JP2002134359A - Electronic component case and electronic component using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize compactness, low cost, reduction in external dimensions, improvement in packaging density, and prevention of packaging defects. SOLUTION: An anode conductor layer 21 and a cathode conductor layer 22 are formed in the front surface of a printed wiring board 20, and an anode terminal 23 and a cathode terminal 24 are formed in the rear surface. The anode conductor layer 21 and the anode terminal 23, and the cathode conductor layer 22 and the cathode terminal 24 are connected electrically via through- connection holes 16, 16. A mounting part 28 of a lead frame is electrically connected to the anode conductor layer 21 through resistance welding. An anode lead 2 of a capacitor element 3 is electrically connected to the mounting part 28 by resistance welding, and a cathode layer 4 is connected onto the cathode conductor layer 22 by a conductive adhesive 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element mounting portion for mounting an element, a terminal mounting portion which stands on the element mounting portion and mounts one terminal of the element, The present invention relates to an electronic component case having a plurality of terminals provided on a back surface of a mounting portion and electrically connected to a plurality of terminal portions of the element, respectively, and an electronic component using the same.

[0002]

2. Description of the Related Art For example, in a chip type capacitor incorporated in an electronic device such as a cellular phone or a personal computer, an anode lead wire is led out from a side end surface of a columnar element, and a cathode layer is formed on an outer peripheral portion. Have been. The base on which this element is mounted is formed by an element mounting part on which the element is mounted, and a lead wire mounting part that stands on the element mounting part and mounts the anode lead wire, An anode terminal and a cathode terminal are provided on the back surface of the unit and electrically connected to the anode lead wire and the cathode layer, respectively.

FIG. 10 is a sectional view of a conventional chip type capacitor, which will be described with reference to FIG. A chip-shaped tantalum solid electrolytic capacitor denoted by reference numeral 1 as a whole is a prismatic capacitor element 3 made of a tantalum sintered body having an anode lead wire 2 led out from one end face;
It comprises a cathode terminal 5 connected to the cathode layer 4 on the outer periphery of the capacitor element 3 and an anode terminal 6 connected to the anode lead wire 2.

[0004] The capacitor element 3 is obtained by molding a fine powder made of tantalum in which one end of an anode lead wire 2 made of tantalum or the like is embedded in advance by using a pressing mold to form a pressed compact 9 (raw pellet). The raw pellets are manufactured by heating and sintering in a vacuum. Thereafter, a dielectric film layer is formed on the entire surface of the tantalum sintered body, and a solid electrolyte layer and a cathode layer 4 are sequentially formed thereon, whereby the capacitor element 3 is manufactured. Next, the anode terminal 6 is connected to the anode lead wire 2 by resistance welding or the like, and the cathode terminal 5 is connected to the cathode layer 4 by a conductive adhesive 7.

[0005] Thereafter, a part of the anode terminal 4 including a connection portion between the capacitor element 3 and the anode lead wire 2 and a connection portion between the cathode terminal 5 and the cathode layer 4 are formed of an outer covering made of insulating resin (resin outer covering). 8). Anode terminal 6
And the cathode terminal 5 are drawn out from the mutually facing side surfaces of the exterior 8 and bent downward, and further, the tip is bent toward the lower surface side of the exterior 8 to manufacture the chip-type tantalum solid electrolytic capacitor 1. You.

The chip type tantalum solid electrolytic capacitor 1 manufactured as described above is mounted on a motherboard 40 as shown in FIG. That is, on the land portions 44a and 44b provided on the surface of the motherboard 40,
The anode terminal 6 and the cathode terminal 5 of the tantalum solid electrolytic capacitor 1 are mounted, and the anode terminal 6 and the cathode terminal 5 are electrically connected to the lands 44a and 44b via the solders 43a and 43b.

[0007]

However, in the conventional chip type tantalum solid electrolytic capacitor 1 described above, since the press-formed body 9 is formed by the press-forming die, there is naturally a limit in forming the compact compact body. In addition, there is a problem that an expensive press-molding die cannot be used to form an inexpensive mold. Further, as shown in FIG. 10, the above-mentioned conventional chip-type tantalum solid electrolytic capacitor 1 is covered with an exterior 8 to protect a connection point A between the anode lead wire 2 and the anode terminal 6, and the anode terminal 6 is Once pulled out from the side surface of the exterior 8, it is bent to the lower surface side. For this reason, the length L1 of the connection portion A becomes long, and when the external dimensions of the chip-type tantalum solid electrolytic capacitor 1 are restricted, the dimension L2 of the capacitor element 3 is secured in order to secure the connection portion A in the exterior 8. Must be reduced accordingly. Therefore, there is a problem that the ratio of the volume of the capacitor element 3 to the exterior 8 (hereinafter, referred to as volume efficiency) is low, and it is difficult to increase the capacitance as compared with the external dimensions.

As shown in FIG. 11A, in the above-mentioned conventional chip-type tantalum solid electrolytic capacitor 1, a part of each of the anode terminal 6 and the cathode terminal 5 is bent, and the bent portion 6a , 5a are also provided on both end surfaces of the chip type tantalum solid electrolytic capacitor 1. Therefore, since the solders 43a and 43b also adhere to these bent portions 6a and 6b,
Land portions 44a and 44b need to be extended outside both end surfaces of the chip type tantalum solid electrolytic capacitor 1.
For this reason, the length L4 for mounting the chip-type tantalum solid electrolytic capacitor 1 on the motherboard 40 must be larger than the entire length of the chip-type tantalum solid electrolytic capacitor 1, so that the mounting area increases and the mounting density increases. There is also a problem that is reduced.

Further, as shown in FIG. 1B, the anode terminal 6 and the cathode terminal 5 are displaced with respect to the land portions 44a and 44b, and the chip type capacitor 1 is moved
0, the left and right lands 44a, 44
The amount of the solder 43a applied on the “b” becomes larger than the amount of the solder 43b. Therefore, the adhesive force of one solder 43a is larger than the adhesive force of the other solder 43b, and the chip-type capacitor 1 is easily rotated counterclockwise in the drawing due to the different adhesive force. Therefore, as shown by a two-dot chain line in the figure, the other end of the chip-type capacitor 1 rises from the motherboard 40, that is, a so-called Manhattan phenomenon is caused, and there is a problem that a mounting failure occurs.

The present invention has been made in view of the above-mentioned conventional problems, and a first object is to reduce the size and to reduce the cost. A second object is to reduce the external dimensions while keeping the capacitance the same. A third object is to improve the mounting density. A fourth object is to prevent mounting defects.

[0011]

In order to achieve the above object, according to the first aspect of the present invention, there is provided an element mounting portion for mounting a component element, and a plurality of component elements installed upright on the element mounting portion. A terminal mounting portion for mounting at least one of the terminal portions;
In an electronic component case having a plurality of terminals provided on a back surface of the element mounting portion and electrically connected to a plurality of terminal portions of the component element, the element mounting portion is formed by an insulating plate, A lead frame is provided on the surface of the insulating plate as the terminal mounting portion formed of a conductive material, and the rest of the plurality of terminal portions of the component element is electrically connected on the surface of the insulating plate. Providing a layer and a conductor layer to which the lead frame is electrically connected, respectively.
The conductor layer and the plurality of terminals are connected to each other through through-holes formed in the insulating plate. Therefore, the electronic component case is formed by the printed wiring board and the lead frame.

According to a second aspect of the present invention, a component element is mounted on the element mounting portion of the electronic component case according to the first aspect,
An electronic component in which the component element is covered with an exterior made of an insulating resin, wherein a terminal portion of the component element is provided on one side of a lead wire derived from a side end face of the component element and the other provided on an outer peripheral portion of the component element. A lead layer of one polarity is placed on the lead frame and electrically connected to the lead frame, and the other polarity layer is placed on a conductor layer on the insulating plate. And electrically connected to this conductor layer. Therefore, the terminal is not pulled out from the side surface of the exterior. Further, the lead wires and the terminals are electrically connected via a lead frame.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view for explaining a method of manufacturing a printed wiring board on which elements are mounted in an electronic component case according to the present invention. 2 and 3 are cross-sectional views for explaining a method of manufacturing an electronic component. FIG.
Is a plan view of the lead frame, and FIG. 5 is a plan view of the printed wiring board. FIG. 6 is an exploded perspective view for explaining a method of assembling the element and the lead frame to the printed wiring board. FIG. 7 is a perspective view showing the same assembled state. FIG. 8 is a side view for explaining a mounting area of an embodiment product formed according to the present invention. In these drawings, the same members or the equivalent members described in the related art shown in FIG. 10 described above are denoted by the same reference numerals, and the detailed description will be appropriately omitted.

In FIG. 1 (a), a double-sided copper-clad laminate denoted by reference numeral 11 is provided with copper foils 13, 13 attached to both sides of an insulating resin substrate 12. Note that the insulating resin substrate 12 may be a thermosetting resin or a thermoplastic resin. As shown in FIG. 1B, this double-sided copper-clad laminate 11
After drilling the through holes 14, 14 with a drill, a copper plating film 15 is formed on the copper foil 13 by performing panel plating with copper as shown in FIG. A copper plating film 15 is also formed on the hole wall, and through connection holes 16 are formed.

As shown in FIG. 1D, the upper surface terminal portions 17a and 17b and the lower surface terminal portions 18a and 18b are electrically connected to each other through the through connection hole 16 around the through connection hole 16 by etching. To form Next, as shown in FIG.
Fill. Thereafter, as shown in FIG. 2F, nickel / gold plating is performed on the upper surface terminal portions 17a and 17b and the lower surface terminal portions 18a and 18b, and the anode conductor layer 21, the cathode conductor layer 22, and the anode terminal 23 and the cathode terminal 24 are formed respectively, and the printed wiring board 20 is formed. Therefore, the upper and lower portions of the insulating resin 19 in the through connection hole 16 are closed by the anode conductor layer 21 and the anode terminal 23 and the cathode conductor layer 22 and the cathode terminal 24.

The printed wiring board 20 thus formed
As shown in FIG. 5 and FIG. 6, the whole is formed in a large format, and a large number (six for convenience in the figure) of elongated rectangular slits 25 are provided in two rows on the left and right at equal intervals in the vertical direction. ing. In the four regions D surrounded by the slits 25, the anode conductor layer 21 shown in FIG.
And cathode conductor layer 22, anode terminal 23 and cathode terminal 24
Are formed one by one.

4 and FIG.
Is a lead frame, which is formed in a frame shape by a conductive metal and has substantially the same outer shape as that of the printed wiring board 20. A large number (four for convenience in the figure) of mounting portions 28 projecting so as to be separated are provided. 5 and 6, by mounting the lead frame 27 on the printed wiring board 20, the mounting portion 28 of the lead frame 27 is connected to the anode conductor of the printed wiring board 20 as shown in FIG. Abuts on layer 21. By electrically connecting the mounting portion 28 and the anode conductor layer 21 by resistance welding and fixing the lead frame 27 on the printed wiring board 20, the capacitor element 3
Is formed in the electronic component case 30 on which is mounted.

As described above, since the electronic component case 30 is formed by mounting the lead frame 27 on the printed wiring board 20, not only the size can be reduced, but also the cost can be reduced. This allows the printed wiring board 20 in which the through-hole 16 is formed to be formed with high precision and small size, and does not require an expensive molding die as in the prior art, so that it can be formed at low cost. Because. Moreover, the flat lead frame 2
7 can be used, so that it can be formed inexpensively and precisely with a small size.

Next, as shown in FIG. 2B and FIG. 5, a predetermined lead frame 27 is formed on the anode conductor layer 21 of the printed wiring board 20 by a metal (Au, Ag, Cu, Sn,
Pb, Ni, etc.)-Containing paste, for example, solder paste or the like. Next, the capacitor element 3 is mounted on the printed wiring board by placing the anode lead wire 2 of the capacitor element 3 on the mounting portion 28 of the lead frame 27 and bringing the cathode layer 4 into contact with the cathode conductor layer 22. 20. By electrically connecting the anode lead wire 2 and the mounting portion 28 by resistance welding, the anode lead wire 2 and the anode conductor layer 21 are electrically connected via the mounting portion 28.
By electrically connecting the cathode layer 4 and the cathode conductor layer 22 via the conductive adhesive 7, as shown in FIG. 7, a large number (for convenience, four) of capacitor elements 3 are connected to the printed wiring board 20. Implemented above.

Next, the printed wiring board 20 is inserted into the slit 2
5 is inserted into a mold (not shown) having a large number of small projections projecting from the surface of the printed wiring board 20 and a frame-like frame, and the liquid resin is brought to a predetermined height in the frame. Is supplied and solidified to form the outer package 8. Here, the insides of the through connection holes 16, 16 of the printed wiring board 20 are filled with resins 19, 19.
9 is closed by the anode conductor layer 21 and the anode terminal 23 and the cathode conductor layer 22 and the cathode terminal 24.

Therefore, when the exterior 8 is formed, the liquid resin of the exterior 8 does not pass through the through-hole 16 to the back surface of the printed wiring board 20. Neither does it cover 23 or the cathode terminal 24 nor adhere to the back surface of the printed wiring board 20. For this reason, as will be described later, when this chip type capacitor 35 is mounted on the motherboard 40, it is possible to prevent the occurrence of conduction failure between the anode terminal 23 and the cathode terminal 24 and the land portions 41 a and 41 b of the motherboard 40. it can. In addition, as a method of forming the exterior 8, a cavity for loading the printed wiring board 20 is formed by using the above-described mold as a lower mold, and an upper mold that covers the lower mold, and the liquid resin is passed through the mold gate. An injection molding method of injecting into the cavity may be used.

Next, as shown in FIG. 3A and FIG. 5, the wafer is cut along line E by dicing, and FIG.
A large number of chip type capacitors 35 as electronic components shown in FIG. The total length B1 of the anode terminal 23 and the total length B of the cathode terminal 24 of the chip type capacitor 35 thus formed are described.
2 is formed so that the mounting area of the anode terminal 23 and the mounting area of the cathode terminal 24 are substantially the same. Also,
The anode terminal 23 and the cathode terminal 24 are positioned symmetrically with respect to the longitudinal center line C of the chip capacitor 35.

In this case, if it is attempted to manufacture the printed wiring board 20 on which the capacitor element 3 is mounted and the lead frame 27 using a molded product using a molding die, the molding die becomes large due to the manufacturing cost. And the number of chip-type capacitors 35 that can be manufactured by one molding is naturally limited. On the other hand, according to the method of manufacturing the chip-type capacitor 35 of the present invention described above, the printed wiring board 20 is used, and the anode lead wire 2 is mounted on the printed wiring board 20 to be mounted on the terminal mounting portion. By adopting a method in which the mounting portion 28 is manufactured by mounting the lead frame 27, the printed wiring board 20 and the lead frame 27 having large external dimensions can be adopted.

For this reason, one printed wiring board 20 and 1
Since a large number of chip capacitors 35 can be manufactured from one lead frame 27, productivity is improved. By the way, when a molded product is manufactured with a molding die,
The limit is to manufacture a substrate having an outer dimension of 70 mm × 90 mm, and about 1100 chip-type capacitors 35 are manufactured per one substrate. On the other hand, according to the present invention, the printed wiring board 20 and the lead frame 27 having the outer dimensions of 330 mm × 330 mm can be manufactured.
7, it was confirmed that about 18,000 chip-type capacitors 35 can be manufactured per sheet.

In the chip type capacitor 35 thus formed, the anode lead wire 2 and the anode terminal 23 are electrically connected through the through-hole 16 formed in the printed wiring board 20. Unlike the conventional case, the anode terminal 6 is not pulled out from the side surface of the exterior 8. Therefore, as shown in FIG. 3B, the lead wire 2 for the anode and the conductor layer 21 for the anode are connected to the lead frame 2 serving as the terminal mounting portion 28.
7, the length l1 of the connection point A is shortened, and the dimension l2 of the capacitor element 3 can be made larger than the external dimension of the chip-type capacitor 35. For this reason, the volume efficiency of the capacitor element 3 formed in the exterior 8 is increased, and the capacitance can be increased as compared with the external dimensions. In other words, when the ratings are the same, the product size can be reduced. Table 1
Is a comparison of product dimensions between the product of the present invention and a conventional product.

[0026]

[Table 1]

Further, since the anode lead wire 2 and the anode terminal 23 are electrically connected through the through connection hole 16, the connection between the anode lead wire 2 and the anode conductor layer 21 is formed by the exterior 8. The risk of connection failure or peeling due to expansion or shrinkage of the resin or the like generated during coating is reduced, and the yield is improved. In addition, since the anode lead wire 2 and the anode conductor layer 21 can be directly connected without the need to connect them by wires or the like, not only the number of steps is reduced, but also the manufacturing cost is reduced and the productivity is improved.

Further, the cathode layer 4 and the cathode terminal 24 are electrically connected through the through-hole 16 so that
A cathode terminal 24 is provided on a side surface of the chip type capacitor 35.
Is not exposed. Therefore, the anode terminal 23 and the cathode terminal 2
Reference numeral 4 denotes a structure provided only on the lower surface of the chip type capacitor 35. Also, the total length B1 of the anode terminal 23 and the cathode terminal 2
4 has the same overall length B2, and the surface area of the anode terminal 23 and the surface area of the cathode terminal 24 are the same. Further, similarly to the above-described first embodiment,
The anode terminal 23 and the cathode terminal 24 are positioned symmetrically with respect to the longitudinal center line C of the chip capacitor 35.

FIG. 8 is a side view for explaining the mounting area of the product according to the embodiment of the present invention. In the figure, as described above, the chip type capacitor 35 of the present invention is used.
Has a structure in which the anode terminal 23 and the cathode terminal 24 are provided only on the lower surface of the chip type capacitor 35. Therefore, the land portions 41a of the motherboard 40,
When the anode terminal 23 and the cathode terminal 24 are soldered to 41b, the solder 43 does not leak from both side surfaces of the chip type capacitor 35.

Therefore, the lengths B1 and B2 of the land portions 41a and 41b are determined by the anode terminal 23 and the cathode terminal 24.
Of the land portions 41a,
It is not necessary to expose and extend 41b from both end surfaces of the chip type capacitor 1 in the left-right direction. Therefore, the length 14 for mounting the chip-type capacitor 35 on the motherboard 40 can be formed to be the same as the entire length of the chip-type capacitor 35, so that the mounting area is minimized and the mounting density is improved. Table 2 is a comparison of the mounting area between the product of the present invention and the conventional product, and it was confirmed that the mounting area was reduced by 60% or more.

[0031]

[Table 2]

Further, even if the chip type capacitor 35 is mounted on the mother board 40 in a state where the anode terminal 23 and the cathode terminal 24 are displaced from the lands 41a and 41b, the solder is not applied to the chip type capacitor 35. No leakage from both sides. Therefore, since solder does not adhere to both side surfaces of the chip type capacitor 35, the Manhattan phenomenon can be prevented and the quality can be improved.

The surface area of the anode terminal 23 and the cathode terminal 2
4 have the same surface area, so that the anode terminal 23 and the cathode terminal 24 with respect to the land portions 41a and 41b are formed.
Therefore, the chip-type capacitor 35 is fixed in a stable state without tilting with respect to the motherboard 40. In addition, these anode terminals 2
3 and the cathode terminal 24 are positioned symmetrically with respect to the center line C in the longitudinal direction of the chip-type capacitor 35, so that the chip-type capacitor 35 is fixed to the motherboard 40 with an equal left and right adhesive force.

FIG. 9 is a sectional view of an electronic component according to a second embodiment of the present invention. In the second embodiment, an example of a transistor or a diode is shown as an electronic component. An emitter terminal portion 51 and a collector terminal portion 52 are provided to project from both end surfaces of a component element 50, respectively.
A base terminal portion 53 is provided on a part of the outer peripheral portion. On the upper surface of the printed wiring board 20, three conductor layers 55, 5
6, 57 are formed, and on the lower surface of the printed wiring board 20,
Three terminals 58, 59, 60 are formed. These three conductor layers 55, 56, 57 and three terminals 58, 5
9 and 60 are electrically connected to each other through through connection holes 16, 16, 16 formed in the printed wiring board 20.

The base terminal 53 of the component element 50 is placed on the conductor layer 57 of the printed wiring board 20 and electrically connected by the conductive adhesive 7 so that the base terminal 53 and the terminal 60 are connected. It is electrically connected through the through-hole 16. On the conductor layers 55, 56 of the printed wiring board 20, two mounting portions 28, 28 of the lead frame 27 are electrically connected via a solder paste (not shown). The emitter terminal portion 51 and the collector terminal portion 52 of the component element 50 are mounted on these two mounting portions 28 and 28, and are electrically connected by resistance welding. Therefore, the emitter terminal portion 51 and the collector terminal portion 52
Are electrically connected to the terminals 58 and 59 through the lead frame 27, the conductor layers 55 and 56, and the through connection holes 16 and 16. In the second embodiment, the same operation and effect as those in the first embodiment can be obtained.

The conductor layers 21, 22 and the terminals 23, 24 and the conductor layers 55, 56, 57 and the terminals 58, 59, 60 are electrically connected through the through connection holes 16, but are electrically connected through the non-through connection holes. You may connect. Terminals 23 and 24 and terminal 5
Although two and three examples of 8, 59, and 60 are shown, four or more may be used depending on the type of component element.

[0037]

As described above, according to the first aspect of the present invention, not only the size can be reduced, but also the cost can be reduced.

Further, according to the second aspect of the present invention, since the conductor layer and the terminal are electrically connected through the through-hole, the terminal is protruded from the side surface of the insulating plate. Therefore, the outer dimensions can be reduced. Further, when the electronic component is mounted on the motherboard, the solder does not adhere to both side surfaces of the electronic component, so that the Manhattan phenomenon can be prevented and the quality can be improved. Further, the mounting area is minimized, and the mounting density is improved. In addition, the possibility that a connection portion between the lead wire and the conductor layer causes connection failure or peeling due to expansion or contraction of a resin or the like generated when the resin is covered with the exterior is reduced, and the yield is improved. In addition, since the lead wire and the conductor layer can be directly connected without the need to connect with a wire or the like, not only the man-hour is reduced, but also the manufacturing cost is reduced and the productivity is improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining a method of manufacturing a printed wiring board on which elements are mounted in an electronic component case according to the present invention.

FIG. 2 is a cross-sectional view for explaining a method for manufacturing an electronic component case according to the present invention.

FIG. 3 is a cross-sectional view illustrating a method for manufacturing an electronic component according to the present invention.

FIG. 4 is a plan view of a lead frame in the electronic component case according to the present invention.

FIG. 5 is a plan view of a printed wiring board in the electronic component case according to the present invention.

FIG. 6 is an exploded perspective view for explaining a method of assembling an element and a lead frame to a printed wiring board in the electronic component according to the present invention.

FIG. 7 is a perspective view showing an assembled state of the electronic component according to the present invention.

FIG. 8 is a side view for explaining a mounting area of an embodiment product formed according to the present invention.

FIG. 9 is a cross-sectional view of an electronic component according to a second embodiment of the present invention.

FIG. 10 is a cross-sectional view of a conventional electronic component.

FIG. 11A is a side view for explaining a mounting area of a conventional electronic component, and FIG. 11B is a side view for explaining a Manhattan phenomenon in the conventional electronic component.

[Explanation of symbols]

12: insulating resin substrate, 16: through connection hole, 19: insulating resin, 20: printed wiring board, 21: conductor layer for anode, 22
... Cathode conductor layer, 23 ... Anode terminal, 24 ... Cathode terminal, 2
7 Lead frame, 28 Mounting section, 30 Electronic component case, 35 Capacitor chip, 40 Motherboard, 41a, 41b, 44a, 44b Land section, 43
a, 43b: solder, 51: emitter terminal, 52: collector terminal, 53: base terminal, 55, 56, 57
... conductor layers, 58, 59, 60 ... terminals.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01G 9/10 H01G 9/05 F

Claims (2)

[Claims] An element mounting portion on which the component element is mounted, a terminal mounting portion erected on the element mounting portion and mounting at least one of a plurality of terminal portions of the component element; In an electronic component case including a plurality of terminals provided on a back surface of an element mounting portion and electrically connected to a plurality of terminal portions of the component element, the element mounting portion is formed by an insulating plate. A lead frame as a terminal mounting portion formed of a conductive material on a surface of an insulating plate, and a conductor layer on the surface of the insulating plate to which the rest of the plurality of terminal portions of the component element is electrically connected And a conductor layer to which the lead frame is electrically connected, and the conductor layer and the plurality of terminals are respectively connected through through-holes formed in the insulating plate. . 2. An electronic component, comprising: a component element mounted on an element mounting portion of the electronic component case according to claim 1; and the component element covered with an exterior made of an insulating resin. Is composed of a lead wire of one polarity derived from the side end face of the component element and a layer of the other polarity provided on the outer peripheral portion of the component element, and the lead wire of one polarity is placed on the lead frame. An electronic component, wherein the electronic component is electrically connected to the lead frame, and the other polarity layer is mounted on a conductor layer on the insulating plate and electrically connected to the conductor layer.