JP2002124608A - Semiconductor cooling system for rolling stock - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor cooling system for a rolling stock which can be miniaturized, while ensuring cooling performance for cooling a semiconductor element. SOLUTION: The height of a heat dissipation fin 11 is increased at the center part of a cooling block 6, mounted with a semiconductor element 4 and is decreased at the end parts of the block 6, thereby ensuring cooling performance of the element 4. Also, semiconductor cooling units 8A through 8E are arranged, so as to face opposite each other with the higher part 12a of one unit 8A and the lower part 12b of another unit 8D facing opposite to each other. In this way, the distance between a pair of right and left sidewalls 3a and 3b of a cooling air duct 3 is narrowed, to decrease the width in the right and left direction as shown in the figure, of a semiconductor cooling system 10 for a rolling stock, and the distances in the vertical direction, as shown in the figure, between the respective units 8A through 8E can be made narrow. Thus, a semiconductor cooling system 30 can be miniaturized as a whole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device for a vehicle, and more particularly, to a cooling performance by arranging semiconductor cooling units having radiating fins having different heights according to their positions so as to face each other. The present invention relates to a semiconductor cooling device for a vehicle in which the overall size is reduced while ensuring the above.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element for power conversion has been used to control a driving motor for a railway vehicle or the like. However, in order to efficiently dissipate the heat generated by the semiconductor element to the outside, a semiconductor cooling element is used. The device is used.

The structure of such a semiconductor cooling device will be briefly described with reference to FIGS. 7 and 8. The cooling air 2 supplied from the blower 1 flows in the cooling air duct 3 flowing upward in the drawing at the left and right sides of the drawing. Are provided with a semiconductor element 4 for power conversion and auxiliary articles 5 such as a snubber circuit, a filter capacitor, and a gate amplifier.

On the surface 6a of the cooling block 6 on which the semiconductor element 4 is mounted, on the side of the cooling air duct 3, a number of rectangular plate-shaped radiating fins 7 extending parallel to the plane of the drawing are perpendicular to the plane of the drawing. The cooling air 2 is arranged so as to be parallel to each other with a gap in the direction, and the cooling air 2 flows between the gaps. The radiation fins 7 on the left and right sides protrude into the cooling air duct 3 so as to face each other, and the value of the height H protruding into the cooling air duct 3 from the surface 6a of the cooling block 6 is Is constant regardless of the part.

As a result, the heat generated by the semiconductor element 4 is transferred from the cooling block 6 to the radiating fins 7,
The heat is transferred from the radiation fins 7 to the cooling air 2 and is discharged to the outside air, whereby the semiconductor element 4 is cooled.

[0006]

By the way, as shown in FIG. 7, a semiconductor cooling unit 8 having a semiconductor element 4, an auxiliary article 5, a cooling block 6 and a radiating fin 7 is opposed to both left and right sides of a cooling air duct 3. In such a case, when the height H of the radiation fins 7 is increased, the value of the entire width L of the semiconductor cooling device 9 increases as shown in FIG. Accordingly, when such a semiconductor cooling device 9 is installed in a place where the space is limited, such as inside the locomotive K, not only is the restriction on outfitting large, but also the width W of the internal passage R is reduced. It becomes difficult to secure.

However, if the height H of the radiation fins 7 is reduced in order to secure the width W of the internal passage 11, the cooling performance is reduced. For this reason, it is necessary to secure the cooling performance by increasing the volume and velocity of the cooling air 2 generated by the blower 1. However, the size and size of the blower 1 are relatively large, and the vibration and noise are increased. And the radiation fins 7 are clogged.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a semiconductor cooling device for a vehicle which can be downsized while ensuring cooling performance.

[0009]

According to a first aspect of the present invention, there is provided a cooling unit having a cooling block on which a semiconductor element is mounted, wherein the cooling units are provided with radiating fins on a surface of the cooling block. Are arranged so as to face each other, the height of the radiating fins extending from the surface of the cooling block varies depending on the location of the cooling block, and the radiating fins of one of the semiconductor cooling units The semiconductor cooling units are arranged such that a portion where the height of the semiconductor cooling unit is high and a portion where the height of the radiation fin of the other semiconductor cooling unit is low face each other.

That is, according to the present invention, "the height of the radiating fins disposed on the surface of the cooling block does not need to be equal at all portions of the cooling block, and the height of the radiating fins is changed according to the portion of the cooling block. However, this does not impair the cooling performance of the semiconductor cooling unit. " Thereby, the height of the radiation fin arranged on the surface of the cooling block is made different depending on the portion of the cooling block, and the portion where the height of the radiation fin is high and the portion where the height of the radiation fin are low face each other. If the semiconductor cooling units are arranged as described above, while ensuring the cooling performance,
By bringing the cooling blocks closer to each other, the overall size of the semiconductor cooling device can be reduced. The radiating fins may have a structure in which rectangular plate-shaped fin members are arranged in parallel with each other with a predetermined gap therebetween, and cooling air flows through the gap between the radiating fins.

According to a second aspect of the present invention, in the first aspect, the height of the radiating fins is increased at the center of the cooling block, and the heat is radiated at the ends of the cooling block. The height of the fin is reduced.

That is, when the temperature of each part of the radiating fin disposed on the surface of the cooling block was measured, as shown by the isotherm T in FIG. 8, the radiating fin disposed at the end of the cooling block was obtained. Was found to be sufficiently lower than the tip temperature of the radiating fins arranged at the center of the cooling block. This is because, for example, in the case of a rectangular cooling block, the radiation fins located at the ends are more likely to contact the cooling air and have higher cooling efficiency, but the radiation fins located in the center are less likely to contact the cooling air and heat is trapped. It seems to be easy. Thus, the cooling performance of the semiconductor cooling unit can be ensured even if the height of the radiation fin is reduced at the end of the cooling block. Therefore, the height of the radiating fin is increased at the center of the cooling block, and the height of the radiating fin is reduced at the end of the cooling block. By arranging the semiconductor cooling units such that the portions of the semiconductor cooling units in which the heights of the radiation fins are low face each other, the overall size of the semiconductor cooling device can be reduced while ensuring cooling performance. The height of the radiating fins can be set so as to gradually decrease from the center to the end of the cooling block.

According to a third aspect of the present invention, there is provided a cooling block according to the first aspect, wherein each of the cooling blocks has a portion corresponding to a position where a semiconductor element having a large heat value is mounted. The height of the radiating fin is increased, and the height of the radiating fin is reduced at a portion corresponding to a position where the semiconductor element having a small heat value is mounted.

That is, it is necessary to increase the height of the radiating fins in a portion corresponding to a semiconductor element having a high calorific value to secure cooling performance. The fins need not be at the same height. Therefore, the height of the radiation fin corresponding to the semiconductor element having a high calorific value is increased, and the height of the radiation fin corresponding to the semiconductor element with a low calorific value is decreased. If the semiconductor cooling units are arranged such that the portion where the height is higher and the portion where the height of the radiation fin of the other semiconductor cooling unit is lower face each other, the overall size of the semiconductor cooling device can be reduced while ensuring the cooling performance. be able to. In addition,
A semiconductor element having a large heat value is a semiconductor element having a large loss, and a semiconductor element having a small heat value is a semiconductor element having a small loss.

According to a fourth aspect of the present invention, there is provided the cooling fin according to the second or third aspect, wherein the radiating fin comprises a fin member having a high height extending from the surface of the cooling block, A plurality of fin members extending from the surface and having a low height are arranged side by side in a direction perpendicular to the direction in which the cooling air flows.

That is, according to the second aspect, the height of the radiation fin is reduced at one end and the other end of each portion of the cooling block in a direction perpendicular to the direction in which the cooling air flows. Then, a fin member having a low height is disposed at one end and the other end of the cooling block, and a fin member having a high height is disposed at the center of the cooling block. In other words, the radiation fins are formed by arranging a plurality of fin members having different shapes in a direction perpendicular to the direction in which the cooling air flows.

On the other hand, in the semiconductor device according to the third aspect, the semiconductor element having a large amount of heat and the semiconductor element having a small amount of heat are separated in a direction perpendicular to the direction in which the cooling air flows to form a cooling block. When mounted, a high-height fin member is provided at a portion corresponding to a semiconductor element having a large amount of heat generation, and a fin member having a low height is provided at a portion corresponding to a semiconductor element having a small amount of heat generation. A member is provided. In other words, the radiation fins are formed by arranging a plurality of fin members having different shapes in a direction perpendicular to the direction in which the cooling air flows.

According to a fifth aspect of the present invention, in order to solve the above problem, in the second or third aspect, the heat radiation fin has a high portion and a low portion extending from the surface of the cooling block. It is characterized in that a plurality of one fin members are formed side by side in a direction perpendicular to the direction in which the cooling air flows.

That is, according to the second aspect of the present invention, if the height of the radiating fins is reduced at the front end and the rear end in the direction in which the cooling air flows, the height of the front end and the rear end in the direction in which the cooling air flows. The radiation fins can be formed by arranging a plurality of fin members having a small height and a high height at the center in the direction in which the cooling air flows, in a direction perpendicular to the direction in which the cooling air flows. In other words, the radiation fin can be formed by the same fin member, so that the production cost of the radiation fin can be significantly reduced.

On the other hand, in the semiconductor device according to the third aspect, when the semiconductor element having a large amount of heat and the semiconductor element having a small amount of heat are separated from each other in a direction in which the cooling air flows and attached to the cooling block, the cooling air is generated. In one cooling fin extending in the flowing direction, the height of a portion corresponding to a semiconductor element having a large amount of heat generation is increased, and the height of a portion corresponding to a semiconductor element having a small amount of heat generation is reduced. In other words, the radiation fin can be formed by the same fin member, so that the production cost of the radiation fin can be significantly reduced.

According to a sixth aspect of the present invention, there is provided a semiconductor cooling unit having heat radiating fins disposed on a surface of a cooling block on which a semiconductor element is mounted, such that the heat radiating fins face each other. In the semiconductor cooling device for a vehicle, the height of the radiating fins extending from the surface of the cooling block varies depending on the portion of the cooling block, and the radiating fins are adjacent to each other through a portion where the height of the radiating fin is reduced. Thus, the cooling blocks are connected to each other so as to form a cooling air duct through which the cooling air flows.

That is, when connecting cooling blocks to each other to form a cooling air duct having, for example, a rectangular cross section, if the heights of the radiating fins are made equal in all portions of the cooling block, the adjacent radiating fins are connected to each other. Since it is necessary to prevent interference, the cooling air duct becomes large. At this time, in the means according to claim 6, since the radiation fins are adjacent to each other through the portion where the height of the radiation fins is reduced, the radiation fins can be arranged close to each other, and the cooling air The size of the duct can be reduced, and the overall size of the semiconductor cooling device can be reduced.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a semiconductor cooling device for a vehicle according to the present invention will be described in detail with reference to FIGS. In the following description, the same portions are denoted by the same reference numerals, and the description thereof is omitted.
The direction in which the cooling air flows is referred to as the front-back direction, and the direction perpendicular to the direction in which the cooling air flows is referred to as the vertical direction or the vertical direction.

First Embodiment First, a semiconductor cooling device for a vehicle according to a first embodiment will be described with reference to FIG.

The semiconductor cooling device 10 for a vehicle according to the first embodiment.
Are provided on the left and right sides of the cooling air duct 3 in which cooling air flows in a direction perpendicular to the plane of the drawing showing the inside thereof, semiconductor devices 4 for power conversion, and auxiliary articles such as snubber circuits, filter capacitors, and gate amplifiers. 5 and each cooling block 6 on which each semiconductor element 4 is mounted.
The heat radiation fins 11 are respectively arranged on the surface of the cooling air duct 3 and protrude inside the cooling air duct 3. Then, the semiconductor element 4, the auxiliary article 5, the cooling block 6, and the radiation fin 1
1 constitutes one semiconductor cooling unit 8A to 8E, respectively.

The radiating fins 11 extend perpendicularly to the plane of the drawing and the side walls 3a and 3b of the cooling air duct 3.
Many rectangular plate-shaped fin members 12 having different shapes from each other
Are arranged side by side in the vertical direction in the figure, in parallel with each other and with a predetermined gap. Of the many fin members 12, the height H1 of the fin member 12a disposed at the center of the cooling block 6 in the vertical direction in the drawing is the highest, and the fin members 12a are disposed at both ends of the cooling block 6 in the vertical direction in the drawing. The height H2 of the fin members 12b and 12c is the lowest. The fin member 12a and the fin members 12b, 1
The other fin members arranged between the fin members 2c and 2c are formed such that their heights gradually decrease as they approach the fin members 12b and 12c.

As shown by drawing an isotherm T in FIG.
The temperatures of the tip portions of the respective fin members 12 forming the radiation fins 11 are substantially equal. That is, in the radiation fin 11 of the first embodiment, the value of the height H2 at both ends is smaller than the height H1 at the center, but the temperature distribution in each part of the radiation fin 11 and the height of each part are different. By optimizing the relationship, fin efficiency is improved as a whole and cooling performance is secured.

In each of the cooling units 8A to 8E, the radiating fin 11 has the highest (H1) central portion 12a.
And the lowest (H2) end portions 12b and 12c are opposed to each other in the left and right direction in the figure while being shifted in the vertical direction (direction perpendicular to the direction in which the cooling air flows). Are arranged as follows. This allows
The width L in the illustrated left-right direction of the semiconductor cooling device 10 can be reduced by reducing the interval between the pair of left and right side walls 3a, 3b of the cooling air duct 3, and the illustrated vertical direction (cooling air flows) of each of the cooling units 8A to 8E. Direction perpendicular to the direction)
Of the semiconductor cooling device 10 can be reduced.
Can be downsized as a whole.

Since the cooling performance of the radiating fins 11 is ensured while the cooling air duct 3 is downsized, it is not necessary to increase the size of a blower (not shown) for supplying cooling air into the cooling air duct 3. Thus, it is possible to prevent problems such as an increase in vibration and noise and an increase in the amount of dust and clogging of the radiation fins 11 with an increase in the size of the blower.

Second Embodiment Next, a semiconductor cooling device for a vehicle according to a second embodiment will be described with reference to FIG.

Second Embodiment Semiconductor Cooling Apparatus for Vehicle 20
Are located on the left and right sides of the cooling air duct 3 in which cooling air flows in a direction perpendicular to the plane of the drawing showing the inside, semiconductor devices 4a and 4b for power conversion, snubber circuits, filter capacitors, gate amplifiers, and the like. Auxiliary articles 5 are provided, and respective radiating fins 21 are provided on the surface of each cooling block 6 on which each semiconductor element 4 is mounted, so as to protrude into the cooling air duct 3. The semiconductor elements 4a, 4b, the auxiliary article 5, the cooling block 6, and the radiating fins 11 form one semiconductor cooling unit 8A-8.
E are respectively constituted.

The semiconductor element 4a has a large loss and a large calorific value. On the other hand, the semiconductor element 4b has a small loss and a small calorific value. Therefore, the semiconductor element 4a having a large heat value is mounted on the upper part of the cooling block 6 in the figure, and the semiconductor element 4b having a small heat value is mounted on the lower part of the cooling block 6 in the figure. That is, the semiconductor element 4a having a large amount of heat generation and the semiconductor element 4 having a small amount of heat generation
and b are attached to the cooling block 6 in a direction perpendicular to the direction in which the cooling air flows. As a result, the temperature of the cooling block 6 is higher in the upper part in the drawing than in the lower part in the drawing. When a large number of semiconductor elements 4a and 4b are mounted on the cooling block 6, respectively,
The semiconductor elements 4a generating a large amount of heat are arranged in rows so as to overlap in a direction perpendicular to the plane of the drawing (the direction in which the cooling air flows), and the semiconductor elements 4b generating a large amount of heat are placed on the plane of the drawing. They are arranged in rows so that they overlap in a direction perpendicular to them.

The radiating fins 21 extend perpendicularly to the plane of the drawing and the side walls 3a and 3b of the cooling air duct 3.
A large number of rectangular plate-shaped fin members 22 having two types of shapes are
They are formed by being arranged in parallel in the vertical direction in the figure with a predetermined gap left therebetween. Among the many fin members 22, the height H1 of the fin member 22a disposed in the upper half of the cooling block 6 in the drawing is large, but the fin member 22b disposed in the lower half of the cooling block 6 in the drawing.
Of the height H2 is small.

At this time, as shown by the isotherm T in FIG. 2, the temperature of the tip portion of each fin member 22 forming the radiation fin 21 is determined by the height H1 and the height H1.
The value of 2 is almost equal to the small value. That is, the radiation fins 21 in the second embodiment have a height H1 of the upper half corresponding to the semiconductor element 4a generating a large amount of heat.
On the other hand, the value of the height H2 of the lower half corresponding to the semiconductor element 4b having a small calorific value is reduced, but by optimizing the relationship between the temperature distribution and the height in each part of the radiation fin 21, Overall, the cooling performance is secured by improving the fin efficiency.

Further, each of the cooling units 8A to 8E is arranged so that the high (H1) portion 22a and the low (H2) portion 22b of each radiating fin 21 face each other in the horizontal direction in the drawing. They are arranged facing each other. Accordingly, the space between the pair of left and right side walls 3a and 3b of the cooling air duct 3 can be reduced to reduce the width L of the semiconductor cooling device 20 in the left-right direction in the figure, and each of the cooling units 8A to 8E.
Can be narrowed in the illustrated vertical direction (direction perpendicular to the direction in which the cooling air flows), so that the size of the semiconductor cooling device 20 can be reduced as a whole.

Further, since the cooling performance of the radiation fins 21 is ensured while the cooling air duct 3 is downsized, it is not necessary to increase the size of a blower (not shown) for supplying cooling air into the cooling air duct 3. Accordingly, it is possible to prevent problems such as an increase in vibration and noise and an increase in the amount of dust and clogging of the radiation fins 21 with an increase in the size of the blower.

Third Embodiment Next, a semiconductor cooling device for a vehicle according to a third embodiment will be described with reference to FIG.

The semiconductor cooling device 30 for a vehicle according to the third embodiment.
Are provided on the left and right sides of the cooling air duct 3 in which cooling air flows in a direction perpendicular to the plane of the drawing showing the inside thereof, semiconductor devices 4 for power conversion, and auxiliary articles such as snubber circuits, filter capacitors, and gate amplifiers. 5 and each cooling block 6 on which each semiconductor element 4 is mounted.
The radiation fins 11 are arranged on the surface of the cooling air duct 3 so as to protrude inside the cooling air duct 3. Then, the semiconductor element 4, the auxiliary article 5, the cooling block 6, and the radiation fin 1
1 constitutes one semiconductor cooling unit 8A to 8E, respectively.

The radiating fins 31 are composed of a plurality of plate-shaped fin members 32 of the same shape extending in parallel to the plane of the drawing and perpendicular to the side walls 3a and 3b of the cooling air duct 3 in parallel with each other and at predetermined intervals. Are formed in parallel with each other in a direction perpendicular to the plane of the drawing with a gap therebetween. Of the multiple fin members 32, the height H1 of the portion 32a located at the center of the cooling block 6 in the vertical direction in the drawing is the highest, and the portions 31b and 31c located at both ends of the cooling block 6 in the vertical direction in the drawing. Is the lowest in height H2.
In addition, between the central portion 32a of the fin member 32 and the upper and lower ends 32b and 32c, the fin member 32 extends in an inclined manner so that the height gradually changes.

As shown by the isotherm T in FIG.
The temperatures of the tip portions of the fin members 32 forming the radiation fins 31 are substantially equal. In other words, the radiation fins 31 in the third embodiment have the height H2 at the front end and the rear end in the direction in which the cooling air 2 flows smaller than the height H1 at the center. By optimizing the relationship between the temperature distribution and the height in each part of the fin 31, the fin efficiency is improved as a whole and the cooling performance is secured.

Further, each of the cooling units 8A to 8E is arranged in the vertical direction (cooling wind) in such a manner that the central portion 32a where the height of each heat radiation fin 31 is highest and the opposite front and rear ends 32b and 32c face each other. (In the direction in which the fluid flows) and are arranged so as to face each other in the left-right direction in the figure. Thereby, a pair of left and right side walls 3 of the cooling air duct 3
The width L of the semiconductor cooling device 10 in the illustrated left-right direction can be reduced by reducing the distance between the a and 3b, and the illustrated cooling direction of each of the cooling units 8A to 8E (the direction in which the cooling air flows).
Of the semiconductor cooling device 30 can be reduced.
Can be downsized as a whole.

Further, since the cooling performance of the radiating fins 31 is ensured while the cooling air duct 3 is downsized, the blower 1 for supplying the cooling air into the cooling air duct 3 is enlarged to increase the wind speed of the cooling air. There is no need to increase the air volume. Accordingly, it is possible to prevent problems such as an increase in vibration and noise, an increase in the amount of dust, and clogging of the radiation fins 31 with an increase in the size of the blower 1.

Further, in the third embodiment, since all the fin members 32 forming the heat radiation fins 31 have the same shape, the number of parts is reduced and the heat radiation fins 3 are reduced.
1 can reduce the manufacturing cost.

Fourth Embodiment Next, a semiconductor cooling device for a vehicle according to a fourth embodiment will be described with reference to FIG.

The semiconductor cooling device 40 for a vehicle according to the fourth embodiment.
Are located on the left and right sides of the cooling air duct 3 through which cooling air flows in the vertical direction in the figure, and semiconductor elements 4 for power conversion.
a and 4b, and auxiliary articles 5 such as a snubber circuit, a filter capacitor, and a gate amplifier.
The cooling fins 41 are arranged on the surface of each cooling block 6 on which each semiconductor element 4 is mounted, and are protruded into the cooling air duct 3. Then, the semiconductor elements 4a,
4b, auxiliary article 5, cooling block 6, and radiation fin 1
1 constitutes one semiconductor cooling unit 8A to 8E, respectively.

The semiconductor element 4a has a large loss and a large calorific value. On the other hand, the semiconductor element 4b has a small loss and a small calorific value. Therefore, the semiconductor element 4a having a large heat value is mounted on the upper part of the cooling block 6 in the figure, and the semiconductor element 4b having a small heat value is mounted on the lower part of the cooling block 6 in the figure. That is, the semiconductor element 4a having a large amount of heat generation and the semiconductor element 4 having a small amount of heat generation
b in the direction in which the cooling air flows and the cooling block 6
It is attached to. As a result, the temperature of the cooling block 6 is higher in the upper part in the drawing than in the lower part in the drawing. The cooling block 6 includes a large number of semiconductor elements 4.
When each of the semiconductor elements 4a and 4b is mounted, the semiconductor elements 4a that generate a large amount of heat are arranged in rows so as to overlap in a direction perpendicular to the plane of the drawing (a direction perpendicular to the direction in which the cooling air flows). At the same time, the semiconductor elements 4b that generate a large amount of heat are arranged in rows so as to overlap in a direction perpendicular to the plane of the drawing.

The radiating fins 41 are composed of a plurality of plate-like fin members 42 of the same shape extending parallel to the plane of the drawing and perpendicular to the side walls 3 a and 3 b of the cooling air duct 3. Are formed in parallel with each other in the vertical direction in the figure with a gap. A portion 42 of the fin member 42 which is located in the upper half of the cooling block 6 in the drawing.
Although the value of the height H1 of “a” is large, the height H2 of the portion 42b located in the lower half of the cooling block 6 in the figure is small.

At this time, as shown by the isotherm T in FIG. 4, the temperature of the tip portion of the fin member 42 forming the radiation fin 41 is a portion 42a having a height H1 and a temperature having a height H2.
Is substantially equal to the portion 42b. That is, the radiation fin 41 in the fourth embodiment has a height H1 in the upper half of the figure corresponding to the semiconductor element 4a generating a large amount of heat, and a height H1 in the lower half of the figure corresponding to the semiconductor element 4b having a small amount of heat generation. Although the value of the height H2 is small, the relationship between the temperature distribution in each part of the heat radiation fin 41 and the height of each part of the heat radiation fin 41 is optimized, thereby improving the fin efficiency as a whole and securing the cooling performance. ing.

The cooling units 8A to 8E are arranged in the horizontal direction in the drawing such that the high (H1) portion 42a and the low (H2) portion 42b of the heat radiation fins 41 face each other. They are arranged facing each other. Thereby, the space between the pair of left and right side walls 3a and 3b of the cooling air duct 3 can be narrowed to reduce the width L of the semiconductor cooling device 40 in the left-right direction in the figure, and each of the cooling units 8A to 8E.
Can be narrowed in the illustrated vertical direction (the direction in which the cooling air flows), so that the size of the semiconductor cooling device 40 can be reduced as a whole.

Further, since the cooling performance of the radiation fins 41 is ensured while the cooling air duct 3 is downsized, it is not necessary to increase the size of the blower 1 for supplying the cooling air into the cooling air duct 3. As a result, as the blower 1 becomes larger,
It is possible to prevent problems such as an increase in vibration and noise, an increase in the amount of dust, and clogging of the radiation fin 41.

Further, in the fourth embodiment, since all the fin members 42 forming the heat radiation fins 41 have the same shape, the number of parts is reduced and the heat radiation fins 4 are reduced.
1 can reduce the manufacturing cost.

Fifth Embodiment Next, a semiconductor cooling device for a vehicle according to a fifth embodiment will be described with reference to FIG.

The semiconductor cooling device 50 for a vehicle according to the fifth embodiment.
Are the cooling blocks 51 and 5 on which the semiconductor element 4 is mounted.
2, 53, and 54 around the axis of the flow path through which the cooling air flows.
By displacing the positions by 0 degrees and connecting the respective ends of the cooling blocks 51, 52, 53, 54 to each other via the respective connecting portions 55, the cooling blocks 51, 52, 53, 54 are connected in a direction perpendicular to the plane of the drawing. A cooling air duct 56 having a rectangular cross section through which the cooling air flows is formed. Further, a packing (not shown) is provided at each connection portion 55, and the cooling air duct 56 can be formed airtight.

At this time, the cooling blocks 51, 52, 5
The radiating fins 57 arranged on the surfaces of the cooling air ducts 56 and protruding into the cooling air duct 56 are provided in the same manner as the radiating fins of the first embodiment described above.
The height of the portion 57a located at the center of the center 53, 54 is the highest, and the height of the portions 57b, 57c located at both ends of the cooling blocks 51, 52, 53, 54 is the lowest. ing.

As a result, the radiation fins 57 are adjacent to each other via the portions 57b and 57c whose heights have been reduced. Do not interfere with each other. Therefore, the radiation fins 57 can be arranged close to each other, and the cooling air duct 56 can be reduced in size and the overall size of the semiconductor cooling device 50 can be reduced.

Each of the cooling blocks 51, 52, 53,
Since the cooling air duct 56 can be formed by 54, other components for forming the cooling air duct can be eliminated.

Sixth Embodiment Next, a semiconductor cooling device for a vehicle according to a sixth embodiment will be described with reference to FIG.

The heat radiation fins 57 in the semiconductor cooling device 50 for a vehicle according to the fifth embodiment described above have the same construction as the heat radiation fins according to the first embodiment. On the other hand, in the semiconductor cooling device 50 for a vehicle according to the sixth embodiment, the radiation fins 67 are configured similarly to the radiation fins according to the second embodiment.

That is, each of the cooling blocks 51, 52, 5
The radiating fins 67 disposed on the surfaces of the cooling air ducts 56 and disposed on the surfaces of the cooling air ducts 56 are provided in the same manner as the radiating fins of the second embodiment described above.
The height of the portion 67a corresponding to the semiconductor element 4b having a large calorific value is reduced while the height of the portion 67a corresponding to the height a is high.

As a result, the heat radiation fins 67 are adjacent to each other via the portion 67b having a reduced height. Therefore, even if the heat radiation fins 67 are arranged close to each other, the heat radiation fins 67 adjacent to each other can be mutually connected. There is no interference. Therefore, the radiating fins 67 can be arranged close to each other, and the cooling air duct 56 can be reduced in size and the overall size of the semiconductor cooling device 60 can be reduced.

Although the embodiments of the semiconductor cooling device for a vehicle according to the present invention have been described in detail above, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications are possible. . For example, in the above-described fifth and sixth embodiments, the radiation fins in the above-described third and fourth embodiments can be used.

[0062]

As is apparent from the above description, in the semiconductor cooling device for a vehicle according to the present invention, the height of the radiation fin extending from the surface of the cooling block on which the semiconductor element is mounted is made different depending on the position of the cooling block. In addition, since a portion where the height of one heat radiation fin is high and a portion where the height of the other heat radiation fin is low are opposed to each other, the cooling blocks are arranged close to each other and the semiconductor cooling device is arranged. Can be reduced in size. At this time, the height of the radiating fins provided at the end of the cooling block is reduced, and the height of the radiating fins provided corresponding to the semiconductor element having a small calorific value is reduced, so that the cooling performance may be impaired. Absent. In addition, since the cooling performance of the cooling fins is secured while reducing the size of some of the cooling fins, it is necessary to increase the size and size of the blower that supplies the cooling air to the inside of the cooling air duct to increase the speed and volume of the cooling air. Therefore, it is possible to prevent problems such as vibration and noise increasing with an increase in the size of the blower and clogging of the radiation fin due to an increase in the amount of dust. Also, since the cooling air duct is formed using the cooling block while radiating fins are arranged close to each other,
The size of the cooling air duct can be reduced and the size of the semiconductor cooling device can be reduced, and other components for forming the cooling air duct can be eliminated.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view schematically showing a semiconductor cooling device for a vehicle according to a first embodiment of the invention.

FIG. 2 is a vertical sectional view schematically showing a vehicular semiconductor cooling device according to a second embodiment of the present invention.

FIG. 3 is a horizontal sectional view schematically showing a semiconductor cooling device for a vehicle according to a third embodiment of the invention.

FIG. 4 is a horizontal sectional view schematically showing a semiconductor cooling device for a vehicle according to a fourth embodiment of the invention.

FIG. 5 is a vertical sectional view schematically showing a semiconductor cooling device for a vehicle according to a fifth embodiment of the invention.

FIG. 6 is a vertical sectional view schematically showing a semiconductor cooling device for a vehicle according to a sixth embodiment of the invention.

FIG. 7 is a horizontal sectional view schematically showing a conventional semiconductor cooling device for a vehicle.

8 is a vertical sectional view schematically showing the semiconductor cooling device for a vehicle shown in FIG. 7;

FIG. 9 is a plan view schematically showing a state in which a conventional vehicle semiconductor cooling device is mounted on a vehicle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Blower 2 Cooling air 3 Cooling air duct 4 Semiconductor element 5 Auxiliary article 6 Cooling block 7 Radiation fin 8 Semiconductor cooling unit 9 Semiconductor cooling device 10 Semiconductor cooling device for vehicles of the first embodiment 11 Radiation fin 12 Fin member 12a Central portion 12b , 12c End 20 Semiconductor cooling device for vehicle of second embodiment 21 Heat radiating fin 22 Fin member 30 Semiconductor cooling device for vehicle of third embodiment 31 Heat radiating fin 32 Fin member 32a Central portion 32b, 32c End portion 40 Fourth embodiment Semiconductor cooling device for vehicle in form 41 Radiating fin 42 Fin member 50 Semiconductor cooling device for vehicle in fifth embodiment 51, 52, 53, 54 Cooling block 55 Connecting portion 56 Cooling air duct 57 Heat radiating fin 60 Vehicle in sixth embodiment Semiconductor cooling device 67 radiation fin

Claims (6)

[Claims] 1. A vehicular semiconductor cooling device in which semiconductor cooling units each having radiation fins arranged on the surface of a cooling block on which a semiconductor element is mounted are arranged such that the radiation fins face each other. The height extending from the surface of the cooling block is made different depending on the position of the cooling block, and the height of the radiating fin of one semiconductor cooling unit and the height of the radiating fin of the other semiconductor cooling unit are increased. A semiconductor cooling device for a vehicle, wherein the semiconductor cooling units are arranged such that portions having a lower surface are opposed to each other. 2. The cooling fin according to claim 1, wherein the height of the radiating fin is increased at a central portion of the cooling block, and the height of the radiating fin is reduced at an end of the cooling block. Semiconductor cooling device for vehicles. 3. The height of the radiating fins is increased at a position corresponding to a position where the semiconductor element having a large amount of heat is mounted, and the semiconductor element having a small amount of heat is mounted at each of the positions of the cooling block. The semiconductor cooling device for a vehicle according to claim 1, wherein the height of the radiation fin is reduced at a portion corresponding to the set position. 4. The radiating fin comprises a fin member having a high height extending from the surface of the cooling block and a fin member having a low height extending from the surface of the cooling block. 4. The semiconductor cooling device for a vehicle according to claim 2, wherein a plurality of the cooling devices are formed in parallel in a vertical direction. 5. The radiating fin comprises a plurality of fin members each having a high portion and a low portion extending from the surface of the cooling block and arranged in parallel in a direction perpendicular to a direction in which the cooling air flows. The semiconductor cooling device for a vehicle according to claim 2, wherein the semiconductor cooling device is formed. 6. A semiconductor cooling device for a vehicle in which semiconductor cooling units each having radiation fins arranged on the surface of a cooling block on which a semiconductor element is mounted are arranged such that the radiation fins face each other. The height extending from the surface of the cooling block is made different depending on the location of the cooling block, and the cooling blocks are arranged so that the radiating fins are adjacent to each other through a portion where the height of the radiating fin is reduced. A semiconductor cooling unit for a vehicle, which is connected to each other and forms a cooling air duct through which the cooling air flows.