JP2002137155A - Method and device for grinding outer periphery of work - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform machining of a chamfer surface without the occurrence of a step to the surface of a disc-form work, such as a semiconductor wafer. SOLUTION: A chamfer surface formed at the outer peripheral part of a work W is polished through relative rotation of a grinding ring 27 and a work by at least either one of the grinding ring or the work. The polishing ring 27 has an inner peripheral grinding surface 35 in a recess shape formed in an inclination state between a small diameter part 33 and a large diameter part 34, and a rotation center axis Ow of the work is inclined on a base of a grinding center axis Og and the chamfer surface is brought into contact with the inner peripheral grinding surface 35 in a manner that the work W crosses the inner peripheral grinding surface 35. Since this action brings overhang parts Wa and Wb of the work W into a state to be pushed out from the small diameter part 33 and the large diameter part 34, a polishing pad is prevented from making contact with the surface side of the work W and a step is prevented from occurring to the work W as a result of machining.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a polishing technique of a workpiece outer periphery for polishing a chamfer surface formed on an outer periphery of a disk-shaped workpiece such as a silicon semiconductor wafer.

[0002]

2. Description of the Related Art A semiconductor integrated circuit is formed on a surface of a semiconductor wafer made of silicon or a compound semiconductor wafer such as gallium arsenide through a series of manufacturing processes, and a chip is cut out from the semiconductor wafer to form a semiconductor integrated circuit device, that is, a semiconductor device. Is manufactured.

A silicon semiconductor wafer is formed by cutting a cylindrical silicon single crystal ingot into a disk shape using a cutter. The chamfering process using a grindstone is performed on the chamfering surface, that is, the bevel portion, of the outer peripheral surface of each semiconductor wafer, and the outer peripheral surface is also grinded. Further, these are subjected to lapping or polishing using a polishing pad. .

Conventionally, in order to lap or polish a chamfer surface formed on an outer peripheral portion of a semiconductor wafer, a polishing pad having a hemispherical polishing surface is rotated, and a chamfer surface of a disc-shaped semiconductor wafer is rotated. Is pressed against the spherical polishing surface, and the semiconductor wafer, that is, the work is rotated. An example of such a polishing apparatus, that is, a chamfering apparatus, is disclosed in Japanese Patent Application Laid-Open No. 10-29142.

[0005]

When the chamfering surface of a semiconductor wafer is polished using such a conventional chamfering apparatus, not only the chamfering surface but also a portion of the semiconductor wafer surface adjacent to the chamfering surface is polished. Was polished by a polishing pad, and a step was sometimes generated in that portion. In particular, when a large number of semiconductor wafers are repeatedly processed with the same polishing pad and track-like grooves are generated on the polishing surface of the polishing pad by the pressing force of the semiconductor wafer, a significant step is formed on the surface of the semiconductor wafer.

[0006] Since a semiconductor wafer having a step cannot be used, the polishing pad must be frequently replaced with a new one, which is a bottleneck in improving the processing efficiency. Further, if a step occurs on the surface of the semiconductor wafer during the chamfering process, the semiconductor wafer cannot be used, thereby lowering the processing yield.

An object of the present invention is to make it possible to process a chamfer surface without generating a step on the surface of a disk-shaped work such as a semiconductor wafer.

[0008]

The method for polishing the outer periphery of a work according to the present invention is a method for polishing the outer periphery of a work for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped work. The inner peripheral polishing surface of the polishing ring having an inner peripheral polishing surface formed to be inclined with respect to the diameter portion is substantially 180 ° apart from the center of the work in the chamfer surface.
° The polishing center axis is inclined with respect to the work center axis to press the chamfer surface so that the phase-shifted portion protrudes from the small-diameter portion and the large-diameter portion, and the work and the polishing ring are relatively rotated. It is characterized by making it.

The method for polishing the outer periphery of a work according to the present invention is a method for polishing the outer periphery of a work for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped work, wherein a slope between a small diameter portion and a large diameter portion is provided. A polishing ring having an inner peripheral polishing surface formed as described above is rotated around a polishing center axis, and a portion of the chamfer surface which is shifted from the center of the work by approximately 180 ° with respect to each other has the small diameter portion and the large diameter portion. The workpiece is rotated while pressing the chamfer surface against the inner peripheral polishing surface in a state where the workpiece central axis is inclined with respect to the polishing central axis so as to protrude from the portion.

The method for polishing the outer periphery of a work according to the present invention is a method for polishing the outer periphery of a work for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped work, wherein a slope between a small diameter portion and a large diameter portion is provided. A portion of the chamfer surface, which is substantially 180 ° out of phase with respect to the center of the workpiece, is formed on the inner peripheral polishing surface of the polishing ring having the inner peripheral polishing surface formed by the small diameter portion and the large diameter portion. The grinding center axis is inclined with respect to the work center axis so as to protrude, and the chamfer surface is pressed to rotate the work and the polishing ring relatively, so that the grinding center axis and the work center axis are relatively positioned. At least one of the polishing ring and the work is reciprocated in a swinging manner so as to swing.

The method for polishing the outer periphery of a work according to the present invention is a method for polishing the outer periphery of a work in which a chamfer surface formed on an outer peripheral portion of a disk-shaped work is polished, wherein a slope between a small diameter portion and a large diameter portion is provided. On the inner peripheral polishing surface of the polishing ring having the inner peripheral polishing surface formed as above, the polishing center axis is inclined with respect to the work central axis, and under the state where the chamfer surface is pressed, the workpiece and the The polishing ring is relatively rotated, and the entire circumference polishing process in a state where the entire chamfer surface is in contact with the inner peripheral polishing surface, and the phase of the chamfer surface is substantially 180 ° relative to the center of the work. An overhang polishing process is performed in a state where the shifted portion is protruded from the small diameter portion and the large diameter portion.

The polishing apparatus for polishing the outer periphery of a work according to the present invention is a polishing apparatus for polishing the outer periphery of a workpiece formed by polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped work. A polishing ring having an inner peripheral polishing surface formed as described above, and a work center such that a portion of the chamfer surface which is substantially 180 ° out of phase from the center of the work protrudes from the small diameter portion and the large diameter portion. A work holder for holding the work by inclining an axis with respect to the polishing center axis, and rotating means for relatively rotating the work and the polishing ring while pressing the chamfer surface against the inner peripheral polishing surface; It is characterized by having.

The polishing apparatus for polishing the outer periphery of a work according to the present invention is a polishing apparatus for polishing an outer periphery of a work for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped work. A polishing ring having an inner peripheral polishing surface formed as a polishing ring rotating means for rotating the polishing ring,
The work center axis is inclined with respect to the polishing center axis so that a portion of the chamfer surface, which is out of phase with the center of the work by approximately 180 °, protrudes from the small diameter portion and the large diameter portion. A work holder for holding,
And a work rotating means for rotating the work while pressing the chamfer surface against the inner peripheral polishing surface.

An apparatus for polishing the outer periphery of a workpiece according to the present invention is an apparatus for polishing a workpiece outer periphery for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece, wherein an inclined portion between a small diameter portion and a large diameter portion is provided. A polishing ring having an inner peripheral polishing surface formed as described above, and a work center such that a portion of the chamfer surface which is substantially 180 ° out of phase from the center of the work protrudes from the small diameter portion and the large diameter portion. A work holder for holding the work by inclining an axis with respect to the polishing center axis, and rotating means for relatively rotating the work and the polishing ring while pressing the chamfer surface against the inner peripheral polishing surface; Having a rocking means for rocking and reciprocating at least one of the polishing ring and the work so that the polishing center axis and the work center axis relatively swing. And butterflies.

An apparatus for polishing the outer periphery of a work according to the present invention is an apparatus for polishing the outer periphery of a work for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped work. A polishing ring having an inner peripheral polishing surface formed as described above, and holding the work in a state in which the polishing center axis is inclined with respect to the work central axis and the chamfer surface is pressed against the inner peripheral polishing surface. A work holder, rotating means for relatively rotating the work and the polishing ring, and reciprocatingly swinging the polishing center axis or the work center axis, so that the entire chamfer surface comes into contact with the inner peripheral polishing surface. Polishing over the entire circumference, and overhang polishing in a state where a portion of the chamfer surface, which is out of phase with the center of the work by approximately 180 °, protrudes from the small-diameter portion and the large-diameter portion. Processing and And having a rocking means for performing.

In the present invention, since the overhang polishing is performed from the start to the end of the polishing of the chamfer surface, or the overhang is performed in addition to the entire circumference polishing, the inside of the chamfer surface can be polished. The formation of steps on the work surface is prevented. Thereby, the polishing efficiency can be improved, and the polishing quality of the work can be improved.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing a polishing apparatus for an outer periphery of a work according to an embodiment of the present invention. A silicon semiconductor wafer is used as a work and a chamfer surface, that is, a beveling portion, formed on the outer peripheral surface is polished by the polishing apparatus. Processed. An orientation flat and a notch are formed on the semiconductor wafer to determine the crystal direction and align the crystal orientation. The chamfer surface other than these portions is polished.

This polishing apparatus has a work holding table 11 for holding a work W, and the work W is mounted on the upper surface of the work holding table 11. The work W is sucked and held by negative pressure air supplied to a vacuum passage formed on the surface of the work holding table 11. A rotary shaft 12 is fixed to the work holding table 11, and the rotary shaft 12 is rotatably mounted on a vertically movable plate 14 provided on a base 13 so as to be vertically movable. A motor 15 is attached to the vertically moving plate 14, and a gear 16 fixed to a shaft of the motor 15 and a gear 17 fixed to the rotating shaft 12 mesh with each other, and the motor 15 serving as a work rotating unit rotates the work holding table 11. Is rotated, and the work W held by the work holding table 11 is driven to rotate about the work center axis Ow.

Below the base 13, a lower base 18 is fixed by a connecting rod 19, and the work holding table 11 is moved by a rod 22 of a pneumatic cylinder 21 attached to the lower base 18 to move the vertical moving plate 14. It can move up and down together. In order to guide the vertical movement of the vertical movement plate 14, a guide rod 23 fixed to the vertical movement plate 14 passes through a guide sleeve 24 fixed to the bases 13, 18.

Above the work holding table 11, a disk-shaped polishing table 25 is disposed so as to face the work holding table 11.
The polishing table 25 is fixed to a rotating shaft 26, and is driven to rotate by a motor (not shown) as rotating means. Polishing table 2
5, a polishing ring 27 is fixed, and the polishing ring 2
7 is a polishing center axis Og which is a rotation center of the rotation shaft 26.
Is driven around. In the rotary shaft 26, the polishing center axis Og is inclined at an angle θ with respect to the workpiece center axis Ow, and in the illustrated case, the angle θ is set to 2 °. However, this angle θ can be set to an arbitrary angle depending on conditions such as the outer diameter of the work W. In the polishing apparatus shown in FIG. 1, the workpiece central axis Ow is perpendicular, and the polishing central axis Og is inclined at an angle θ with respect to this central axis. The work center axis Ow may be inclined.

The chamfer surfaces C1 and C2 are formed on the outer peripheral portions of both surfaces of the work W, and the respective chamfer surfaces are polished by the polishing apparatus shown in FIG. At the time of this polishing, the work W is placed on the work holding table 11 and held by suction while the work holding table 11 is lowered. Next, when the work holding table 11 is raised by the pneumatic cylinder 21, one chamfer surface C1 of the work W is pressed against the polishing ring 27. Under the pressed state, the chamfer surface C
1 is polished. During polishing, a polishing liquid such as a polishing liquid or a lapping liquid is applied to the polishing pad 32 and the work W.
Is applied between When polishing the other chamfer surface C2, the same polishing is performed after the work W is turned over.

FIG. 2A is a cross-sectional view showing the polishing ring 27 in a state where the work W is pressed, and FIG. 2B is a cross-sectional view along the line BB in FIG. 2A.

The polishing ring 27 includes an annular member 31 made of metal, resin, or the like, and the polishing pad 3 attached to the surface thereof.
The polishing pad 32 has an inner peripheral polishing surface 35 formed between the small diameter portion 33 and the large diameter portion 34 so as to be inclined. The polishing pad 32 is connected to the small-diameter portion 33, and a retracting portion 36 formed by bending the inner peripheral polishing surface 35.
And a retracting portion 37 connected to the large-diameter portion 34 and bent with respect to the inner peripheral polishing surface 35. These retracting portions 36 and 37 do not contact the workpiece W. The chamfer surface of the work W is polished only by the peripheral polishing surface 35.

As shown in FIG. 1, the outer diameter of the workpiece W is D0
Then, the inner diameter D1 of the small diameter portion 33 of the inner peripheral polishing surface 35 is set to be smaller than the work outer diameter D0, and the inner diameter D2 of the large diameter portion 34 is set to be larger than the work outer diameter. The width dimension of the polishing surface 35 is T. As shown in FIG. 2A, the workpiece central axis Ow and the polishing central axis Og are inclined at an angle θ to each other, and the workpiece W is inclined such that the chamfer surface of the workpiece W crosses the inner peripheral polishing surface 35. When W is pressed against the polishing ring 27, portions that are out of phase with each other by approximately 180 ° from the center portion W0 of the work protrude from the small-diameter portion 33 and the large-diameter portion. That is, it will overhang. Reference numeral Wa denotes a portion protruding from the small diameter portion 33, and reference numeral Wb denotes a portion protruding from the large diameter portion.

As described above, the chamfer surface is the inner peripheral polishing surface 3
5, the workpiece W is overhanged and pressed against the polishing ring 27, and as shown in FIG. 2 (B), the inner peripheral polishing surface 35 contacts only the chamfer surface and has a larger diameter than the chamfer surface. It does not come into contact with the inner part in the direction. This prevents a step from being formed on the surface of the work W adjacent to the chamfer surface, and enables a high-quality polished surface to be processed. In particular, even if a large number of works W are polished by using the polishing ring 27, the inner peripheral polishing surface 35 is uniformly worn as a whole, so that it is not necessary to replace the polishing ring 27 frequently.

FIG. 3A is a perspective view showing the workpiece W pressed against the inner peripheral polishing surface 35 of the polishing ring 27 in a state where it is turned upside down. 35 will be contacted. The inner peripheral polishing surface 35 has a spherical shape, and the chamfer surface contacts the spherical inner peripheral polishing surface 35 and is polished.
The shape of the inner peripheral polishing surface 35 is not limited to a spherical shape, but may be another concave shape such as a conical shape.

The polishing pad 32 has a size including not only the inner peripheral polishing surface 35 but also the retracting portions 36 and 37. This is to make it easy to attach the polishing pad 32 to the annular member 31. Since only the inner peripheral polishing surface 35 is polished, the polishing pad 32 having the size of this portion may be attached to the annular member 31.

FIG. 3B is a perspective view showing a modification of the annular member 31. As shown in FIG. An annular member 31 is formed by arranging a plurality of arc-shaped segments 31a in a ring shape with a predetermined gap therebetween and attaching the same to the polishing table 25, and a polishing pad (not shown) is attached to each segment 31a. Will be. As described above, when the polishing pad 32 is attached to the segment 31a, the inner peripheral polishing surface 35 becomes a polishing surface having a gap corresponding to the gap between the segments. In the case shown in FIG. 3B, there are eight segments 31a, but this number can be any number. Further, the gap between the segments 31a can be set to an arbitrary interval.

FIG. 3C is a cross-sectional view showing a modified example of the polishing ring 27. The concave portions 3 are formed on both sides in the width direction of the inner peripheral polishing surface 35.
By forming 8, portions on both sides in the width direction of the inner peripheral polishing surface 35 are used as retreating portions. Further, in the case shown in FIG.
And a spring member 40 is provided between the polishing ring 27 and the polishing table 25 so that the inner peripheral polishing surface 35 applies a pressing force uniformly over the entire chamfer surface. The spring member 40 may be provided also in the cases shown in FIGS. Further, the polishing ring 27 may be configured using a polishing pad having a shape including the annular member 31.

FIG. 4A shows a state in which the polishing apparatus shown in FIG. 1 rotates the polishing ring 27 and the workpiece W to perform polishing. In the case shown in the figure, the outer periphery of the workpiece W and the polishing ring 2 are rotated in opposite directions.
7 may be rotated in the same direction as long as a slip occurs relative to. Further, the rotation of the work W and the polishing ring 27 is not limited to the case where both are rotated as described above, and the polishing process is performed by rotating at least one of them to relatively rotate the work W and the polishing ring 27. It can be performed.

FIGS. 4B to 4D are cross-sectional views showing another polishing method for polishing the chamfer surface using the polishing ring 27 shown in FIGS. 1 and 2, respectively. FIG.
In the case shown in FIG. 4B, the polishing ring 27 is rotated in the same manner as in FIG. 4A, while the work W is protruded from the small-diameter portion 33 and the large-diameter portion 34, that is, the overhang portions Wa, The indexing rotation is performed by following the rotation of the polishing ring 27 so that the position of Wb gradually changes. Even with such a processing method, the chamfer surface can be polished similarly to the case shown in FIG.

In the case shown in FIG.
7 is rotated, and only the work W is rotated about the work center axis Ow. In this case,
In order to bring the work W into contact with the entire inner peripheral polishing surface 35,
The polishing ring 27 is reciprocated by swinging so that the polishing center axis Og swings in the direction indicated by the arrow. However, the swinging reciprocation is performed by the work W and the polishing ring 27.
May be relatively moved, and the work may be oscillated and reciprocated so as to swing the work center axis Ow without swinging and reciprocating the polishing ring 27.
These oscillating motions are performed by oscillating a rotating shaft that rotationally drives the work holding table or a rotating shaft that rotationally drives the polishing table 25 using a motor, a pneumatic cylinder, or the like as a driving source.

In the polishing method shown in FIGS. 4A to 4C, the work W is polished so that the overhang portions Wa and Wb are always maintained from the start to the end of the polishing. However, it is also possible to alternately perform the overhang polishing in the overhanging state and the entire circumference polishing in which the entire chamfer surface is brought into contact with the inner peripheral polishing surface 35 without overhanging to perform the polishing. good.

FIG. 4D is a diagram showing a polishing method in the case where the entire circumference polishing and the overhang polishing are performed as described above. In this case, the workpiece W is rotated around the workpiece central axis Ow, The polishing ring 27 is rotated around the polishing central axis Og, and the polishing ring 27 is reciprocated so that the polishing central axis Og swings. In FIG. 4D, a work W indicated by a solid line indicates a state in which the entire chamfer surface is in contact with the inner peripheral polishing surface 35, and a two-dot chain line indicates the work W
The protruding portions, that is, the overhang portions Wa and Wb are separated from the inner peripheral polishing surface 35 as in the above-described polishing method.

By reciprocating the polishing ring 27, the overhang polishing may be performed after the entire circumference polishing is performed for a predetermined time, and conversely, the overhang processing may be performed first. Alternatively, both polishing processes may be repeated a plurality of times. In such a polishing method, the work W may be reciprocated in a swinging manner, or both may be reciprocated in a swinging manner. Further, as shown in FIG. Ring 2
7 may not be rotated.

FIG. 5 is a view showing a polishing ring 27a as a comparative example. If the whole of the chamfer surface of the work W is constantly brought into contact with the polishing pad 32a to carry out the polishing, the polishing area which comes into contact with the work W will be described. 41 is worn, and a step is generated in a portion of the polishing pad 32a outside the polishing region 41, and the inside 42 of the chamfer surface of the work surface comes into contact with the step, and the contact portion is polished and the work is performed. A step occurs on the surface of W.

On the other hand, in the present invention, the inner peripheral polishing surface 3 formed in a spherical or conical concave shape is used.
5 so that the chamfer surface of the work W is brought into contact with the inner peripheral polishing surface 35 so as to cross the inclined surface 5, and a part of the work W is overhanged so as to be separated from the inner peripheral polishing surface 35 so as not to come into contact with the same. , Work W and inner peripheral polishing surface 35
Since the polishing process is performed by relative sliding with the polishing pad, it is possible to prevent the polishing surface from coming into contact with an inner portion of the chamfer surface due to a step of the polishing pad. This allows
Even if a large number of works are polished using the polishing pad 32 continuously, each work can be processed with desired accuracy.

The present invention is not limited to the above embodiment, but can be variously modified without departing from the gist thereof. For example, the illustrated polishing apparatus applies the present invention to lap or polish a chamfer surface of a work by interposing a polishing liquid between the polishing pad 32 and the work W. It can also be applied to the case of grinding a workpiece. In the polishing apparatus shown in FIG. 1, the work holding table 11 is disposed below the polishing table 25, but the vertical relationship may be reversed.

[0039]

According to the present invention, since the workpiece is brought into contact with the polishing surface so as to cross the inner peripheral polishing surface provided on the polishing ring, the polishing surface can come into contact with the inner portion of the chamfer surface. In addition, a step is prevented from being formed on the surface of the work, and a high-quality work can be processed with high yield. Further, even if a large number of workpieces are processed without replacing the polishing ring, the polishing quality does not decrease and the polishing efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a polishing apparatus for an outer periphery of a work according to an embodiment of the present invention.

FIG. 2A is a cross-sectional view showing a polishing ring in a state where a work is pressed, and FIG. 2B is a cross-sectional view taken along line BB in FIG. 2A.

FIG. 3A is a perspective view in which the polishing ring is turned upside down and extruded portions are exaggerated, and FIG.
It is a perspective view which shows the modification of an annular member, (C) is sectional drawing which shows the modification of a grinding ring.

FIG. 4A is a cross-sectional view showing a state where the chamfer surface is being polished by the polishing apparatus shown in FIG. 1;
(D) is a cross-sectional view showing a state in which polishing is performed by another processing method.

FIG. 5 is a sectional view showing a polishing ring as a comparative example.

[Explanation of symbols]

 11 Work Holder 12 Rotary Shaft 15 Motor 21 Pneumatic Cylinder 25 Polishing Table 26 Rotary Shaft 27 Polishing Ring 31 Annular Member 32 Polishing Pad 33 Small Diameter Portion 34 Large Diameter Portion 35 Inner Peripheral Polishing Surface 36, 37 Retreating Part 38 Recess W Work (Semiconductor) Wafer) Overhang (overhang) Wb Overhang (overhang)

Claims (8)

[Claims] 1. A polishing method for an outer periphery of a workpiece, wherein a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece is polished, the inner peripheral polishing being formed to be inclined between a small diameter portion and a large diameter portion. On the inner peripheral polishing surface of the polishing ring having a surface, the polishing center axis is set so that a portion of the chamfer surface, which is substantially 180 ° out of phase from the center of the work, protrudes from the small diameter portion and the large diameter portion. A method for polishing the outer periphery of a work, wherein the work and the polishing ring are relatively rotated by pressing the chamfer surface while being inclined with respect to the center axis of the work. 2. A polishing method for polishing an outer periphery of a workpiece, which is configured to polish a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece, wherein an inner peripheral polishing formed to be inclined between a small diameter portion and a large diameter portion. A grinding ring having a surface is rotated about a grinding central axis, and a work center axis is formed such that a portion of the chamfer surface, which is out of phase with the center of the work by approximately 180 °, protrudes from the small diameter portion and the large diameter portion. Polishing the outer periphery of the workpiece while pressing the chamfer surface against the inner peripheral polishing surface in a state where the workpiece is inclined with respect to the polishing center axis. 3. A polishing method of a workpiece outer periphery for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece, wherein an inner peripheral polishing formed to be inclined between a small diameter portion and a large diameter portion. On the inner peripheral polishing surface of the polishing ring having a surface, the polishing center axis is set so that a portion of the chamfer surface, which is substantially 180 ° out of phase from the center of the work, protrudes from the small diameter portion and the large diameter portion. Pressing the chamfer surface inclining with respect to the work center axis, relatively rotating the work and the polishing ring, so that the polishing center axis and the work center axis relatively swing motion. A method for polishing the outer periphery of a work, characterized in that at least one of the polishing ring and the work is reciprocally oscillated. 4. A polishing method of a workpiece outer periphery for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped work, wherein an inner peripheral polishing formed to be inclined between a small diameter portion and a large diameter portion. On the inner peripheral polishing surface of the polishing ring having a surface, the polishing center axis is inclined with respect to the work center axis, and under the state where the chamfer surface is pressed, the work and the polishing ring are relatively moved. Rotating, the entire circumference polishing process in a state where the entire chamfer surface is in contact with the inner peripheral polishing surface, and the portion of the chamfer surface that is substantially 180 ° out of phase with respect to the center of the work with the small diameter portion. A method of polishing the outer periphery of a work, comprising performing overhang polishing in a state of protruding from the large diameter portion. 5. An apparatus for polishing an outer periphery of a workpiece for polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece, the inner peripheral polishing being formed to be inclined between a small diameter portion and a large diameter portion. A polishing ring having a surface, and a workpiece central axis with respect to the polishing central axis such that a portion of the chamfer surface, which is substantially 180 ° out of phase from the center of the workpiece, protrudes from the small diameter portion and the large diameter portion. A workpiece holder for holding the workpiece by tilting the workpiece, and rotating means for relatively rotating the workpiece and the polishing ring while pressing the chamfer surface against the inner peripheral polishing surface. Peripheral polishing device. 6. A polishing apparatus for polishing an outer periphery of a workpiece formed by polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece, wherein an inner peripheral polishing is formed so as to be inclined between a small diameter portion and a large diameter portion. A polishing ring having a surface; a polishing ring rotating means for rotating the polishing ring; and a portion of the chamfer surface, which is substantially 180 ° out of phase with respect to the center of the work, protrudes from the small diameter portion and the large diameter portion. A work holder for holding the work by tilting the work center axis with respect to the polishing center axis, and a work rotating means for rotating the work while pressing the chamfer surface against the inner peripheral polishing surface. A polishing device for the outer periphery of a work, characterized by the following. 7. A polishing apparatus for polishing an outer periphery of a workpiece formed by polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece, wherein an inner peripheral polishing formed to be inclined between a small diameter portion and a large diameter portion. A polishing ring having a surface, and a workpiece central axis with respect to the polishing central axis such that a portion of the chamfer surface, which is substantially 180 ° out of phase from the center of the workpiece, protrudes from the small diameter portion and the large diameter portion. A workpiece holder for holding the workpiece by tilting the workpiece, rotating means for relatively rotating the workpiece and the polishing ring while pressing the chamfer surface against the inner peripheral polishing surface, the polishing center axis and the workpiece A polishing means for oscillating at least one of the polishing ring and the work so as to reciprocate at least one of the work such that the center axis relatively swings with respect to the center axis. . 8. A polishing apparatus for polishing an outer periphery of a workpiece formed by polishing a chamfer surface formed on an outer peripheral portion of a disk-shaped workpiece, wherein an inner peripheral polishing formed to be inclined between a small diameter portion and a large diameter portion. A polishing ring having a surface, a work holder for holding the work in a state in which a polishing center axis is inclined with respect to the work center axis and the chamfer surface is pressed against the inner peripheral polishing surface; and Rotating means for relatively rotating the polishing ring; and reciprocating swinging movement of the polishing center axis or the work center axis so that the entire periphery of the chamfer surface is in contact with the inner peripheral polishing surface. And a swinging means for performing an overhang polishing process in a state in which a portion of the chamfer surface, which is substantially 180 ° out of phase from the center of the work, protrudes from the small-diameter portion and the large-diameter portion. To have Characteristic polishing equipment for the outer periphery of the work.