JP2002111215A - 配線基板とその製造方法 - Google Patents
配線基板とその製造方法Info
- Publication number
- JP2002111215A JP2002111215A JP2000296946A JP2000296946A JP2002111215A JP 2002111215 A JP2002111215 A JP 2002111215A JP 2000296946 A JP2000296946 A JP 2000296946A JP 2000296946 A JP2000296946 A JP 2000296946A JP 2002111215 A JP2002111215 A JP 2002111215A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- woven fabric
- wiring board
- epoxy resin
- fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000296946A JP2002111215A (ja) | 2000-09-28 | 2000-09-28 | 配線基板とその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000296946A JP2002111215A (ja) | 2000-09-28 | 2000-09-28 | 配線基板とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002111215A true JP2002111215A (ja) | 2002-04-12 |
| JP2002111215A5 JP2002111215A5 (enExample) | 2009-09-24 |
Family
ID=18779139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000296946A Pending JP2002111215A (ja) | 2000-09-28 | 2000-09-28 | 配線基板とその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002111215A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115840A (ja) * | 2005-10-19 | 2007-05-10 | Kyocera Corp | 配線基板および配線基板の製造方法 |
| JP2008109073A (ja) * | 2006-03-30 | 2008-05-08 | Kyocera Corp | 配線基板および実装構造体 |
| US20110232953A1 (en) * | 2010-03-29 | 2011-09-29 | Kyocera Corporation | Circuit board and structure using the same |
| US8182729B2 (en) | 2008-03-12 | 2012-05-22 | Denso Corporation | Wiring board and method of making the same |
| US8446734B2 (en) | 2006-03-30 | 2013-05-21 | Kyocera Corporation | Circuit board and mounting structure |
-
2000
- 2000-09-28 JP JP2000296946A patent/JP2002111215A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115840A (ja) * | 2005-10-19 | 2007-05-10 | Kyocera Corp | 配線基板および配線基板の製造方法 |
| JP2008109073A (ja) * | 2006-03-30 | 2008-05-08 | Kyocera Corp | 配線基板および実装構造体 |
| US8446734B2 (en) | 2006-03-30 | 2013-05-21 | Kyocera Corporation | Circuit board and mounting structure |
| US8182729B2 (en) | 2008-03-12 | 2012-05-22 | Denso Corporation | Wiring board and method of making the same |
| US20110232953A1 (en) * | 2010-03-29 | 2011-09-29 | Kyocera Corporation | Circuit board and structure using the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Effective date: 20070820 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090810 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Effective date: 20090810 Free format text: JAPANESE INTERMEDIATE CODE: A871 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20090826 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20090901 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091102 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091201 |