JP2002111297A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus assuring safety by effectively closing a gap of both sides of a feeder base. SOLUTION: The electronic component mounting apparatus picks up electronic components from electronic component supply units 7A and 7B by a transfer head, and transfers and mounts the components on a board. The apparatus comprises a cover for covering a mounting mechanism such as a head moving mechanism for moving the transfer head, a board positioning unit, the feeder base and the like. The cover has an opening/closing type ceiling cover 14 (first cover) for covering the head moving mechanism, and a fixed cover (second cover) 17 for closing a gap generated at both sides of the bases 8 of the units 7A and 7B. Thus, the gap generated at the operating surface of the apparatus is closed by the cover 17 while assuring opening/closing operability of the cover 14, and an operator's safety can be assured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art In an electronic component mounting apparatus, a method using a tape feeder is known as a method of supplying an electronic component to a pickup position of a nozzle of a transfer head.
In this method, a large number of tape feeders are used side by side on a feeder base, and an electronic component supply unit is configured by arranging the feeder base on a side of a mounting stage of an electronic component mounting apparatus.

An electronic component is picked up by the transfer head from the electronic component supply unit, and the mounting operation of the electronic component is performed by moving the transfer head to the substrate of the mounting stage. For this reason, in the electronic component mounting apparatus,
A head moving mechanism such as an XY table for moving the transfer head is provided. Since all the tape feeders of the electronic component supply unit need to be included in the moving range of the transfer head, the width of the head moving mechanism necessarily extends laterally beyond the feeder base.

[0004]

However, in the electronic component mounting apparatus configured as described above, there are the following difficulties in forming the cover of the apparatus for ensuring the safety of workers. Was. That is, as described above, since the head moving mechanism has a structure that extends beyond the feeder base, the cover of the head moving mechanism is wider than the horizontal dimension of the feeder base of the supply unit. Therefore, a vertical gap is formed on both sides of the feeder base located below the front surface of the cover of the head moving mechanism, and the gap remains open even when the tape feeder is mounted on the feeder base. However, there is a problem that the safety of the worker may be hindered.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus in which the gaps on both sides of a feeder base are effectively closed to ensure safety.

[0006]

An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that picks up an electronic component from an electronic component supply unit by a transfer head and transfers the electronic component onto a substrate. A feeder base which is provided in the unit and on which a plurality of tape feeders can be mounted, a substrate positioning unit which holds and positions the substrate, and a transfer head which picks up an electronic component from the tape feeder, and the electronic component supply unit and the substrate. A head moving mechanism for reciprocating between the substrate positioning unit, a feeder base, and a cover unit that covers a mounting mechanism unit including the head moving mechanism, and the cover unit is an openable / closable type that covers the head moving mechanism. The first cover closes a gap formed on both sides of the feeder base on a vertical plane orthogonal to a direction in which the feeder base is disposed. 2 and a cover.

According to the present invention, an openable first cover for covering the head moving mechanism is provided on the cover for covering the mounting mechanism.
By including a cover and a second cover that closes a gap formed on both sides of the feeder base on a vertical plane perpendicular to the disposing direction of the feeder base,
It is possible to close the gap generated on the operation surface of the electronic component mounting apparatus while ensuring the operability of opening and closing the cover, thereby ensuring the safety of the worker.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a side sectional view of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. It is a front view of an electronic component mounting device.

First, an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, an electronic component mounting apparatus 1 includes:
It has two mounting stages 2A and 2B. A substrate loading port 3 provided on the side surface is provided on the mounting stage 2A on the upstream side.
The substrate 6 is carried in. The electronic component supply units 7A and 7B with respect to the substrate 6 positioned on the transport path 5 (see FIG.
The electronic component picked up from is mounted.

The electronic component supply units 7A and 7B are provided with a feeder base 8 which is slidably disposed in a horizontal direction and on which a plurality of tape feeders 9 can be mounted. The tape feeder 9 is a supply reel 11 mounted in parallel on a carriage 10.
The electronic component in the taping state is pulled out from the container and fed by pitch. Thereby, the electronic component is supplied to the electronic component pickup position of each mounting stage.

As shown in FIG. 2, the electronic component mounting apparatus 1 comprises:
Four XY table mechanisms each composed of an X table and a Y table are provided corresponding to the electronic component supply units 7A and 7B provided on the base 4, respectively.
The transfer head 12 is mounted on the Y table mechanism.
Here, two transfer heads 12 are shown. The transfer head 12 moves horizontally, and picks up electronic components from the tape feeders 9 arranged in the electronic component supply units on each side by the nozzles 12a.

The transfer head 12 is connected to the electronic component supply unit 7.
After recognizing the electronic component via the camera 13 disposed between A and 7B and the transport path 5, the electronic component is mounted on the substrate 6. That is, the XY table mechanism is a head moving mechanism that reciprocates the transfer head 12 between the electronic component supply units 7A and 7B and the substrate. The XY table mechanism provided with the transport path 5, the feeder base 8, and the transfer head 12, which is a substrate positioning section, constitutes a mounting mechanism section.

As shown in FIGS. 2 and 3, the outside of the mounting mechanism is covered with a plurality of covers, and external access to these mounting mechanisms is restricted. Hereinafter, these covers will be described. As shown in FIG. 2, the transfer head 12 and the XY table mechanism for moving the transfer head 12 are covered by a bent openable / closable ceiling cover (first cover) 14 partially including a ceiling portion and an upper portion of the front surface. Have been done. By grasping a handle 16 provided on the front surface of the ceiling cover 14 and lifting it upward, the ceiling cover 14 is opened around a hinge fulcrum 15 provided on the ceiling. Thereby, inspection and maintenance work of the transfer head 12 and the XY table mechanism can be performed.

Further, as shown in FIG.
A fixed cover (second cover) 17 that closes a gap formed on both sides of the feeder base 8 on a vertical plane orthogonal to the sliding direction of the feeder base 8 is attached to both sides of the feeder base 8 of A (same as 7B). Have been. The gap in which the fixed cover 17 is closed is caused by the XY table mechanism projecting laterally beyond the feeder base 8 because the XY table mechanism is inevitably wider than the width of the feeder base 8 due to functional requirements. .

This electronic component mounting apparatus is configured as described above, and the mounting operation will be described below. When the mounting operation is started, the mounting head 12 repeatedly picks up the electronic components from the tape feeders 9 of the respective electronic component supply units 7A and 7B and mounts the electronic components on the substrate 6 on the transport path 5. During this mounting operation, the operator performs a tape supply operation and an inspection operation of each part at any time.

That is, in the tape supply operation, the worker accesses the electronic component supply units 7A and 7B, and supplies the tapes to the respective tape feeders 9 by the supply reels 11.
Perform the work such as exchange of the effect. In this tape supply operation, both sides of the feeder base 8 are closed by the fixed covers 17, so that a situation in which the operator accidentally inserts his hand into the operating mounting mechanism does not occur.

If an abnormality such as a board transport trouble occurs inside the apparatus during the mounting operation, the operator stops the apparatus, opens the ceiling cover 14 and performs an operation such as an internal inspection. . At this time, the operator opens the ceiling cover 14 by lifting the handle 16 by hand. Even during this operation, both sides of the feeder base 8 are closed by the fixed covers 17, so that the safety of the worker is ensured. As described above, the openable and closable ceiling cover 14 is provided on the operation surface of the electronic component mounting apparatus according to the target.
And the fixed cover 17 are selectively used and arranged, thereby realizing a cover arrangement in consideration of operability and safety.

[0018]

According to the present invention, the cover for covering the mounting mechanism is provided with an openable first cover for covering the head positioning mechanism, and the cover of the feeder base on a vertical plane perpendicular to the sliding direction of the feeder base. By providing the second cover for closing the gap formed on both sides, the gap formed on the operation surface of the electronic component mounting apparatus can be closed, and the safety of the worker can be ensured.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side sectional view of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a front view of the electronic component mounting apparatus according to the embodiment of the present invention;

[Explanation of symbols]

 2A, 2B Mounting stage 5 Transport path 6 Substrate 7A, 7B Electronic component supply unit 8 Feeder base 9 Tape feeder 12 Transfer head 14 Ceiling cover 17 Fixed cover

Continued on the front page (72) Inventor Takashi Hirahara 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E313 AA01 AA11 AA15 DD31 EE22 FF24 FF28 FG10

Claims (1)

[Claims] An electronic component mounting apparatus for picking up an electronic component from an electronic component supply unit by a transfer head and transferring and mounting the electronic component on a substrate, wherein a plurality of tape feeders arranged in the electronic component supply unit are mountable. A feeder base, a substrate positioning unit that holds and positions the substrate, a head moving mechanism that reciprocates a transfer head that picks up an electronic component from the tape feeder between the electronic component supply unit and the substrate, and the substrate. A positioning unit, a feeder base, and a cover unit that covers a mounting mechanism unit including a head moving mechanism. The cover unit includes an openable first cover that covers the head moving mechanism, and an arrangement direction of the feeder base. And a second cover for closing a vertical gap generated on both sides of the feeder base in a perpendicular vertical plane. Child component mounting apparatus.