a desired shape. Forming a photosensitive material layer on one surface on which is formed, and from the other surface of the transparent substrate on which the opaque conductive layer is not formed,
And a first exposure step of irradiating light at a predetermined angle with respect to the plane of the transparent substrate to expose a predetermined portion of the photosensitive material layer in a desired shape, and the opaque conductive layer of the transparent substrate. And irradiating the transparent substrate with light at an angle different from that of the first exposure step on the other surface side on which the photosensitive material layer is not formed. A second exposure step of exposing a portion of a desired shape,
Developing the photosensitive material layer to form a pattern, forming a nozzle component on the opaque conductive layer by electroforming, forming the nozzle component on the transparent substrate, the opaque conductive layer, Separating from the conductive material layer.

Further, there is provided an optical component which is manufactured by an electroforming method and has minute micro holes, wherein the micro holes are formed at an angle other than 90 degrees with respect to the surface of the optical component where the micro holes are formed. It is characterized by being opened at an angle.

An optical component manufactured by an electroforming method and having minute micro holes, wherein a plurality of the minute holes are formed, and at least one or more of the plurality of the minute holes is connected to another minute hole. It is characterized by being formed at different angles.

Further, it is preferable that the optical component is manufactured by an electroforming method and has minute fine holes, and the opening of the minute hole has a minute size that cannot be cut by cutting.

The size of the opening of the micropore is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is preferably 50 μm or less.

It is preferable that the shape of the opening of the micropore is a shape other than the elliptical shape.

Ni, Cu, Co, Sn, Zn, Au, P
It is preferable to use a material containing at least one of t, Ag, and Pb.

Further, the present invention relates to a method for producing an optical component having minute and fine holes produced by an electroforming method, wherein the opaque conductive layer is patterned in a desired shape. Forming a photosensitive material layer on one surface on which the conductive layer is formed, and from the other surface of the transparent substrate on which the opaque conductive layer is not formed,
Irradiating the photosensitive material layer with light at a predetermined inclination angle other than 90 degrees with respect to the plane of the transparent substrate; developing the photosensitive material layer to form a pattern; Forming an optical component on the conductive layer by an electroforming method.

Further, the present invention provides a method for manufacturing an optical component having fine holes, which is manufactured by an electroforming method, wherein the opaque conductive layer is patterned in a desired shape. Forming a photosensitive material layer on one surface on which a layer is formed, and from the other surface of the transparent substrate on which the opaque conductive layer is not formed,
And a first exposure step of irradiating light at a predetermined angle with respect to the plane of the transparent substrate to expose a predetermined portion of the photosensitive material layer in a desired shape, and the opaque conductive layer of the transparent substrate. And irradiating the transparent substrate with light at an angle different from that of the first exposure step on the other surface side on which the photosensitive material layer is not formed. A second exposure step of exposing a portion of a desired shape,
A step of developing the photosensitive material layer to form a pattern; and a step of forming a micro-shaped structure on the opaque conductive layer by electroforming.

Further, there is provided a display device having an optical component having micro holes and a light source for emitting light, and displaying an image by transmitting the light emitted from the light source to the micro holes. A plurality of the micro holes provided in the component are provided at desired positions at different inclination angles, and light emitted from the light source is transmitted only in a direction along the central axis of the micro holes. .

Further, it is preferable that the opening of the minute hole provided in the display device has a minute size that cannot be cut by cutting.

The size of the opening of the fine hole provided in the display device is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is preferably 50 μm or less.

It is preferable that the shape of the opening of the minute hole provided in the display device is a shape other than the elliptical shape.

Further, an electroforming mold having a minute shape inclined at a predetermined angle, wherein the transparent substrate transmits light,
A first opaque layer patterned on one side of the transparent substrate, a second opaque layer patterned on the other side of the transparent substrate, and a patterned photosensitive material layer The photosensitive material layer is disposed on the non-film-forming portion of the first opaque layer on the transparent substrate, and the non-film-forming portion of the second opaque layer and the first opaque layer It is formed in a direction in which light passes through the non-film-forming portion of the conductive layer.

A transparent substrate in which a patterned first opaque layer and a second opaque layer are respectively formed on predetermined surfaces, and a photosensitive material layer is formed on the first opaque layer. Is arranged at a position that can be irradiated from the light source, and by changing the relative position between the transparent substrate and the light source, the photosensitive material layer is formed in a shape corresponding to the pattern of the first opaque layer and the second opaque layer. It is characterized by being exposed and patterned.

Furthermore, it is preferable that at least one non-film-forming portion is patterned in the first opaque layer and the second opaque layer.

Further, it is preferable that the photosensitive material layer is formed on the surface of the transparent substrate on which the first opaque layer is formed, and that the first opaque layer has conductivity.

(Function) By exposing the photosensitive insoluble material from the transparent substrate side at a predetermined inclination angle by the above means of the present invention, the photosensitive insoluble material is formed into a fine shape corresponding to the shape of the opaque conductive layer. Further, it could be formed in an inclined shape inclined in the light irradiation direction.

The part composed of the photosensitive insoluble material, the transparent substrate, and the opaque conductive layer formed in the inclined shape can be used as it is as a mold for electroforming (referred to as an electroforming base mold). .

The electroforming mold of the present invention obtained in this manner has a fine shape that cannot be achieved by the conventional cutting method. As a result, the electroforming mold can be used. Thus, it was possible to obtain a micro-shaped structure provided with an inclined hole having a very small opening which could not be achieved conventionally. Further, it was possible to obtain a micro-shaped structure having a highly reliable inclined hole having good dimensional accuracy.

Further, according to the above-mentioned means of the present invention, since many holes can be machined at a time, the productivity was very good as compared with the conventional cutting method.

Further, by the above-described means of the present invention, it was possible to obtain a nozzle component having a nozzle hole which is extremely small, has high dimensional accuracy, and is inclined at a predetermined angle.

Further, by the above-described means of the present invention, it was possible to obtain an optical component having a very small size, high dimensional accuracy, and an inclined fine hole. Further, by using the optical component, it was possible to obtain a display device in which an image displayed varies depending on a viewing angle.

[0058]

(First Embodiment) FIG. 1 is a sectional view of an electroformed structure having inclined holes according to a first embodiment of the present invention. An inclined hole 11 having a size of d is penetrated through an electroformed structure 10 formed by deposition by an electroforming method. The inclined hole 11 is inclined at an inclination angle θ with respect to the hole opening surface g on which the opening appears.

In the first embodiment, the electroformed structure 1
0 is formed in a plate-like shape having a plate thickness of 50 μm. The opening of the inclined hole 11 penetrated has a circular shape, and its size d has a diameter of φ30 μm. Further, the inclined hole 11 has an inclination angle θ = 60.
And each inclined hole 11 is 150μ.
They are formed side by side at intervals of m, that is, at pitches. In the present invention, the inclination angle θ is defined as the angle between the central axis of the inclined hole 11 and the hole opening surface g. In addition, the central axis of the inclined hole 11 refers to an axis connecting the centers of the opening shapes at both ends of the penetrated inclined hole 11 (the center of the circle of φ30 μm in the first embodiment).

FIG. 3 is a view showing a method of manufacturing an electroformed structure having inclined holes according to the first embodiment. Hereinafter, a method for manufacturing the electroformed structure according to the first embodiment will be described with reference to FIG.

First, as shown in FIG.
An opaque conductive layer 200 is formed on the layer 00 by patterning it into a desired shape. By using photolithography and etching, which are often used in the LSI field, for patterning, high-precision patterning on the order of microns can be achieved. In the first embodiment, a transparent substrate 100 is made of borosilicate glass having a thickness of 0.4 mm, and an opaque layer having a laminated structure in which a lower layer is a chromium (Cr) film and an upper layer is a gold (Au) film. The conductive layer 200 was formed by patterning. Cr film of opaque conductive layer 200 and Au
The thickness of each film is 0.05 μm (Cr), 0.2 μm
m (Au), both were formed by a sputtering method which is a kind of vacuum film forming method. As for the patterning, a pattern in which a circular pattern having a diameter of 30 μm was removed at an interval (pitch) of 150 μm using photolithography and etching as described above was completed.

Next, a resist 3 made of a photosensitive insoluble material is used.
00 is formed in a desired thickness on one surface of the transparent substrate 100 on which the opaque conductive layer 200 is formed. In the first embodiment, a negative resist THB-130N (trade name) manufactured by JSR Corporation was used as the resist 300, and the resist 300 was formed with a thickness of 60 μm by spin coating. The spin coating conditions at this time were a rotation speed of 1000 rpm and a processing time of 10 seconds.

Next, ultraviolet rays are irradiated from the other side of the transparent substrate 100 where the opaque conductive layer 200 is not formed, and the resist 300 is exposed through the transparent substrate 100. Such an exposure method is generally called a back exposure method. At this time, by inclining the transparent substrate 100 at a predetermined angle, ultraviolet rays are applied to the transparent substrate 100 from an oblique direction (FIG. 3B). In the description of the present invention, the angle of inclination of the transparent substrate 100 is defined as a substrate inclination angle ψ, and the substrate inclination angle ψ is defined as an angle of inclination of the substrate with respect to a plane perpendicular to the ultraviolet irradiation direction. Book first
In the embodiment, the substrate inclination angle ψ is set to 30 degrees.

In the exposure step shown in FIG. 3B, the opaque conductive layer 200 has a desired shape (a circular pattern having a diameter of 30 μm in the present embodiment as described above) in the middle of the irradiation with ultraviolet rays. (A pattern removed at intervals of 150 μm).
The opaque conductive layer 200 serves as an exposure mask, and only a desired portion of the resist 300 is partially exposed. At this time, since the transparent substrate 100 is inclined at the substrate inclination angle ψ = 30 degrees as described above, the resist 300 is exposed from an oblique direction. In the first embodiment, the resist 300 was exposed at an exposure amount of 450 mJ / cm ² .

Since the resist 300 is a photosensitive insoluble material, if the resist 300 is developed after the exposure step shown in FIG. 3B, a patterned resist 310 as shown in FIG. 3C can be formed. The state shown in FIG. 3C is a mold for an electroforming step performed after this step, and this state is called an electroforming base mold. In the first embodiment, a resist 310 having a pattern of 30 μm in diameter and 60 μm in height inclined at an angle of 60 degrees with respect to the plane of the transparent substrate 100 could be formed. The resist 310 has a shape that becomes a mold for forming the inclined hole 11, and the inclination angle (= 60 degrees) of the resist 310 becomes the inclination angle θ of the inclined hole 11 as it is. In the first embodiment, a THB-130N (resist 300) dedicated developer (trade name: THB-D1) is used as a developer, and the developer is used at a solution temperature of 40 ° C.
For a minute.

Thereafter, as shown in FIG. 3D, an electroformed structure 10 is formed on the opaque conductive layer 200 by an electroforming method. The electroforming method refers to a method of forming a structure by depositing a plating material on an electrode surface by an electrolytic plating method, and is a processing method that has been widely used conventionally. In the method of manufacturing the electroformed structure 10 of the present invention, the porous structure 1 made of a plating material is formed on the opaque conductive layer 200 by using the opaque conductive layer 200 as an electrode of the electroforming method.
0 is formed. As described above, in the manufacturing method of the present invention, the opaque conductive layer 200 has both the role of a mask for exposure and the role of an electrode for electroforming. In the first embodiment, the electroformed structure 10 made of Ni and having a thickness of 50 μm is formed by nickel (Ni) electroforming. The Ni electroforming process at this time was performed using Ni sulfamate plating solution at a liquid temperature of 50 ° C. and a current density of 1 A / dm ² for 5 hours.

Finally, the resist 310, the opaque conductive layer 200, and the transparent substrate 100 are removed from the electroformed structure 10, and the electroformed structure 1 having the inclined holes 11 as shown in FIG.
0 is completed. In the first embodiment, the resist 310 is dissolved and removed with a 50% aqueous solution of potassium hydroxide (KOH) at 50 ° C., and the opaque conductive layer 200 and the transparent substrate 1 are removed.
No. 00 was physically peeled off. In the present invention, the opaque conductive layer 200 does not necessarily need to be removed from the electroformed structure 10, and there is no problem even if it is formed on the electroformed structure 10.

As described above, in the first embodiment, the 50 μm-thick electroformed structure in which the inclined holes 11 having the opening dimension d of 30 μm in diameter and the inclination angle θ of 60 ° are arranged at intervals of 150 μm (pitch). The body 10 could be manufactured. Book first
The shape of the opening of the inclined hole is 30 μm as in the embodiment of FIG.
One of the features of the present invention is that it can be formed in a circular shape of m. When the inclined hole is formed by a conventional drilling method, the opening of the inclined hole cannot be made smaller than 60 μm at least, and the shape of the opening is always an elliptical shape as shown in FIG. It is because it is done.

In the method of manufacturing an electroformed structure according to the present invention, the inclination of the inclined hole, that is, the inclination angle is determined during the exposure step. In the present invention, the substrate tilt angle ψ shown in FIG.
It can be confirmed from the results of the first embodiment that the relationship of θ = 90 ° −ψ (1) holds between the inclination angles θ of the inclined holes 11 shown in FIG. Therefore, the inclined hole 1 inclined at a desired inclination angle θ
In the case of processing No. 1, exposure may be performed by setting the substrate tilt angle ψ so that the relational expression of the above expression (1) is satisfied. According to our experiments, 45 ° ≦ θ <90 °, 90 °
It has been confirmed that an inclined hole can be easily formed by the present invention within the range of <θ ≦ 135 °.

The electroformed structure 10 according to the first embodiment
It can be seen that the opening dimension d = 30 μm of the inclined hole 11 is much smaller than the minimum hole diameter 60 μm that can be drilled by a cutting method. It is clear from the working method that the opening dimension d can be easily made larger than 30 μm in the electroformed structure of the present invention, and it is obvious that the electroformed structure provided with the inclined hole having a hole diameter of about d = 60 μm. It can also form a body. As described above, the feature of the electroformed structure of the present invention is that the opening dimension d which cannot be cut by the drilling method is 50 mm.
The point is that a minute inclined hole of not more than μm can be formed.

In the present invention, the shape of the inclined hole 11 is determined by the pattern of the opaque conductive layer 200, as can be seen from the above-described processing method. In the manufacturing method of the present invention, since the photolithography method is used for patterning the opaque conductive layer 200, patterning can be performed with very high accuracy. As a result, the inclined hole 11 formed based on the pattern could be formed with higher precision than the conventional drill machining. Its accuracy has been achieved at the micron level. Still another feature of the electroformed structure of the present invention is that an inclined hole having extremely high dimensional accuracy, which cannot be achieved by a cutting method using a drill, can be formed.

Although the electroformed structure 10 made of Ni is manufactured by the Ni electroforming method in the first embodiment, the present invention is not limited to the Ni material. As described above, the electroforming method is a type of the electrolytic plating method, and any material that can be deposited by the electrolytic plating method can manufacture the electroformed structure of the present invention. In addition to Ni, electroplatable materials include Cu, Co, Sn, Zn, Au,
Pt, Ag, Pb and alloys containing these materials are mentioned.

(Second Embodiment) FIG. 2 is a sectional view of an electroformed structure having inclined holes according to a second embodiment of the present invention. Electroformed structure 20 formed by deposition by electroforming
In this example, an inclined hole 21a and an inclined hole 21b having an opening size d and different inclination angles penetrate therethrough. FIG.
As shown in the figure, the inclined hole 21a is inclined at an inclination angle θ1 with respect to the hole opening surface h in which the opening appears, while the inclined hole 21b is inclined with respect to the hole opening surface h at an angle of inclination θ2. ing.

In the second embodiment, the electroformed structure 2
0 is formed in a plate-like shape having a plate thickness of 50 μm. Each of the openings of the inclined holes 21a and 21b penetrated has a circular shape, and the size d has a diameter of φ30 μm. Furthermore, the inclined hole 21
a is inclined at an inclination angle θ1 (the angle between the central axes of the inclined holes 21a and 21b and the hole opening surface h) = 60 degrees, while the inclined hole 21b is inclined at an inclination angle θ2 = 120 degrees. It is made. Each inclined hole 21a is also formed at an interval (pitch) of 150 μm, and each inclined hole 21b is similarly formed at an interval (pitch) of 150 μm.

As described above, in the second embodiment, some of the minute holes are formed at different angles depending on the holes. The present invention is characterized in that an electroformed structure having such fine holes formed at different angles can be easily and accurately achieved.

In the second embodiment, each of the inclined holes 21a and 21b formed in the electroformed
It is configured to be inclined with respect to the 0 plane. However, the electroformed structure of the present invention does not require that all the micropores be inclined. As long as it has at least one inclined hole, it can be a feature of the electroformed structure of the present invention. For example, in an electroformed structure having a plurality of micropores, only one of the plurality of micropores may be inclined and all the others may be vertical holes. This is because even with such a structure, an electroformed structure provided with minute and highly dimensional accuracy inclined holes, which is a feature of the present invention, is sufficiently achieved.

FIG. 4 is a view showing a method of manufacturing an electroformed structure having inclined holes according to the second embodiment. Hereinafter, a method for manufacturing the electroformed structure according to the second embodiment will be described with reference to FIG.

First, as shown in FIG.
An opaque conductive layer 200 is formed on the layer 00 by patterning it into a desired shape. As in the first embodiment, patterning was performed with high accuracy on a micron level by using a photolithography method and an etching method often used in the field of LSI. In the second embodiment, a transparent substrate 100 is made of borosilicate glass having a thickness of 0.4 mm, and an opaque layer having a laminated structure in which a lower layer is a chromium (Cr) film and an upper layer is a gold (Au) film. The conductive layer 200 was formed by patterning. The thickness of each of the Cr film and the Au film of the opaque conductive layer 200 is 0.05 μm.
Both m (Cr) and 0.2 μm (Au) were formed by a sputtering method, which is a kind of vacuum film formation method. The patterning is performed using the photolithography method and the etching method as described above, and has a diameter of 30 μm as in the first embodiment.
A pattern in which m circular patterns were removed at intervals (pitch) of 150 μm was completed.

Next, a resist 3 made of a photosensitive insoluble material is used.
00 is formed in a desired thickness on one surface of the transparent substrate 100 on which the opaque conductive layer 200 is formed. In the second embodiment, a negative resist THB-130N manufactured by JSR Corporation is used as the resist 300, and the resist 300 is formed with a thickness of 60 μm by spin coating. The spin coating conditions at this time were a rotation speed of 1000 rpm and a processing time of 10 seconds.

Next, as shown in FIG. 4B, ultraviolet light is irradiated from the other side of the transparent substrate 100 where the opaque conductive layer 200 is not formed, and the resist 300 is passed through the transparent substrate 100. Expose the desired portion of At this time, the transparent substrate 100 is tilted at a predetermined angle so that ultraviolet light is applied to the transparent substrate 100 from an oblique direction (this step is referred to as a first exposure step in the manufacturing method of the present invention). To.) In the first exposure step of the second embodiment, the substrate inclination angle ψ1 = + 30 degrees, which is defined as an angle with respect to a plane perpendicular to the ultraviolet irradiation direction.

In the first exposure step shown in FIG. 4B, an opaque conductive layer patterned with a pattern in which a circular pattern having a diameter of 30 μm is removed at intervals of 150 μm during the irradiation with ultraviolet rays. 200 and book 1
A first light-shielding mask 400 is provided for shielding a predetermined portion that is not desired to be exposed in the exposure step. Therefore, as shown in FIG. 4B, only a desired portion of the resist 300 is partially exposed. At this time, since the transparent substrate 100 is inclined at the substrate inclination angle ψ1 = + 30 degrees as described above, the resist 300 is exposed from an oblique direction. In the first exposure step of the second embodiment, 45
The resist 300 was exposed at an exposure amount of 0 mJ / cm ² .

Next, as shown in FIG. 4C, ultraviolet light is again irradiated from the other surface side of the transparent substrate 100 where the opaque conductive layer 200 is not formed, and the resist is passed through the transparent substrate 100. A desired portion of the substrate 300 other than the portion exposed in the first exposure step is exposed. At this time, the transparent substrate 100 was irradiated with ultraviolet rays while being tilted at a substrate angle ψ2 different from the substrate angle ψ1 in the first exposure step (this step is referred to as a second exposure step in the manufacturing method of the present invention). I do.)
In the second exposure step of the second embodiment, the substrate inclination angle ψ2 = -30 degrees, which is defined as an angle with respect to a plane perpendicular to the ultraviolet irradiation direction. In the second embodiment, FIG.
The tilt direction of the transparent substrate 100 shown in FIG. 4B is defined as a (+) direction, and the tilt direction of the transparent substrate 100 shown in FIG.

In the second exposure step shown in FIG. 4C, an opaque conductive layer patterned with a pattern in which a circular pattern having a diameter of 30 μm is removed at intervals of 150 μm during the irradiation with ultraviolet rays. 200 and book 1
A second light-shielding mask 410 is provided for shielding the portion exposed in the exposure step. Therefore, as shown in FIG. 4C, only a desired portion of the resist 300 is partially exposed. At this time, as described above, the substrate tilt angle ψ2 = −
Since the transparent substrate 100 is inclined at 30 degrees, the resist 300 is exposed from an oblique direction different from the first exposure step. In the second exposure step of the second embodiment, the resist 300 was exposed at an exposure amount of 450 mJ / cm ² .

Since the resist 300 is a photosensitive insoluble material, if the resist 300 is developed after the first exposure step and the second exposure step, a patterned resist 320 as shown in FIG. 4D can be formed. . In the second embodiment, a resist 320 composed of a pattern having a diameter of 30 μm and a height of 60 μm inclined at an angle of 60 degrees with respect to the plane of the transparent substrate 100 and a pattern of a diameter of 30 μm and a height of 60 μm inclined at an angle of 120 degrees. Could be formed. The resist 320 has a shape that becomes a mold for forming the inclined holes 21a and the inclined holes 21b.
1, the portion of the resist 320 at an inclination angle of 120 degrees becomes the inclination angle θ2 of the inclined hole 21b as it is. The second
In the second embodiment, as in the first embodiment, a developing solution (THB-D1) of THB-130N (resist 300) was used as a developing solution, and development was performed at a solution temperature of 40 ° C. for 2 minutes.

Thereafter, as shown in FIG. 4E, an electroformed structure 20 is formed on the opaque conductive layer 200 by an electroforming method. In the second embodiment, a 50 μm-thick electroformed structure 20 made of Ni is formed by nickel (Ni) electroforming.
Was formed. At this time, the Ni electroforming process is performed at a liquid temperature of 50 ° C. using a Ni sulfamate plating solution at 1 A / A.
The treatment was performed at a current density of dm ² for 5 hours.

Finally, the resist 320, the opaque conductive layer 200, and the transparent substrate 100 were removed from the electroformed structure 20, and provided with inclined holes 21a and 21b having different inclination angles as shown in FIG. The electroformed structure 20 was completed.
In the second embodiment, the resist 320 is set at 10% of 50 ° C.
The opaque conductive layer 200 and the transparent substrate 100 were mechanically removed by dissolving and removing with an aqueous solution of potassium hydroxide (KOH).

As described above, in the present second embodiment, the inclined hole 21a having the opening dimension d of 30 μm in diameter and the inclination angle θ of 60 degrees and the inclined hole 21a of opening dimension d of 30 μm in diameter and the inclination angle θ of 120 degrees are provided. An electroformed structure 20 having a thickness of 50 μm in which the holes 21b were arranged at intervals (pitch) of 150 μm could be manufactured.

In the second embodiment of the present invention, the first
The substrate inclination angle ψ1 and the inclination angle θ1 of the inclined hole 21a in the second exposure step, the substrate inclination angle ψ in the second exposure step
Equation (1) is established between 2 and the inclination angle θ2 of the inclined hole 21b, as in the first embodiment. Therefore, in the second embodiment as well, if the substrate tilt angle ψ is set and exposed so that the relational expression of Expression (1) is established, a tilt hole formed at a desired tilt angle θ can be achieved. One of the features of the present invention is that by setting the substrate angle ψ, an accurate inclination angle θ can be achieved, and as a result, not only the hole size but also the accuracy of the hole angle can be improved. .

The electroformed structure 20 according to the second embodiment
The opening dimension d = 30 μm of the inclined holes 21a and 21b is
The hole diameter is much smaller than the minimum hole diameter of 60 μm that can be drilled by a cutting method. The second embodiment is also a structure having a shape that cannot be achieved by cutting with a drill.

In the second embodiment, two exposure steps (FIG. 4B, FIG.
According to (c)), two types of inclined holes having different inclination angles are formed. Similarly, if the exposure process in which the irradiation direction of the ultraviolet ray is different is repeated three times or more, three or more types of inclined holes having different inclination angles are formed. Is also possible.

(Third Embodiment) FIG. 5 is a perspective view of an electroformed structure having inclined holes according to a third embodiment of the present invention and an electroformed structure having inclined holes according to the fourth embodiment. It is.

FIG. 5A shows an electroformed structure according to the third embodiment. In the third embodiment, the length of one side is 50 μm
The electroformed structure 30 having a thickness of 50 μm provided with the inclined hole 31 having a rectangular opening was manufactured. The inclined hole 31 formed in the electroformed structure 30 according to the third embodiment is formed by being inclined at an angle of 45 degrees with respect to the plane of the electroformed structure 30. Electroformed structure 30 of the third embodiment
Was manufactured by the same manufacturing method as in the first embodiment.

First, an opaque conductive layer having a laminated structure in which the lower layer was a chromium (Cr) film and the upper layer was a gold (Au) film was formed on a borosilicate glass having a thickness of 0.4 mm by a sputtering method. Subsequently, the opaque conductive layer made of Au / Cr was removed in a rectangular shape with one side of 50 μm by etching. As described above, a 50 μm rectangular opaque conductive layer having a pattern through which ultraviolet light was transmitted was formed on the borosilicate glass. Further, a resist made of a photosensitive insoluble material was applied on the borosilicate glass so as to cover the opaque conductive layer. The same resist as that of the first embodiment, THB-130N manufactured by JSR was used, and the resist was applied with a thickness of 60 μm under the same conditions as in the first embodiment. As described above, in the third embodiment, except that the pattern of the opaque conductive layer is different from that of the first embodiment.
The same process was performed under the same conditions as in FIG. 3A of the first embodiment.

Next, as in the state shown in FIG. 3B, the borosilicate glass having the resist and the opaque conductive layer
The film was exposed to ultraviolet light at an angle of 45 degrees (紫外線: substrate inclination angle) through the borosilicate glass using the opaque conductive layer as a mask. The exposure amount was 450 mJ / cm ² .

Thereafter, the resist (THB-130N) is developed with a dedicated developer (THB-D1),
A resist pattern having a height of 60 μm and a side of 50 μm and inclined at an angle of 45 ° with respect to the plane of the borosilicate glass was formed. This is an electroforming mold for forming the electroformed structure of the third embodiment.

Thereafter, Ni electroforming is performed on the basis of the electroforming mold formed of the resist, and finally, the resist, A
The opaque conductive layer made of u / Cr and the borosilicate glass were removed to complete the electroformed structure made of Ni (FIG. 5A) according to the third embodiment. The Ni electroforming method and the method of removing the resist, the opaque conductive layer made of Au / Cr, and the borosilicate glass were performed under the same conditions as those described in the first embodiment.

(Fourth Embodiment) FIG. 5B shows an electroformed structure according to a fourth embodiment. In the fourth embodiment, as shown in FIG. 5B, an electroformed structure 40 having an inclined hole 41 having a star-shaped opening was manufactured. Book 4
The electroformed structure 40 of this embodiment was manufactured by the same manufacturing method as in the first embodiment and the third embodiment.

First, an opaque conductive layer having a laminated structure in which the lower layer is a chromium (Cr) film and the upper layer is a gold (Au) film was formed on a borosilicate glass having a thickness of 0.4 mm by a sputtering method. Subsequently, the opaque conductive layer made of Au / Cr was removed in a star shape by etching. As described above, an opaque conductive layer having a star-shaped pattern through which ultraviolet light was transmitted was formed on the borosilicate glass. Further, a resist made of a photosensitive insoluble material was applied on the borosilicate glass so as to cover the opaque conductive layer. The resist is THB-1 manufactured by JSR as in the first embodiment.
30N was applied by a spin coating method under the same conditions as in the first embodiment to a thickness of 60 μm. The steps described above are substantially the same as those in FIG. However, in the fourth embodiment, the pattern of the opaque conductive layer is different from that of the first embodiment. Subsequent manufacturing steps were performed under exactly the same conditions as those of the electroformed structure of the third embodiment.

As can be seen from the third embodiment and the fourth embodiment, according to the method of manufacturing an electroformed structure having inclined holes according to the present invention, it cannot be achieved by a conventional cutting method using a drill. An inclined hole having an opening shape can be formed. The shape of the opening is not limited to the shapes shown in the third and fourth embodiments. In addition,
For example, equilateral triangle, other triangle, rectangle, diamond, other square, regular pentagon, other pentagon, regular hexagon,
Other polygons, such as a hexagon, are mentioned. Furthermore, the size of the opening can be so small that it cannot be machined by a conventional drilling method. FIG. 13 shows the third
It is the figure which showed the size of the opening part of the inclined hole of the electroformed structure by Embodiment 4 and 4th Embodiment. According to FIG. 13, the size d of the opening of the inclined hole 31 in the third embodiment was 50 μm, while the size d of the opening of the inclined hole 41 in the fourth embodiment was 30 μm.
It can be seen that both are very small openings. In the present invention, the size of the opening is defined as the diameter of a circle inscribed in the shape of the opening.

(Fifth Embodiment) FIG. 10 shows a fifth embodiment of the present invention.
It is sectional drawing of the electroformed structure provided with the inclined hole by embodiment. Electroformed structure 8 formed by deposition by electroforming
In 0, an inclined hole 81 having a size of d and a penetrating inclined hole 82 having a size of d and an unpenetrated inclined hole 82 are formed. Inclined holes 81, 82
Is inclined at an inclination angle θ with respect to a hole opening surface i, which is a surface on which the opening of the penetrating inclined hole 81 appears.

In the fifth embodiment, the electroformed structure 8
Numeral 0 is formed in a plate shape having a plate thickness of 80 μm. Further, two openings of the inclined hole 81 penetrated and one opening of the inclined hole 82 not penetrated are all circular, and each of the sizes d has a diameter φ50 μm.
m. Further, the inclined holes 81, 8
2 is inclined at an inclination angle θ (the angle between the central axis of the inclined holes 81 and 82 and the hole opening surface g) = 60 degrees,
The inclined holes 81 and 82 are formed side by side at an interval of 150 μm. In FIG. 10, the thickness direction (vertical direction in FIG. 10) is exaggerated for easy understanding of the difference between a non-through hole and a through hole which is a feature of the fifth embodiment.

FIG. 11 is a diagram showing the first half of a method of manufacturing an electroformed structure having inclined holes according to the fifth embodiment. FIG. 12 is a view showing the latter half of the method of manufacturing the electroformed structure having the inclined holes according to the fifth embodiment. Hereinafter, a method of manufacturing the electroformed structure of the fifth embodiment will be described with reference to FIGS.

First, as shown in FIG. 11A, an opaque conductive layer 210 is formed on a transparent substrate 100 by patterning it into a desired shape. Photolithography and etching were used for patterning. In the fifth embodiment,
A transparent substrate 100 is made of borosilicate glass having a thickness of 0.4 mm, on which a lower layer is a chromium (Cr) film and an upper layer is gold (A).
u) The opaque conductive layer 210 having a laminated structure as a film was formed by patterning. Cr of opaque conductive layer 210
The thickness of each of the film and the Au film is 0.05 μm (Cr),
Both layers were formed by sputtering, which is a kind of vacuum film forming method, with a thickness of 0.2 μm (Au). Also, patterning is
As described above, a pattern in which a circular pattern having a diameter of 50 μm was removed at intervals (pitch) of 150 μm using photolithography and etching was completed.

Next, a first resist 330 made of a photosensitive insoluble material is applied to the opaque conductive layer 21 of the transparent substrate 100.
0 is formed at a desired thickness on one surface where the 0 is formed. In the fifth embodiment, the first resist 330 has J
A negative resist THB-130N (trade name) manufactured by SR Corporation was used and formed to a thickness of 40 μm by spin coating. At this time, the spin coating conditions were as follows.
rpm, treatment time was 10 seconds. In the following description, this step (FIG. 11A) will be referred to as a first resist forming step of the fifth embodiment.

Next, as shown in FIG. 11B, ultraviolet light is irradiated from the other side of the transparent substrate 100 on which the opaque conductive layer 210 is not formed, and the first substrate is interposed through the transparent substrate 100. The resist 330 is exposed. At this time, by inclining the transparent substrate 100 at a predetermined angle, ultraviolet rays are applied to the transparent substrate 100 from an oblique direction (this step is referred to as a first exposure step in the fifth embodiment). ). In the fifth embodiment, the substrate tilt angle ψ defined as an angle with respect to a plane perpendicular to the ultraviolet irradiation direction
To 30 degrees.

In the first exposure step in the fifth embodiment shown in FIG. 11B, the opaque conductive layer 210 is formed in a desired shape (as described above, in the middle of the irradiation with ultraviolet rays). In the embodiment, a circular pattern having a diameter of 50 μm is removed by patterning at intervals of 150 μm).
Serves as an exposure mask, and only a desired portion of the first resist 330 is partially exposed. At this time, since the transparent substrate 100 is inclined at the substrate inclination angle ψ = 30 degrees as described above, the first resist 330 is exposed from an oblique direction. In the first exposure step of the fifth embodiment, the first resist 330 was exposed at an exposure amount of 450 mJ / cm ² .

Next, as shown in FIG. 11C, a second resist 340 made of a photosensitive insoluble material is formed on the first resist 330 to a desired thickness. In the fifth embodiment, a negative resist THB-130N (trade name) manufactured by JSR Corporation is used as the second resist 340, and the second resist 340 is formed with a thickness of 45 μm by spin coating. At this time, the spin coating conditions were as follows: the number of rotations was 1800 rpm, and the processing time was 10 minutes.
Seconds. In the following description, this step (FIG. 11)
(C)) will be referred to as a second resist forming step of the fifth embodiment.

Next, as shown in FIG. 12D, ultraviolet light is again irradiated from the other surface side of the transparent substrate 100 where the opaque conductive layer 210 is not formed, and the transparent substrate 10
0, the second resist 34 via the first resist 330
Expose 0. At this time, the transparent substrate 100 is tilted at the same substrate tilt angle ψ = 30 degrees as in the first exposure step (FIG. 11B), so that ultraviolet rays are irradiated at the same angle as in the first exposure step. . This step is referred to as a second exposure step of the fifth embodiment.

In the second exposure step, a desired part of the exposed part of the first resist 330 already exposed in the first exposure step (FIG. 11B) is not exposed again. Ultraviolet light was shielded by the light shielding mask 420. By doing so, the first resist 33
0, the second resist 340 is unexposed, the first resist 330 is only exposed, and the first resist 330 and the second resist 340 are both exposed. The exposure state can be classified. In the second resist 340 exposed in the second exposure step, the same position on the exposed portion of the first resist 330 exposed in the first exposure step is always exposed.
This is because, as can be seen from FIG. 12D, in the second exposure step in the fifth embodiment, the opaque conductive layer 210 functions as an exposure mask, and the opaque conductive layer 210 is transparent. This is because the exposure is performed at exactly the same position as that in the first exposure step because the substrate is fixed on the conductive substrate 100. This is one of the effects of using the back exposure method in the present invention. The fifth
In the second exposure step of the embodiment, the second resist 340 was exposed at an exposure amount of 450 mJ / cm ² .

First resist 330, second resist 3
Since both are photosensitive insoluble materials, if development is performed after the second exposure step of FIG. 12D, a patterned first resist 350 and second resist 360 as shown in FIG. 12E are formed. Is done. The state shown in FIG. 12E is an electroforming base for an electroforming step performed after this step. In the fifth embodiment, the transparent substrate 100
A first pattern having a diameter of 50 μm and a height of 40 μm made of the first resist 350 inclined at an angle of degrees, and a first pattern of 60 degrees with respect to the plane of the transparent substrate 100 made of the first resist 350 and the second resist 360. Diameter 5 inclined at an angle
A second pattern having a thickness of 0 μm and a height of 85 μm could be formed. In the fifth embodiment, a THB-130N dedicated developer (product name: THB-D1) is used as the developer.
And a developing treatment was performed at a liquid temperature of 40 ° C. for 3 minutes.

Thereafter, as shown in FIG. 12F, an electroformed structure 80 is formed on the opaque conductive layer 210 by an electroforming method. In the fifth embodiment, an electroformed structure 8 made of Ni and having a thickness of 80 μm is formed by nickel (Ni) electroforming.
0 was formed. At this time, the Ni electroforming process is performed using a nickel sulfamate plating solution at a liquid temperature of 50 ° C. and 1A.
/ Dm ^{2 at} a current density of 8 hours.

In the fifth embodiment, as shown in FIG. 12F, the first pattern consisting of only the first resist 350 is formed by performing Ni electroforming so as to have a thickness of 80 μm. All of them could be completely covered by the electroforming material Ni. On the other hand, since the second pattern in which the first resist 350 and the second resist 360 are stacked has a height of 85 μm, it cannot be covered by Ni electroforming with a thickness of 80 μm. In the fifth embodiment of the present invention, the first resist 350
It is important that the electroforming process is performed to such a thickness that the first pattern consisting only of the first pattern is covered and the second pattern in which the first resist 350 and the second resist 360 are stacked is not covered. .

Finally, the first resist 350, the second resist 360, the opaque conductive layer 210, the transparent substrate 10
0 was removed from the electroformed structure 10, and an electroformed structure 80 having inclined holes 8, 82 as shown in FIG. 10 was completed. In the fifth embodiment, first, the opaque conductive layer 210 and the transparent substrate 100 are mechanically removed, and then the first resist 35 is removed.
The 0 and second resists 360 were dissolved and removed with a 50% aqueous solution of 10% potassium hydroxide (KOH).

As described above, in the fifth embodiment, the opening dimension d is 50 μm in diameter and 80 μm in depth (the hole opening surface i
, The inclined hole 81 having an inclination angle θ of 60 degrees, an opening d having a diameter of 50 μm and a depth of 40 μm.
(A vertical distance from the hole opening surface i), and an electroformed structure 80 having a thickness of 80 μm in which inclined holes 82 having an inclination angle θ of 60 degrees and not penetrating are arranged at intervals (pitch) of 150 μm. (FIG. 10). As in the fifth embodiment,
One of the features of the present invention is that the inclined hole 81 that penetrates and the inclined hole 82 that does not penetrate can be formed at the same time.

Further, in the fifth embodiment, the electroformed structure is manufactured by separately exposing the two-layer structure of the first resist 330 and the second resist 340. By repeating the same steps in the structure, it is possible to form inclined holes having different depths in several stages.

(Sixth Embodiment) FIG. 14 shows a sixth embodiment of the present invention.
FIG. 10 is a view showing an exposure step in the method for manufacturing an electroformed structure having inclined holes according to the embodiment. FIG. 15 is a view showing a step after an exposure step in the method for manufacturing an electroformed structure having inclined holes according to the sixth embodiment of the present invention. Figure 1 below
4, a method of manufacturing the electroformed structure according to the sixth embodiment will be described with reference to FIGS.

First, a first opaque layer 220 having conductivity is formed on one surface of the transparent substrate 100 by patterning in a desired shape, and the first opaque layer 220 is formed on the other surface on the back surface. The second opaque layer 23 in any other shape
0 was formed.

In the sixth embodiment, the transparent substrate 100
The first opaque layer 220 and the second opaque layer 220 each having a laminated structure in which a lower layer is a chromium (Cr) film and an upper layer is a gold (Au) film are used on both surfaces thereof. The opaque layers 230 were each formed by patterning.
C of the first opaque layer 220 and the second opaque layer 230
The thickness of each of the r film and the Au film is 0.05 μm (C
r) and 0.2 μm (Au), both of which were formed by a sputtering method which is a kind of vacuum film forming method.

For patterning, a photolithography method and an etching method which are generally widely used in the field of LSI are used. In the present embodiment, the pattern of the first opaque layer 220 is a pattern in which non-film-formed portions removed in a circular shape having a diameter of 100 μm are formed at equal intervals at 200 μm pitch at three locations. On the other hand, the pattern of the second opaque layer 230 has a pattern in which a non-film-formed portion removed in a circular shape having a diameter of 100 μm is formed at one place. Are formed in a positional relationship as shown in FIG.

Further, in the present invention, the first opaque layer 22
On top of this, a resist 300 was formed. In the sixth embodiment, a photosensitive insoluble material THB-130N manufactured by JSR Corporation is used as the resist 300, and 50% is formed by spin coating.
It was formed with a thickness of μm.

In the present invention, the first opaque layer 220 and the second opaque layer 23 having different patterns are thus obtained.
0 was formed on both sides, and the transparent substrate 100 on which the resist 300 was formed on the first opaque layer 220 was exposed as shown in FIG.

The exposure method in the manufacturing method of the present invention is performed by moving the transparent substrate 100 at a predetermined speed under a fixed light source 800 that emits ultraviolet light. At this time, the transparent substrate 100 includes the second opaque layer 2
The side where 30 is formed is arranged facing the light source 800.
By disposing the transparent substrate 100 in this manner, light emitted from the light source 800 is partially shielded by the second opaque layer 230 and the first opaque layer 220. That is, the second opaque layer 230 and the first opaque layer 220 function as a mask.

As the transparent substrate 100 moves under the light source 800, the relative positional relationship between the light source 800 and the transparent substrate 100 changes from FIG. 14A to FIG. 14E.

First, in FIG. 14A, the light emitted from the light source 800 can reach the transparent substrate 100 only through the non-film-formed portion where the second opaque layer 230 has been removed. The light that can pass through the transparent substrate 100 is applied to the first opaque layer 220 in the irradiation direction.
The resist 300 is reached via the non-film-formed portion from which is removed.

In FIG. 14A, the light source 800 and the second
Non-film-forming portion of the opaque layer 230 and the first opaque layer 2
Light from a direction in which the non-film-forming portions 20 are arranged in a straight line is selectively selected, and the resist 300 is exposed according to the direction.

Next, when the transparent substrate 100 moves to a position as shown in FIG. 14B, the light that has traveled through the transparent substrate 100 through the non-film-formed portion where the second opaque layer 230 has been removed is , Blocked by the first opaque layer 220;
It does not reach the resist 300. Therefore resist 300
Exposure is not performed in that part.

When the transparent substrate 100 further moves to the position shown in FIG. 14C, the light from the light source 800 is
After passing through the non-film-forming portion of the first opaque layer 220 and the non-film-forming portion of the second opaque layer 230, the resist 300 is exposed again.

Thereafter, the transparent substrate 100 is moved to the state shown in FIG.
Move to the position shown in FIG.
Light that has traveled through the transparent substrate 100 through the non-deposited portion where the zero has been removed is blocked by the first opaque layer 220, and the resist 300 is not exposed.

Subsequently, the transparent substrate 100 is moved to FIG.
(E), the light from the light source 800 passes through the non-film-forming portion of the first opaque layer 220 and the non-film-forming portion of the second opaque layer 230, and is again transferred to the resist. Expose 300.

In the exposure method of the present invention as described above,
The exposure direction of the resist 300 (here, the direction of incidence of light) has different angles in FIGS. 14 (a), (c) and (e). The feature of the present invention is that exposure at several different angles can be performed simultaneously by such a series of exposure steps, and the production efficiency is high and suitable for mass production.

Although the light source 800 is fixed and the transparent substrate 100 is moved in the exposure step in the sixth embodiment, the present invention utilizes the change in the relative positional relationship between the transparent substrate 100 and the light source 800. Therefore, for example, the transparent substrate 100 may be fixed and the light source 800 may be moved, or the transparent substrate 100 and the light source 800 may be moved.
You may move both.

After the exposure step, when the resist 300 is developed, only the exposed portions remain, and a patterned resist 311 as shown in FIG. 15A is formed. This slanted part including the transparent substrate 100, the first opaque layer 220, the second opaque layer 230, and the resist 311 is referred to as an electroforming mold 900 for the next electroforming step. In the present embodiment, development was performed using a developing solution dedicated to THB-130N.

Next, as shown in FIG. 15B, an electroformed structure 90 is formed on the first opaque layer 220 having conductivity by electroforming. At this time, the electroformed structure 90 is formed so as to transfer the shape of the resist 311.
In this embodiment, the nickel (Ni) electroforming method
An electroformed structure 90 made of i was formed.

Finally, as shown in FIG. 15 (c), the electroformed structure 90 is transformed into a transparent substrate 100 which is an electroforming base mold, a first opaque layer 220, a second opaque layer 230, and a resist 3.
11 and the electroformed structure 90 is completed.

In the electroformed structure 90 manufactured in this manner, the inclined holes 91 and 93 formed at different angles with respect to the plane p are formed, and the electroformed structure 90 is formed perpendicular to the plane p. Vertical vertical holes 92 are formed, each of which is a very fine through hole having a size of 100 μm. The dimensional accuracy was very high, about 1 μm.

In the sixth embodiment, FIG.
Although the inclined-shaped part in the state shown in (a) is used as the electroforming mold 900, the inclined-shaped part itself can be used as a part. In that case, the first opaque layer 220 and the second opaque layer 230 do not necessarily need to have conductivity.

(Seventh Embodiment) FIG. 6 is a plan view of an optical component having an inclined through hole according to a seventh embodiment of the present invention. FIG. 7 is a cross-sectional view of a main part of an optical component having an inclined through hole according to a seventh embodiment of the present invention. Book 7
In the embodiment, the electroformed structure having the inclined holes according to the second embodiment is manufactured by changing the shape for an optical component. The optical component 50 shown in FIG. 6 has two types of inclined holes 51a and 51b having different inclination angles and different opening shapes. Each of the inclined holes 51a and 51b is formed at a required predetermined position. In the second embodiment, the shape of the opening of the inclined hole 51a is circular, and the shape of the opening of the inclined hole 51b is rectangular. However, this is intentionally changed to make the seventh embodiment easier to understand. Therefore, it is not always necessary to change the shape of the opening as an optical component.

FIG. 7A is a diagram showing a cross section taken along the line AA shown in FIG. 6, and is a diagram showing a cross section near the inclined hole 51a. FIG. 7B is a diagram showing a cross section taken along the line BB shown in FIG. 6, and is a diagram showing a cross section near the inclined hole 51b. The inclined hole 51a provided in the optical component 50 is shown in FIG.
As shown in the figure, the holes are inclined at an inclination angle of 60 degrees. On the other hand, as shown in FIG. 7B, the inclined hole 51b provided in the optical component 50 is inclined at an inclination angle of 120 degrees. Both of the inclined holes 51a and 51b have openings of 50 μm.

The optical component 50 according to the seventh embodiment is an electroformed structure made of Ni and having a thickness of 50 μm and has the same steps and conditions as those of the second embodiment shown in FIG. Manufactured. The second embodiment differs from the second embodiment in the pattern shape of the opaque conductive layer.

The optical component of the seventh embodiment can be used for a display device as shown in FIG. FIG. 8 is a view showing a display device using an optical component according to a seventh embodiment of the present invention. The display device 400 shown in FIG.
000. The light source 3000 is arranged on the back surface of the optical component 50 in which the penetrating inclined holes 51a and 51b having different inclinations are formed, and light is emitted. Then, light source 3
7 (a) and 7 (b), only light in the direction along the respective inclination angles of the penetrated inclined holes 51a and 51b is transmitted, and light in other directions is transmitted. Light is blocked.

The display device 4000 using the optical component according to the seventh embodiment of the present invention is a display device 4000 that displays only light in a direction along the respective inclination angles of the inclined holes 51a and 51b.

When the light source 3000 is arranged on the back surface of the optical component 50 and is irradiated with light, as shown in FIG.
When the optical component 50 is viewed from the α direction which is the same direction as the tilt direction of the optical component 50, only the light transmitted through the tilt hole 51a can be observed.
Light transmitted through the inclined hole 51b cannot be observed. as a result,
As shown in FIG. 8A, the character "A" drawn by the transmitted light can be observed.

On the other hand, when the optical component 50 is viewed from the β direction which is the same direction as the inclined direction of the inclined hole 51b as shown in FIG. 8B, only the light transmitted through the inclined hole 51b can be observed, and the inclined hole 51a can be observed. The transmitted light cannot be observed. As a result, as shown in FIG. 8B, “B” drawn by the transmitted light
Can be observed.

As described above, with the optical component 50 according to the seventh embodiment of the present invention, the display device 4000 capable of displaying different images depending on the viewing direction has been achieved.

The optical component 50 according to the seventh embodiment of the present invention is manufactured by the manufacturing method according to the second embodiment shown in FIG. 4, and after the electroforming step, the resist 310, the opaque conductive layer 200, and the Although the substrate 100 was removed and completed, since the transparent substrate 100 can transmit light, only the resist 310 may be removed, and the opaque conductive layer 200 and the transparent substrate 100 may not be removed. . Even in such a case, it is possible to sufficiently function as an optical component.

(Eighth Embodiment) FIG. 9 is a sectional view showing the vicinity of a nozzle of a liquid ejecting apparatus using a nozzle component according to an eighth embodiment of the present invention, and using the nozzle component according to the ninth embodiment of the present invention. FIG. 4 is a cross-sectional view of the vicinity of a nozzle of the liquid ejecting apparatus. The electroformed structure provided with the inclined hole according to the present invention can be applied to a nozzle component constituting an ejection device for ejecting a fluid such as a liquid or a gas.

In the eighth embodiment, as shown in FIG. 9A, a nozzle 61 for ejecting the liquid 600 is provided in a part of the liquid chamber 500, which is a part for storing the liquid 600. The nozzle component 60 is joined. The liquid chamber 500 is sufficiently filled with the liquid 600, and the liquid 600 is ejected from the nozzle 61 by applying an external force to the liquid 600 by some method. The nozzle component 60 of the eighth embodiment has a nozzle 61 having a circular opening having a diameter of 50 μm, as shown in FIG.
As shown in (a), the liquid 600 is inclined at an angle approaching each other toward the side from which the liquid 600 is ejected. Therefore, the pressurized liquid 600 is ejected as shown by the broken line in FIG. As described above, the liquid ejecting apparatus using the nozzle component according to the eighth embodiment of the present invention is suitable for ejecting a liquid at a high density in a narrow range.

The nozzle component 60 having the nozzles 61 inclined at different angles according to the eighth embodiment can be manufactured by the same manufacturing method as that of the second embodiment of the present invention. In the eighth embodiment, by using the manufacturing method, the nozzle component 60 made of Ni and having a plate thickness of 50 μm can be manufactured.

In the eighth embodiment, the nozzle component provided in the liquid ejecting apparatus for ejecting the liquid is achieved by the present invention. However, the object to be ejected is not limited to the liquid, but may be a fluid. If so, it may be a gas or a solid, or an object in which both are mixed. Note that a fluid refers to an object that can flow by an external force.

(Ninth Embodiment) In the ninth embodiment, as shown in FIG. 9B, a liquid 60 is stored in a part of a liquid chamber 500 which is a part for storing a liquid 600.
A nozzle component 70 provided with a nozzle 71 for jetting 0 is joined. The liquid chamber 500 is sufficiently filled with the liquid 600, and an external force is applied to the liquid 600 by any method, so that the liquid
0 is ejected. In the nozzle component 70 of the ninth embodiment, a nozzle 71 having a circular opening with a diameter of 50 μm is formed at an angle away from each other toward the side from which the liquid 600 is ejected, as shown in FIG. 9B. Have been. Therefore, the liquid 600 pressurized is
As shown by the dashed line in FIG. As described above, the liquid ejecting apparatus using the nozzle component according to the eighth embodiment of the present invention is suitable for ejecting liquid to different places by one ejection.

The nozzle part 70 having the nozzles 71 inclined at different angles according to the ninth embodiment can be manufactured by the same manufacturing method as that of the second embodiment of the present invention. In the ninth embodiment, by using the manufacturing method, the nozzle component 70 made of Ni and having a plate thickness of 50 μm can be manufactured.

[0152]

According to the present invention, it is possible to obtain a structure having an inclined hole having a very small opening, which has not been achieved conventionally. Further, it was possible to obtain a structure having a highly reliable inclined hole with good dimensional accuracy. Since more holes can be processed at once, the productivity was also very good.

Further, by the above means of the present invention, it was possible to obtain a nozzle component having a nozzle hole which is extremely minute, has high dimensional accuracy, and is inclined at a predetermined angle.

Further, by the above means of the present invention, it was possible to obtain an optical component having an extremely small size, high dimensional accuracy, and an inclined through hole.

Further, by the above-described means of the present invention, it was possible to obtain a display device for displaying different images depending on the viewing direction.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electroformed structure according to an embodiment of the present invention.

FIG. 2 is a sectional view of an electroformed structure according to an embodiment of the present invention.

FIG. 3 is a view showing a method for manufacturing an electroformed structure according to an embodiment of the present invention.

FIG. 4 is a view illustrating a method for manufacturing an electroformed structure according to an embodiment of the present invention.

FIG. 5 is a perspective view of an electroformed structure having inclined holes according to an embodiment of the present invention.

FIG. 6 is a plan view of an optical component having an inclined through hole according to the present invention.

FIG. 7 is a sectional view of a main part of an optical component having an inclined through hole according to the present invention.

FIG. 8 is a diagram showing a display device using the optical component of the present invention.

FIG. 9 is a cross-sectional view of the vicinity of a nozzle of a liquid ejection device using a nozzle component according to the present invention.

FIG. 10 is a sectional view of an electroformed structure having inclined holes according to an embodiment of the present invention.

FIG. 11 is a diagram showing a first half of a method of manufacturing an electroformed structure having inclined holes according to an embodiment of the present invention.

FIG. 12 is a view showing a latter half of the method of manufacturing the electroformed structure having the inclined holes according to the embodiment of the present invention.

FIG. 13 is a diagram showing the size of the opening of the inclined hole of the electroformed structure of the present invention.

FIG. 14 is a view showing an exposure step in the method for manufacturing a microstructure according to the embodiment of the present invention.

FIG. 15 is a view showing a step after an exposure step in the method for manufacturing a microstructure according to the embodiment of the present invention.

FIG. 16 is a perspective view of a structure having inclined holes manufactured by machining with a conventional drill.

FIG. 17 is a diagram showing a state in which an inclined hole is machined by a conventional drill.

[Description of Signs] 10, 20, 30, 40, 80, 90 Electroformed structure 11, 21a, 21b, 31, 41 Inclined hole 50 Optical component 51a, 51b Inclined hole 60, 70 Nozzle component 61, 71 Nozzle 81, 82, 91, 93 Inclined hole 92 Vertical hole 100 Transparent substrate 200, 210 Opaque conductive layer 220 First opaque layer 230 Second opaque layer 300, 310, 311, 320 Resist 330, 350 First resist 340, 360 Second resist 400, 410, 420 Light shielding mask 500 Liquid chamber 600 Liquid 800 Light source 900 Electroforming mold 1000 Structure 1100 Hole 2000 Drill 3000 Light source 4000 Display device

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) G09F 19/14 G09F 19/14

Claims (42)

[Claims] 1. A micro-shaped structure in which micro holes are inclined and opened, wherein the shape of the opening of the micro holes is a shape other than an elliptical shape, and a center axis of the micro holes and the micro holes are formed. A micro-shaped structure wherein the angle of inclination is an angle other than 90 degrees when an angle formed by a surface with a hole is an angle of inclination. 2. The microstructure according to claim 1, wherein the inclination angle is an angle of 45 ° or more and 135 ° or less. 3. A micro-shaped structure in which a plurality of micro-holes are formed at an angle, wherein an opening of the micro-hole has a shape other than an elliptical shape, and a center axis of the micro-hole. A micro-shaped structure having a plurality of micro holes, wherein the angle of inclination is different from other micro holes, when an angle formed by a surface with the micro holes is an inclination angle. 4. The method according to claim 1, wherein the size of the opening of the minute hole is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is 50 μm or less. Or the micro-shaped structure according to claim 3. 5. The micro-shaped structure according to claim 1, wherein the shape of the opening of the micro-hole is polygonal. 6. The micro-shaped structure according to claim 3, wherein both the micro-holes penetrating and the micro-holes not penetrating are provided. 7. Ni, Cu, Co, Sn, Zn, Au,
The microstructure according to claim 1, wherein the microstructure is made of a material containing at least one element of Pt, Ag, and Pb. 8. A microstructure having micropores, wherein the micropores are formed on a transparent substrate formed by patterning an opaque conductive layer in a desired shape. Forming a photosensitive material layer on the surface on which the opaque conductive layer is not formed on the transparent substrate. Exposing the photosensitive material layer by irradiating light at an angle of; developing and patterning the photosensitive material layer; forming a micro-shaped structure on the opaque conductive layer by electroforming. A micro-shaped structure formed by a forming method comprising: an electroforming step of forming; and a step of separating the micro-shaped structure from the transparent substrate and the photosensitive material layer. 9. A micro-shaped structure having a micro-shape inclined at a predetermined angle, comprising: a transparent substrate that transmits light; and a first opaque pattern formed on one surface of the transparent substrate by patterning. A transparent layer, a second opaque layer formed by patterning on the other surface of the transparent substrate, and a patterned photosensitive material layer, wherein the photosensitive material layer Is disposed on the non-film-forming portion of the first opaque layer, and in a direction in which light passes through the non-film-forming portion of the second opaque layer and the non-film-forming portion of the first opaque layer. The formed micro-shaped structure. 10. A micro-shaped structure having a micro-shape inclined at a predetermined angle, wherein a patterned first opaque layer and a second opaque layer are formed on different predetermined surfaces, respectively. And a transparent substrate having a photosensitive material layer formed on the first opaque layer,
The photosensitive material layer is exposed in a shape corresponding to the pattern of the first opaque layer and the second opaque layer by changing the relative position between the transparent substrate and the light source by arranging the light-sensitive material at a position that can be irradiated from the light source. A micro-shaped structure formed by a forming method comprising the steps of: 11. The micro-shaped structure according to claim 9, wherein the first opaque layer and the second opaque layer have at least one non-film-forming portion. . 12. The micro-shaped structure according to claim 9, wherein a patterned shape of the first opaque layer and a patterned shape of the second opaque layer are different from each other. . 13. A method for manufacturing a micro-shaped structure having micro holes, wherein the opaque conductive layer is formed on a transparent substrate formed by patterning the opaque conductive layer in a desired shape. Forming a photosensitive material layer on the surface of the transparent substrate, and a predetermined angle other than 90 degrees with respect to the plane of the transparent substrate from the surface of the transparent substrate on which the opaque conductive layer is not formed. Exposing the photosensitive material layer by irradiating the photosensitive material layer with light; developing the photosensitive material layer to form a pattern; forming a microstructure on the opaque conductive layer by electroforming. A method for manufacturing a microscopic structure, comprising: an electroforming step; and a step of separating the microscopic structure from the transparent substrate and the photosensitive material layer. 14. A method for producing a micro-shaped structure having micro holes, wherein the opaque conductive layer is formed on a transparent substrate formed by patterning the opaque conductive layer in a desired shape. Forming a photosensitive material layer on a surface of the transparent substrate, and irradiating light at a predetermined angle to a plane of the transparent substrate from a surface of the transparent substrate on which the opaque conductive layer is not formed. A first exposure step of exposing a predetermined portion of the photosensitive material layer in a desired shape; and a plane of the transparent substrate from a side of the transparent substrate on which the opaque conductive layer is not formed. A second exposure step of irradiating light at an angle different from that of the first exposure step, and exposing an unexposed portion of the photosensitive material layer in a desired shape in the first exposure step; Developing and patterning a layer of photosensitive material; Production of a micro-shaped structure having an electroforming step of forming a micro-shaped structure on an electroconductive layer by an electroforming method, and a step of separating the micro-shaped structure from the transparent substrate and the photosensitive material layer Method. 15. A method of manufacturing a micro-shaped structure having micro holes, wherein the opaque conductive layer is formed on a transparent substrate formed by patterning the opaque conductive layer in a desired shape. Forming a first photosensitive material layer on the surface on which the opaque conductive layer is not formed on the transparent substrate at a predetermined angle with respect to the plane of the transparent substrate. A first exposure step of irradiating light and exposing a predetermined portion of the first photosensitive material layer in a desired shape; and a transparent substrate formed by patterning the opaque conductive layer in a desired shape. Forming a second photosensitive material layer on the first photosensitive material layer; and forming a flat surface of the transparent substrate from a side of the transparent substrate on which the opaque conductive layer is not formed. Is irradiated at a predetermined angle to the second photosensitive material layer. A second exposure step of exposing at Nozomu shape, by developing the first photosensitive material layer and the second photosensitive material layer, a first pattern of a first photosensitive material layer, the first
Forming a second pattern consisting of a photosensitive material layer and a second photosensitive material layer, and electroforming the opaque conductive layer, the first pattern is completely covered, and Production of a micro-shaped structure comprising: an electroforming step of forming a micro-shaped structure with a thickness that does not cover two patterns; and a step of separating the micro-shaped structure from the transparent substrate and the photosensitive material layer. Method. 16. A method of manufacturing a micro-shaped structure having a micro-shape inclined at a predetermined angle, wherein the patterned first opaque layer and the second opaque layer are respectively formed on different predetermined surfaces. Forming a transparent substrate on which a photosensitive material layer is formed on the first opaque layer,
The photosensitive material layer is exposed in a shape corresponding to the pattern of the first opaque layer and the second opaque layer by changing the relative position between the transparent substrate and the light source by arranging the light-sensitive material at a position that can be irradiated from the light source. And forming a micro-shaped structure. 17. A method of manufacturing a micro-shaped structure having a shape inclined at a predetermined angle, wherein a first opaque layer having conductivity is provided on one surface of a transparent substrate that transmits light. Forming a second opaque layer in another pattern different from the first opaque layer on the other surface of the transparent substrate; and Step of forming a photosensitive material layer, and the first opaque layer, the transparent substrate on which the second opaque layer and the photosensitive material layer are formed, at least one of the light source, at a predetermined relative speed, Exposing from the side on which the second opaque layer is formed while moving, partially exposing the photosensitive material layer, and developing and patterning the partially exposed photosensitive material layer And a first opaque layer having conductivity Process and the micro-shaped structure of the patterned photosensitive material layer, the manufacturing method of the micro-shaped structure and a step of separating the transparent substrate to form a micro-shaped structures by electroforming method. 18. The method according to claim 16, wherein each of the first opaque layer and the second opaque layer has at least one non-film-forming portion. Method. 19. A nozzle component manufactured by an electroforming method and having a nozzle hole for ejecting a fluid, wherein an opening of the nozzle hole has a shape other than an elliptical shape. A nozzle component, wherein the inclination angle is an angle other than 90 degrees when an angle formed between a central axis and a surface provided with the nozzle hole is an inclination angle. 20. The inclination angle is 45 ° or more and 135 °.
20. The nozzle component according to claim 19, wherein the angle is as follows. 21. A nozzle component manufactured by an electroforming method and having a plurality of nozzle holes for ejecting a fluid, wherein an opening of the nozzle hole has a shape other than an elliptical shape. A nozzle component having, among the plurality of nozzle holes, a nozzle hole having the different inclination angle from other nozzle holes, when an angle formed between a central axis of the hole and a surface on which the nozzle hole is formed is an inclination angle; . 22. The size of the opening of the nozzle hole is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is 50 μm or less. Or the nozzle component according to claim 21. 23. The method according to claim 19, wherein the shape of the opening of the nozzle hole is polygonal.
2. The nozzle component according to 1. 24. Ni, Cu, Co, Sn, Zn, A
22. The nozzle component according to claim 19, wherein the nozzle component is made of a material containing at least one of u, Pt, Ag, and Pb. 25. A method of manufacturing a nozzle component having a nozzle hole for ejecting a fluid, wherein the opaque conductive layer of a transparent substrate formed by patterning the opaque conductive layer in a desired shape is provided. A step of forming a photosensitive material layer on the surface on which the opaque conductive layer is not formed on the surface of the transparent substrate other than 90 degrees with respect to a plane of the transparent substrate; Exposing the photosensitive material layer by irradiating light at a predetermined angle; developing and patterning the photosensitive material layer; forming a nozzle part on the opaque conductive layer by electroforming. And a step of separating the nozzle component from the transparent substrate and the photosensitive material layer. 26. A method of manufacturing a nozzle component having a nozzle hole for ejecting a fluid, wherein the opaque conductive layer is formed by patterning a opaque conductive layer in a desired shape. Forming a photosensitive material layer on the surface on which the opaque conductive layer is not formed on the surface on which the opaque conductive layer is not formed, at a predetermined angle with respect to the plane of the transparent substrate; A first exposure step of irradiating light to expose a predetermined portion of the photosensitive material layer in a desired shape; and a step of exposing the transparent substrate from the side of the transparent substrate on which the opaque conductive layer is not formed. A second exposure step of irradiating the plane of the substrate with light at an angle different from that of the first exposure step, and exposing an unexposed portion of the photosensitive material layer in a desired shape in the first exposure step Developing and patterning the photosensitive material layer Step and said forming a nozzle part by electroforming on the opaque conductive layer on the transparent substrate of the nozzle part, a manufacturing method of a nozzle part and a step of separating from the photosensitive material layer. 27. An optical component manufactured by an electroforming method and having micro holes, wherein an opening of the micro holes has a shape of:
An optical component having a shape other than an elliptical shape, wherein the inclination angle is an angle other than 90 degrees when an angle formed between a central axis of the microhole and a surface on which the microhole is formed is an inclination angle. 28. The inclination angle is 45 ° or more and 135 °.
The optical component according to claim 27, wherein the angle is as follows. 29. An optical component manufactured by an electroforming method and provided with a plurality of micro holes, wherein the shape of the opening of the micro holes is a shape other than an elliptical shape, and the center of the micro holes is An optical component having, among the plurality of micro holes, a micro hole having the different inclination angle from another micro hole, where an angle formed by a surface on which the micro holes are formed is an inclination angle. 30. The size of the opening of the minute hole is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is 50 μm or less. Or the optical component according to claim 29. 31. The shape of the opening of the minute hole is a polygonal shape.
An optical component according to item 1. 32. Ni, Cu, Co, Sn, Zn, A
30. The optical component according to claim 27, wherein the optical component is made of a material containing at least one of u, Pt, Ag, and Pb. 33. A method of manufacturing an optical component having micropores, which is manufactured by an electroforming method, wherein the opaque conductive layer is patterned in a desired shape, and wherein the opaque conductive layer is patterned. Forming a photosensitive material layer on the surface on which the layer is formed; and 90 degrees from the surface of the transparent substrate on which the opaque conductive layer is not formed with respect to the plane of the transparent substrate. Irradiating light at a predetermined angle other than to expose the photosensitive material layer; developing and patterning the photosensitive material layer; and forming an optical component on the opaque conductive layer by electroforming. Forming an optical component. 34. A method of manufacturing an optical component having micropores, which is manufactured by an electroforming method, wherein the opaque conductive layer is patterned in a desired shape. A step of forming a photosensitive material layer on the surface on which the layer is formed; and, from the side of the transparent substrate on which the opaque conductive layer is not formed, a predetermined surface with respect to the plane of the transparent substrate. Irradiating light at an angle, a first exposure step of exposing a predetermined portion of the photosensitive material layer in a desired shape, and from the side of the transparent substrate on which the opaque conductive layer is not formed, A second step of irradiating light onto the plane of the transparent substrate at an angle different from that of the first exposure step, and exposing the unexposed portion of the photosensitive material layer in a desired shape in the first exposure step. An exposure step, and developing and patterning the photosensitive material layer Degree and method of manufacturing the optical component and a step of forming an optical component by electroforming on the opaque conductive layer. 35. A display device, comprising: an optical component having a fine hole; and a light source for emitting light, wherein the display device displays an image by transmitting light emitted from the light source to the fine hole. The shape of the opening is a shape other than an elliptical shape, the plurality of micro holes provided in the optical component are formed at desired positions at different inclination angles, and the light emitted from the light source is A display device that transmits light only in the direction along the central axis of the hole. 36. The size of the opening of the micropore is represented by the diameter of a circle inscribed in the shape of the opening, and the size of the opening is 50 μm or less. The display device according to claim 1. 37. The display device according to claim 35, wherein the shape of the opening of the minute hole is a polygonal shape. 38. An electroforming mold having a minute shape inclined at a predetermined angle, comprising: a transparent substrate that transmits light; and a first opaque pattern formed on one surface of the transparent substrate by patterning. A transparent layer, a second opaque layer formed by patterning on the other surface of the transparent substrate, and a patterned photosensitive material layer, wherein the photosensitive material layer Is disposed on the non-film-forming portion of the first opaque layer, and in a direction in which light passes through the non-film-forming portion of the second opaque layer and the non-film-forming portion of the first opaque layer. An electroformed base mold that has been formed. 39. An electroforming die having a micro shape inclined at a predetermined angle, wherein a patterned first opaque layer and a second opaque layer are respectively formed on a predetermined surface; By disposing a transparent substrate having a photosensitive material layer formed on the first opaque layer at a position that can be irradiated from a light source, and changing the relative position between the transparent substrate and the light source, Exposing the layer to a pattern corresponding to the patterns of the first opaque layer and the second opaque layer to pattern the layer. 40. The electroforming mold according to claim 38, wherein the first opaque layer and the second opaque layer have at least one non-film-forming portion. . 41. The electroforming mold according to claim 38, wherein the patterned shapes of the first opaque layer and the second opaque layer are different from each other. . 42. A photosensitive material layer is formed on the surface of the transparent substrate on which the first opaque layer is formed, and the first opaque layer has conductivity. An electroforming mold according to claim 38 or claim 39.