JP2002134534A - Method for encapsulating semiconductor component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten a time needed for filling a resin into a cavity between a substrate and a flip chip packaged semiconductor component and a time needed for encapsulation. SOLUTION: A semiconductor component encapsulating method comprises following steps: (a) a step of applying a resin 3b on the circumference of the semiconductor component using a dispenser; (b) a step of hardening the resin by raising the temperature of the substrate or the semiconductor component 1 to the curing temperature of the resin 3, wherein the viscosity of the resin 3 may drop rapidly when the resin is curing so that the resin 3 is impregnated into the cavity; (c) a step wherein the air in the space surrounded with the resin 3 expands with heat and may escape from an air vent hole 3a, so that the resin 3 can spread over the whole space under the semiconductor component 1, an under fill is formed and the semiconductor component 1 is encapsulated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for encapsulating a semiconductor component, and more particularly, to a method for encapsulating a semiconductor component in which a gap between a flip-chip mounted semiconductor component and a substrate is filled with a resin to form an underfill. About the method.

[0002]

2. Description of the Related Art As a conventional technique relating to semiconductor component encapsulation, a semiconductor encapsulation method in which a liquid resin is injected between a semiconductor component and a substrate by utilizing a capillary phenomenon is described in, for example, "Electronic Materials", January 1997, 129.

Further, bare chip LSIs for printed wiring boards
A hole for venting air is provided in a part of the mounting surface, and when filling the underfill, air remaining in the gap between the printed wiring board and the bare chip LSI is sucked out and removed, so that the bonding strength is high and sufficient heat Chip LS that provides buffering effect
Japanese Unexamined Patent Application Publication No. 10-261661 discloses an underfill filling method for easily manufacturing an I-mounted printed wiring board.

Further, when filling the gap between the flip-chip mounted semiconductor chip and the wiring board with resin, a resin injection through hole is provided at a predetermined position of the wiring board, and the resin injection through hole is provided in the resin injection through hole. Japanese Patent Laid-Open No. 10-2 discloses a method for manufacturing a semiconductor package in which a resin supply nozzle is inserted to fill a gap between a semiconductor chip and a wiring board with a resin by a resin injection pressure, thereby shortening a required filling time.
No. 70477.

FIG. 9 is a view schematically showing a conventional method of underfilling a semiconductor component. The bumps 12 provided on the semiconductor component 11 are connected to the electrodes provided on the substrate 14 (flip chip bonding), and the resin 13 is discharged by a dispenser 15 into the gap between the semiconductor component 11 and the substrate 14. The resin 13 is applied by moving along the outer periphery.

FIG. 10 shows that the resin 13 applied around the semiconductor component 11 using the coating method shown in FIG.
FIG. 3 is a diagram showing a state of permeation into a gap between a substrate 1 and a substrate 14 over time. In the conventional sealing method, (A) the semiconductor component 1
The resin 13 is applied to one or two sides around 1 and (B) the applied resin 13 is applied to the semiconductor component 11 by capillary action.
(C) Resin 13 is applied to semiconductor component 11
After completely penetrating the lower gap, the temperature is raised to the curing temperature of the resin to cure the resin 13 and form an underfill.

[0007]

SUMMARY OF THE INVENTION A CSP (Chip Size Pa)
ckage) and Grid like BGA (Ball Grid Array)
In mounting Array type semiconductor components on a substrate or flip chip mounting a semiconductor chip, the chip, CSP,
The connection between the BGA and the substrate is connected via bumps on the semiconductor chip. At this time, to ensure the reliability of the connection,
It is necessary to interpose an underfill around the bump,
In particular, it is essential for flip chip mounting.

A general method of injecting the underfill is a supply method using a dispenser. By supplying the resin from a nozzle around the component, the resin penetrates by a capillary phenomenon and is sealed. The problem with such a conventional method is that it takes a long time until the semiconductor chip is completely sealed. After applying the resin, a waiting time is required until it permeates the entire lower surface of the semiconductor chip, and the resin is applied again after the applied resin no longer permeates, so the application time and the resin penetration time are required It has become.

Therefore, according to the present invention, a resin is filled in a gap between a flip-chip mounted semiconductor component and a substrate,
An object of the present invention is to provide a semiconductor component sealing method capable of shortening a time required for sealing a semiconductor component.

Further, the present invention smoothes out air from inside the gap in the process of resin infiltration into the gap between the semiconductor component on which flip-chip mounting has been performed and the substrate, and prevents the generation of voids in the underfill. The purpose is to do.

Another object of the present invention is to prevent the generation of voids in the underfill due to a shortage of resin when the resin is allowed to penetrate into the gap under the semiconductor component and is cured.

Further, the present invention provides a method for mounting a semiconductor component on a substrate and applying the resin to the periphery of the semiconductor component so that the resin does not spread to the periphery and spreads efficiently into the joint. Aim.

Another object of the present invention is to heat a substrate or a semiconductor component by using a simple heating means, so that the resin penetrates into a gap under the semiconductor component in a short time and is cured.

[0014]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a first technical means thereof is a semiconductor component sealing method for mounting a semiconductor component on a substrate via a bump. In the stopping method, a resin is applied around the semiconductor component, and then heated to a temperature at which the resin cures, whereby the resin is permeated into a gap between the semiconductor component and the substrate and sealed. I do.

According to a second technical means of the present invention, in the semiconductor component sealing method of the first technical means, an air vent hole is provided for connecting a gap surrounded by the resin and the outside of the semiconductor component.

According to a third technical means, in the semiconductor component sealing method of the first technical means, the bumps of the semiconductor component have a row arrangement structure.

A fourth technical means is the semiconductor component sealing method according to the first technical means, wherein the bump of the semiconductor component is connected to a center of the semiconductor component. It is characterized in that there is one or more rows of regions where there is no bump between the outer periphery and the outer periphery.

The fifth technical means is the semiconductor component sealing method according to the first technical means, wherein the method of heating the resin is as follows.
It is characterized in that the resin is heated at the time of application of the resin, and after the penetration into the gap is completed, is further heated to a curing temperature to be cured.

According to a sixth technical means, in the semiconductor component sealing method of the second technical means, the amount of resin applied around the air vent hole is increased as compared with other parts.

According to a seventh technical means, in the semiconductor component sealing method according to the second technical means, the air vent hole is provided on an extension of the bumps of the row arrangement structure in the row direction.

According to an eighth technical means, in the semiconductor component sealing method of the first technical means, the substrate is provided with an enclosure around the semiconductor component mounting position.

A ninth technical means is the semiconductor component sealing method according to the eighth technical means, characterized in that the enclosure is formed of metal.

According to a tenth technical means, in the semiconductor component sealing method of the first technical means, the resin heating method heats only the semiconductor component.

According to an eleventh technical means, in the semiconductor component sealing method of the first technical means, the method of heating the resin heats only the substrate at the semiconductor component mounting position.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a method for injecting a resin into a gap between a flip-chip mounted semiconductor component and a substrate to form an underfill and to seal the resin. Is used to inject the resin. A resin necessary for sealing is applied beforehand around the semiconductor component, and after the application is completed, the substrate or the semiconductor component is heated to a temperature at which it hardens. This heating causes the viscosity of the resin to drop sharply,
The resin permeates into the gap between the semiconductor component and the substrate. Along with this, the cavity below the semiconductor component escapes to the periphery, and finally the resin covers all the connection parts of the semiconductor component and is sealed. A feature of the semiconductor component sealing method of the present invention is that it is not necessary to wait until the resin permeates the entire surface of the gap, and the resin can be cured in a short time. Further, since it is not necessary to heat the substrate for the purpose of infiltrating the resin into the gap, it can be realized with a simpler apparatus.

An embodiment of the present invention will be described below with reference to an embodiment shown in FIGS. (First Embodiment) FIG. 1 is a view showing a semiconductor component sealing method according to a first embodiment of the present invention, and corresponds to the first aspect of the present invention. The state in which the resin 3 applied around the semiconductor component 1 permeates into the gap between the semiconductor component 1 and the substrate is shown with time. The semiconductor component sealing method of the first embodiment is as follows.
It comprises the following steps. (A) The resin 3 is applied around the semiconductor component 1 by a dispenser 15 as shown in FIG. (B) The substrate or the semiconductor component is heated up to the curing temperature of the resin 3 to cure the resin. At this time, there is no need to wait for the applied resin 3 to penetrate into the cavity below the semiconductor component 1 by capillary action. Then, at the time of curing, the viscosity of the resin 3 sharply decreases, and the resin 3 permeates into the gap. (C) Since the air surrounded by the resin 3 in the gap expands due to heat, the air expands outside and escapes, and the resin 3 spreads over the entire gap under the semiconductor component 1 to form an underfill. Is done.

The advantage of the semiconductor component sealing method of the first embodiment is that it is not necessary to wait for a long time for the resin 3 to penetrate under the semiconductor component 1, so that the semiconductor component can be sealed in a short time. Becomes possible. In addition, in the conventional sealing method, when applying the resin, it is necessary to heat the substrate to reduce the viscosity of the resin, but in the sealing method of the present invention, heating only for penetrating the resin is unnecessary, The process is simplified and sealing can be performed at low cost. At this time, if the resin is applied by heating the substrate, the resin can be sealed in a shorter time because the viscosity of the resin is reduced.

(Second Embodiment) FIG. 2 is a view showing a semiconductor component sealing method of a second embodiment, and corresponds to the second aspect of the present invention. In the semiconductor component sealing method of the second embodiment, when the resin 3 is applied around the semiconductor component 1 by the dispenser 15,
At least one or more air vent holes 3a are provided in advance. In the first embodiment, the resin 3 permeates into the gap below the semiconductor component 1 due to the decrease in viscosity during heating. At this time, the air in the gap surrounded by the resin 3 tends to spread to the outer periphery due to expansion by heating, but by providing the air vent hole 3a, the direction in which the air is to spread is determined as shown in FIG. Accordingly, the resin 3 can also be easily spread and spread, and the resin can be sealed with less occurrence of voids.

(Third Embodiment) Resin 3 in First Embodiment
The problem with the penetration of air and the escape of air in the gap is the arrangement of the bumps 2 provided on the semiconductor component 1. Since a large number of bumps 2 exist in the gap, the resin 3 around the bumps 2 is hard to move due to the close contact with the bumps. Therefore, if a portion in the gap is surrounded by the bump, it is difficult to secure an escape route for air, and the resin 3 remains as a void when the resin 3 is cured. Third
In the embodiment, by arranging the bumps in a line in the column direction as shown in FIGS. 1 and 2, it is possible to intentionally secure a passage for air and secure sealing by a good underfill without voids. Is done.

(Fourth Embodiment) FIGS. 3 and 4 show a semiconductor component sealing method according to a fourth embodiment, and show a bump arrangement according to the fourth aspect of the present invention. The fourth embodiment is characterized in that the air passages 2a and 2b are secured during the arrangement of the bumps, leaving ample room for the air to escape. FIG. 3 shows an example in which a region in which one or more line-shaped bump rows do not exist is provided.
a is formed, and a passage for air from a portion in the gap to the periphery can be secured. FIG. 4 shows an air passage 2
This is an example in which a region without a bump, which is b, is provided from the center of the gap to the periphery of the semiconductor component 1. Such spaces as the air passages 2a and 2b can be realized irrespective of the arrangement of the bumps, and the fourth embodiment can be considered as one of the specific examples.

(Fifth Embodiment) In the first embodiment, a resin is applied around the semiconductor component 1. In the fifth embodiment, the substrate is heated when the resin is applied. By doing so, the viscosity of the resin on the substrate is reduced, and the wettability of the resin is improved. Therefore, sealing can be performed in a shorter time than in the sealing method of the first embodiment.

(Sixth Embodiment) FIG. 5 is a view showing a semiconductor component sealing method according to a sixth embodiment, and corresponds to the sixth aspect of the present invention. When the resin 3 penetrates into the gap, the region of the air vent hole 3a of the applied resin is sealed last, so that a sufficient amount of resin is required. Therefore, by applying a large amount of resin around the air vent hole 3a, it is possible to prevent the occurrence of voids in the underfill due to insufficient application of the resin.

(Seventh Embodiment) FIG. 6 is a view showing a semiconductor component sealing method according to a seventh embodiment, and corresponds to the seventh aspect of the present invention. By combining the semiconductor component sealing methods of the second and third embodiments, the resin can be efficiently sealed. That is, the air vent hole 3a is formed at the position of the resin in the row direction of the bumps 2 forming the row arrangement structure. Since it is difficult for air to escape in the direction in which the bumps are present, by providing the air escape path 2a in the direction in which the bumps are not provided, sealing in a voidless manner is realized.

(Eighth Embodiment) FIG. 7 is a view showing a semiconductor component sealing method according to an eighth embodiment, and corresponds to the eighth aspect of the present invention. When the semiconductor component is mounted on the substrate 4 and the resin 3 is applied, the wet spread of the resin when the resin is applied is determined based on the wettability of the resin 3 with the semiconductor component 1 and the substrate 4. In the semiconductor component sealing method according to the eighth embodiment, a sufficient amount of the resin 3 needs to be supplied to the periphery of the semiconductor component 1 because the resin is sealed only by applying the resin 3 to the periphery of the semiconductor component 1. Therefore, it spreads greatly on the substrate 4 and spreads.
There is a possibility that a situation may occur in which interference occurs with other adjacent components. 8th
In the embodiment, the substrate 4 around the area where the semiconductor component 1 is mounted
Is provided, and an application area of the resin 3 is determined. By doing so, it is possible to prevent the spread of the resin when the resin is applied, and to allow the resin to efficiently penetrate under the semiconductor component.

(Ninth Embodiment) FIG. 8 is a view showing a semiconductor component sealing method according to a ninth embodiment, and corresponds to the ninth embodiment. In the enclosure 5 of the eighth embodiment, when printing the solder on the substrate 4, there is a problem that unevenness is generated on the substrate 4, making it difficult to print the solder. As a solution to this, an electrode 6 made of a material that is wetted by solder is formed at the position of the enclosure 5, and the solder 7 is printed and reflowed on the electrode 6 to form an enclosure made of solder. And the spread of wetness when the resin is applied can be suppressed. Specifically, as the material of the electrode 6 at this time, gold, copper,
A feature is that nickel, platinum, and the like are present on the surface layer.
In the case of gold, a multi-layer structure such as nickel / aluminum may be used as a base metal, and in the case of copper, solder pre-coating or pre-flux may be used to prevent oxidation.

(Tenth Embodiment) In the method of heating a substrate in the first embodiment, the entire substrate is heated. However, components mounted on the substrate include components that are sensitive to heat. Such components are not usually soldered in the reflow process, but utilize the flow process. In the tenth embodiment corresponding to the tenth aspect, in order to avoid such deterioration of the parts, only the semiconductor parts for sealing the resin are heated so that no thermal shock is given to other parts. You can do so. Specific methods include direct heating with a contact heater, local hot air from the component direction, an infrared heater, microwave heating, and the like.

(Eleventh Embodiment) The tenth embodiment is an example having a feature in heating components, but the eleventh embodiment corresponding to the eleventh aspect of the present invention is directed to locally heating a substrate. Features. By installing a heater below the semiconductor component mounting position of the stage holding the substrate, it is possible to easily locally heat the substrate portion corresponding to the semiconductor component mounting position.

[0038]

As is apparent from the above description, the present invention has the following effects. According to the first aspect of the present invention, the resin is applied only to the periphery without applying to the entire gap under the semiconductor component, so that the time for the step of sealing the semiconductor component can be reduced. In addition, since it is not necessary to heat only for applying the resin, the semiconductor component sealing method can be performed with a cheaper apparatus.

According to the second aspect of the present invention, by providing an air vent hole in the resin, the air vent path can be set in advance, and the semiconductor component can be reliably sealed by a good underfill without voids. Can be stopped.

According to the third aspect of the present invention, by arranging the bump arrangement in one direction, it is possible to facilitate air bleeding when the resin penetrates into the gap under the semiconductor component, and it is possible to eliminate voids in a favorable manner. The semiconductor component can be reliably sealed by the underfill.

According to the fourth aspect of the present invention, by providing an area not surrounded by bumps in the gap, it is possible to secure an air passage when the resin permeates the gap under the semiconductor component. The semiconductor component can be reliably sealed by a good underfill without the problem.

According to the fifth aspect of the present invention, by heating at the time of applying the resin, the viscosity of the resin is reduced, and
Semiconductor components can be sealed.

According to the invention of claim 6, by applying a large amount of resin around the air vent hole, it is possible to prevent the occurrence of voids in the underfill due to insufficient resin.

According to the seventh aspect of the present invention, the air can efficiently escape to the outside by providing the air vent holes provided in the resin applied around the semiconductor component in the same direction as the arrangement of the bumps.

According to the eighth aspect of the present invention, by providing an enclosure around the semiconductor component mounting position of the substrate, the resin does not spread to the periphery and spreads efficiently to the joint.

According to the ninth aspect, the enclosure can be formed without restricting the solder printing. Also,
The enclosure can be provided by a simple process.

According to the tenth aspect of the present invention, by heating the semiconductor component, the resin can be permeated into the gap below the semiconductor component and cured without causing other components to be thermally damaged.

According to the eleventh aspect, the resin can be permeated into the gap below the semiconductor component and cured by a simpler heating method.

[Brief description of the drawings]

FIG. 1 is a view showing a semiconductor component sealing method according to a first embodiment.

FIG. 2 is a view showing a semiconductor component sealing method according to a second embodiment.

FIG. 3 is a view showing a semiconductor component sealing method according to a fourth embodiment.

FIG. 4 is a view showing a semiconductor component sealing method according to a fourth embodiment.

FIG. 5 is a view showing a semiconductor component sealing method according to a sixth embodiment.

FIG. 6 is a view illustrating a semiconductor component sealing method according to a seventh embodiment.

FIG. 7 is a view showing a semiconductor component sealing method according to an eighth embodiment.

FIG. 8 is a view showing a semiconductor component sealing method according to a ninth embodiment.

FIG. 9 is a view showing a resin coating method of a conventional semiconductor component sealing method.

10 is a diagram showing a conventional semiconductor component sealing method using the resin coating method shown in FIG.

[Explanation of symbols]

1,11: semiconductor parts, 2,12: bumps, 2a, 2b
… Air vent, 3,13… resin, 3a… air vent,
4, 14: substrate, 5: enclosure, 6: electrode, 7: solder, 1
5 ... Dispenser.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshihiro Yoshida 1-3-6 Nakamagome, Ota-ku, Tokyo Stock inside Ricoh Company (72) Inventor Tsukasa Sazu 1-3-6 Nakamagome, Ota-ku, Tokyo Stock Ricoh Co., Ltd. (72) Inventor Satoshi Kuwasaki 1-3-6 Nakamagome, Ota-ku, Tokyo F-term in Ricoh Co., Ltd. 5F044 LL11 QQ02 RR19 5F061 AA01 BA03 CA05 CB13

Claims (11)

[Claims] In a semiconductor component sealing method for mounting a semiconductor component on a substrate via bumps, a resin is applied to the periphery of the semiconductor component, and then heated to a temperature at which the resin cures, whereby the semiconductor component is heated. And sealing the resin by penetrating the resin into a gap between the substrate and the substrate. 2. The semiconductor component sealing method according to claim 1, further comprising: providing an air vent hole connecting a void surrounded by the resin and the outside of the semiconductor component. 3. The semiconductor component sealing method according to claim 1, wherein the bumps of the semiconductor component have a row arrangement structure. 4. The semiconductor component sealing method according to claim 1, wherein the bumps of the semiconductor component have at least one row of regions without bumps between a central portion and an outer peripheral portion of the semiconductor component. Semiconductor component sealing method. 5. The method for sealing a semiconductor component according to claim 1, wherein in the method of heating the resin, the resin is heated at the time of applying the resin, and after the penetration into the gap is completed, the resin is further heated to a curing temperature to be cured. A semiconductor component sealing method characterized by the above-mentioned. 6. The semiconductor component sealing method according to claim 2, wherein the amount of resin applied around the air vent hole is increased as compared with other portions. 7. The semiconductor component sealing method according to claim 2, wherein the air vent hole is provided on an extension of the bumps of the row arrangement structure in the row direction. 8. The semiconductor component sealing method according to claim 1, wherein the substrate is provided with an enclosure around the semiconductor component mounting position. 9. The method according to claim 8, wherein the enclosure is formed of a metal. 10. The semiconductor component sealing method according to claim 1, wherein said resin heating method heats only said semiconductor component. 11. The semiconductor component sealing method according to claim 1, wherein said resin heating method heats only a substrate at a semiconductor component mounting position.