JP2002118352A - Method for mounting surface-mounted component, and sheet for mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount the unit of surface-mounted parts by soldering regardless of the presence/absence of components mounted around the mount space of surface-mounted components on a circuit board. SOLUTION: In a sheet 15 for surface-mounted component mounting, an adhesive 17 is provided on one side of an insulating sheet 16 formed with through holes 19 matched with a conductor pattern for surface-mounted component connection of the circuit board, solder paste is charged in the through holes 19 by sticking the through hole on the circuit board while matching it with the conductor pattern for connection, and the terminal for connection of the surface-mounted component is positioned on the through holes 19, heated and soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting component mounting method, a mounting sheet, and a mounting structure suitable for mounting a surface mounting component alone on a circuit board.

2. Description of the Related Art There are various types of surface mount components (SMD) mounted and mounted on a circuit board such as a printed circuit board by surface mount technology (SMT), and the characteristic configuration thereof is an electrode for mounting connection. The configuration of the connection terminal is, for example, a packaged semiconductor integrated circuit such as BGA (Ball Grid Array) or BC
C (Bump Chip Carry).

The configuration of such a surface mount component will be described with reference to a BGA type surface mount component 1 shown in FIG. 16. A semiconductor integrated circuit chip is housed in a package 2 which is formed of a synthetic resin molded in a rectangular shape in plan view. An electrode connected to the circuit is connected to a circular connection terminal pattern which is regularly arranged and formed in a lattice pattern on the back surface of the package 2, and the ball terminal 3 which is a spherical solder is provided on the connection terminal pattern. Are attached to each other by fusing.

[0004] Incidentally, actually, one side of the square of the package 2 is 10 mm, and the diameter of the ball terminal 3 is 0.3 mmφ.
The pitch interval of the ball terminals 3 is 0.5 mm, and the ball terminals 3
FIG. 16 shows the diameter of the ball terminal 3 larger than the actual size and facilitates understanding in the following description. Shown. 16A is a side view, and FIG. 16B is a rear view.

In order to mount and mount on a circuit board, a conductor pattern for solder connection, which is connected to the circuit pattern on the circuit board surface, is placed in the same state as the ball terminals 3 of the surface mount component 1 are arranged. Is formed, and a creamy solder paste containing a solvent is applied to the conductor pattern surface by a printing method using a printing mask, and the positions of the conductor pattern on the circuit board side and the ball terminals 3 of the surface mount component 1 are determined. The soldering connection is carried out by mounting the components in an exactly matched state, feeding the whole into a heating furnace or the like, heating it, and taking out and cooling the solder in a molten state.

After that, an adhesive is supplied between the circuit board surface and the surface of the package 2 to be bonded and fixed.

[0007]

2. Description of the Related Art At the initial stage of mounting and soldering a surface mount component on an entire circuit board, the above steps can be performed without any problem. However, the surface mount component mounted in a state shown in FIG. If necessary, such as replacing the component 1, a local heater by high-frequency heating is brought into contact with the upper surface of the surface mount component 1 to heat it, thereby melting the solder and breaking the fixing adhesive by heating. However, it is not easy to print and apply a solder paste for soldering and mounting a new replacement surface mount component 1 on the conductor pattern after the removal.

The necessity of replacement (repair) is, for example, in a test process, a short circuit failure due to solder between adjacent terminals,
This is a case where a so-called solder bridge, an open fault in which connection by solder is not made, or a defect of the semiconductor itself is detected by an electrical test or the like.

The reason is that it is not easy because a large number of other surface mount components 5 made of small chip components are mounted near the periphery of the surface mount component 1 mounted on the circuit board 4 at a high density. 10 mm around the surface mount component 1 as space for placing a mask for solder paste printing
Although a certain gap is required, such a space cannot be provided at all.

[0010] For this purpose, a conventional work procedure will be described. First, the adhesive remaining around the removed conductor pattern is removed, and the solder on the surface of the connection conductor pattern is removed to clean the conductor pattern. Face.

With respect to the new surface mount component 1 for replacement to be replaced, the package 2 is fitted into the recess 7 on the upper surface of the component support 6 shown in FIG. 18 with the ball terminals 3 of the surface mount component 1 facing upward. Then, a mask plate 8 for printing is put on from above.

Although not shown, the mask plate 8 is provided with reference pins 9, 9 protruding from two end portions of the component support 6 so as to be fitted therein. The mutual positions are accurately positioned. Although not shown, the mask plate 8 is provided with through holes for solder application corresponding to the positions of all the ball terminals 3 of the surface mount component 1.

[0013] As shown in FIG.
Paste 1 on the mask plate 8 located at the end of
The squeegee 12 is a plate-shaped spatula.
By moving the ball terminal 3 toward the other end in the direction of the arrow so as to be pushed into the through hole formed at the ball terminal 3, the solder paste 11 is filled in the entire through hole and the ball terminal 3 is filled. 3, the mask plate 8 is removed, and the surface-mounted component 1 is removed from the recess 7
Remove from

Next, the surface-mounted component 1 in a state where the solder paste 11 is printed and adhered to the ball terminals 3 is placed on the connection conductor pattern surface of the circuit board 4 which has been cleaned beforehand, with all the ball terminals 3 attached thereto. The position is accurately aligned, mounted, and heated by a local heating device (not shown) to cool the solder in a molten state and perform soldering.
A viscous adhesive is filled between the circuit board 4 and the package 2 to be adhered and fixed.

[0015]

According to the above-mentioned conventional mounting method, after the solder paste 11 is printed in the through holes of the mask plate 8, the mask plate 8 is removed and pulled up, and the through holes are filled with the solder paste. There is a portion where the solder paste 11 adheres to the through-hole of the mask plate 8 and can be lifted up, and there is a problem that a required amount of solder is not applied to the ball terminals 3. This involves a troublesome operation of manually applying a required amount of solder paste on the surface of the ball terminal 3 using a microscope.

In addition, since the mask plate 8 is a flat plate and the surface of the ball terminal 3 is a fine spherical surface, the solder paste 11 to be imprinted follows the spherical surface of the ball terminal so that a large number of balls are formed. The adhesion is not always uniform to all of the terminals 3, and an error occurs in the amount of adhesion more than an allowable value.

There is also a dispense method (discharge method) in which the solder paste is supplied and applied without printing the solder paste on the connection terminals on the surface mount component side. It is not practical because of the need to control and the development and investment of such equipment.

The above is the case of a BGA type surface mount component. In the case of a BCC type surface mount component, a uniform amount of solder is secured because the soldering connection terminal is not a solder but a conductor surface. With difficulty.

According to the present invention, in view of the above-mentioned current problems, mounting in which such problems are solved is realized, and it is possible to cope with lightening, miniaturization, and high density of various devices. Further, it is an object of the present invention to enable reliable positioning and fixing and solder supply.

[0020]

The basic first means of the present invention for solving the above-mentioned problems is that the through-holes coincide with the conductor patterns for connecting surface-mounted components on the circuit board. A surface-mount component mounting sheet, which is provided with an adhesive on one side of a heat-resistant insulator sheet formed with
Using the adhesive surface as the circuit board surface, align the through-hole with the connection conductor pattern, position and fix it, fill the through-hole of the mounting sheet with a soldering solvent or a solder paste containing a solvent, This is a method of mounting a surface mounting component in which a connection terminal is positioned on a through hole and heated and soldered and mounted.

According to the first means, since the mounting sheet is positioned and adhered and fixed to the circuit board surface, the mounting sheet does not move to a state of being positioned with respect to the circuit board. In this state, the through holes are filled with a soldering solvent or a solder paste containing a solvent, and the connection positions of the surface mount components are easily aligned by aligning the connection terminals of the surface mount components on the through holes. For example, the surface mounting component can be heated to melt and connect the solder to be mounted. Therefore, an appropriate amount of the filler filled in the through hole is reliably secured by the through hole, and there is no variation such as an error.

In the case where the electrode portion of the surface mount component is a BGA connection terminal or the like provided with solder, even if the filler in the through hole is only a solvent such as a flux,
Alternatively, a solder paste may be used, and in the case of a BCC connection terminal or the like not provided with solder, the solder paste is used.

A second means of the present invention is a surface mounting method in which an adhesive is provided on one surface of a heat-resistant insulating sheet having a through-hole corresponding to a conductor pattern for connecting a surface-mounted component of a circuit board. A component mounting sheet in which the through-holes are aligned with the connection conductor patterns of the circuit board and are attached with an adhesive, and the through-holes are filled with a soldering solvent or a solvent-containing solder paste to connect the surface-mounted components. This is a surface mounting component mounting sheet that can be heated and soldered and mounted by positioning terminals for mounting on through holes.

According to the second means, since the mounting sheet is provided only with the adhesive on one surface with the through hole, the adhesive surface is covered with a peelable protective backing sheet. There is no problem such as deterioration over a long period, and it can be used immediately as needed.

Since solder or the like is supplied to the through hole in a filled state when mounting the surface mount component, similarly, an appropriate amount of flux or solder having no deterioration or the like is supplied in a fresh state, and soldering and mounting can be performed.

Also, by fitting the individual pieces of the mounting sheet to the external dimensions of the package of the surface mounting component, the mounting sheet is adhered and mounted in accordance with the frame shape of the mounting position formed on the circuit board; and By mounting the package of the surface mount components according to the outer shape of the mounting sheet, mutual positioning can be easily performed.

By providing a large number of individual pieces of the mounting sheet on the backing paper, it is convenient because they can be separated and peeled and used.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment based on the gist of the structure of a method and a sheet for mounting a surface mounted component of the present invention will be described in detail with reference to the drawings. It is to be noted that the same parts are denoted by the same reference numerals for the sake of convenience for easy understanding throughout the drawings. Also, circuit wiring patterns on a circuit board or the like are not shown because they are complicated.

FIG. 1 shows an embodiment of a surface mounting component mounting sheet (hereinafter, simply referred to as a mounting sheet) 15 according to the present invention. FIG. 1 (a) is a perspective view, and FIG. It is shown in a side sectional view. The mounting sheet 15 is also an adhesive sheet having a heat-resistant and electrically insulating sheet 16 provided on one side with an adhesive 17 having the same heat resistance and tackiness. Is adhered and attached to the surface of the backing sheet 18 formed on the hardly-adhesive treated surface.
On the surface of the sheet 16, a large number of through holes 19 are regularly formed at lattice positions together with the adhesive 17. The adhesive 17 may be an adhesive.

The unit piece of the mounting sheet 15 is shown in FIG.
6, the size of the external shape and dimensions of the package 2 of the surface mount component 1 is the same, and the positions of the through holes 19 provided in a lattice are also the same as the positions of the respective ball terminals 3.

The thickness of the sheet 16 is smaller than the height of the ball terminals 3 so as to have a relationship as described later. Through hole 1
9 is formed on the sheet 16 including the adhesive 17,
It is not formed on the mount 18. However, Mount 1
8 can also be formed.

The material of the sheet 16 is a relatively flexible glass fiber-containing epoxy resin plate, tetrafluoroethylene resin (Teflon) plate, polyimide resin plate, or the like. 0.30mm, about
The selection and application are made according to the diameter (height) of the ball terminal 3.

FIG. 2A is a plan view of a main part of the circuit board 4, and a connecting conductor pattern 21 for soldering, mounting and connecting the surface mount component 1 is formed on the surface of the circuit board 4. A pair of marks 22 corresponding to the outer shape and size of the package 2 are symmetrically marked at diagonal positions.

The individual pieces of the mounting sheet 15 described with reference to FIG. 1 are peeled off from the backing sheet 18 and removed, and the surface of the adhesive 17 side is used as the connecting conductor 21 side of the circuit board 4 by using tweezers or the like. By supporting and carefully sticking the corners so as to match the mark 22 while observing through a magnifying glass or the like, it is possible to mount the apparatus in the state shown in FIG. When attached in this manner, the respective through holes 19 coincide with and overlap with the positions of the respective connecting conductor patterns 21.

Here, the mounting sheet 15 and the ball terminals 3
Will be described with reference to FIG. First, according to an enlarged sectional view of a main part in a state where the surface mount component 1 and the circuit board 4 are combined in FIG.
The diameter of the ball terminal 3 which is a BGA is d, the diameter of the connecting conductor pattern 21 on the circuit board 4 side is D,
The distance between the package 2 and the surface of the circuit board 4 is H,
The thickness of the mounting sheet 15 shown in FIG.

As described above, basically, the relation between the diameter d of the ball terminal 3 and the diameter D of the connecting conductor pattern 21 is d =
D, the relationship between the diameter K of the through hole 19 of the mounting sheet 15 and the diameter D of the connecting conductor pattern 21 is K = D,
Regarding the relationship between the thickness T of the mounting sheet 15 and the diameter d of the ball terminal 3, when d ≦ 0.3 mm, T = 0.03.
０．１0.1 mm, d> 0.3 mm, T = 0.
It is appropriately selected as a range of 1 to 0.15 to 0.3 mm.

For example, the diameter d of the ball terminal 3 is 0.3
mm, the distance H between the package 2 and the circuit board 4 is H =
It is set to 0.25 ± 0.1 mm.

The mounting sheet 15 is mounted on the circuit board 4 as shown in FIG.
FIG. 4 is an enlarged side cross-sectional view attached to the state shown in FIG. 4B, and the soldering and mounting of the surface mount component 1 will be described below with reference to the drawings. FIG. 4 shows that another surface mount component 5 which is a chip component is mounted on the periphery.

Next, as shown in FIG. 5, an appropriate amount of the solder paste 11 is placed on one end of the mounting sheet 15, and a squeegee 23 made of a plate-shaped spatula having a sharp edge like a knife edge is mounted on the mounting sheet 15. By moving the solder paste 11 in the direction of the arrow while making contact with the upper surface 15, the solder paste 11 is pushed into the through-hole 19 and the upper surface of the through-hole 19 becomes flat. Make sure that the sheet 16 is not in the through hole 19
The solder paste 11 is removed so that it does not exist on the surface, so that the solder paste 11 is cleaned.

By sharpening the tip of the squeegee 23 into a sharp knife edge, the through hole 1 of the mounting sheet 15 is formed.
The solder paste 11 filled in 9 is not scraped off, and the solder paste 11 does not adhere to the sheet surface, so that a clean state can be obtained effectively.

In the above state, the surface of the package 2 is mounted on the mounting sheet 15 with the surface of the ball terminal 3 of the surface mount component 1 facing downward, as shown in FIG. In order to match the shape around the sheet 15,
Again, by observing with a magnifying glass or the like, the ball terminals 3 are accurately positioned from directly above and carefully placed, so that the tip end of each ball terminal 3 has a through hole 19 filled with the solder paste 11 of the mounting sheet 15. It is mounted so as to fit into the part, and the mutual position is stabilized.

As shown in FIG. 7, the portion of the circuit board 4 on which the surface mount components 1 are mounted is set as a predetermined position of the heating device, and the head 25 of the heater provided thereon is lowered. . The head section 25 of the heater is composed of an outer duct 26 and an inner duct 27 provided at intervals, each having a rectangular shape. Are connected by a rib 28. By lowering, the outer duct 26 is appropriately spaced around the package 2 of the surface-mounted component 1 in the state shown in FIG. It will surround you.

In the state of FIG. 8, hot air is blown from a hot air generator (not shown) from above the inner duct 27, so that the hot air is blown by the package 2 of the surface mount component 1 and the outer duct 26 as indicated by arrows. The hot air is exhausted from the gap between the outer duct 26 and the inner duct 27 into the upper air while heating the surface of the circuit board 4 surrounded by The solder paste 11 filled in the through holes 19 of the sheet 15 is melted and soldered to each other. As a result, the connection terminals of the surface mount component 1 and the connection conductor patterns 21 of the circuit board 4 are electrically connected. After a lapse of a predetermined time from connection to the circuit board, the hot air generator is stopped, the molten solder is cured, and the circuit board 4 is taken out.

This state is as shown in FIG. 9, in which an integrated solder 29 for connecting the respective circuit connection terminal patterns is formed, and the solder 29 firmly connects both electrodes and mechanically. Have been. Since a gap is formed between the upper surface of the sheet 16 of the mounting sheet 15 and the lower surface of the package 2 of the surface mount component 1, it is possible to perform cleaning with a cleaning liquid as needed. Alternatively, a synthetic resin adhesive may be flowed in and filled to perform adhesive fixing for securing mechanical strength between the surfaces.

As described above, the mounting sheet 15 is
Adhesion and fixation to the surface ensures reliable positioning, and since there is no gap between them, the outflow and movement of molten solder is reliably prevented, the amount of solder for connection is ensured, and the solder bridge between adjacent patterns is secured. No short circuit faults occur due to

As described above, when the solder paste 11 is filled in the through holes 19 of the mounting sheet 15 mounted on the circuit board 4, the ball terminals 3 of the surface mount component 1
Although it is described that the positioning is manually performed to mount the device, a cautious operation is required. Therefore, the mounting device is not limited thereto, and the mounting device can be used.

That is, the mounting sheet 15 of the circuit board 4
Is set on a movable table on a plane in the X-Y direction below the mounting device, with the
The upper surface of the package 2 is sucked and held by a vacuum suction chuck provided in an elevating mechanism for vertical movement with the ball terminal 3 of the lower surface as a lower surface, and is disposed to face upward so as to face the surface of the mounting sheet 15. The surface of the upper and lower surface mount components 1 and the mounting sheet 15 are superimposed and enlarged on one screen of an image device in which an optical system and an image pickup device capable of simultaneously observing the upper and lower surfaces on the same axis are interposed between the two. Display,
While observing, the position of the surface-mounted component 1 is rotated in the XY directions and in the horizontal plane so that the position of each of the ball terminals 3 of the surface-mounted component 1 and the position of each of the through holes 19 of the mounting sheet 15 match. It is also possible to easily mount by moving the fine movement mechanism and aligning the position, retracting the optical system and the imaging device in that state, and lowering the mounting sheet 15 immediately below.

Although it is possible to manufacture and store a large number of the mounting sheets 15 as individual pieces, as shown in FIG. 10, the mounting sheets 15 are continuously arranged on a plurality of planes on a single wide board. A plurality of mounting sheets 3 formed on a wide surface which is formed so as to be separated from each other and is provided with a cut 31 so as to be separable while leaving a wide mount 18 at a boundary portion thereof.
It is also possible to set it to 2. The individual portions of the plurality of mounting sheets 32 formed on the wide surface are the same as those described with reference to FIG. 1, and only one through hole 19 is shown for convenience.

As to another form of the mounting sheet 15, as shown in FIG. 11, the mounting sheet 15 is formed in a continuous state in a row on a long mounting sheet, and the long mounting sheet 18 is left at a boundary portion thereof. It is also possible to form a plurality of mounting sheets 33 formed on a tape surface having cuts 31 provided so as to be separable, and can be stored by winding or the like since it is long. The individual portions of the plurality of mounting sheets 33 formed on the tape surface are the same as those described with reference to FIG. 1, and only one portion of the through hole 19 is similarly shown.

In the above description, the surface mounting component 1 is a BGA type connection terminal and the ball terminal 3 is made of solder. However, the present invention is not limited to the mounting of such a surface mounting component. The present invention is also applicable to a component having no solder, for example, a BCC type surface mount component 41 shown in FIG. FIG.
(A) is a side view, and (b) is a back view.

That is, the surface mount component 41 of the BCC type
A semiconductor integrated circuit chip is housed inside a package 42 which is formed of a synthetic resin molded in a rectangular shape in a plan view, and electrodes connected to the circuit are formed around a back surface of the package 42 in a rectangular or square shape. It is connected to the connection terminal 43.

Actually, one side of the square of the package 42 is 5 mm, the width of one side of the rectangular connection terminal 43 is 0.3 mm, the length is 0.4 mm, and the height is 0.085 m.
m.

The connection conductor patterns on the circuit board side are also formed in the same shape and size as the connection terminals 43. The connection terminals 43 are made of Ni, and the surfaces thereof are plated with Au.

FIG. 13 shows an embodiment of a surface mounting component mounting sheet (hereinafter abbreviated as mounting sheet) 45 for the BCC type surface mounting component 41 according to the present invention, and FIG. A plan view and a side sectional view in FIG.
The mounting sheet 45 is also an adhesive sheet in which an adhesive 47 also having heat resistance is provided on one surface of a sheet 46 made of a heat-resistant electrode insulator. It is adhered and attached to the surface of the mount 48 formed on the surface. On the surface around the sheet 46, a large number of rectangular through-holes 49 are formed regularly along with the adhesive 47 at frame-shaped positions.

The unit piece of the mounting sheet 45 is shown in FIG.
2, the size of the external shape and dimensions of the package 42 of the surface mount component 41 described above, and the position of the through hole 49 provided at the frame-shaped position also matches the position of each connection terminal 43. ing.

The thickness of the sheet 46 is thinner than the height of the connection terminals 43, and the through holes 49
6 and is not formed on the backing sheet 48.
However, it may be formed penetrating the mount 48.

The material of the sheet 46 is the same as that described with reference to FIG. 1, and is made of a relatively flexible epoxy resin plate containing glass fiber, a tetrafluoroethylene resin (Teflon) plate, or the like. 0.03 mm, but the connection terminal 4
3 can be set appropriately according to the height.

FIG. 14A is a plan view of a main part of the circuit board 4, and a connecting conductor pattern 51 for soldering, mounting, and connecting the surface mount component 41 is formed on the surface of the circuit board 4. A pair of marks 52 corresponding to the outer shape size of the package 42 are symmetrically marked at diagonal positions.

The individual pieces of the mounting sheet 45 described with reference to FIG. 13 are peeled off from the backing sheet 48 and removed, and the surface of the adhesive 47 side is used as the connection conductor pattern 51 side of the circuit board 4 using tweezers or the like. By supporting and carefully affixing while observing through a magnifying glass or the like so that the corners coincide with the marks 52, the state shown in FIG. When attached in this manner, each through-hole 49 is connected to each of the connection conductor patterns 51.
And will overlap.

In the mounting sheet 45 in this state, the solder paste 11 is filled in all the through holes 49 by the same procedure as described with reference to FIG.

As shown in the enlarged sectional side view of the main part of FIG. 15A from the top of the mounting sheet 45 filled with the solder paste 11, the connection terminals 43 of the surface mount component 41 are With the surface facing down, the periphery of the package 42 is accurately aligned from directly above while observing with a magnifying glass, etc., and carefully placed so that the periphery of the package 42 matches the shape of the periphery of the mounting sheet 45. Each connection terminal 43
Are fitted so as to fit into the portions of the through holes 49 of the mounting sheet 45 filled with the solder paste 11, and the mutual positions are stabilized.

The surface mount component 1 in FIGS. 7 and 8 will be described by substituting the surface mount component 41 of the BCC type. The portion of the circuit board 4 on which the surface mount component 41 is mounted is set as a predetermined position in a heating device. Then, the head 25 of the heater disposed thereon is lowered. In this case, the head section 25 of the heater is arranged such that the outer duct 26 is provided with an appropriate space around the package 42 of the surface mount component 41 and the tip comes into contact with the surface of the circuit board 4 to surround the surface mount component 41. Become.

In the state shown in FIG. 8, hot air is blown from a hot air generator (not shown) from above the inner duct 27, so that the surface-mounted component 41 becomes a package 42 and a portion of the circuit board 4 surrounded by the outer duct 26. The surface is heated to melt the solder paste 11 filled in the through holes 49 of the mounting sheet 45 and soldered to the connection terminals 43 to connect the connection terminals 43 of the surface mount component 41 to the circuit board 4. After a lapse of a predetermined time from the electrical connection with the conductor pattern 51, the hot air generator is stopped to cure the molten solder, and the circuit board 4 is taken out.

FIG. 15B is an enlarged view of a main part in this state.
And solder 53 for connecting the respective circuit connection patterns. The solder 53 spreads over the entire surface so as to crawl along the surface of the connection terminal 43 due to its wettability when melted. Is contracted by the surface tension to obtain a reliable connection state.
This provides a strong electrical and mechanical connection.

An upper surface of the sheet 46 of the mounting sheet 45;
Since a gap is formed between the surface mounting component 41 and the lower surface of the package 42, it is possible to perform cleaning with a cleaning liquid as needed. Adhesion and fixing for ensuring mechanical strength may be possible.

Also in this embodiment, the mounting sheet 45 is adhered and fixed to the surface of the circuit board 4 to ensure reliable positioning and to prevent the outflow and movement of the molten solder because there is no gap between them. As a result, the amount of solder for connection is ensured and a short circuit failure due to a solder bridge between adjacent patterns does not occur.

Also in this embodiment, when the solder paste 11 is filled in the through holes 49 of the mounting sheet 45 mounted on the circuit board 4, the connection terminals 43 of the surface mount component 41 are formed. It is of course possible to adopt a mounting device using an optical system as described above without manually performing alignment and mounting work.
It is efficient.

A large number of mounting sheets 45 may be manufactured, stored and used as individual pieces.
It is also possible to form a plurality of sheets continuously on a single wide board as shown in FIG. 11 or to form a continuous row in a row on a long board as shown in FIG.

The surface mount component to which the present invention is applied is BG
The present invention is not limited to the A-type surface mount component or the BCC type surface mount component, and has a similar configuration, for example, a known SOP or SON (Small Outl).
Needless to say, the present invention can be applied to an (In Non Lead) type surface mount component, other surface mount components, and the like.

(Supplementary Note 1) The surface mount component mounting sheet, which is provided with an adhesive on one surface of a heat-resistant insulating sheet having a through hole formed in correspondence with the surface mount component connection conductor pattern of the circuit board, is prepared by the above-described method. The through hole is positioned so as to match the conductor pattern for connection, the surface mounting component mounting sheet is attached to the circuit board with an adhesive surface, and the soldering solvent is filled in the through hole of the surface mounting component mounting sheet. A method for mounting a surface-mounted component, wherein a connection terminal comprising solder of the surface-mounted component is positioned on a through-hole and heated and soldered. (Supplementary Note 2) A surface-mount component mounting sheet having an adhesive on one surface of a heat-resistant insulating sheet having a through-hole formed in correspondence with the surface-mount-component-connection conductor pattern of the circuit board is provided. Position the surface mounting component mounting sheet so that it matches the connection conductor pattern, attach the surface mounting component mounting sheet to the circuit board with the adhesive, fill the through holes of the surface mounting component mounting sheet with solder paste containing a solvent, and then mount the surface mounting component. A method for mounting a surface mounting component, wherein the connection terminal of (1) is positioned on the through hole and heated and soldered. (Supplementary Note 3) The method for mounting a surface-mounted component according to supplementary note 1, wherein the surface-mounted component includes a BGA connection terminal.

(Supplementary Note 4) An adhesive is provided on one surface of a heat-resistant insulating sheet having a through-hole corresponding to the conductor pattern for connecting a surface-mounted component of the circuit board, and the through-hole is connected to the circuit board. Fill the through hole with soldering solvent or solder paste containing solvent in accordance with the conductive pattern for soldering, fill the through hole with solder paste containing solvent, position the connection terminal of the surface mount component on the through hole, and heat and solder. A sheet for mounting surface mount components, characterized in that: (Supplementary Note 5) The surface mounting component mounting sheet according to Supplementary Note 4, wherein the outer size of the sheet is equal to the outer size of the surface mount component.

(Supplementary Note 6) An insulating sheet having a through-hole corresponding to the conductor pattern for connecting a surface-mounted component of the circuit board is adhered with an adhesive so that the through-hole matches the conductor pattern of the circuit board. A mounting structure for a surface mount component, wherein a connection terminal of the mount component is located on the through hole, and the connection conductor pattern of the circuit board and the connection terminal of the surface mount component are connected by soldering.

[0073]

As described above in detail, according to the method for mounting a surface mount component, the mounting sheet, and the mounting structure according to the present invention, the solder paste or the solder paste directly containing the flux only in the space for mounting the surface mount component. The flux, which is the solvent for solder, can be supplied reliably and in an appropriate amount, and instead of removing the print mask and transferring and supplying it to the surface mount component as in the past, it is only necessary to fill it. Can be surely done.

According to the present mounting sheet, by selecting and setting the thickness, when the connection terminal of the surface mount component has solder, the filler to be filled is either flux only or solder paste. Is selectively filled, and when no solder is provided, the solder paste is supplied and filled, and the solder paste can be supplied in an appropriate amount, so that the soldering quality is stabilized.

Since the opening of the through-hole of the mounting sheet also serves as a positioning guide, the mounting operation of the surface mounting component can be performed manually, and the mounting device is not necessarily required.

The mounting sheet is positioned and fixed with respect to the circuit board, and the surface-mounted components are positioned with respect to the mounting sheet. Since the flow to the portion is also prevented, it is reliable and no solder bridge is generated.

In addition, by matching the outer size of the mounting sheet with the outer size of the surface-mounted components, positioning during the mounting operation can be easily performed, and the thickness of the mounting sheet can be selectively set. By doing so, it is possible to secure a gap between the mounting sheet and the package surface of the surface mount component, so that it is possible to fill and bond the adhesive between them, and the practical effect is extremely remarkable. It is.

[Brief description of the drawings]

FIG. 1 is a perspective view and a side sectional view of a first surface mounting component mounting sheet of the present invention.

FIG. 2 is an explanatory diagram of a method of attaching the mounting sheet of FIG. 1 to a circuit board.

FIG. 3 is an explanatory diagram of a dimensional relationship between a BGA type surface mount component, a circuit board, and a mounting sheet.

FIG. 4 is an explanatory view (1) of a method for mounting a surface mount component according to the present invention.

FIG. 5 is an explanatory view (No. 2) of the mounting method of the surface mounting component according to the present invention.

FIG. 6 is an explanatory view (No. 3) of the mounting method of the surface mount component according to the present invention.

FIG. 7 shows a soldering method (part 1) using a heater.

FIG. 8 shows a soldering method (part 2) using a heater.

FIG. 9 shows a state in which the surface mount component is mounted by soldering according to the present invention.

FIG. 10 shows a state in which a plurality of mounting sheets are formed on one mount.

FIG. 11 shows a state in which a plurality of mounting sheets are formed on a band-shaped mount.

FIG. 12 is a side view and a rear view of a BCC type surface mount component.

FIG. 13 is a plan view and a side cross-sectional view of a second sheet for mounting surface mount components of the present invention.

14 is an explanatory diagram of a method of attaching the mounting sheet of FIG. 13 to a circuit board.

FIG. 15 is an enlarged view of a main part in a state where a surface mount component is mounted on a circuit board and in a state where it is soldered.

FIG. 16 is a side view and a back view of a BGA type surface mount component.

FIG. 17 is a plan view of a circuit board on which surface mount components are mounted.

FIG. 18 is an explanatory view (part 1) of a conventional method for supplying a solder paste to a surface mount component.

FIG. 19 is an explanatory view (part 2) of a conventional method for supplying a solder paste to a surface mount component.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 surface mount component, BGA type surface mount component 2 package 3 ball terminal, connection terminal 4 circuit board 5 other surface mount component 6 component support stand 7 recess 8 mask plate 9 reference pin 11 solder paste 12 squeegee 15 mounting Sheet 16 Sheet 17 Adhesive 18 Backing sheet 19 Through hole 21 Connection conductor pattern 22 Mark 23 Squeegee 25 Head part of heater 26 Outer duct 27 Inner duct 28 Plate-shaped rib 29 Solder 31 Cut 32 Formed on wide surface A plurality of mounting sheets 33 A plurality of mounting sheets formed on a tape surface 41 Surface mounting components, BCC type surface mounting components 42 Packages 43 Connection terminals 45 Mounting sheets 46 Sheets 47 Adhesives 48 Mounts 49 Through holes 51 Connections Conductor pattern 52 Mark 53 Solder

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B41F 15/36 B41F 15/36 B // B23K 101: 42 B23K 101: 42 F term (Reference) 2C035 AA06 FD01 5E319 AA03 AB05 AC01 AC16 AC17 BB05 CC44 CC49 CD04 CD07 CD29 GG03 GG05 GG09 GG15

Claims (3)

[Claims] 1. A sheet for mounting a surface-mounted component, comprising a surface of a heat-resistant insulating sheet having a through-hole corresponding to a conductor pattern for connecting a surface-mounted component on a circuit board, the surface of which is provided with an adhesive. Is positioned so that it conforms to the connection conductor pattern, the surface mounting component mounting sheet is attached to the circuit board with an adhesive surface, and the soldering solvent is filled into the through holes of the surface mounting component mounting sheet and surface mounted. A method of mounting a surface mount component, wherein a connection terminal provided with solder of the component is positioned on the through hole and heated and soldered. 2. A sheet for mounting a surface-mounted component, comprising an adhesive on one surface of a heat-resistant insulating sheet having a through-hole formed in correspondence with a conductor pattern for connecting a surface-mounted component on a circuit board, comprising: Is positioned so that it conforms to the connection conductor pattern, the surface mounting component mounting sheet is attached to the circuit board with an adhesive surface, and the solder paste containing the solvent is filled into the through holes of the surface mounting component mounting sheet and surface mounted. A method for mounting a surface mount component, wherein a connection terminal of the component is positioned on the through hole and heated and soldered. 3. A heat-resistant insulating sheet having a through-hole formed on a surface of a heat-resistant insulating sheet corresponding to a conductor pattern for connecting a surface-mounted component of a circuit board, the adhesive being provided on one surface thereof. Fill the through hole with soldering solvent or solvent-containing solder paste in accordance with the pattern according to the adhesive surface, position the connection terminal of the surface mount component on the through hole, and heat and solder. A sheet for mounting surface mount components, characterized in that: